JPH11176713A - Substrate processing management device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the load of the processing quality management work of a substrate and to continuously stabilize the quality of the substrate. SOLUTION: An automatic quality management device is connected to a substrate processor and a measuring unit via communication lines. The management device executes substrate processing, based on receipt data to manage the quality of the substrate processed in the substrate processor, based on measured data obtained from the measuring unit. The measuring unit measures film thickness data, as a processing result from the processed substrate. The management device receives measurement data from the measuring unit in a communication means 22, and measurement data is accumulated in a file 42 in accordance with the data received by which the substrate is processed. A relation between receipt data and the film thickness of the substrate is calculated from plural pieces of measurement data in a regressive formula deciding means 31. When measurement data which a statistical analysis means 32 receives is varied from a quality management rule based on the pertinent rule and a target value, which an operator inputs from an input means 51, a regressing formula is calculated backward, by using the target value, receipt data satisfying the target value is calculated, receipt data is downloaded from a communication means 21, and the substrate processor is made have the processing executed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for performing processing such as thin film formation on a substrate such as a semiconductor wafer for forming a semiconductor device or a glass substrate for forming an LCD. The present invention relates to a technique for managing the quality of a substrate processed by a substrate processing apparatus.

[0002]

2. Description of the Related Art In a substrate processing apparatus, generally, a set value such as a temperature or a gas flow rate and a processing time thereof are specified in a recipe as data, and the substrate processing is performed based on the data specified in the recipe. Is to run. Then, when adjusting the processing amount of the substrate (for example, the film thickness), the recipe data is changed, and the substrate processing apparatus executes the processing based on the recipe data.

[0003] In a substrate processing apparatus using such recipe data, in order to manage the quality of the processed substrate, the processed substrate is set in a measuring instrument and the processing amount is measured. Is registered by the operator, and it is checked later whether the measured data is within the normal range. If the quality is poor, the operator changes the recipe data obtained by processing the object to be processed based on rules of thumb, and causes the substrate processing apparatus to perform the next process using the changed recipe data.

[0004]

As described above, in the conventional quality control, the operator manually registers the measurement data of the substrate processing amount, judges the quality on the basis of the registered data, and further transmits the recipe data. Because of the change, there were the following problems.

[0005] It is necessary to have many engineers who are familiar with the relationship between the recipe data and the processing amount for each processing type, and even if the processing type is the same, the relationship between the recipe data and the processing amount is slightly different due to a change over time. Since many skilled technicians are required, a great deal of labor and cost were required to stabilize the processing quality. In addition, a certain amount of time is required every time from when the measurement data is registered to when the quality is determined based on the measurement data and the recipe data is changed, so that a wait time until the next processing occurs. The operating rate has been reduced. Alternatively, when the next process is executed without waiting for the quality inspection based on the measurement data, a defective product is easily produced and the productivity is reduced.

Further, since it is difficult to predict the amount of processing in the next and subsequent processing, there is a risk of executing processing in which the amount of processing becomes an abnormal value. The treatment was delayed, such as changing, and productivity was reduced. Also, LC
D and semiconductor production lines require extremely high cleanliness, so it is strongly desired to eliminate paper as a source of particles.However, paper for measuring data and recipe data is required. Therefore, the productivity has been reduced due to the quality reduction caused by the particles.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to reduce the burden of processing quality control work on a substrate and to stabilize the quality of the substrate continuously.

[0008]

A substrate processing management apparatus according to the present invention has a function of causing a substrate processing apparatus to execute processing based on data specified in a recipe, and further includes processing performed by the substrate processing apparatus. There is provided a means for receiving data of a processing result measured from the substrate via a communication path from a measuring device, and accumulating the received measurement data in association with recipe data obtained by processing the substrate. This automatically collects data for grasping how the substrate is processed in accordance with the recipe data without generating particles, etc., and without missing necessary data. can do.

[0009] A substrate processing management apparatus according to the present invention comprises:
Means for calculating a relational expression between the recipe data and the processing result data of the substrate from the plurality of measurement data, and display means for displaying a graph of the calculated relational expression and the plurality of measurement data on the same graph screen. Have. Thereby, the processing amount according to the recipe data is statistically analyzed, and the operator can grasp at a glance the variation in the actually measured processing amount with respect to the processing amount originally obtained statistically.

[0010] Further, the substrate processing management apparatus according to the present invention comprises:
Means for calculating a relational expression between the recipe data and the processing result data of the substrate from the plurality of measurement data; means for receiving a quality control rule input by an operator and a target value of the processing result of the substrate; and measurement data received by the receiving means. Means for calculating the recipe data corresponding to the target value by inverting the relational expression calculated using the target value when deviating from the quality control rule; and for the substrate processing apparatus based on the calculated recipe data. And control means for executing processing.

Thus, the amount of substrate processing is automatically managed according to the quality control rules specified by the operator. Then, when the actual processing amount deviates from this rule, recipe data that should achieve the target processing amount (target value) specified by the operator is automatically calculated,
The subsequent processing is performed by the substrate processing apparatus based on the recipe data, whereby the production of defective products is quickly suppressed, and the quality is automatically and real-time stabilized. In the substrate processing management apparatus according to the present invention, the operator can also input and specify the relational expression between the recipe data and the processing result data of the substrate, and can also modify the recipe data according to the rule of thumb. .

Further, in the substrate processing management apparatus according to the present invention, an upper limit value and a lower limit value of the processing result data are set as a quality control rule, and the measurement data received from the measuring device is set to the upper limit value and the lower limit value. Is used, a rule for calculating the corresponding recipe data using the target value is used. As a result, the actual processing amount can be automatically set between the upper limit and the lower limit specified by the operator,
A certain quality of substrate processing can be realized.

Further, in the substrate processing management apparatus according to the present invention, as a quality control rule, when all of a plurality of continuous measurement data received from a measuring device exceed or fall below a target value, a corresponding recipe is used using the target value. Use rules to calculate data. Accordingly, it is possible to predict that the actual processing amount tends to be higher or lower than the target value, correct the recipe data before a large deviation occurs, and realize a substrate processing of a certain quality. .

Further, according to the present invention, a substrate processing apparatus is connected to a substrate processing apparatus and a measuring instrument via a communication line, and the substrate processing apparatus executes processing on the substrate processing apparatus based on data specified in a recipe. Then, the present invention is also realized as a substrate processing management system that manages the quality of the substrate processed by the substrate processing apparatus based on the measurement data obtained from the measuring device. Then, the measuring device measures predetermined processing result data from the substrate processed by the substrate processing apparatus, and the substrate processing management apparatus has the above-described functional units, automatically collects measurement data, and collects recipe data. Achieves stable board quality by automatic correction.

In particular, in stabilizing the quality of the substrate in the present invention, the data of the processing result of the substrate is measured by measuring the substrate processed by the substrate processing apparatus with a measuring device, and a plurality of substrates obtained by the measuring device are measured. Calculates the relational expression between the recipe data and the processing result data of the substrate from the measurement data for the substrate, and calculates the relational expression using the preset target value when the measurement data obtained from the measuring device deviates from the quality control rules. A substrate processing management method is implemented in which recipe data corresponding to the target value is calculated by performing an inverse calculation, and the substrate processing apparatus executes processing based on the calculated recipe data.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be specifically described by the following embodiments. 1 and 2 show an example of a board management system to which the present invention is applied, respectively. FIG.
Is a so-called job shop type, in which a plurality of semiconductor manufacturing apparatuses 1 for performing a film forming process on a semiconductor wafer as a substrate to be processed, and a processing amount of the film forming process performed on the semiconductor wafer ( In this example, a measuring device 2 for measuring the film thickness), a group management device 3 for managing a plurality of semiconductor manufacturing apparatuses 1 using the recipe data and managing the quality of a film formed on a semiconductor wafer, Each semiconductor manufacturing device 1
And a LAN line 4 connecting the measuring device 2 and the group management device 3
And

In such a job shop type system, a worker or an automatic transport vehicle (not shown) transports a semiconductor wafer to the semiconductor manufacturing apparatus 1 which is in charge of a different process and performs the process. Measuring device 2
A predetermined film formation is performed on the semiconductor wafer by repeating the transfer to the semiconductor wafer and measuring the processing amount. In such a series of steps, the group management device 3 communicates with the semiconductor manufacturing device 1 and the measuring device 2 via the LAN line 4 to collect data measured by the measuring device 2 as described later. The collected measurement data is displayed, statistically analyzed, and the recipe data is downloaded to the semiconductor manufacturing apparatus 1 so as to obtain a stable processing amount based on the quality control rules.

The system shown in FIG. 2 is a so-called cluster type, and includes a plurality of processing chambers 5 for forming a film on a semiconductor wafer as a substrate to be processed, a cleaning device 6 for cleaning the semiconductor wafer, and a semiconductor wafer. The units such as the measuring device 7 for measuring the processing amount (in this example, the film thickness) of the film forming process performed in the above and the load lock chamber 8 for loading and unloading the semiconductor wafer are arranged so as to face the center of the polygon. In this central part, a transfer tool 9 for transferring a semiconductor wafer between the units is provided in a cluster tool configuration. Further, this system is connected to a controller 10 that manages the units 5 to 8 and the transporter 9 using the recipe data and manages the quality of film formation applied to the semiconductor wafer, and a cluster tool and the controller 10. LAN line 11 to be connected.

In such a cluster type system, the transporter 9 transports the semiconductor wafers to the units in charge of different processes to perform the processing, and transports the processed semiconductor wafers to the measuring device 7 for processing. By repeatedly measuring the amount, a predetermined film is formed on the semiconductor wafer. In such a series of processes, as described later, the controller 10 communicates with the cluster tool via the LAN line 11 to collect data measured by the measuring device 7, display the collected measurement data, and display statistics. Analysis and download of recipe data to a cluster tool to achieve a stable processing amount based on quality control rules are performed.

FIG. 3 shows a functional configuration of an automatic quality control device (substrate processing control device) according to an example of the present invention. This automatic quality management device is realized as the group management device 3 in the system shown in FIG. 1, and is realized as the controller 10 in the system shown in FIG. The automatic quality control device performs a regression equation by performing a statistical analysis of a relationship between a processing amount data (measurement data) measured from a semiconductor wafer and recipe data and a communication control unit 20 for performing communication with the outside via a communication path. And a storage unit 40 for storing various data such as recipe data and measurement data for correcting the recipe data so as to satisfy the target value of the processing amount.
And a screen control unit 50 serving as an input / output interface for the operator.

The communication control unit 20 is composed of a communication interface, necessary hardware resources and software, and has a processing unit communication unit 21 for communicating with the substrate processing apparatus via a communication path, and a measurement unit via a communication path. Measuring instrument communication means 22 for communicating with the measuring instrument. That is, in the system of FIG. 1, communication with each semiconductor manufacturing apparatus 1 is performed by the processing apparatus communication unit 21 via the LAN line 4,
Communication with the measuring device 2 is performed by the measuring device communication means 22.
Further, in the system shown in FIG.
Communication with each processing chamber unit 5 is performed by the processing device communication unit 21, and the measurement unit 7 is transmitted by the measurement unit communication unit 22.
And communication is performed.

The statistical analysis section 30 is composed of necessary hardware resources and software, and statistically analyzes the relationship between the measurement data of the semiconductor wafer transmitted from the measuring device and the recipe data subjected to the processing. A regression equation determination means for determining a regression equation (relational equation); And statistical analysis means 32 for calculating recipe data corresponding to.

The storage section 40 is constituted by a memory for reading and writing data and holding it in a freely readable manner. The storage section 40 stores a recipe storage file 41 for storing recipe data defining processing conditions for the substrate processing apparatus, and stores measurement data received from a measuring instrument. There are a measurement data file 42 to be stored, a regression equation file 43 to store the determined coefficients of the regression equation, and a quality control rule file 44 to store the target value (film thickness in this example) and the quality control rules. doing.

The screen control unit 50 comprises a display device and a well-known input / output interface device such as a pointing device or a key device. And a display means 52 for displaying on the screen.

In this example, the measurement data from the measuring device is collected by a procedure as shown in FIGS. 4 to 7, and a regression equation indicating the relationship between the processing amount and the processing time of the recipe data is determined. Judge whether the measured data value is out of control based on the quality control rules, and in the case of out of control, correct the processing time of the recipe data based on the regression equation so as to satisfy the target value, and process the substrate. The process of downloading to the device is automatically performed.

Here, in this example, a temperature set value for defining a heating temperature and a heating processing time based on the temperature set value are defined as recipe data. A plurality of types of recipe data are identified by recipe names and stored in the recipe storage file 41 in advance. As shown in FIG. A combination with the processing time is set in advance by using the recipe data. The quality control rules and target values are input by the operator as described later and stored in the quality control rule file 44 in advance. As shown in FIG. A plurality of quality management rules and target values are set in advance.

Explaining the contents of the quality control rule file 44, the target value is a target value of the film thickness which is the processing amount, and the upper limit value and the lower limit value are the limit values that can be regarded as normal in quality control. , And the number of designated data is determined by each rule No. Is the number of measurement data to be read in the processing of the rule No .. Indicates whether is currently specified. Rule No. shown in FIG. Rule 1 is a rule that, when the measured data of the current process exceeds the upper limit value or falls below the lower limit value, changes the recipe data subjected to the process to satisfy the target value for the next process. .
Rule No. 2 and Rule No. The rule of 3 is that if the measurement data of this process is biased above or below the target value,
This is a rule in which the recipe data that has been subjected to the process is changed so as to satisfy the target value for the next process, assuming that there is a tendency to deviate from the limit value. That is, the rule No. 2
Is a rule for changing the recipe data when the film thicknesses for the specified number of recent measurement data, including the current processing, all exceed the target value. Reference numeral 3 denotes a rule for changing the recipe data when the film thickness for the number of designated data of recent measurement data is less than the target value, including the current processing.

First, the recipe data stored in the recipe storage file 41 specified by the operator from the input means 51 is transmitted to the communication path by using the functions of the automatic quality control device as the group control device 3 and the controller 10. The process of the main control shown in FIG. 4 is started by downloading to the substrate processing apparatus via the CPU. As described above, when the recipe data is downloaded and the processing by the substrate processing apparatus is started, the automatic quality control apparatus is in a state of waiting for a processing end notification from the substrate processing apparatus (step S1). Then, when a process end notification is received via the communication path and the processing device communication means 21 (step S2), the recipe name and data contents (temperature set value and processing time) of the recipe data in charge of the process are stored in the measurement data file 42. (Step S3).

Next, the automatic quality control device enters a state of waiting for reception of measurement data on the substrate (semiconductor wafer in this example) on which the processing has been performed (step S4). When the data (in this example, the film thickness) is received as measurement data via the communication path and the measuring instrument communication means 22 (step S5), the measurement data is associated with the recipe data in charge of the processing, and the measurement data file is received. 42 (step S
6). That is, as shown in FIG. 9, an example of the dry oxidation process is that the measurement data (that is, the film thickness value) is the name (recipe name) of the recipe responsible for the process and the data content (that is, the temperature setting value and the process value). Time).

Next, the automatic quality control device determines a regression equation showing the relationship between the measurement data and the processing time of the recipe data using the plurality of measurement data stored in the measurement data file 42 (step S7). More specifically, in this example, as described later, the regression equation determination means 31 executes an arithmetic process using the least squares method according to the procedure shown in FIG. To be stored.

Next, as described later, the statistical analysis means 32
Performs a statistical analysis process according to the procedure shown in FIGS. 6 and 7 (step S8), evaluates the measurement data obtained by the current process using the quality control rules and target values,
If the quality control rule is not satisfied, the recipe data in charge of the current process is changed using the corresponding regression equation, and this is stored in the recipe storage file 41.

Next, a control means (not shown) attached to the recipe storage file 41 and the processing device communication means 21 determines whether or not the recipe data has been changed by the above-described statistical analysis processing (step S9). Is changed, the changed recipe data is downloaded from the communication means 21 to the substrate processing apparatus via the communication path (step S10). As a result, the substrate processing apparatus performs the next processing on the substrate using the changed recipe data, and performs processing that satisfies the target value on the substrate to be processed. Therefore, if the desired film thickness cannot be obtained as a result of processing the substrate in a certain process cycle,
In the next process cycle, the processing is automatically executed in accordance with the changed recipe data, so that the desired film thickness can be quickly processed.

The above-described regression equation determination processing (step S
7) will be described in detail. First, as shown in FIG. 5, a measurement data value y which is the same as the recipe name and the temperature set value of the recipe data processed this time is measured from the measurement data file 42.
And all the processing times x are read and taken into the calculation buffer of the statistical analysis means 32 (steps S11 to S11).
14). Next, based on the data captured in the calculation buffer, the product sum S (x
y), and the sum of squared deviations of processing time x S (xx)
Is calculated, and the regression coefficient b is calculated by dividing the product sum of the processing time and the film thickness by the sum of the squared deviations of the processing time (step S15). In this example, the relationship between the processing time x and the film thickness y is set to y = a + bx. However, the present invention can be applied to various other relationships such as a curved relationship. it can.

Next, the average value of the film thickness y is calculated.
An average value of the processing time x is calculated, and a value obtained by multiplying the average value of the processing time by the regression coefficient b is subtracted from the average value of the film thickness to calculate a y intercept a (step S16). Then, the calculated y-intercept a of the zero-order coefficient and the regression coefficient b of the first-order coefficient are stored in the regression equation file 43 (step S17). That is, as shown in an example of the case of the dry oxidation process in FIG. 11, the calculated y-intercept a and the regression coefficient b are stored in the regression equation file 43 in association with the name of the corresponding recipe (recipe name). , And subsequent statistical analysis processing (step S8)
Is used to change the processing time of the recipe data. Note that such y-intercept a and regression coefficient b are
An operator may input a desired value from the input means 51 and store the desired value in the regression equation file 43 so as to use it for the process of changing recipe data.

Here, the above calculation processing (step S1)
5, S16) will be described in more detail. In this process, as shown in FIG. 10, coefficients a and b along the tendency of a plurality of measurement data values having a variation are determined in the relationship of y = a + bx. An operation is performed. That is, in the relation y = a + bx, by the least square method, Q = Σ ｛y
_i− (a + bx _i )｝ ² is determined such that a and b are minimized, and the regression coefficient b is calculated as the product sum S of x and y.
(xy) and the sum of squared deviations of x S (xx), b = S
(xy) / S (xx), and the y-intercept a is calculated from the average value of y, the average value of x, and the regression coefficient b as follows:
It is determined by b * (average value of x).

The above-described statistical analysis processing (step S
8), first, as shown in FIG. 6, first, the quality management rule No. designated by the operator from the quality management rule file 44. Is determined (step S21), and the rule No. is determined. (Step S22). This rule No. (Step S22) according to the rule No. shown in FIG. Description will be made using the processing of No. 2.

First, rule no. 2 is stored in the quality management rule file 44 as shown in FIG. 2 and the target value of data that matches the recipe name of the recipe data processed this time is read (step S3).
1). Next, the measured data value and the processing time of the data corresponding to the recipe name of the recipe data processed this time are read from the measured data file 42 for the specified number of data (step S).
32 to S34).

Next, it is determined whether or not all the read measurement data values exceed the target value (step S35). If the measurement data values do not exceed the target value, the measurement data does not tend to exceed the limit value. Leave as is and do not change. On the other hand, if the measured value exceeds the target value, the measured data tends to exceed the limit value. To prevent this, the recipe data is changed so as to approach the target value.

That is, the difference Δy between the latest measured data value obtained for the current process and the target value is calculated (step S).
36) Then, the regression coefficient b of the data that matches the recipe name of the recipe data used in the current process is read from the regression equation file 43 (step S37). Next, the difference Δy is divided by b to calculate a change Δx in the processing time of the recipe data (step S38), and the processing time x of the current recipe data is calculated.
Then, the processing time x of the recipe data to be used in the next processing is determined by subtracting Δx from the processing time, and the processing time of the corresponding data in the recipe storage file 41 is changed to the determined processing time x (step S39). As a result, the changed recipe data is downloaded to the substrate processing apparatus, and even if the result actually processed by the substrate processing apparatus tends to deviate from the expected value, the target value specified by the operator is set. Modifications are made to meet.

FIG. 8 shows a procedure of input / output processing performed by the screen control unit 50. When the automatic quality control device is started, the screen control unit 50 is in a state of waiting for input (step S41), and when an input from the operator is received from the input unit 51 (step S42), the input type of this input is determined. (Step S43). As a result, if the input type is recipe registration (step S
44), the display means 52 displays a recipe registration screen as shown in FIG. 14 (step S45). Then, when the operator inputs the recipe name, the temperature set value, and the processing time from the input unit 51, these data are received (step S46), and the data is stored in association with each other as shown in FIG. File 41
(Step S47).

On the other hand, if the input type is statistical analysis (step S48), necessary measurement data is read from the measurement data file 42 (step S49), and necessary regression equation coefficients are read from the regression equation file 43 (step S48). S50). Then, a graph of a relational expression suitable for satisfying the target value is created using the regression coefficient (step S51), and the display means 52 displays the graph and the measured data value on the same graph screen as shown in FIG. (Step S
52). Thereby, the operator can grasp at a glance the measurement data accumulated in the measurement data file 42 and the tendency graph which can realize the target value in relation to the measurement data.

On the other hand, if the input type is the registration of a quality management rule (step S53), the display means 52 displays a quality management rule registration screen as shown in FIG. 16 (step S54). Then, a name (recipe name) of the recipe data to which the rule is applied, a target value, an upper limit value, a lower limit value, and
Rule No. Is input (step S55), and these data are stored in the memory shown in FIG.
As shown in FIG. 2, they are stored in the quality management rule file 44 in association with each other (step S56). This allows
The operator can arbitrarily set a quality control rule for a desired recipe.

In the above-described example, each functional unit according to the present invention is configured using the computer system constituting the group management device 3 and the controller 10. In the present invention, each functional unit is provided by a dedicated circuit. Or a device. Further, in the above example, the processing time is corrected according to the film thickness of the processing result using the temperature set value and the processing time as the recipe data.
The temperature set value may be corrected, the value may be corrected as recipe data including a gas flow rate or the like, or the measured data may be the film quality of the substrate. In short, there is no particular limitation as long as the recipe data is set in the substrate processing apparatus, and the measurement data is not particularly limited as long as the processing result is to be inspected.

[0044]

As described above, according to the present invention,
Since the measurement data of the processing amount can be automatically collected by communication, labor and labor costs of workers can be reduced, and errors or omission of data registered for quality control can be prevented. it can. Further, since paperlessness which is strongly demanded in a semiconductor manufacturing line can be realized, particles can be reduced, the quality (yield) of an object to be processed can be improved, and production efficiency can be increased.

Further, according to the present invention, the operator can easily grasp the relationship between the processing amount and the recipe data, and can easily know the recipe data for obtaining the required processing amount. . Therefore, it is possible to easily and appropriately adjust the processing amount of the new processing type. Further, according to the present invention, it is possible to perform quality control according to a quality control rule desired by an operator. In addition, since the quality can be stabilized by automatically and in real time changing the recipe data, the burden on the quality control work can be reduced, the occurrence of defective products can be suppressed, and the production efficiency can be greatly improved.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of a board management system to which the present invention is applied.

FIG. 2 is a diagram showing another example of the board management system to which the present invention is applied.

FIG. 3 is a functional configuration diagram showing an automatic quality management device according to an example of the present invention.

FIG. 4 is a flowchart illustrating a procedure of a main control process according to an example of the present invention.

FIG. 5 is a flowchart illustrating a procedure of a regression equation determination process according to an example of the present invention.

FIG. 6 is a flowchart illustrating a procedure of a statistical analysis process according to an example of the present invention.

FIG. 7 is a flowchart illustrating a procedure of a quality management process according to an example of the present invention.

FIG. 8 is a flowchart illustrating a procedure of a screen control process according to an example of the present invention.

FIG. 9 is a diagram showing a measurement data file structure according to an example of the present invention.

FIG. 10 is a graph illustrating a regression equation calculation process according to an example of the present invention.

FIG. 11 is a diagram showing a regression equation file structure according to an example of the present invention.

FIG. 12 is a diagram showing a quality management rule file structure according to an example of the present invention.

FIG. 13 is a diagram showing a recipe storage file structure according to an example of the present invention.

FIG. 14 is a diagram showing a recipe registration screen according to an example of the present invention.

FIG. 15 is a diagram showing a statistical analysis screen according to an example of the present invention.

FIG. 16 is a diagram showing a quality management rule registration screen according to an example of the present invention.

[Explanation of symbols]

3 ... group management device, 2, 7 ... measuring device, 4, 1
1 ... LAN line, 20 ... communication control unit, 21
..Processing device communication means, 22 ... measurement device communication means,
30: statistical analysis unit, 31: regression equation determination means,
32: statistical analysis means, 40: storage unit, 41
..Recipe storage file, 42 ... Measurement data file, 43 ... Regression equation file, 44 ... Quality control rule file, 50 ... Screen control unit, 51 ...
.Input means, 52 display means,

Claims (8)

[Claims] 1. A substrate processing management apparatus for causing a substrate processing apparatus to execute processing based on data specified in a recipe, wherein data of a processing result measured from a substrate processed by the substrate processing apparatus is transmitted from a measuring device to a communication path. And a storage unit for storing measurement data received by the reception unit in association with recipe data that has processed the substrate, and storing the measurement data. 2. The substrate processing management apparatus according to claim 1, wherein: means for calculating a relational expression between the recipe data and the processing result data of the substrate from a plurality of measurement data; a graph of the calculated relational expression; And a display means for displaying the measurement data on the same graph screen. 3. The substrate processing management apparatus according to claim 1, wherein: means for calculating a relational expression between the recipe data and the processing result data of the substrate from a plurality of measurement data; a quality control rule and a substrate processing input by an operator. Means for receiving the target value of the result, and when the measurement data received by the receiving means deviates from the quality control rule, the recipe data corresponding to the target value is calculated by back-calculating the relational expression calculated using the target value. A substrate processing management apparatus further comprising: a calculating unit; and a control unit that causes the substrate processing apparatus to execute a process based on the calculated recipe data. 4. The substrate processing management apparatus according to claim 1, wherein: means for receiving a relational expression between recipe data input by the operator and processing result data of the substrate; quality control rules and substrate processing result data input by the operator. Means for receiving the target value of, and means for calculating the recipe data corresponding to the target value by back-calculating the relational expression using the target value when the measurement data received by the receiving means deviates from the quality control rule. And a control means for causing the substrate processing apparatus to execute processing based on the calculated recipe data. 5. The substrate processing management apparatus according to claim 3, wherein the quality management rule sets an upper limit value and a lower limit value of the processing result data, and the measurement data received by the receiving unit is set to the upper limit value and the lower limit value. A substrate processing management apparatus characterized by a rule for calculating corresponding recipe data using a target value when the value deviates from between an upper limit value and a lower limit value. 6. The substrate processing management apparatus according to claim 3, wherein the quality control rule is such that when all of a plurality of continuous measurement data received by the receiving means exceed or fall below a target value, the target value is set to a target value. A substrate processing management device, wherein the rule is a rule for calculating corresponding recipe data by using a rule. 7. A substrate processing management apparatus is connected to a substrate processing apparatus and a measuring instrument via a communication line, and the substrate processing management apparatus causes the substrate processing apparatus to execute processing based on data specified in a recipe. A substrate processing management system that manages the quality of a substrate processed by the substrate processing apparatus based on the measurement data obtained from the measuring apparatus, wherein the measuring device measures predetermined processing result data from the substrate processed by the substrate processing apparatus. A substrate processing management device, receiving means for receiving measurement data from the measuring device via a communication path, and storage means for storing the measurement data received by the receiving means in association with data of a recipe that has processed the substrate; Means for calculating a relational expression between recipe data and substrate processing result data from a plurality of measurement data; a quality control rule input by an operator; Means for receiving, and means for calculating recipe data corresponding to the target value by back-calculating the relational expression calculated using the target value when the measurement data received by the receiving means deviates from the quality control rule. Control means for causing the substrate processing apparatus to execute processing based on the calculated recipe data. 8. A substrate processing management system that causes a substrate processing apparatus to execute processing based on data specified in a recipe and manages the quality of a substrate processed by the substrate processing apparatus based on measurement data obtained from a measuring device. A method comprising: measuring a substrate processed by a substrate processing apparatus with a measuring device to measure data of a processing result of the substrate; and measuring recipe data and a substrate based on measurement data of a plurality of substrates obtained by the measuring device. Calculates the relational expression with the processing result data of the above, and when the measurement data obtained from the measuring device deviates from the quality control rules, the relational expression is inversely calculated using the preset target value, and the recipe corresponding to the target value is calculated. A substrate processing management method, comprising: calculating data; and causing a substrate processing apparatus to execute processing based on the calculated recipe data.