JPH11177261A - Supporting structure in electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To thin a structure much more without spoiling shock resistance and vibration resistance. SOLUTION: A bracket 2 is fixed to the side of a magnetic disk device 1 and the bracket 2 is sandwiched by an upper buffer member 4 and a lower buffer member 5 from upper/lower directions. The upper buffer member 4 and the lower buffer member 5 are inserted into the inner faces of a casing 6 from the upper/lower directions. Then, the magnetic device 1 is supported in the inner space of the casing 6. Since the bracket 2 is sandwiched by the upper buffer member 4 and the lower buffer member 5, the size of the upper/lower direction becomes thinner compared to a case when the magnetic disk device 1 itself is inserted between the upper buffer member 4 and the lower buffer member 5 in the same sizes. Since the thickness of the upper buffer member 4 and the lower buffer member 5 is not made thinner than a former one, shock resistance and vibration resistance are not damaged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a support structure inside an electronic device, which comprises a housing of the electronic device and a built-in unit.

[0002]

2. Description of the Related Art Conventionally, an electronic device has a built-in unit (hereinafter referred to as a built-in unit) which is unitized in order to increase the efficiency of an assembling operation or facilitate replacement. Many have a built-in structure. For example, in the case of a personal computer,
As a built-in unit, a built-in peripheral device such as a magnetic disk device or an optical disk device is incorporated.

In an electronic device having such an internal structure,
The built-in unit often includes electronic components and movable mechanisms that are vulnerable to shock.In this case, if the shock applied to the housing is transmitted to the built-in unit as it is, the electronic components and movable mechanism in the built-in unit will be damaged. There is a risk of failure. Also, when a vibration source such as a motor is mounted on the built-in unit, if the vibration generated by the built-in unit is transmitted to the housing as it is, the housing will vibrate and cause noise, or other parts may vibrate. Can be transmitted and have unexpected adverse effects.

To accommodate such a built-in unit in a housing, conventionally, as shown in FIG. 3, for example, buffer members 101 and 102 made of a low-hardness material such as rubber are used.
The internal structure is interposed between the built-in unit 103 and the housing 104 so that the built-in unit 103 and the housing 104 are not in direct contact.

[0005]

By the way, in the case of an electronic device in which portability is regarded as important, for example, as in a portable computer, there is generally a demand to make the device as thin as possible. However, the cushioning members 101, 10
The thicknesses t1 and t2 of No. 2 effectively absorb at least the impact.
It is necessary to ensure a thickness that can be relaxed, and if the thicknesses t1 and t2 themselves are made thinner than the current levels, there is a possibility that impact resistance and vibration isolation may be impaired. The built-in unit 10
The thickness t3 of 3 is usually already made as thin as possible at the design stage, and it is difficult to make it thinner than it is now. for that reason,
It has been extremely difficult to make this type of electronic equipment thinner than it is now.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide an electronic device which can be made thinner without impairing impact resistance and vibration proofing. It is to provide a support structure.

[0007]

Means for Solving the Problems and Effects of the Invention In order to achieve the above object, the present invention provides a housing having an internal space and a housing housed in the internal space of the housing. Possible built-in unit, while supporting the built-in unit in the internal space of the housing without intervening between the housing and the built-in unit and directly contacting both,
A support structure inside the electronic device, comprising a buffer member capable of relaxing shock and vibration transmitted from one of the built-in unit and the housing to the other, and a support plate having a smaller vertical dimension than the built-in unit is provided. , The support plate is laterally extended from the side surface of the built-in unit, the support plate is sandwiched by the buffer member from above and below, and the buffer member is sandwiched between the inner surfaces of the housing from above and below, and the built-in unit is It is characterized by being supported in the internal space of the housing.

First, in the configuration of the present invention, "vertical direction" and "lateral direction" are defined as structures included in the support structure (ie, the housing, the built-in unit, the cushioning member,
And a support plate) for specifying the relative positional relationship between them, but not for specifying the arrangement direction of the entire support structure. For example, the above “vertical direction” and “horizontal direction” are not synonymous with “vertical direction” and “horizontal direction”, and the “vertical direction” here refers to any direction depending on the arrangement state of the electronic device. It can be. However, at least the “horizontal direction” is always a direction substantially perpendicular to the “vertical direction”, and this relative relationship is unchanged.

The housing serves as a container for housing the built-in unit, but its material and shape are not particularly limited. The housing itself may be composed of several parts, for example, one that combines a main body part and a lid part to form one housing, one that combines several panel parts to form a housing, and the like. I can think. Further, even if the housing accommodates only one built-in unit and is completed as one electronic device, the housing houses a plurality of built-in units and a group of other components that are directly provided, and forms one electronic device. It may be completed as a device. Furthermore, this housing is not necessarily the outermost part of the electronic device, and the housing itself may be housed in another housing.

[0010] The built-in unit is at least a built-in built-in device or component, but its function, shape, constituent parts, etc. are not particularly limited. Some specific examples include, for example, a built-in unit of an electronic device, such as a computer, an audio device, a measuring device, and a medical device, which wants to eliminate adverse effects due to vibrations and shocks as much as possible, or various machine tools. A built-in unit of an electronic device in which a mechanism serving as a vibration source coexists in one frame can be considered. Among them, a personal computer (especially a portable type) is one of the electronic devices for which it is extremely important to reduce the thickness. A typical example of a built-in unit of this type of personal computer is a magnetic disk drive. (For example, a hard disk device and an FD device) and an optical disk device (for example, a CD-ROM device).

The specific shape of the cushioning member is not particularly limited as long as it can form the above-described support structure. Also,
The material is not particularly limited as long as it is a low-hardness elastomer material capable of absorbing and mitigating impact. Specifically, for example, a gel resin, a rubber resin, a foam resin, or the like can be used. These can alleviate the impact with elastic deformation and then restore their shape to maintain the impact absorbing ability. Among them, the gel-like resin loses its fluidity as a whole, while the resin components crosslink with each other to form a network-like structure, and a fluid component such as a plasticizer is included in the gaps of the network structure. Since it is in a gel state, it exhibits so-called viscoelasticity and has a very large loss coefficient, which is particularly desirable in that vibration can be quickly converged.

The support plate may be formed integrally with the built-in unit or may be formed by fixing another component to the built-in unit, as long as the support plate extends laterally from the side surface of the built-in unit. The area of the upper and lower surfaces of the support plate is used to distribute pressure and frictional force between the upper and lower surfaces of the support plate and the cushioning member to the extent that the cushioning member functions effectively. The necessary area should be secured. However, this area cannot be specified by a numerical value or the like because it can vary depending on the physical properties of the buffer member itself or the magnitude of the assumed maximum impact force.

According to the support structure inside the electronic device configured as described above, a support plate having a shape smaller in the vertical direction than the built-in unit is extended from the built-in unit, and the support plate is vertically supported by the buffer member. It is sandwiched. Therefore, the thickness of the portion where the support plate is sandwiched between the buffer members is thinner than when the built-in unit itself is sandwiched between the buffer members having the same thickness. Then, the cushioning member and the support plate are sandwiched between inner surfaces of the housing. Therefore, when supporting the built-in unit in the internal space of the housing, the vertical dimension of the internal space of the housing may be small, and as a result, the electronic device is thinner than before. In addition, since the thickness of the cushioning member is not reduced in such a reduction in thickness, the shock resistance and the vibration proof property are not impaired as compared with the conventional product.

Next, the supporting structure inside the electronic device according to the present invention is characterized in that a side surface of the buffer member is in contact with an inner surface of the housing. With such a structure, the buffer member is difficult to be displaced to the side, and particularly when a lateral force (such as an impact) acts on a part of the support structure, the buffer member is placed above the buffer member. The buffer performance is higher than a structure in which only the lower surface and the inner surface of the housing are in contact with each other.

According to a third aspect of the present invention, there is provided a supporting structure inside the electronic device, wherein a concave portion is formed on an upper surface and / or a lower surface of the support plate, and a part of the buffer member is intruded inside the concave portion. It is characterized by having become.

In this support structure, the recess may be formed on either the upper surface or the lower surface, or may be formed on both. Also, for each of the upper and lower surfaces,
Only one may be formed, or a plurality may be formed. Further, it may be a bottomed hole or a groove having an opening on only one of the upper surface and the lower surface, or a through hole or a notch having an opening on both the upper surface and the lower surface.

Then, a part of the buffer member is intricately formed inside such a concave portion. As a method of forming a part of the buffer member into the inside of the concave portion, a method of forming a part of the buffer member in advance to match the concave portion and forming the convex portion into the concave portion, A method may be considered in which a part of the cushioning member is deformed by pressing against the support plate and bites into the recess.

Even with such a structure, the cushioning member is difficult to be displaced to the side. Therefore, particularly when a lateral force (such as an impact) acts on a part of this support structure, the cushioning member is cushioned. The buffer performance is higher than a structure in which only the upper and lower surfaces of the member and the inner surface of the housing are in contact with each other.

It should be noted that such a configuration can be adopted in combination with the characteristic configuration described in claim 2, and in that case, the buffer performance is further enhanced. Next, claim 4
The support structure inside the electronic device according to the aspect of the invention may be configured such that a through-hole that penetrates the support plate in an up-down direction is formed as the concave portion, and a part of the buffer member is indented inside the through-hole. Moreover, the intricate portions from both the upper and lower sides are mutually adhered inside the through hole.

In order for the cushioning members to adhere to each other inside the through-holes, it is only necessary to impart tackiness to the surface of the cushioning member. An adhesive layer made of a material different from the cushioning member itself may be provided on the surface of the member. Also, either one of the intricate portions from above and below may have adhesiveness, or both may have adhesiveness.

Even with such a structure, the cushioning member is difficult to be displaced laterally. Therefore, particularly in the case where a lateral force (such as an impact) acts on a part of this support structure, a claim is made. As compared with the support structure described in Item 3, the buffer performance is further improved. Next, the supporting structure in the electronic device according to claim 5, wherein a convex portion is formed on an upper surface and / or a lower surface of the support plate, and the convex portion is embedded in the buffer member. Features.

In this support structure, the convex portion may be formed on either the upper surface or the lower surface, or may be formed on both. Also, for each of the upper and lower surfaces,
Only one may be formed, or a plurality may be formed. And this convex part is in the state where it was embedded in the buffer member. As a method of making the buffer member intrude the convex part, a part of the buffer member is formed in advance with a concave part,
There may be conceived a method in which the convex portion is entangled with the concave portion, a method in which the convex portion is pressed into contact with the buffer member, and the convex portion bites into the buffer member while partially deforming the buffer member.

Even with such a structure, the cushioning member is hardly displaced to the side. Therefore, particularly when a lateral force (such as an impact) acts on a part of the support structure, the cushioning member is cushioned. The buffer performance is higher than a structure in which only the upper and lower surfaces of the member and the inner surface of the housing are in contact with each other.

Incidentally, such a configuration can be adopted in combination with the characteristic configuration described in claims 2 to 4, in which case the buffer performance is further enhanced.

[0025]

Next, an embodiment of the present invention will be described with reference to an example. As shown in FIGS. 1A to 1C, a bracket 2 is provided with a screw 3 on a side surface of a magnetic disk device 1 which is a built-in unit of a personal computer.
This bracket 2 is sandwiched between the upper buffer member 4 and the lower buffer member 5 from above and below, and further, the upper buffer member 4 and the lower buffer member 5
Are sandwiched between the inner surfaces of the housing 6 from above and below, and the magnetic disk device 1 is supported in the internal space of the housing 6.

The magnetic disk drive 1 has a structure in which an internal mechanism is housed in a metal case, and its outer shape is a thin rectangular parallelepiped. Although not directly related to the main parts of the present invention, although not shown, cables and the like necessary for connection to the computer and the power supply are led out of the case.

2 (a) to 2 (d).
As shown in FIG. 1, a metal plate is formed by press working, and the lower end of the mounting portion 10 is bent 90 degrees around the mounting portion 10 which is closely arranged on the side surface of the magnetic disk drive 1 to form a first laterally extending portion. A protrusion 11 is formed, and both side ends of the mounting
The first protrusion 1 is bent 90 degrees to the same side as the side extension 11.
2 and the second convex portion 13, and the lower end of the first convex portion 12 is bent 90 degrees to the side away from the second convex portion 13 to form the second laterally extending portion 14, and the second convex portion 13 is formed. Is bent 90 degrees to the side away from the first convex portion 12 to form the third laterally extending portion 1.
5 is formed. A screw hole 16 for passing a screw is formed in the mounting portion 10, between the first side extension 11 and the second side extension 14, between the first side extension 11 and the first side extension 11. Gaps 17 and 18 are formed between the three laterally extending portions 15, respectively.

In the partial structure of the bracket 2, the first side extending portion 11, the second side extending portion 14, and the third side extending portion 15 are provided on the support plate of the present invention. It is a corresponding part. In addition, the gaps 17 and 18 are portions corresponding to concave portions (more specifically, through holes vertically penetrating the support plate) formed on the upper surface and / or the lower surface of the support plate. Further, the first convex portion 12 and the second convex portion 13 are portions corresponding to the convex portions formed on the upper surface and / or the lower surface of the support plate.

The upper cushioning member 4 and the lower cushioning member 5
Each of them is a columnar body made of a urethane resin-based gel material. In this gel-like material, the urethane resin crosslinks each other to form a network-like structure, and a fluid component such as a plasticizer and fine particles of alumina as a heat-conductive filler are included in the gaps of the network structure. It loses fluidity as a whole and becomes gel-like. Such a gel-like material exhibits so-called viscoelasticity and has a relatively large loss coefficient, so that a large part of the transmitted vibration energy can be converted into heat energy and consumed internally, and excellent buffer performance Demonstrate.

As shown in FIGS. 1A to 1C, the upper buffer member 4 and the lower buffer member 5 are both larger in length and width than the bracket 2. The bracket 2 is completely wrapped around the side surface of the magnetic disk drive 1. Further, as shown in FIG. 1A, a slit 20 is formed in the upper cushioning member 4, and the first convex portion 12 and the second convex portion 1 of the bracket 2 are formed.
3 has just entered the slit 20. Furthermore, the gel-like material forming the upper cushioning member 4 and the lower cushioning member 5 is a material having an adhesive surface, and the upper cushioning member 4 and the lower cushioning member 5 include a portion around the bracket 2, and The portions of the bracket 2 that have entered the gaps 17 and 18 are in a state of mutual adhesion.

The housing 6 is made of resin and includes a main body part 22 and a lid part 24. The vertical dimension of the internal space of the housing 6 is designed to be slightly smaller than the vertical dimension of the entire three components when the bracket 2 is sandwiched between the upper buffer member 4 and the lower buffer member 5. Therefore, when each part is stored in the main body part 22,
Until the lid component 24 is attached, the upper end of the upper cushioning member 4 slightly protrudes from the main body component 22, but the upper cushioning member 4 is pressed down by the lid component 24 and the lid component 24 is fixed to the main body component 22. Then, the upper cushioning member 4 and the lower cushioning member 5 are strongly pressed from above and below, and fit in the internal space of the housing 6 in a slightly deformed state.

As described above, since the upper cushioning member 4 and the lower cushioning member 5 are housed in the housing 6, the bracket 2 is strongly sandwiched between the upper cushioning member 4 and the lower cushioning member 5. In a state where In addition, the upper buffer member 4 and the lower buffer member 5 are expanded in the lateral direction by the amount compressed vertically, and are also in pressure contact with the side wall of the internal space of the housing 6.

According to the support structure of the magnetic disk drive 1 configured as described above, the bracket 2 is
Since the magnetic disk device 1 is supported by being sandwiched between the upper and lower buffer members 5, the magnetic disk device 1 is compared with a case where the magnetic disk device 1 itself is sandwiched between the upper buffer member 4 and the lower buffer member 5 of the same size. Thus, a thin structure having a small vertical dimension is obtained.
In addition, since the thickness of the upper cushioning member 4 and the lower cushioning member 5 is not made thinner than in the prior art in such a reduction in thickness, impact resistance and vibration damping properties are impaired as compared with conventional products. Nor.

A structure in which the side surfaces of the upper buffer member 4 and the lower buffer member 5 are brought into contact with the inner surface of the housing 6, and the gaps 17, 18 of the bracket 2 are partially provided in the upper buffer member 4 and the lower buffer member 5. And a structure in which the first convex portion 12 and the second convex portion 13 of the bracket 2 are embedded in the slit 20 of the upper cushioning member 4. The magnetic disk drive 1 acts so as to prevent relative movement between the lower buffer member 5 and the bracket 2 and is supported in an extremely stable state.

Although the embodiment of the present invention has been described above, various specific embodiments other than the above are conceivable for the embodiment of the present invention. For example, in the above-described embodiment, the upper cushioning member 4 and the lower cushioning member 5 are designed to fit into the gaps 17 and 18 of the bracket 2 with deformation. ,
The upper cushioning member 4 and the lower cushioning member 5 can be more complicatedly meshed with each other if they are formed in advance into a shape having irregularities that mesh with each other. In this case, if a member is formed at a position where the intermeshing irregularities are back-to-back, the two parts can be engaged only by preparing two parts of the same shape.

[Brief description of the drawings]

FIG. 1 is a support structure inside an electronic device shown as an embodiment, in which (a) is a perspective view (excluding a housing),
(B) is a schematic sectional view taken along the line AA, and (c) is a schematic sectional view taken along the line BB.

FIG. 2 shows a bracket, (a) is a side view thereof,
(B) is a plan view, (c) is a front view, and (d) is a bottom view.

FIG. 3 is a schematic sectional view showing a support structure inside a conventional electronic device.

[Explanation of symbols]

1 ... magnetic disk device (built-in unit), 2 ...
Bracket, 3 screws, 4 upper cushioning member (buffer member), 5 lower cushioning member (cushion member), 6
· Case, 10 ··· Mounting part, 11 ··· First side extending part (support plate), 12 ··· First convex part (convex part), 13 ···
2nd convex part (convex part), 14 ... 2nd side extension part (support plate), 15 ... 3rd side extension part (support plate), 16 ...
.Screw holes, 17, 18,... Gaps (recesses), 20.
Slits, 22: body parts, 24: lid parts.

[Procedure amendment]

[Submission date] December 11, 1998

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction contents]

[0007]

Means for Solving the Problems and Effects of the Invention In order to achieve the above object, the present invention provides a housing having an internal space and a housing housed in the internal space of the housing. Possible built-in unit, while supporting the built-in unit in the internal space of the housing without intervening between the housing and the built-in unit and directly contacting both,
A support structure inside the electronic device, comprising a buffer member capable of relaxing shock and vibration transmitted from one of the built-in unit and the housing to the other, and a support plate having a smaller vertical dimension than the built-in unit is provided. , The support plate is laterally extended from the side surface of the built-in unit, the support plate is sandwiched by the buffer member from above and below, and the buffer member is sandwiched between the inner surfaces of the housing from above and below, and the built-in unit is Being supported within the interior space of the housing ,
A recess is formed on the upper surface and / or lower surface of the support plate,
A state in which a part of the cushioning member is entangled inside the recess.
It is characterized by having become .

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction contents]

The support plate may be formed integrally with the built-in unit or may be formed by fixing another component to the built-in unit, as long as the support plate extends laterally from the side surface of the built-in unit. The area of the upper and lower surfaces of the support plate is used to distribute pressure and frictional force between the upper and lower surfaces of the support plate and the cushioning member to the extent that the cushioning member functions effectively. The necessary area should be secured. However, this area cannot be specified by a numerical value or the like because it can vary depending on the physical properties of the buffer member itself or the magnitude of the assumed maximum impact force. Sa
Furthermore, the recess is formed on either the upper surface or the lower surface.
It may be formed or both. Also,
Even if only one is formed on each of the upper and lower surfaces,
The number may be formed. Also, whether on top or bottom
Even if it is a bottomed hole or groove with an opening in only one of them,
Through holes or notches with openings on both top and bottom
It may be. Then, loosely into such a concave portion.
Part of the opposing member is in a complicated state. Cushioning material
As a method to make a part of
A part of the shock absorbing member is formed into a convex shape according to the concave portion.
Method to make the convex part fit into the concave part,
Part of the cushioning member is deformed by pressing against the support plate
It is possible to consider such a method as to make the inside of the concave portion bite.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction contents]

According to the support structure inside the electronic device configured as described above, a support plate having a shape smaller in the vertical direction than the built-in unit is extended from the built-in unit, and the support plate is vertically supported by the buffer member. It is sandwiched. Therefore, the thickness of the portion where the support plate is sandwiched between the buffer members is thinner than when the built-in unit itself is sandwiched between the buffer members having the same thickness. Then, the cushioning member and the support plate are sandwiched between inner surfaces of the housing. Therefore, when supporting the built-in unit in the internal space of the housing, the vertical dimension of the internal space of the housing may be small, and as a result, the electronic device is thinner than before. In addition, since the thickness of the cushioning member is not reduced in such a reduction in thickness, the shock resistance and the vibration proof property are not impaired as compared with the conventional product. Also special
A concave portion is formed on the upper surface and / or lower surface of the support plate.
And a part of the cushioning member is entangled inside the recess.
The structure makes it difficult for the cushioning member to be displaced sideways.
In particular, a lateral force (impact) is applied to part of this support structure.
Impact), the upper and lower surfaces of the cushioning member
Buffering performance compared to a structure where only the inner surface of the housing is in contact
Get higher.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0014

[Correction method] Change

[Correction contents]

Next, in the supporting structure according to the second aspect of the present invention, the concave portion penetrates the supporting plate vertically.
Is formed, and a part of the cushioning member is
It is in a state of being complicated inside the through hole, and moreover,
The intricate parts from below are mutually inside the through hole
It is characterized by being sticky . Insert the buffer into the through hole
To make the parts stick together, make sure the surface of the cushioning material is sticky.
This can be done by applying
Even if it is formed of a material such as
May be provided with an adhesive layer made of a different material. Also on
One of the intricate parts from below is sticky
Or both may be tacky. Such a structure
Then, even when compared with the support structure according to claim 2,
The structure is such that the cushioning member is less likely to be displaced sideways.
Lateral force (such as impact) acts on part of the support structure
In such a case, the buffer performance becomes higher.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0015

[Correction method] Change

[Correction contents]

According to a third aspect of the present invention, there is provided a support structure inside an electronic device, wherein a convex portion is formed on an upper surface and / or a lower surface of the support plate.
Formed, and the convex portion is in a state of being intertwined with the buffer member.
It is characterized by becoming .

[Procedure amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Change

[Correction contents]

In this support structure, the convex portion may be formed on either the upper surface or the lower surface, or may be formed on both. Also, for each of the upper and lower surfaces,
Only one may be formed, or a plurality may be formed .

[Procedure amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0017

[Correction method] Change

[Correction contents]

The projection is in a state of being intertwined with the cushioning member . As a method of forming a convex part in the buffer member , a concave part is formed in a part of the buffer member in advance.
Advance, a method of Irikuma convex portions in the concave portion, a convex portion loosely
Part of the cushioning member is deformed by pressing against the impact member
It is possible to consider a method of making the convex portion bite into the inside of the buffer member while making the protrusion .

[Procedure amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0019

[Correction method] Change

[Correction contents]

Incidentally, such a configuration is described in claim 1 or
It can be employed in combination with the characteristic configuration described in claim 2, and in that case, the buffer performance is further enhanced.

[Procedure amendment 10]

[Document name to be amended] Statement

[Correction target item name] 0020

[Correction method] Change

[Correction contents]

Next, a support inside the electronic device according to claim 4 is provided.
The structure further comprises a side surface of the cushioning member formed inside the housing.
It is characterized by being brought into contact with a surface. Such a structure
By doing so, it becomes a structure that the cushioning member is difficult to displace to the side
In particular, lateral forces (impacts)
The upper and lower surfaces of the cushioning member and the housing
Higher cushioning performance compared to a structure in which only the body surface is in contact
It becomes.

[Procedure amendment 11]

[Document name to be amended] Statement

[Correction target item name] 0021

[Correction method] Deleted

[Procedure amendment 12]

[Document name to be amended] Statement

[Correction target item name] 0022

[Correction method] Deleted

[Procedure amendment 13]

[Document name to be amended] Statement

[Correction target item name] 0023

[Correction method] Deleted

[Procedure amendment 14]

[Document name to be amended] Statement

[Correction target item name] 0024

[Correction method] Deleted

[Procedure amendment 15]

[Document name to be amended] Drawing

[Correction target item name] Fig. 1

[Correction method] Change

[Correction contents]

FIG.

[Procedure amendment 16]

[Document name to be amended] Drawing

[Correction target item name] Figure 2

[Correction method] Change

[Correction contents]

FIG. 2

Claims (5)

[Claims] 1. A housing having an internal space, a built-in unit that can be stored in the internal space of the housing, and the built-in unit interposed between the housing and the built-in unit without directly contacting both. A support structure inside the electronic device, comprising: a unit that is supported in the internal space of the housing, and a buffer member that can reduce shock and vibration transmitted from one of the built-in unit and the housing to the other. A support plate having a smaller vertical dimension than the built-in unit,
The support plate extends laterally from a side surface of the built-in unit, the support plate is sandwiched by the buffer member from above and below, and the buffer member is sandwiched between inner surfaces of the housing from above and below, and the built-in unit is A support structure inside an electronic device, which is supported in an internal space of a housing. 2. The support structure according to claim 1, wherein a side surface of said buffer member is in contact with an inner surface of said housing. 3. The support structure inside an electronic device according to claim 1, wherein a concave portion is formed on an upper surface and / or a lower surface of the support plate, and a part of the buffer member is moved inward of the concave portion. A support structure inside an electronic device, which is in a complicated state. 4. The support structure inside an electronic device according to claim 3, wherein a through-hole penetrating the support plate in a vertical direction is formed as the concave portion, and a part of the buffer member is inside the through-hole. A support structure inside the electronic device, wherein the support structure is in a state of being intricate, and the intricate portions from both the upper and lower sides are mutually adhered inside the through hole. 5. The support structure inside an electronic device according to claim 1, wherein a convex portion is formed on an upper surface and / or a lower surface of said support plate, and said convex portion is provided with said buffer member. A support structure inside an electronic device, which is in a complicated state.