JPH1116974A - Abnormal light-emitting part specifying method of lsi and its equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To detect only abnormal light-emitting from an LSI and uniquely recognize an abnormal light-emitting part. SOLUTION: By an emission microscope equipment installed in a black box 100, a pattern image of a sample 106 is image picked up and stored in an image memory 15a. By an LSI tester 108, the sample is set in the state of imperfect operation, and an imperfect operation light-emitting image is image picked up and stored in an image memory 15b. The sample is set in a state of acceptable product operation, and a perfect acceptable light emitting image is image picked up and stored in an image memory 15c. The light-emitting images in the image memories 15b and 15c are inputted in a difference image processing means 11, and a light emission difference image between both of the generated images is stored in an image memory 15d. By a superposition processing means 12, the pattern image of the memory 15a and the light emission difference image of the memory 15d are subjected to superposition processing, and the result is displayed on a display screen. Thereby an abnormal light-emitting part is uniquely specified.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for identifying a failure location of an LSI, and more particularly to a technique for identifying an abnormal light emission location using an emission microscope.

[0002]

2. Description of the Related Art Heretofore, this type of LSI fault location method is to apply a DC voltage to an LSI set in an emission microscope to make it a static operation state, or to connect a test pattern by connecting to an LSI tester. An abnormal light emission from an LSI is detected by an emission microscope in a state in which a defective state is reproduced as a function operation state in which the vehicle is run, and a failure portion is specified.

FIG. 16 is a block diagram showing a configuration of a conventional emission microscope system, and FIG. 17 is a flowchart showing a procedure for specifying an abnormal light emission portion of an LSI by the emission microscope system shown in FIG.

In FIG. 16A, a microscope 101, a detector 102 for capturing an LSI pattern image and a light emission image, a light source 103 for observing an LSI pattern image, and a light source 103 are provided in a dark box 100. An XYZ stage 104 for controlling the positions of the microscope and the detector and an xyzθ stage 105 for mounting and controlling the position of an LSI sample 306 to be observed are provided.
A control computer 110, an input device 111, a control window display device 112, an image processing device 313, and an image display device 114 are provided outside the dark box 100.

[0005] As shown in FIG. 16 (B), the image processing device 313 includes an overlay processing means 91 and an image memory 92.
And The sample 306 includes the cable 10
7, the sample driving source 108 is connected. This drive source enables power supply and test pattern supply to the sample 306. The sample driving source 108 includes, for example, LS
There are an I-tester, a power supply to be applied to a power supply terminal, a device which applies a voltage obtained by dividing a power supply voltage to an input terminal / bidirectional terminal by an appropriate resistor, or a power supply voltage or a reference (ground) voltage. . Here, it is assumed that an LSI tester is connected to simplify the description.

[0006] The microscope 101 and the detector 102 are integrated, and interlock with the movement of the XYZ stage 104. X
The YZ stage 104, xyzθ stage 105, and light source 103 are controlled by an external control computer 110, respectively. Further, the pattern image and the light emission image obtained by the detector 102 are once taken into the control computer 110 as an image signal, and output to the image processing device 313. A predetermined control window is independently displayed on the control window display device 112, and can be controlled to a predetermined state by an operation from the input device 111. Further, on the image display device 114, a pattern image and a light emission image or a superimposed image executed by the superimposition processing means 91 of the image processing device 313 is displayed.

Next, with reference to FIGS. 16 and 17, a procedure for specifying an abnormal light emitting portion using a conventional emission microscope system will be described. The sample 306 is set on the xyzθ stage 105 in the dark box 100 (S31). After adjusting the position of the XYZ stage 104 so that the microscope 101 and the detector 102 are just above the sample 306,
The pattern image is captured by the detector 102 and displayed on the display screen T of the image display device 114 (S32). FIG. 18 shows the pattern image thus obtained. By adjusting the brightness, focus, inclination, and the like of the pattern image by controlling the light amount of the light source 103 and the control of the xyzθ stage 105, and obtaining an optimal pattern image, the pattern image is stored in the image memory 92a of the image processing device 313 ( S33).

[0008] The LSI tester 108 supplies power and a test pattern to the sample 306, and the sample 306 is brought into an operating state (S34). Weak light generated from the sample is captured as an emission image by the detector 102, and the image display device 114
(S35). The light emission image is stored in an image processing device 31
3 is stored in the image memory 92b (S36). afterwards,
The supply of the power supply and the test pattern to the sample 306 is stopped, emission observation is performed in a non-operating state, the emission is obtained as background noise emission, and the emission image is subtracted from the emission image stored in the image memory 92b to remove noise emission. You may also get FIG. 19 is a light emission image displayed on the display screen T of the image display device 114.

In accordance with a command from the control computer 110, the pattern image stored in the image memory 92a in the image processing device 313 and the light emission image stored in the image memory 92b are superimposed on the superimposition processing means 91 (S3).
7) The superimposed image is displayed on the image display device 114 (S38). FIG. 20 is a superimposed image displayed on the display screen T of the image display device 114. From this superimposed image, it is possible to specify from which part of the sample the light is emitted.

[0010]

In the prior art described above, when observing light emission while the LSI is operating,
Light emission other than abnormal light emission may be detected. For example,
In a CMOS circuit, a through current is generated at the moment when the potential of the internal wiring changes, and light emission occurs in a transistor portion forming the through current path. Further, when a wiring having a logically intermediate potential exists, light emission also occurs in the input transistor portion of a circuit connected to the wiring. Also,
If an analog circuit or the like that constantly supplies a current is present, a large amount of light is emitted at that location. These are not abnormal light emission and are unavoidable in operation.

For this reason, the above-described conventional step S35
Since the luminescence image displayed by contains all luminescence points,
There is a drawback that it is difficult to uniquely determine an abnormal light emission location from the superimposed image displayed in step S38.

[0012] Further, by observing light emission by the above-mentioned conventional technique under a non-defective or non-defective operating condition and comparing a luminescence image of the non-defective product with a luminescence image of a target LSI, abnormal In some cases, light emission is distinguished from other light emission, but if abnormal light emission is weaker than other light emission, it will be buried in other light emission, making it extremely difficult to uniquely determine abnormal light emission. There are drawbacks.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method and an apparatus for identifying an abnormal light emission portion which can detect only abnormal light emission from an LSI and uniquely identify the abnormal light emission portion.

[0014]

According to the present invention, there is provided a method for identifying an abnormal light emission portion, which comprises: a light emission image of a defective LSI or an LSI in a defective operation state to be observed; and a light emission image of a non-defective LSI or an LSI in a non-defective operation state. A light emission difference image processing means for obtaining a difference between the light emission difference image and the pattern image;

Here, the LSI under the defective operation state and the LSI under the good product state mean the same LSI.

Further, the above-mentioned method for specifying an abnormal light emission location includes:
When the non-defective LSI and the defective LSI are separate and a slight displacement occurs between the two LSIs, alignment processing means of a pattern image of the non-defective LSI for correcting the misregistration;
Image correction means for correcting the emission image of the non-defective LSI based on the correction data obtained by the alignment processing of the pattern image.

The light emission difference image processing means can obtain a light emission difference image between a light emission image of a defective LSI or an LSI in a defective operation state and a light emission image of a non-defective LSI or an LSI in a non-defective operation state. Therefore, it is possible to detect only a defective product or abnormal light emission in a defective operation state, and it is possible to uniquely identify an abnormal light emission portion by superimposing the defective image on a pattern image.

The alignment processing means corrects a positional shift caused when the defective product is different from the non-defective product, and aligns the non-defective pattern image at the same position as the defective pattern image.
As a result, it is possible to obtain the position correction amount of the non-defective pattern image.

The image correcting means corrects the non-defective light emission image based on the correction data obtained by the alignment processing means. As a result, in the difference image processing means, a difference image having no displacement between the defective light emission image and the position-corrected non-defective light emission image can be obtained. A light emitting portion can be specified.

The method of specifying an abnormal light emission portion of an LSI according to the present invention will be described below in the order of steps.

In a dark box, a pattern image of an LSI sample is picked up by an emission microscope and displayed on an image display device, the pattern image is stored in an image memory, and a sample drive source is operated to set the sample in a defective operation state. The image of the light emission generated from the sample in the defective operation state is captured by the detector, displayed on the image display device, the defective operation emission image is stored in the image memory, the sample driving source is operated, and the sample is put in the non-defective operation state. , And a detector detects an emission image from the sample in the non-defective operation state, displays the image on the image display device, stores the non-defective operation emission image in the image memory, and stores the defective operation emission image and the non-defective operation image stored in the image memory. The operation light emission image is taken into the difference image processing means, the light emission difference image between the defective operation light emission image and the non-defective operation light emission image is displayed on the image display device, and the light emission difference image is stored in the image memory. The combined processing means superimposes pattern image stored in the image memory and a luminous difference image, is to identify an abnormal light emitting portions of the sample by displaying the superimposed image on the image display device.

Further, a process of comparing the non-defective LSI with the defective LSI and specifying the abnormal light emitting portion of the defective product by the method for specifying the abnormal light emitting portion of the LSI according to the present invention is as follows.

In a dark box, a pattern image of at least one of the two LSI samples is picked up by an emission microscope and displayed on an image display device, and the pattern image is stored in an image memory. Is set to an operating state, an emission image of the sample is captured by a detector, displayed on an image display device, and the emission image is stored in an image memory, and the pattern of the other sample of the two LSI samples is An image is captured and displayed on an image display device, and the pattern image is stored in an image memory, the other sample is set to an operating state, and a light emission image of the sample is captured by the detector, and image display is performed. Display the image on the device, store the luminescence image in the image memory, display the pattern image of one sample on the image display device, and mark the pattern image for alignment. The pattern image of the other sample is displayed on the image display device, and the pattern image is marked for alignment, and the alignment of the two samples is performed based on the two markings with the pattern images of the two samples. Then, the correction data of the pattern image of the other sample with respect to the pattern image of the one sample is stored in the memory, the emission image of the other sample is displayed on the image display device, and the acquisition of the other sample is performed by the image correction means. Based on the corrected data
The image of the light emission image is corrected and stored in the image memory,
The emission image of one sample stored in the image memory and the emission image of which the image has been corrected are taken into difference image processing means to obtain an emission difference image between the two emission images, and displayed as an emission difference image. The light emission difference image is displayed on the device, and the light emission difference image is stored in an image memory, and one of the pattern images stored in the image memory and the light emission difference image are overlapped by the overlay processing means, and the superimposed image is displayed on the image display device. , It is possible to identify an abnormal light emission portion of one of the samples.

LS using emission microscope of the present invention
The first device for identifying the abnormal light emission position of I is a microscope in a dark box, a detector fixed to the microscope to capture and output an image, a stage for controlling the position of the microscope, and a sample to be observed. A stage equipped with a light source, and a control computer and an input device for independently controlling each device outside the dark box, a control window display device of the computer, and an image obtained from the detector via the control computer. An image processing apparatus for processing a signal, an image display apparatus for displaying a pattern image or a light emission image of the sample, and a contact mechanism with a power source serving as a drive source of the sample and voltage supply means for input terminals and bidirectional terminals. And further disposed in the image processing apparatus, obtained from two different operating conditions given to the sample, for obtaining a light emission difference image between the light emission images,
It has a difference image processing means, a superposition processing means, and an image memory.

LS using the emission microscope of the present invention
The second device for identifying the abnormal light emission point of I is provided in the image processing device described in the first device for acquiring a light emission difference image between at least two LSI samples to be observed. In addition to the difference image processing means and the superimposition processing means, an alignment processing means for performing alignment processing between the pattern images of the respective samples, and a correction data storage memory for storing correction data obtained from the alignment processing means And an image correcting means for correcting any one of the light emission images of the sample based on the correction data.

[0026]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 shows a first example of a method for identifying an abnormal light emitting portion of an LSI using an emission microscope according to the present invention.
FIG. 2 is a flowchart showing a procedure for specifying an abnormal light emitting portion of an LSI according to the present invention.

In FIG. 1A, in a dark box 100,
A microscope 101, a detector 102 for capturing an LSI pattern image and an emission image, a light source 103 for observing the LSI pattern image, an XYZ stage 104 for controlling the position of the microscope and the detector, and observation An xyzθ stage 105 for mounting a target LSI sample 106 and controlling its position is provided. Dark box 10
0, the control computer 110 and the input device 1
11, a control window display device 112, an image processing device 113, and an image display device 114.

As shown in FIG. 1B, the image processing device 113 includes a superposition processing unit 12 and a difference image processing unit 11.
And an image memory 15.

The difference image processing means 11 generates a light emission image of one LSI sample to be observed stored in the image memory 15 in a defective operation state (hereinafter, referred to as a defective operation light emission image) and a non-defective operation state. (Hereinafter, referred to as a non-defective operation light-emitting image) is acquired and displayed on the image display device 114.

The superimposition processing means 12 includes the image memory 1
A superimposition process of the pattern image and the light emission difference image stored in 5 is performed.

The image memory 15 stores a pattern image, a light emission image, and a light emission difference image.

A sample driving source 108 is connected to the sample 106 via a cable 107. With this drive source, power can be supplied to the sample 106 and a test pattern can be supplied. The sample driving source 108 includes, for example, an LSI tester, a power supply applied to a power supply terminal, a voltage obtained by dividing a power supply voltage into an input terminal and a bidirectional terminal by an appropriate resistor, or a power supply voltage or a reference (ground) voltage. There are devices that provide one of them. Here, for the sake of simplicity, LS
It is assumed that an I tester is connected.

The microscope 101 and the detector 102 are integrated, and interlock with the movement of the XYZ stage 104. X
The YZ stage 104, xyzθ stage 105, and light source 103 are controlled by an external control computer 110, respectively. Further, the pattern image and the light emission image obtained by the detector 102 are once taken into the control computer 110 as an image signal, and output to the image processing device 113. A predetermined control window is independently displayed on the control window display device 112, and can be controlled to a predetermined state by an operation from the input device 111. The image display device 114 displays a pattern image and a light emission image, or a superimposed image executed by the superimposition processing means 91 of the image processing device 113.

Next, an operation example of the first embodiment of the present invention will be described in time series with reference to FIGS. The sample 106 to be observed is set on the sample stage 105 (S11). The pattern image is captured by the detector 102 and displayed on the image display device 114 (S12). XY
When an optimal pattern image is obtained by adjusting the Z stage 104, the light source 103, and the xyzθ stage 105, the pattern image is stored in the image memory 15a (S13). The sample 106 is set by the LSI tester 108 so as to be in a defective operation state (S14). Light emission from the sample in a malfunctioning state is detected by the detector 102, captured as a malfunctioning light emission image, and displayed on the image display device 114 (S
15). The defective operation light emission image is stored in the image memory 15b (S16). FIG. 3 shows a malfunction light emission image displayed on the display screen T of the image display device 114.

The sample 10 is measured by the LSI tester 108.
6 is set to be in a non-defective operation state (S17).
The light emission of the sample in the non-defective operation state is detected by the detector 102, and an image is taken as a non-defective operation light emission image.
4 is displayed (S18). The non-defective operation light emission image is stored in the image memory 15c (S19). FIG. 4 shows a display screen T
3 shows the non-defective operation light emission image displayed in FIG.

In response to a command from the control computer 110, the defective image emission image stored in the image memory 15b and the non-defective operation emission image stored in the image memory 15c are taken into the difference image processing means 11, and the difference image between the two images is read. Is obtained for each pixel, and is displayed on the display device 114 as a light emission difference image. The light emission difference image is stored in the image memory 15d (S
1B). FIG. 5 shows a light emission difference image displayed on the display screen T.

In accordance with a command from the control computer 110, the superimposition processing means 12 superimposes the optimum pattern stored in the image memory 15a and the light emission difference image stored in the image memory 15d (S1C). The image is displayed on the image display device 114 as a combined image (S1).
D). FIG. 6 shows a superimposed image displayed on the display screen T, from which an abnormal light emitting portion can be specified.

As described above, in the first embodiment of the present invention, the light emission difference image is obtained between the light emission image in the defective operation state and the light emission image in the good operation state by the difference image processing means, and the light emission difference is obtained. Since the image and the pattern image are superimposed, it is possible to uniquely recognize only the abnormal light emitting portion included in the defective operation state.

Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 7 is a block diagram of the second embodiment of the present invention, and FIG. 8 is a flowchart showing a procedure of the second embodiment.

In FIG. 7, the difference from the first embodiment shown in FIG. 1 is that the image processing device 213 differs from the first embodiment in addition to the configuration of the image processing device 113 in the first embodiment.
Alignment processing means 21, image correction means 22, and correction data memory 26 are newly provided.
5 is that the functions are increased.

When the defective and non-defective LSIs are separate, the alignment processing means 21 corrects the positional deviation between the defective pattern image and the non-defective pattern image, and stores the correction data in the memory 26. The image correcting unit 22 corrects the non-defective luminescent image based on the correction data of the pattern image obtained by the alignment processing unit 21 and stores the corrected luminescent image in the image memory 25. Correction data memory 2
Reference numeral 6 stores the correction data obtained by the alignment processing means 21.

Next, an operation example of the second embodiment of the present invention will be described in time series with reference to FIGS. First, a defective sample 206 is set (S21), and a pattern image is captured and displayed on the image display device 114 (S2).
2). When an optimal pattern image is obtained, the image memory 25a
(S23). FIG. 9 shows a pattern image of a defective product displayed on the display screen T of the image display device 114.

The defective sample 206 is put into an operating state by the LSI tester 108 (S24). The light emission is detected by the detector 102 and captured as a light emission image.
14 is displayed (S25). The defective light emission image is stored in the image memory 25b (S26). FIG. 10 shows a defective light emission image displayed on the display screen T.

Next, a non-defective sample 206 is set (S2).
7), a pattern image is captured and displayed on the image display device 114 (S28). The non-defective pattern image is stored in the image memory 25c (S29). FIG. 11 shows a non-defective pattern displayed on the display screen T. Due to individual differences between samples, even when the stage position is exactly the same, there is generally a slight misalignment between the defective pattern image and the non-defective pattern image.

A non-defective sample 2 was obtained by the LSI tester 108.
06 is activated (S2A). The light emission is detected by the detector 102 and captured as a light emission image to form the image display device 11.
4 (S2B). The image is stored in the image memory 25d as a good light emission image (S2C). FIG. 12 shows a non-defective emission image displayed on the display screen T. It goes without saying that the non-defective product light emission image has the same positional deviation as the defective product light emission image, as in the case of the pattern image.

Next, the defective product pattern image is displayed on the image display device 1.
14 is displayed (S2D). Markers A1, A2, A3 for alignment are hit at three characteristic positions of the pattern by the input device 111 (S2E). FIG. 13 shows a defective product pattern image displayed on the front screen T with the marker attached.

Similarly, a non-defective pattern image is displayed on the image display device 1.
14 (S2F), the defective pattern marker A
Markers B1, B2,
Hit B3 (S2G). FIG. 14 shows a non-defective pattern image displayed on the display screen T with the marker attached.

In accordance with a command from the control computer 110, the alignment processing means 21 aligns the non-defective pattern image to the position of the defective pattern image based on the three markers (S2H). The correction data of the non-defective pattern image at that time is stored in the memory 26 (S2J).

Next, a non-defective emission image is displayed on the image display device 114 (S2K). In accordance with a command from the control computer 110, the image correcting means 22 performs image correction of the non-defective light emission image based on the correction data acquired at the time of alignment of the non-defective pattern image (S2L). The image-corrected non-defective emission image is stored in the image memory 25e (S2M). FIG.
Reference numeral 5 denotes a non-defective light emission image after image correction displayed on the display screen T.

In response to a command from the control computer 110, the defective image emission image stored in the image memory 25b and the non-defective image emission image after image correction stored in the image memory 25e are taken into the difference image processing means 211. The display device 1 obtains a difference for each pixel between the two emission images, and obtains the difference as an emission difference image.
14 (S2N), and the light emission difference image is stored in the image memory 2
5f (S2P).

In accordance with an instruction from the control computer 110, the image memory 25a is
Is superimposed on the defective pattern stored in the image memory 25f and the light emission difference image stored in the image memory 25f (S2).
Q) The image is displayed on the image display device 114 as a superimposed image (S2R).

As described above, in the second embodiment of the present invention, when the defective LSI and the non-defective LSI are separated from each other, a slight displacement occurs due to the individual difference between the samples. The pattern image is aligned with the position of the defective pattern image, and based on the correction data obtained at that time, the non-defective luminescence image is corrected by the image correcting means, and the defective luminescence image and the corrected non-defective luminescence image are interposed. , It is possible to obtain an accurate light emission difference image without a positional shift. By superimposing the light emission difference image and the defective product pattern image, it is possible to uniquely identify only the abnormal light emission portion included in the defective product, as in the first embodiment.

[0053]

As described above, according to the present invention, one L
An emission image difference between the defective operation state and the non-defective product operation state of the SI or an emission difference image between separate defective and non-defective LSIs is acquired by the difference image processing means, and each is superimposed on the pattern image. As a result, it is possible to uniquely recognize an abnormal light emitting portion, thereby eliminating the need to check the light emitting portions from other portions. In addition, when the defective product and the non-defective product of the LSI are separate from each other and the alignment is poor. When they do not match, the non-defective pattern image is aligned to the position of the defective pattern image by the alignment processing means, and the image of the non-defective light emission image is corrected based on the correction data obtained at that time. Since the displacement due to the difference can be corrected, there is an effect that an accurate light emission difference image can be obtained, and further, the light emission difference image is obtained as described above. It, since the background noise contained in both emission image is naturally canceled, the background light emission is also removed, thereby an effect that needs to perform background processing is eliminated.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of a first embodiment of an emission microscope system of the present invention.

FIG. 2 is a flowchart showing an operation of the first embodiment.

FIG. 3 is a schematic plan view of a malfunction operation light emission image displayed in the drawing in the first embodiment.

FIG. 4 is a schematic plan view of a non-defective operation light emission image displayed on a screen in the first embodiment.

FIG. 5 is a schematic plan view of a light emission difference image obtained by a difference image processing unit in the first embodiment.

FIG. 6 is a schematic plan view of a superimposed image obtained by a superimposing unit in the first embodiment.

FIG. 7 is a block diagram illustrating a configuration of an emission microscope system according to a second embodiment of the present invention.

FIG. 8 is a flowchart showing the operation of the second embodiment.

FIG. 9 is a schematic plan view of a pattern image of a defective product displayed in a drawing in the second embodiment.

FIG. 10 is a schematic plan view of a defective light emission image displayed on a screen in the second embodiment.

FIG. 11 is a schematic plan view of a non-defective pattern image displayed on a screen in the second embodiment.

FIG. 12 is a schematic plan view of a non-defective emission image displayed on a screen in a second embodiment.

FIG. 13 is a schematic plan view of a defective product pattern image with a marker attached in the second embodiment.

FIG. 14 is a schematic plan view of a non-defective pattern image with a marker attached in the second embodiment.

FIG. 15 is a schematic plan view of a non-defective light emission image corrected by an image correction unit according to the second embodiment.

FIG. 16 is a block diagram of an emission microscope system according to the related art.

FIG. 17 is a flowchart showing the operation of the apparatus of FIG.

FIG. 18 is a schematic plan view of a pattern image displayed on a screen in the apparatus of FIG. 16;

FIG. 19 is a schematic plan view of a light-emitting image displayed on a screen in the apparatus of FIG. 16;

20 is a schematic plan view of a superimposed image obtained by superimposition processing means in the apparatus of FIG.

[Explanation of symbols]

REFERENCE SIGNS LIST 100 Dark box 102 Detector 103 Light source 104 XYZ stage 105 xyzθ stage 106, 206, 306 Sample 107 Connection cable 108 Sample drive source (LSI tester, etc.) 110 Control computer 111 Input device 112 Control window display device 113, 213, 313 Image processing device 114 Image display device 11, 211 Difference image processing means 12, 212, 91 Superposition processing means 15, 15a to 15d, 25, 25a to 25f, 92,
92a, 92b Image memory 21 Alignment processing means 22 Image correction means 26 Memory T Display screen of image display device 114

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI G01R 31/302 G01R 31/28 L G06T 1/00 G06F 15/64 D

Claims (4)

[Claims] 1. A pattern image of an LSI sample is picked up by an emission microscope in a dark box and displayed on an image display device. The pattern image is stored in an image memory. Detecting the emission image generated from the sample in the defective operation state by the detector, displaying the image on the image display device, storing the defective operation emission image in the image memory, and operating the sample driving source Setting the sample in a non-defective operation state, capturing an emission image from the non-defective operation sample by the detector, displaying the image on the image display device, storing the non-defective operation emission image in an image memory, The defective operation emission image and the non-defective operation emission image stored in the image memory are taken into difference image processing means, and a light emission difference image between the defective operation emission image and the non-defective operation emission image Is displayed on the image display device, the light emission difference image is stored in an image memory, and the pattern image and the light emission difference image stored in the image memory are superimposed by superimposition processing means. The abnormal light emission spot specifying method of the LSI, wherein the abnormal light emission spot of the sample is specified by displaying the image on the image display device. 2. A pattern image of one of at least two LSI samples is picked up by an emission microscope in a dark box and displayed on an image display device, and the pattern image is stored in an image memory. One sample is set to an operating state, an emission image of the sample is captured by a detector, displayed on the image display device, and the emission image is stored in an image memory, A pattern image of the other sample is taken and displayed on the image display device, and the pattern image is stored in an image memory. The other sample is set in an operating state, and a light emission image of the sample is detected by the detector. The image is displayed on the image display device, and the emission image is stored in an image memory. The pattern image of the one sample is displayed on the image display device, and the pattern image is aligned with the pattern image. Marking for the pattern, displaying the pattern image of the other sample on the image display device, marking the pattern image for alignment, and applying the respective pattern images of the two samples. In addition, alignment of the two samples is performed based on the two markings, and correction data for the pattern image of the other sample with respect to the pattern image of the one sample is stored in a memory, and the emission image of the other sample is stored. Is displayed on the image display device,
The image correction unit performs image correction of the luminescence image based on the correction data obtained by the other sample and stores the luminescence image in an image memory, and the luminescence image of the one sample stored in the image memory; The other light emission image subjected to the image correction is taken into difference image processing means to obtain a light emission difference image between the two light emission images, displayed on the image display device as a light emission difference image, and the light emission difference image is displayed as an image. By storing the one pattern image stored in the image memory and the light emission difference image by a superimposition processing unit, and displaying the superimposed image on the image display device, L which specifies an abnormal light emission portion of one sample
A method for specifying an abnormal light emission location of SI. 3. An apparatus for specifying an abnormal light emitting portion of an LSI using an emission microscope, wherein a microscope, a detector fixed to the microscope and taking in an image and outputting the image are provided in a dark box; A stage for controlling the position of the sample, a stage on which a sample to be observed is mounted, and a light source. Outside the dark box, a control computer and an input device for independently controlling the respective devices, and a control window of the computer A display device, an image processing device for processing an image signal obtained from the detector via the control computer, an image display device for displaying a pattern image or a light emission image of the sample, and a power supply serving as a drive source for the sample And a contact mechanism with a voltage supply means to input terminals and bidirectional terminals, further provided in the image processing apparatus, and provided to the sample An abnormal light emission spot specifying device for an LSI, comprising: a difference image processing means, an overlay processing means, and an image memory for obtaining a light emission difference image between light emission images obtained from different operation conditions. . 4. At least two LSIs to be observed
In order to acquire the emission difference image between the samples, disposed in the image processing apparatus, in addition to the difference image processing means and the superposition processing means, alignment processing between the pattern images of the respective samples Alignment processing means for performing, a correction data storage memory for storing correction data obtained from the alignment processing means,
4. The abnormal light emission spot specifying device for an LSI according to claim 3, further comprising image correction means for correcting one of the light emission images of the sample based on the correction data.