JPH11174688A - Method and device for chemical treatment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an even chemical treatment without generating spotted unevenness due to bubbles and mist by supplying chemical on a material to be treated, and carrying it for the predetermined time while holding the chemical. SOLUTION: A material to be treated is carried on a pass line 6 from left to right, while being treated by chemical. The chemical is supplied from a chemical supplying means 1 so as to form a chemical layer on the material to be treated. The material to be treated is carried while holding the chemical and chemical treatment is performed is carrying. The degradated chemical by treating the material to be treated is replaced with new chemical by a chemical replacing means 3, and chemical treatment of the material to be treated is further proceeded. Then the chemical is eliminated from the material to be treated by a washing shower 4 to finish the chemical treatment of the material to be treated. Finally, a water cutting means 5 such as an air knife squeeze water on the material to be treated to finish all the process of the chemical treatment. Carrying method is selected in response to the shape of the material to be treated, and a method for horizontally holding the material to be treated is desirable.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chemical liquid processing apparatus particularly suitable for use in a process for manufacturing a color filter for a liquid crystal display.

[0002]

2. Description of the Related Art In the process of manufacturing a color filter for a liquid crystal display, a positive or negative photosensitive resin colored with a pigment or the like is applied on a substrate, or a photosensitive resin is coated on a colored non-photosensitive resin. Coating in a laminated state, exposure,
The photolithography method for development is dominant. In the photolithography method, there are many steps using a chemical such as a cleaning step, a developing step, and a stripping step, and various methods such as a spin method, a shower method, and a dip method are selected according to the type and step of the chemical solution.

[0003] JP-A-5-119482, JP-A-Hei-8
Japanese Patent Application Laid-Open No. 44075/1999 proposes a developing method using a spin method. The spin method is a method in which a substrate is rotated, a chemical solution is dropped on a central portion of the substrate, the chemical solution is radially spread, and the chemical solution penetrates the entire substrate.

[0004] The shower method is a method in which a chemical solution is applied to the entire substrate by using a plurality of nozzles for ejecting the chemical solution in a linear manner, and is permeated.

[0005] The dip method is a method in which a chemical solution is stored in a processing tank and the substrate is put into the tank so that the chemical solution permeates the entire substrate.

However, the conventional method has the following problems.

[0007] As an example, the development process of a color filter is as follows. It is difficult to change the processing time by the spin method, and it is dangerous to rotate a large-sized substrate at a high speed. In such a case, there is a problem that the operation rate may be reduced.

In the dip method, the developing state of the substrate gradually changes as the supplied new liquid gradually degrades. There were problems such as a difference in the processing state.

In the shower system, the variation in the development state in the substrate surface has been improved, but there have been problems such as foaming and mist being generated by the shower, causing spot-like unevenness on the substrate.

[0010]

An object of the present invention is to provide a chemical solution processing method and a chemical solution processing apparatus which can improve the drawbacks of the prior art and can uniformly treat a chemical solution and eliminate spot-like unevenness caused by foam or mist. With the goal.

[0011]

In order to achieve the above object, the present invention employs the following means.

(1) A chemical liquid processing method characterized in that a chemical liquid is supplied onto an object to be processed, and the chemical liquid is conveyed for a predetermined time while holding the chemical liquid on the object to be processed, whereby the chemical processing is performed on the object. (2) Means for supplying a chemical solution onto the object to be processed, means for transporting the chemical solution over the object to be processed for a predetermined time, and replacement of the chemical solution held on the object with a newly supplied chemical solution A chemical processing apparatus comprising: means.

(3) A partition is provided between a section for transporting the chemical solution while holding it on the workpiece and a means for replacing the chemical solution on the workpiece with a newly supplied chemical solution. Item 3. The chemical solution treatment device according to Item 2.

(4) A section having a plurality of processing tanks for transporting the chemical solution while holding it on the processing object and a means for replacing the chemical solution on the processing object with a newly supplied chemical liquid are provided in another processing tank. The chemical treatment device according to the above (2), which is provided.

(5) The chemical processing apparatus according to (2), wherein the means for newly supplying a chemical is a shower system.

(6) The chemical processing apparatus according to (2), wherein the object to be processed is a glass substrate.

(7) The chemical processing apparatus according to any one of (2) to (6), which is a developing apparatus.

(8) The chemical processing apparatus according to any one of (2) to (6), which is a peeling apparatus.

(9) The chemical processing apparatus according to any one of the above (2) to (6), which is a cleaning apparatus.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As described above, a chemical solution processing method according to the present invention supplies a chemical solution onto an object to be processed, and conveys the chemical solution on the object for a predetermined time while holding the chemical solution. Is subjected to a chemical treatment.

As described above, the shower system has an advantage that a chemical solution can be uniformly processed in a plane. The term “in-plane uniformity” as used herein means, for example, that there is no difference in the development speed within the substrate surface and that the in-plane variation in the pixel width after development is small. However, (a) the mist generated from the shower adheres to the substrate before processing, and the part where the mist adheres is quickly treated with the chemical solution. (B) The bubbles generated from the shower adhere to the substrate surface, and the bubbles adhere. Spot-like unevenness is likely to occur because the part is not treated with the chemical solution. Although the in-plane variation of the pixel width is small, there is a spot-like mark locally and the quality is inferior.

In the present invention, in order to prevent the drawbacks (a) and (b), the surface of the substrate is covered with a chemical before the shower treatment so that mist and air bubbles do not directly adhere to the substrate surface. That is, the entire surface of the substrate being transported is covered with a chemical solution, and the substrate is transported for a predetermined time while the chemical solution is held on the workpiece. Preferably, by providing a plurality of means for supplying the chemical before the shower, it is possible to hold the chemical while transporting.

Further, the present invention adopts a structure in which the substrate surface is covered with a chemical solution before the above-mentioned shower process so that mist and bubbles do not directly adhere to the substrate surface, so that the chemical solution process starts slowly. Therefore, the uniformity of the chemical treatment is improved.

Next, the chemical solution processing apparatus of the present invention comprises a means for supplying a chemical solution onto the object to be processed, a means for transporting the chemical solution on the object to be processed for a predetermined time, And a means for replacing the chemical solution held in the device with a newly supplied chemical solution.

The chemical solution covering the substrate deteriorates because the chemical solution treatment is performed during the transportation. Therefore, in the present invention, replacement with a newly supplied chemical solution is performed. Note that, in the present invention, the term “substitution” includes a case in which most of the chemical solution held on the substrate is replaced, but a region very near the substrate surface is not replaced.

Further, according to the present invention, in the above chemical processing apparatus, the interval between the section for transporting the chemical while holding it on the workpiece and the means for replacing the chemical on the workpiece with a newly supplied chemical is provided. And a partition wall.

According to the present invention, there is provided the above-described chemical processing apparatus, comprising a plurality of processing tanks, a section for transporting the chemical while holding the chemical on the workpiece, and a new supply of the chemical on the workpiece. It is characterized in that a means for replacing with a chemical solution is provided in another processing tank.

An ordinary chemical processing apparatus employs a configuration in which a plurality of units (processing tanks) are connected. The partition walls have a structure in which a partition plate is simply provided in the same unit. However, as described above, by separating the portions partitioned between the partition walls into independent units, only the space where the substrate passes between the units is provided. Are connected as openings, so that the mist prevention effect is higher than that of the partition walls.

The chemical processing apparatus of the present invention can be used as a developing device, a peeling device, or a cleaning device. Although an example in which the developing device is used is described in an embodiment described later, the developing device may be used as a peeling device or a cleaning device. That is, it is the same as the developing device in the sense that the resist, dirt, and the like on the substrate surface are removed by using a chemical solution, and can be used as a chemical solution processing step in a color filter manufacturing process.

Hereinafter, preferred embodiments of the present invention will be described.

The effect of the chemical processing apparatus of the present invention is not impaired even if it is used for all or a particularly limited part of the chemical processing apparatus. When used as a part of an apparatus, a conventional chemical solution processing method may be appropriately selected and combined according to the type and purpose of the object to be processed.

As the transfer method applied in the present invention, there are a transfer roller, a transfer machine, a transfer arm, a suction table and the like, which are appropriately selected depending on the form of the object to be processed, but a method capable of holding the object horizontally. Is preferred.

The object to be treated is particularly effective for a glass substrate or the like having a flat surface, but the surface form of the object to be treated is such that it can be transported while holding the chemical at the part where the chemical treatment is performed. Is not particularly limited.

The object to be processed is subjected to the chemical treatment while being conveyed from left to right on the pass line 6 of the apparatus shown in FIG.

The object to be processed, which has been introduced into the apparatus, is first supplied with a chemical solution from the chemical solution supply means 1, and a chemical layer is formed on the object to be processed.

The object to be processed is transported while holding the chemical solution,
During this time, the chemical treatment is performed.

The chemical solution on the object to be processed, which has been deteriorated by the chemical processing, is replaced by a new chemical solution by the chemical replacement means 3, and the chemical processing of the object is further advanced.

Next, the chemical is removed from the object by the washing shower 4, and the chemical treatment of the object is completed.

Finally, the water on the object to be treated is removed by the draining means 5 such as an air knife, and the whole process of the chemical solution treatment is completed.

The method of supplying the chemical solution to the object to be processed is not particularly limited with an aqua knife, a roll coater, a die coater or the like, but a method capable of stably controlling the supply amount and the supply position is preferable. Mist and air bubbles must not be generated. The supply amount of the chemical varies depending on the type and size of the object to be treated, the type of the chemical, the purpose of the treatment, and the like, and is not particularly limited.
The liquid is preferably held at a thickness of １５15 mm, more preferably 2 好 ま し く 8 mm. If the value is smaller than the above-mentioned value, there is a concern that the liquid may run out during the conveyance.

In the case of the photolithography process of a color filter for a liquid crystal display in which the present invention is particularly preferably used, in the step of developing a photosensitive resin and / or a non-photosensitive resin after exposure, sodium hydroxide is preferably used. ,
An aqueous solution of an inorganic alkali such as potassium hydroxide or an aqueous solution of an organic alkali such as tetramethylammonium hydroxide (hereinafter abbreviated as TMAH) is preferably used, but is not particularly limited.

Similarly, in the peeling step after the development, although not particularly limited, propylene glycol monomethyl ether acetate (hereinafter abbreviated as PGMEA), ethylene glycol monomethyl ether acetate (hereinafter abbreviated as MCA)
Etc. are preferably used.

In the washing step, an aqueous solution containing anionic, cationic and nonionic surfactants, pure water or water, ozone water and the like are preferably used.

The concentration of the chemical solution may be appropriately determined according to the type of the chemical solution and the purpose of the treatment, but the concentration of the chemical solution to be supplied first and the concentration of the chemical solution to be replaced later may be changed. If the concentrations of the chemicals are the same, the device configuration is simplified. Further, if the concentration of the chemical solution is changed, the configuration of the apparatus becomes slightly complicated. For example, an initial rapid chemical solution treatment is prevented by first holding the workpiece with a low-concentration chemical solution or a pure solvent (concentration 0%). Various processing effects can be expected.

As means for supplying a new chemical solution and replacing the chemical solution held on the object to be processed, the above-mentioned Aqua knife,
A shower system is particularly preferably used in addition to the die coater and the roll coater. Even if the shower method is used as the chemical liquid replacement means, since the chemical liquid is held on the workpiece in advance,
Spot-like treatment unevenness due to mist or foam directly adhering to the object to be treated is unlikely to occur, and the use of the shower method has the advantage of a uniform chemical treatment capability, which is an advantage of the method, so that the chemical solution has increased uniformity. Processing becomes possible.

When the shower system is used as the chemical replacement means, it is preferable to first increase the distance between the means for supplying the chemical and the chemical replacement means. It is more preferable to provide a partition before the shower method, and it is more preferable to provide a plurality of treatment tanks and separate the shower method. First, the distance between the means for supplying the chemical solution and the means for replacing the chemical solution by the shower method is short, and if there is no partition before the shower method, the mist will be applied before the chemical solution is held on the workpiece. It may adhere to the processed material and impair the effects of the present invention.

According to the present invention, the object to be treated is treated with a chemical by holding and transporting the solution on the object to be treated, and then a new solution is supplied to replace the solution on the object to be treated. It was confirmed that the treatment object could be uniformly treated with the chemical solution. Furthermore, it was confirmed that the use of the shower system as the chemical solution replacement means enabled a more uniform chemical solution treatment, and suppressed spot-like process unevenness due to mist and foam, which were disadvantages of the conventional shower system. .

[0048]

EXAMPLES The present invention will be described based on examples, but the effects of the present invention are not limited by the examples.

FIG. 1 is a schematic view of an apparatus according to one embodiment of the present invention. Reference numeral 1 denotes an aqua knife as a first chemical liquid supply means, 2 denotes a partition of a developing tank, 3 denotes an aqua knife as a chemical liquid replacement means, 4 denotes a developing stop washing shower, 5 denotes an air knife for draining liquid, and 6 denotes a pass line.

FIG. 2 is a schematic diagram of an apparatus used in Embodiment 2 of the present invention. Numeral 1 is an aqua knife as a first chemical liquid supply means, 2 is a partition of a developing tank, 3 is a chemical liquid shower as a chemical liquid replacement means, 4 is a development stop rinsing shower, 5 is a liquid drain air knife, and 6 is a pass line. The difference from the apparatus in FIG. 1 is that a shower system is used as the chemical liquid replacement unit.

FIG. 3 is a schematic view of a conventional shower system used in a comparative example of the present invention. 2 is a partition of the developing tank, 3
Is a chemical solution shower, 4 is a developing stop washing shower, 5 is an air knife for draining, and 6 is a pass line.

FIG. 3 shows a shower having a two-stage configuration. However, in a system in which a chemical solution flows on a substrate such as a shower system, the chemical solution cannot be held and transported on the substrate. In the present invention, the first chemical liquid supply means is for supplying a small amount of mist or air bubbles in order to form a chemical liquid layer on a substrate, and the first chemical liquid supply method is a shower type. Then, it is difficult to form a chemical solution layer on the substrate.

[Example 1] The first chemical solution supply means and the first chemical solution replacement means were examined using the aqua knife method.

Using a die coater, a black paste or a color paste was applied to 370 × 470 mm ² size non-alkali glass using a die coater. The black paste (hereinafter referred to as BM) and the color paste are prepared by dispersing carbon black or red, blue and green (hereinafter referred to as R, G and B) pigments in a non-photosensitive polyimide precursor (polyamic acid). Using.

The coated substrate is heat-treated with a hot plate, and further subjected to a positive resist (Sh) using a die coater.
(Ipley's RC-100) was applied in a layered form, and heat treatment was performed again using a hot plate.

The heat-treated substrate was exposed through a photomask to expose the resist in a predetermined pattern.

The exposed substrate was put into the apparatus shown in FIG. 1 and developed. A room temperature TMAH dilute aqueous solution was used as a developer. By adjusting the transport speed, the developing time was adjusted so that the pattern width became the target value.

The substrate after development was stripped of the unexposed resist with a spin stripper, and then heat-treated on a hot plate. MCA was used as the stripping solution.

The evaluation was made on the development accuracy and development quality. The development accuracy was determined by measuring the pattern width with a microscope and evaluating the in-plane distribution of the pattern width. The development quality was visually inspected with transmitted light and reflected light, and evaluated by the presence or absence of spot-like unevenness.

Example 2 The same study as in Example 1 was conducted, except that an aqua knife was used as the first chemical liquid supply means, and the developing device shown in FIG. 2 was used as the chemical liquid replacement means.

COMPARATIVE EXAMPLE The developing device of FIG. 3 using a conventional shower system was examined in the same manner as in Example 1 except for the above.

[Comparison of Developing Accuracy] Examples 1 and 2 were evaluated with reference to a comparative example of the conventional system (（). Table 1 shows the results.

In Example 1, although the developing accuracy of BM and B was almost the same as that of the comparative example, the developing accuracy of R and G was improved irrespective of the fact that the shower method was not used.

In the embodiment 2 in which the shower system was adopted as the chemical liquid replacement means, the development accuracy was improved in all of BM, R, G and B, and particularly in the case of BM and G, good development accuracy was obtained.

From the above, it was confirmed that the present invention improves the developing accuracy as compared with the prior art, and in particular, that the developing accuracy is improved when the shower system is used as the chemical liquid replacement means.

[Comparison of Developing Grade] As in the case of developing accuracy, the comparative examples of the conventional method were used as a reference (○) in Examples 1 and 2
Was evaluated. Table 1 shows the results.

In Example 1 in which the shower system was not used, there was no spot-like unevenness. Also, in Example 2 in which the shower method was also used, the spot-like unevenness was improved in all the colors BM, R, G, and B.

From the above, it was confirmed that even when the shower method was used, the spot-like unevenness was improved by the present invention.

[0069]

[Table 1]

[0070]

The chemical treatment apparatus of the present invention can uniformly treat an object to be treated without using a shower system. When the shower system is used together, the chemical solution treatment can be performed with further increased uniformity, and the spot-like unevenness caused by mist or foam, which is a disadvantage of the conventional shower system, can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic view of an example of the apparatus of the present invention used in Example 1.

FIG. 2 is a schematic view of an example of the apparatus of the present invention used in Example 2.

FIG. 3 is a schematic view of a conventional apparatus used as a comparative example.

[Explanation of symbols]

 1: Initial chemical liquid supply means 2: Partition of developing tank 3: Chemical liquid replacement means 4: Development stop rinsing shower 5: Liquid knife air knife 6: Pass line

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 21/30 572B (72) Inventor Masahiro Yoshioka 1-1-1, Sonoyama, Otsu-shi, Shiga Pref. ) Inventor, Takehiro Kakinuki 1-1-1, Sonoyama, Otsu, Shiga Prefecture Toray Industries, Ltd.Shiga Plant (72) Inventor Shinji Tomimatsu 1-1-1, Sonoyama, Otsu, Shiga Prefecture, Toray Corporation, Shiga Plant

Claims (9)

[Claims] 1. A chemical liquid processing method comprising: supplying a chemical liquid onto an object to be processed; and transporting the chemical liquid over the object to be processed for a predetermined time while holding the liquid chemical on the object to be processed. 2. A means for supplying a chemical solution onto an object to be processed, a means for transporting the chemical solution on the object to be processed for a predetermined time, and a new supply of the chemical solution held on the object to be processed. A chemical treatment apparatus, comprising: means for replacing with a chemical. 3. A partition is provided between a section for transporting a chemical solution while holding it on an object to be processed and means for replacing the chemical solution on the object with a newly supplied chemical solution. Item 3. The chemical solution treatment device according to Item 2. 4. A separate processing tank having a plurality of processing tanks and a section for transporting a chemical solution while holding it on a processing object, and a means for replacing the chemical solution on the processing object with a newly supplied chemical solution. 3. The chemical processing apparatus according to claim 2, wherein the chemical processing apparatus is provided. 5. The chemical processing apparatus according to claim 2, wherein the means for newly supplying a chemical is a shower system. 6. The chemical processing apparatus according to claim 2, wherein the object to be processed is a glass substrate. 7. A developing device according to claim 2, wherein said developing device is a developing device.
7. The chemical processing apparatus according to any one of claims 6 to 6. 8. The apparatus according to claim 2, wherein said apparatus is a peeling device.
7. The chemical processing apparatus according to any one of claims 6 to 6. 9. The cleaning device according to claim 2, wherein the cleaning device is a cleaning device.
7. The chemical processing apparatus according to any one of claims 6 to 6.