JPH11165061A - Material transfer device and material transfer method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a material transfer device capable of forming a structure having a three-dimensional thickness. SOLUTION: A solid material 1001 is held by a holding means 1002 and projected out from the end face 1003 of the holding means 1002 by a specified amt. as a projecting material 1004. The end face 1003 is confronted with the reference plane 1007 of a confronting means 1006 through a specified gap 1005, and the end of the projecting material 1004 is abutted on the reference plane 1007 by the pressure impression of an abutting means 1008. The projecting material 1004 thus abutted on the reference plane 1007 is selectively heated by a heating means 1009 and melted, and the melt is transferred by a transfer means 1010. A laser beam is projected from a window 1011 as the heating means 1009 to selectively heat and melt the projecting material 1004. The melt is transferred by the pressure of a compressed gas 1012 as the transfer means 1010.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for transferring a heat-melted substance from a heat-melted portion, and a method and a structure for manufacturing a structure produced by using the apparatus or the method.

[0002]

2. Description of the Related Art As a method of transferring a liquid substance, a so-called ink jet head which flies ink using a pressure applying means or a head which supplies magnetic ink using a magnetic field and flies from a stylus using an electric force is used. Yes,
Widely applied in the printing and recording field. In addition, as a so-called vapor phase deposition method in which a space flies in a vaporized or sublimated state after melting and undergoes a transition, for example, in addition to a vacuum deposition method in which a substance is melted using resistance heating or electron beam heating, a sputtering method, a CVD method, or the like is used. And is widely used in the field of thin film formation. Furthermore, in recent years, various types of prototyping to create various three-dimensional structure shapes based on design drawings or computer information have been tried, and a method of exposing and laminating a photosensitive resin, a method of cutting and superimposing thin plates with a laser, or a method of forming a powder. A method of irradiating a laser to harden the powder has been proposed.

[0003]

However, in the head applied in the above-mentioned conventional printing and recording field, an ink dissolved or dispersed in either a solvent or a dispersion medium is used, and after performing a flying transfer, the solvent or the solvent is used. The recording is completed by evaporating or drying the dispersion medium. Therefore, after recording, the solute or dispersoid remains in the recorded portion, and it is difficult to form an image having a three-dimensional thickness. In a method such as overstrike, the base to be laminated is dissolved or dispersed by a solvent or a dispersion medium. However, there is a problem that an image having a three-dimensional thickness cannot be formed, and thus a three-dimensionally thick modeled object cannot be formed. Although the vapor phase deposition method is advantageous for forming a thin film, it is necessary to evacuate the atmosphere to increase the size of the apparatus. There was a problem that it was virtually impossible to do so. Furthermore, in the method of creating a three-dimensional structure shape, the material applicable to the method for manufacturing the three-dimensional structure is limited to a part of the resin. For example, it is difficult to obtain sufficient strength even when solidifying metal powder with a binder. There are issues.

The present invention has been made in view of the above-mentioned conventional problems, and provides a material transfer apparatus, a material transfer method, a method of manufacturing a structure, and a structure capable of forming an image or a structure having, for example, a three-dimensional thickness. With the goal.

[0005]

According to a first aspect of the present invention, there is provided a material transfer apparatus, comprising: holding means; facing means having a reference surface facing one end face of the holding means via a predetermined gap; An abutting means for abutting a protruding material held by the holding means and protruding from the one end surface of the holding means and an opposing material on the reference surface of the opposing means, at least an abutting portion between the protruding material and the opposing substance A heating means for heating and melting at least one of the protruding substance and the counter material, and a transfer means for transferring the melt heated and melted by the heating means from at least the contact portion. The mass transfer apparatus according to the present invention according to claim 2, further comprising a replenishing unit that replenishes at least one of the protruding material and the counter material by an amount of the melt transferred by the transferring unit. I do. According to a third aspect of the present invention, there is provided the substance transfer device according to the third aspect, further comprising an opening unit that releases a holding force of the holding unit with respect to the protruding material in synchronization with the replenishing unit. A material transfer apparatus according to a fourth aspect of the present invention is characterized in that a moving means for moving at least a predetermined portion of the reference surface with which the substance comes into contact is added. According to a fifth aspect of the present invention, there is provided the material transfer device, wherein the protruding material and the opposite material are made of the same material. The material transfer device of the present invention according to claim 6, wherein a heat-resistant layer is provided on at least one of the one end surface of the holding means, the reference surface of the protrusion, or the contact portion of the counter material. Features. According to a seventh aspect of the present invention, in the substance transfer device, the heat-resistant layer is made of a heat conductive material. In the mass transfer device of the present invention according to claim 8, the heating means comprises:
2. The mass transfer apparatus according to claim 1, wherein the apparatus is at least one of energy beam irradiation and current. The material transfer device of the present invention according to claim 9, wherein the protruding material, the holding means, the counter material, or the protruding material.
The material of any combination of the holding means and the heat-resistant layer of the contact portion is a conductive material. According to a tenth aspect of the present invention, there is provided the substance transfer device, wherein the transfer force of the transfer means uses at least one of a flow force and an oscillating force. 12. The material transfer method according to claim 11, wherein the protruding material held by the holding member and protruding from one end surface of the holding member, and the opposing material of the opposing member facing the one end surface via a predetermined gap. At a contact portion between the protruding substance and the opposing substance, and heat-melting at least one of the protruding substance and the opposing substance at least at the abutting portion between the protruding substance and the opposing substance. It is characterized by a transition from a contact portion.
The material transfer method of the present invention according to claim 12, wherein after transferring the melt, at least one of the protruding material or the counter material is supplied by a supply member by an amount of the melt. I do. A material transfer method according to a thirteenth aspect of the present invention is characterized in that the holding force of the holding member with respect to the projecting substance is released in synchronization with the supply of the projecting substance by the supply member. A material transfer method according to a fourteenth aspect of the present invention is characterized in that at least the opposed material of the contact portion is moved for a predetermined time. Claim 1
The material transfer method of the present invention described in 5 is characterized in that the protruding substance and the counter substance are made of the same material. The material transfer method of the present invention according to claim 16, wherein a heat-resistant layer is provided on at least one of the one end surface of the holding member, the contact portion of the protruding material or the facing material. . The material transfer method of the present invention described in claim 17 is characterized in that the heat-resistant layer is made of a heat conductive material. According to a eighteenth aspect of the present invention, there is provided the material transfer method, wherein the molten material is heated and melted by either energy beam irradiation or electric current. 20. The material transfer method according to claim 19, wherein any one of the protruding material, the holding member, and the facing material, or any combination of the protruding material, the holding member, and the heat-resistant layer provided on at least the reference surface is provided. Are all conductive materials. A material transfer method according to a twentieth aspect of the present invention is characterized in that the transfer force for transferring the melt uses at least one of a flow force and an oscillating force. Claim 2
23. The method for producing a structure according to the present invention according to 1 or 22, comprising a step of transferring to a substance to be transferred by using any of the above substance transfer devices or methods, wherein the substance is at least one component of the structure. Is formed on the transferred object. According to a twenty-third aspect of the present invention, a structure according to the present invention is manufactured by the manufacturing method according to the twenty-first or twenty-second aspect.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention is directed to a transfer apparatus for selectively heating and melting a solid substance, transferring the molten substance in a jet or viscous form from the melting point, and forming the substance at a transfer destination. It is a transfer method. One end face of the holding means or the holding member for holding the solid state substance is interposed with the reference surface of the opposing means or the opposing member via a gap, and the solid state protruding substance protruding from the one end face is opposed to the solid state. The opposing material of the means or the opposing member material of the opposing member is brought into contact with the reference surface, and selectively heat-melted at least at the contact portion. Therefore, the gap portion and the contact portion are not only a portion where the heat is melted, but also a portion where the transfer force for transferring the melt acts. If the energy and / or the transfer force for heating is constant, the gap and the contact portion are not melted. The amount of melting is determined and can be transferred by the same amount. The holding means or the holding member accurately positions the protruding substance projecting into the gap, the heating means or the heating member, the transfer means or the transfer member, and the protruding substance is held by the holding means with a predetermined holding force. There is no need to be.

Further, the projecting material projecting from one end face of the holding means or the holding member needs to be brought into contact with the facing material or the facing material on the reference surface, and a predetermined pressure is applied to the projecting material and the reference surface. This can be achieved by providing a contacting means or a contacting member. After the melt is transferred, the supply of the protruding material and / or the counter material by the amount of the melt is provided with a replenishing means (supplying member) or a moving means (moving member), whereby the molten material is continuously transferred. In addition, the state of the gap portion and the contact portion can always be kept constant, and the amount of melting can be more accurately controlled. However, when the holding means or the holding member holds the projecting substance by the holding force and the projecting substance cannot be supplied through the inside of the holding means by the holding force, the replenishing operation of the projecting substance by the replenishing means or the replenishing member is performed. At this time, it is preferable to further include an opening means or an opening member for releasing a holding force for holding the protruding substance in synchronization with the replenishing operation. Note that the opening means or the opening member can also serve as the contacting means or the contacting member. In some cases, the replenishing means can also serve as the contacting means.

In the mass transfer apparatus or mass transfer method of the present invention, the molten material to be transferred can be supplied as described above.
Melting may occur at the abutment between the protruding material and the opposing material. At this time, since the opposing substance and the protruding substance are simultaneously melted and become transition targets, it is necessary to move the opposing substance at least in the contact portion where the protruding substance comes into contact at every predetermined time. In this case, when the protruding substance and the opposing substance can be simultaneously transferred, the protruding substance and the opposing substance can be positively changed to be transferred as a composite substance. By using the same material as the above, only the same material component of the substance can be transferred, and can be appropriately selected as needed.

In the substance transfer according to the present invention, since a portion between the one end face of the holding means or the holding member and the contact portion is selectively heated, one end face of the holding means or the holding member from which the protruding material projects or the reference surface. Preferably, a heat-resistant layer is provided on at least one of the contact portions, and a material having rigidity at the time of heating and excellent in thermo-mechanical properties is desirable. When this heat-resistant layer is provided on the reference surface, only the protruding substance can be melted and transferred. Further, it is preferable to use a material having good thermal conductivity for the heat-resistant layer because the rate of cooling the heat of the heat-resistant layer heated to the melting point of the protruding substance after the transition can be accelerated.
Also, if a heat-conductive heat-resistant layer is provided on one end surface of the holding means or the holding member from which the protruding substance protrudes, it exerts an effect of directly cooling the protruding substance remaining in the gap after the melt transition, so that The cooling of the protruding material can be ensured, and the replenishment can be quickly performed when replenishing the protruding material by the amount of the transferred melt, for example.

For the heating method of the present invention, for example, Joule heat generated by irradiating an energy beam such as an electron beam or a laser beam or flowing an electric current can be applied. If necessary, it can be used alone or in combination as appropriate. . In the case where an electric current is used for the heating method, at least the protruding substance is required to be a conductive material. In this case, not only the protruding substance but also the holding means or the holding member and at least all of the reference surface are used. The conductive property is preferable because the current path concentrates on the protruding substance existing in the gap, particularly on the protruding substance and the opposing substance in the contact part, and increases the efficiency of generating Joule heat. At this time, by making the potential of the protruding substance and at least the potential of the reference surface different, not only can it be possible to apply either a DC voltage or an AC voltage, but also the gap can be instantaneously formed by, for example, applying a pulse voltage. The protruding material at the portion can be melted, and the transition time of the molten material can be shortened.

Further, as the transfer force of the material transfer of the present invention, a gas flow force or a vibration force of a piezoelectric element or an ultrasonic wave can be applied alone or in combination as appropriate. However, when applying the gas flow force to the transfer force, if the molten material is oxidized by contacting with, for example, oxygen gas, and it is necessary to suppress a change in the characteristics of the material such as melting point or electric resistance, the application is performed. It is natural that the reactive gas excludes reactive components such as oxidizing gas. Further, the method for manufacturing a structure of the present invention is to form a structural unit of at least one substance constituting the structure using the above-described material transfer, for example, when manufacturing a structure containing a metal having a high melting point, and the like. preferable.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The principle of the material transfer of the present invention will be described with reference to one embodiment of the material transfer device of the present invention. FIG. 1 is a sectional perspective view showing a main part of an example of the material transfer device of the present invention. The solid state substance 1001 is
02 and protrudes from the end face 1003 of the holding means 1002 by a predetermined amount (the protruding substance 1001 is referred to as a protruding substance 1004). The end face 1003 is provided on the reference face 10 of the facing means 1006 via a predetermined gap 1005.
07, and the end of the protruding substance 1004 comes into contact with the reference surface 1007 by applying pressure from the contact means 1008.
While the protruding material 1004 is in contact with the reference surface 1007 in this manner, it is selectively heated and melted by the heating means 1009, and the melt is transferred by the transfer means 1010. Heating means 1009
For example, the projecting material 1004 is selectively heated and melted by irradiating a laser beam, which is an energy ray, from a window 1011 provided in the heating unit 1009. The transfer means 1010 includes, for example, a compressed gas 101 which is a fluid force.
The melt is transferred by the pressure of 2.

As the substance 1001 applicable to the present invention, any material can be used regardless of an organic material or an inorganic material as long as it is a solid in a normal state and can be melted by heating.
In particular, metallic materials are preferred in terms of structural features such as material transition corresponding to a high melting point, physical properties such as latent heat from a solid phase to a liquid phase and melt viscosity, and application fields. It is a transition in the molten state without being, and it can be transferred without causing the composition fluctuation of the substance to be transferred,
The transition of the constituents of a substance having a plurality of components, such as a mixture, an alloy or a compound, can be performed without change. Note that the shape of the substance 1001, particularly the shape of the protruding substance 1004, is preferably a so-called column shape or plate shape such as a wire or a thread in consideration of a heat conduction effect. The substance transfer amount of the present invention is arbitrary depending on the diameter or cross-sectional area of the protruding substance 1004, the length of the gap 1005, the range of heating and melting by the heating means 1009, the transfer force of the transfer means 1010, and the range of providing the transfer force. Can be set to

Next, the material transfer operation of the apparatus shown in FIG. 1 will be described in detail with reference to FIGS. FIG. 2 shows the holding means 100.
2. The protruding substance 1004 held by the
And then selectively irradiating the protruding material 1004 with the laser beam 2001 from the window 1011 of the heating means 1009 to form the heating portion 2002 on a part of the protruding material 1004. Is shown. When the irradiation time of the laser beam 2001 with respect to the heating unit 2002 is increased, as shown in FIG.
Phase transition to 01. The temperature of the protruding material 1004 and / or the temperature of the heating unit 2002 can be detected by, for example, infrared detection, a thermocouple, or the like. In the configuration shown in FIGS. 1 to 3, it is assumed that the heating unit 2002 and / or the melt 3001 are deformed by the pressure of the abutting means 1008, but for example, a stopper means (not shown) is applied. The deformation can be avoided by providing the contact means 1008 and defining the gap 1005 by the stopper means. Also, the holding means 100
In the case where it is required to keep the relative position of the substance 1001 with respect to the substance 2, the holding force for applying pressure from the side of the holding means 1002 toward the substance 1001 (in FIGS. Although it is necessary, as the means for generating the holding force, for example, the contact means 1008 can be used. When the holding force is not provided to the holding means 1002, for example, a replenishing means described later can be used instead.

Next, as shown in FIG.
12 (eg compressed air) into the transfer means 1010,
The melt 3001 is transferred as a jet 4001 by the flow force. Protruding material 10 after jet 4001 transfer
04, as shown in FIG.
By replenishing the substance 1001 with
4 is restored and the substance can be transferred repeatedly. However, the holding means 1002 holds the substance 1001 with a predetermined holding force,
If the replenishing operation of the replenishing unit 5001 is hindered, the holding force is released by the releasing unit (not shown) during the replenishing operation. As the releasing means, for example, a holding force generating means can be applied. The transfer means 10
When the compressed gas 1012 is applied to 10 and the compressed gas 1012 always flows through the protruding substance 1004, the heating efficiency of the heating means 1009 is reduced. For example, a sealing means such as a shutter can be provided. Also, heating means 1
If the heating by the heat means 009 also always acts on the protruding substance 1004, the portion of the protruding substance 1004 on which the heating means 1009 acts is always in a heated state or a molten state. Preferably, 1011 is provided with a shutter. The operation of these two types of shutters becomes more effective and the transfer efficiency can be improved by control means for controlling the opening and closing of the two types of shutters.

Next, a conceptual configuration of another embodiment of the mass transfer apparatus of the present invention will be described with reference to FIG. However, FIG. 6 shows the transfer means 1010 using the fluid force of the compressed gas shown in FIGS.
This is an example in which a piezoelectric element 6001 used exclusively in a so-called ink jet is applied instead of the above. Further, a configuration in which an ultrasonic wave generating means is applied instead of the piezoelectric element 6001 in FIG. 6 is also possible. When a so-called vibration force such as a piezoelectric element or an ultrasonic wave generating means is applied to the transfer force of the transfer means in this way, the transfer force acts directly and intensively on the melt 3001, thereby improving transfer efficiency. In addition, with this configuration, an electron beam that requires a heating unit to be evacuated can be applied.
Of course, a configuration in which the vibration force of FIG. 6 and the flow force of the compressed gas applied to FIGS.

FIG. 7 shows a conceptual configuration of another embodiment of the mass transfer apparatus of the present invention. The difference from FIGS. 1 to 6 is that the heat-resistant layer 70 is provided on the end face 1003 of the holding member 1002.
01 is provided. The heat-resistant layer 7001 is made of the protruding substance 1
Holding means 10 associated with heating to above the melting point of 004
02 can be prevented from being thermally deformed. As a material applicable to the heat-resistant layer 7001, for example, Al ₂
Oxides such as O ₃ , SiO ₂ , MgO, TiO, MnO, W
C system, Cr ₃ C ₂ system, TiC system, ZrC system, HfC system, V
Carbides such as cemented carbides such as C-based, TaC-based and NbC-based, S
i ₃ N ₄ , BN, TiN, ZrN, HfN, VN, Nb
Nitrides such as N and TaN, sulfides such as ZnS, and other heat-resistant metals such as W, carbon such as graphite, and the like are used singly or in an appropriate combination. It is preferable because it is promoted.

FIG. 8 shows a conceptual configuration of another embodiment of the material transfer apparatus of the present invention. The difference from the above-described FIGS. 1 to 6 is that a facing material layer 8001 is provided on the surface of the facing means 1006.
(Therefore, in this configuration, the facing material layer 8
001 is the reference plane 1007). As a material applied to the facing material layer 8001, the same kind of material as the heat-resistant layer 7001 used in FIG. 7 or another material can be used. In the case where a heat-resistant material is applied to the facing material layer 8001, similarly to the heat-resistant layer 7001, thermal deformation or the like of at least the surface of the facing means 1006 due to heating to the melting point of the protruding substance 1004 or higher can be suppressed. Note that when a heat-resistant material is used for the facing material layer 8001, a material having a small coefficient of thermal expansion is excellent in the releasability of the melt 3001 of the protruding substance 1004, and a material having a high thermal conductivity has a heat radiation effect. Is high, which is preferable. Further, for example, when Joule heat is applied to a heating unit 1009 to be described later, it is necessary to energize the facing material layer 8001. In the case where a material having a lower melting point than the above heat-resistant material is used for the facing material layer 8001, a melt 3001 of the protruding substance 1004 is used.
In some cases, the facing material layer 8001 may also be transferred at the same time as the transfer. At this time, it is preferable that the same material as the substance 1001 be applied to the facing material layer 8001 because the same material is transferred, or conversely, the substance 1001 and the facing material layer 8001 are transferred.
When a different material is positively applied, the melt 3001
For example, a mixture or an alloy can be formed, and the mixture can be transformed in a state of the mixture or the alloy. When at least the melt 3001 and the opposing material layer 8001 are both transferred, after the opposing material layer 8001 is transferred by a predetermined amount 8003, the opposing material layer 8001 is moved, and a new opposing material layer 8001 is transferred to the protruding material. It is necessary to provide a moving means 8002 that makes contact with 1004.

In FIG. 8, the facing material layer 8001 is provided in the facing means 1006 as another layer, and the facing material layer 8001 is provided.
Although only the first material 1 is moved by the moving means 8002, the facing material layer 8001 has a surface layer portion of the facing means 1006,
In other words, the facing material layer 8001 may be integrated with the facing material. In this case, the facing material of the facing means 1006 is moved by the moving means 8002. In the above-described embodiment, the case where the molten material 3001 of the protruding substance 1004 transitions in a granular state is shown. However, when the substance 1001 has malleability, it may transition in a viscous state (or a stringing state) depending on conditions. Although an example in which a metal or an alloy is applied as the substance 1001 has been described, when a so-called thermoplastic resin such as polyester, polyvinyl chloride, or polyethylene is applied as the substance, the transition of the substance becomes granular or viscous ( Alternatively, it can be performed in any of the following types.

FIG. 9 shows a conceptual configuration of another embodiment of the mass transfer apparatus of the present invention. The difference from FIG. 1 to FIG. 8 described above is that Joule heat by energization is applied as a heating means. . In order to apply Joule heat, it is required that at least both the substance 1001 and the reference surface 1007 of the facing unit 1006 have an energizing action. As a Joule heat generation method, an electrode A provided on one side of the substance 1001 is used.
It is only necessary to provide the voltage application means 9003 to the electrode 9001 and the electrode B9002 provided on the reference surface 1007, and the configuration is extremely simple. Switching off is possible. In a preferred embodiment of the present invention, the material 1001, the holding means 1002, the reference surface 10
07 and the opposing means 1006 are conductors. In this configuration, when the potential of the holding means 1002 and the potential of the substance 1001 are the same, and when the potentials of the reference surface 1007 and the opposing means 1006 are the same, the current path of the holding means 1002 and the substance 1001 becomes , The projecting material 1004, especially the projecting material 1004,
Since the current path at the contact portion is narrow, Joule heat is concentrated on the protruding material 1004, and the protruding material 1004 can be selectively heated and melted as if by an electric fuse. Also, with this configuration, less power is required to be supplied, and lower power consumption can be achieved. However, substance 1001,
Holding means 1002, reference plane 1007 and facing means 100
6 is not particularly limited, but when the same material is applied to the substance 1001 and the holding means 1002, for example, the contact resistance at the interface between the substance 1001 and the holding means 1002 can be reduced. This is preferable because Joule heat in the protruding material 1004 is concentrated and the heat generation efficiency is improved.
Further, in a configuration in which there is a need to reduce the contact resistance value at the interface between the substance 1001 and the holding means 1002, the holding means 1002
It is necessary to increase the holding force of the wire. In this case, when the substance 1001 is replenished by the replenishing means 5001, the replenishing operation can be reliably achieved by releasing the holding force by the releasing means.

In the heating means shown in FIG. 9, for example, the heat-resistant layer 7001 shown in FIG. 7 may be provided on the end face 1003, or the facing material layer 8001 shown in FIG. Note that a conductive substance is used as a material applied to the facing material layer 8001 as a matter of course. Especially,
When a material of the same kind as the substance 1001 is applied to the holding means 1002 and a material having both heat resistance, low thermal expansion coefficient, and conductivity, such as a WC-Co cemented carbide, is applied to the reference surface 1007, the protruding substance 1004 abuts. This is preferable because a material transfer operation can be continuously performed without removing a portion. Further, in the case of melting by heating with Joule heat due to energization, the contact resistance at the interface between the protruding end of the protruding material 1004 and the reference surface 1007 is the largest as compared with other contact resistances. It concentrates at the interface, and melting also starts at the interface. Therefore, a uniform amount of the melt 3001 can be obtained from the same location in a very short time, and the transfer means 1
The location where 010 operates can also be concentrated on the same location. Therefore, for example, only the control of at least one of the applied voltage pulse width and the pulse height, that is, the control of the pulse duty, causes the protruding substance 1
The amount of the melt 3001 can be freely selected with high precision up to the entire area 004. In addition, on / off of applied voltage, transition means 1
Various operation timings such as generation of the transfer force 010, operation of the replenishing means 5001 and the releasing means, and application of the contact pressure of the contact means 1008 are sequentially controlled and started / terminated based on predetermined control signals. Further, although the transfer means is not shown in FIG. 9, it is needless to say that, besides applying the fluid force by the compressed gas, a vibration force can also be applied, and the fluid force and the vibration force may be used in combination. In addition, as the protruding substance 1004 when Joule heat is applied to the heating means, for example, a material coated around a thermoplastic resin with a metal or an alloy, or a material coated around a metal or an alloy with a thermoplastic resin may be used. Applicable.

Next, the present invention will be described in more detail with reference to specific examples. As shown in FIG. 10, a pair of grooves 10002 provided in a ceramic holding unit 10001 is
Replenishing means 10 with Pb / Sn-based easy-fusion gold material 10003
004, the protruding material 10005 was formed in the gap from the end face of the holding means 10001, and at the same time, the end of the protruding material 10005 was in contact with the reference surface 10007 of the counter material 10006 of Cu. Note that the replenishing means 10004
In this operation, a low voltage was applied between the substance 10003 and the opposite substance 10006, and the presence or absence of a weak current was detected. next,
Heating control signal generator 10 from outside to heating means 10008
From 009, a heating control signal is given, and the projecting material 10005 is irradiated with a laser beam 10010 and melted based on the heating control signal. The transfer control signal is transferred from the transfer control signal generator 10011 with a predetermined time delay from the heating control signal.
[0012] The shutter 10013 of FIG. 2 applies a compressed gas 10014 of nitrogen to the molten portion of the protruding material 10005 to give a fluid force to transfer the molten portion from the gap. Projecting substance 100
When the volume of the protruding substance 10005 is consumed by the amount of the melted portion transferred from the area 05, the weak current is interrupted, the interruption is detected, and the substance 10003 abuts on the reference surface 10007 of the opposite substance 10006, and the weak current is detected. The supply operation of the supply means 10004 is performed. Thus, Pb
-Sn-based easily fused gold particles can be easily obtained, and the particles can be connected, for example, to an IC and a wiring board, and can be injected into holes provided in the wiring board and conducted between electrodes provided on the front and back of the wiring board. Or three-dimensional objects. FIG.
Although the replenishing means 10004 has shown the structure also serving as the abutting means, the replenishing operation is performed simultaneously with the melting or transfer operation in the configuration of the present embodiment in which the current flowing through the protruding material 10005 is detected at the start and end of the operation of the replenishing means 10004. Starts,
In some cases, it is difficult to impart a sufficient transfer force to the molten material. In such a case, substance 1 is added to holding means 10001.
0003 to the reference surface 10.
007 can be solved by further providing an abutting means for abutting the protruding substance 10005, and it is preferable to provide an opening means for releasing the holding force while the replenishing means 10004 operates.

The substance 10003 and the reference plane 10007
Is not limited to the weak current, and for example, a position detection method or the like can be applied. Further, in FIG. 10, the weak current is applied only to the detection of the contact between the substance 10003 and the reference surface 10007. However, the weak current can be applied to the detection of the melting of the protruding substance 10005 by utilizing the change in the resistance value accompanying the melting of the protruding substance 10005. Heating control signal generator 1000 in FIG.
In FIG. 9, for example, when data based on the structure data of the three-dimensional structure is input to the material transfer device 11001, a component 11002 of the three-dimensional structure can be formed as shown in FIG.
Note that FIG. 11 shows a case in which one material transfer device 11001 is applied. However, when a structure is formed of a plurality of materials, the material transfer device of the present invention is provided for each material as necessary. Just do it.

FIG. 12 is a cross-sectional perspective view showing a main part of another embodiment of the mass transfer apparatus of the present invention, in which a pair of grooves 12002 provided in a holding means 12001 made of ceramic has Pb.
Replenishing means 12004 with Sn-based easy-fusion gold substance 12003
To form a protruding substance 12005 in the gap from the end face of the holding means 12001 and at the same time
Pb · S of the same material as substance 12003 at the end of 2005
The holding force for holding the substance 12003 is brought into contact with the holding means 12008 from the holding force generation means 12008 by contacting with the ceramic opposite substance 12007 having the n-type alloy opposite material layer 12006.
2001. Note that the operation of the replenishing unit 12004 and the holding force generating unit 12008 was performed by applying a low voltage between the substance 12003 and the opposing material layer 12006 and detecting the presence or absence of a weak current. Next, a heating control signal is externally provided to the heating means 12009 from the heating control signal generation unit 12010, and the projecting material 12005 is irradiated with a laser beam and melted based on the heating control signal. A transfer control signal is provided from the transfer control signal generation unit 12011 to the piezoelectric element 12012 of the transfer unit with a predetermined time delay from the heating control signal, and an oscillating force is applied to the melted portion of the protruding material 12005 to transfer the melted portion from the gap. . At this time, the opposing material layer 12006 also partially melts and transfers. When the volume is consumed by the amount of the melted portion transferred from the protruding substance 12005 and the amount of the transferred melted portion of the facing material layer 12006, the weak current is interrupted, and the interruption is detected and the facing material layer 12006 is moved by the moving means 12013.
And the holding force of the holding force generating means 12008 is released, and the substance 1200 is delayed for a predetermined time from the release of the holding force.
The replenishing operation of the replenishing means 12004 is performed until 3 contacts the opposed material layer 12006 and a weak current is detected. When the replenishing operation is completed, the holding force of the holding means 12001 is changed to the substance 1
Joins 2003.

In FIG. 12, since the same material as the substance 12003 is used for the opposite material layer 12006, the material of the substance 12003 and the transition substance is the same, but the material of the opposite material layer 12006 is different from that of the substance 12003. For example, when Pb is applied to the substance 12003 and an alloy that forms an alloy with Pb, such as Sn, is used for the counter material layer 12006, the transition material forms an alloy, and a structure or the like of the alloy can be formed over the transferred object. Further, in the present invention, since the molten material is transferred as it is as described above, it is not a substance transfer through a gas phase such as vapor deposition, so that a change in the composition of the alloy can be avoided. Further, when a material having a melting point higher than the melting point of the substance 12003 such as ceramic, W, or WC-Co is applied to the counter material layer 12006, damage to the surface of the counter material layer 12006 due to melting transition can be suppressed. In addition, when a heat-resistant layer is provided on an end surface of the holding unit 12001 facing the opposing substance 12007, the holding unit 1201 by laser irradiation heating is provided.
01 can also be prevented from being damaged. Although the weak current in this embodiment is applied to the replenishment operation detecting means, the weak current can be applied to the detection of the melting of the protruding material 12005 by utilizing the change in the resistance value accompanying the melting of the protruding material 12005. In the present embodiment, a weak current is applied as the replenishing operation detecting means. However, it is needless to say that a position detecting means for detecting the distance between the protruding substance 12005 and the facing material layer 12006 can be applied.

FIG. 13 is a partial cross-sectional view for explaining one embodiment of a mass transfer apparatus to which Joule heat is applied as a heating means. Wire-like substance 1 in the groove of holding means 13001
3002, and comes into contact with a reference surface 13004 of a counter material 13003 of Cu via a gap, and
02 is held by the holding means 13001 and a predetermined weak pressure is applied by the contact means 13005. Electrode A13006 provided on holding means 13001 and counter material 13
To the electrode B13007 provided at 003
A pulse voltage is applied from 3008. By applying a predetermined pulse voltage between the electrode A13006 and the electrode B13007 while the substance 13002 is in contact with the reference surface 13004, the holding means 130
Due to the difference between the electric potential of 01 and the electric potential of the reference plane 13004, current concentrates on the protruding substance 13009 in the gap to generate Joule heat, which melts the protruding substance 13009. The molten protruding material 13009 is transferred to the transfer means 13010
, And is transferred to the transferred object in a molten state. After the transfer of the melt, the gap between the substance 13002 and the reference plane 13004 is supplied by the supply means 13011.
Supply until reaching.

This series of operations will be described in detail. Substance 1
In a state where the end face of 3002 and the reference plane 13004 are in contact with each other, a control signal 13012 based on the transition data is input to the voltage applying means 13008 and the pulse generating means 13013, and a pulse voltage is applied to the electrodes A13006 and B13007. Electric current flows between the holding means 13001 and the reference surface 13004 via the substance 13002 and the protruding substance 13009. Substance 1 held in holding means 13001
30009 or a substance 13009 protruding from the reference plane 13004
Since the current path is narrower, the protruding substance 13009 is selectively heated and melted by Joule heat. From the control signal 13012 input to the voltage applying means 13008, the time required for the protruding substance 13009 to melt is delayed 1301.
4, the transfer operation control signal is transferred by the transfer means 13010.
Of the piezoelectric element, the vibration force of the piezoelectric element acts on the molten substance, and the molten substance is transferred to the transferred object. Delay time from transition control signal to transition time is 1
By delaying at 3015, the holding force of the holding means 13001 is released, and in synchronization with the release of the holding force, the replenishing means 13011 replenishes the substance 13002, and the switch 13016 selects the low voltage 13017 side. When the reference surface 13004 is reached, a weak current due to the low voltage 13017 is detected by the ammeter 13018, and the substance 130
09 supplies the substance 13002 by the amount lost by the transfer, and after the replenishment operation is completed, the switch 13016 is selected to the high voltage side, and a holding force is applied to the holding means 13001 to generate the control signal 13012 based on the next transfer data. Wait until.

FIG. 14 shows another embodiment of the substance transfer apparatus in which Joule heat is applied to the heating means.
It is principal part sectional drawing which showed only the opposing means and the transfer means. That is, the material 140 of Fe is added to the holding means 14001 of Cu.
02 was penetrated and held, an opposing material layer 14004 of Fe was provided on the surface of the opposing material 14003 of Cu, and the protruding material 14005 in the gap was heated and melted by Joule heat in the same manner as in FIG. At this time, the molten material of the protruding material 14005 is transferred to the transfer means 14007 by the flow force 1400 of the compressed argon gas.
8, the surface layer portion of the opposing material layer 14004 also slightly transits, but the moving means 14006 moves the opposing material layer 1400 in accordance with the surface state of the opposing material layer 14004.
By moving 4, the transfer operation under the same conditions can be ensured.

FIG. 14 shows the case where the material of the opposite material 14003 and the material of the opposite material layer 14004 are different. However, if Fe is applied to the opposite material 14003, there is no need to provide the opposite material layer 14004. In this case, In this case, the opposing substance 14003 itself may be moved by the moving means in accordance with the state of the surface (that is, the reference plane) of the opposing substance 14003. Further, in FIG. 14, since the material of the opposing material layer 14004 and the material of the substance 14002 (protruding substance 14005) are the same, the transferred material is the same as the substance 14002. However, when Zn is applied to the opposing material layer 14004, for example, The transformed material becomes a mixture or alloy of Fe and Zn, and the substance 14002 and the transformed material can be different from each other.

In FIG. 14, since a heating means using Joule heat is used, there is an advantage that a material having a high melting point can be used as compared with the structure shown in FIG. 8 or FIG. further,
In FIG. 14, since the base metal material of Fe and / or Zn is used and the compressed argon gas is applied as the transfer force, the characteristics of the molten transfer material do not change before and after the transfer. When there is such a request, the gas component that can be applied as a fluid force is not limited to argon gas, and for example, a non-oxidizing gas such as helium, neon, krypton, nitrogen, and hydrogen can be used. . In addition, when there is a request to positively change the physical properties of the substance after the transition, such as electrical resistance or melting point, a reactive gas such as oxygen, ozone, or halogen is appropriately added as a gas component for imparting fluidity. It can be achieved by adding.

Although the embodiment in which the protruding substance 14005 and the opposing material layer 14004 (or the opposing substance 14003) are both melt-transferred has been described with reference to FIG. 14, the protruding substance 14005 or the opposing material layer 14004 (or the opposing substance 14003) When, for example, a conductive cemented carbide is applied to any of them, only one of the substances can undergo a melting transition. For example, W containing 11% of Co in the protruding material 14005
Using C cemented carbide, using Cu for the opposing substance 14003,
At the contact portion between the protruding material 14005 and the opposing material 14003, the flow force 1400 of the compressed argon gas
8 from one end face of the opposing substance 14003
When a configuration in which the material is applied in parallel to the plane of 4003 is employed, Joule heat generated by applying a voltage between the protruding material 14005 and the
03 melts, and the melt can be transferred with a flow force of 14008. Opposite substance 14003 decreased with metastasis
Is moved by the moving means 14006 to return to the original state,
It can transfer substances continuously. Note that in the case of the above configuration, for example, the width (horizontal direction of the paper surface) of the protruding substance 14005 in FIG. 14 needs to be the same as the width of the opposing substance 14003, and the shape of the protruding substance 14005 is preferably a thin plate.

FIG. 15 shows another embodiment of the substance transfer apparatus in which Joule heat is applied to the heating means and flow force and vibration force are applied to the transfer means. Only the holding means, the substance, the facing means and the transfer means are shown. It is principal part sectional drawing which showed. That is, Cu
WC cemented carbide counter material 1500 penetrating Au material 15002 into holding means 15001 and containing 11% Co
In addition to contacting the reference surface of No. 3, the holding means 15001 was given a holding force to hold the substance 15002. As in FIG. 13, the protruding substance 15005 in the gap is selectively heated and melted by Joule heat. After the protruding material 15005 is melted, a transfer operation control signal is input to the transfer means including the piezoelectric element 15006 and the fluid nozzle 15007 at the same timing as in FIG. Is given. First, the transfer operation control signal is transmitted to the piezoelectric element 1.
At the same time as applying a vibration force to the melt of the protruding substance 15005 by inputting the compressed gas 15006, the fluid nozzle 15007 is opened by the operation of the piezoelectric element 15006, and the compressed gas 1 compressed the air.
5008 also imparts a fluid force to the melt of the protruding material 15005, and the transition force using both the vibration force and the fluid force produces the protruding material 15005.
05 to the melt.

In this embodiment, since a hard metal is used as the facing material 15003, the heating, melting,
Since the reference plane 15004 is not damaged even if the transfer is repeated, the continuity of the transfer operation is improved. Although FIG. 15 illustrates the case where the cemented carbide is applied to the facing material 15003, the same effect can be obtained by using another material as the facing material 15003 and using the cemented carbide as the facing material layer. And
It is needless to say that a hard metal may be applied to the holding means 15001. Further, in the present embodiment, since the piezoelectric element 15006 and the compressed gas 15008 are used in combination as the transfer means, the transfer force increases, and the piezoelectric element 15006 has a function of a valve of the fluid nozzle 15007. An increased transfer force can be obtained without any device for controlling the generation of fluid force. However, the transfer means shown in FIG. 15 is an example, and the piezoelectric element 15006 and the compressed gas 150
08 in combination with the fluid nozzle 1
A means for selectively generating a fluid force such as a shutter may be applied to the 5007, or an ultrasonic wave and a fluid force may be used in combination. Can be configured.

FIG. 16 shows another embodiment of a substance transfer apparatus in which Joule heat is applied as a heating means and an oscillating force is applied as a transfer means. FIG. Ultrasonic vibration means 160
01 is a holding means 160 for a WC cemented carbide containing 11% Co
The Au protruding material 16003 held by the holding means 16002 at a predetermined pressure constantly vibrates, and one end of the WC cemented carbide counter material 16004 containing 11% Co is engaged with the piezoelectric means 16005. , Ultrasonic vibration means 1600
1 and the piezoelectric means 16005 simultaneously receive a predetermined signal, the one end face of the protruding substance 16003
004 abuts on the abutting portion 16006. Holding means 16
002 and the opposing substance 16004, the protruding substance 160
Power supply 1600 for applying current to melt 03 by Joule heat
7 is connected via electrodes A16008 and B16009.

Next, the operation of the mass transfer apparatus shown in FIG. 16 will be described. Holding means 160 by ultrasonic vibration means 16001
02, the end face of the protruding substance 16003 is held by the contact portion 16006 and the holding means 16
The vibration is repeated between a predetermined position from 002 and a material transfer signal from the outside unless applied to the piezoelectric means 16005. When a material transfer signal is input from the outside, a voltage is applied to the piezoelectric means 16005, and the end of the opposite material 16004 reaches the contact portion 16006, and the ultrasonic vibration means 1600
The protruding substance 16003 is brought into contact with the contact portion 16006
When the current reaches the electrode A16
008 and the protruding material 1600 via the electrode B16009
3 and the current is interrupted when separated from the contact portion 16006. This current is repeatedly turned on and off until the melting point of the protruding substance 16003 is reached.
The signal given to the piezoelectric means 16005 so that the end of 004 is located at the contact portion 16006 is held. Projecting substance 1
When 6003 melts, the differential signal of the piezoelectric means 16005 is cut off, the opposing substance 16004 returns to its original position, and the molten material of the projecting substance 16003
Due to the vibration force of 001, the droplets are transferred.

In this embodiment, the ultrasonic vibration means 1 engaged with the holding means 16002 as the material transfer force of the melt is used.
Although an example in which the 6001 is used is shown, piezoelectric means or fluid force can be applied as the material transfer force.
Of course, the piezoelectric means and the fluid force may be appropriately combined. In addition, when an oscillating force is applied to the element of the mass transfer force, for example, by adding a stopper means for suddenly stopping the vibration at a predetermined position, an inertial force acts on the molten material to be transferred. It is preferable because it increases. Further, in the present embodiment, the ultrasonic vibration means 16
001, a configuration in which vibration is applied to the opposite substance 16004 by the piezoelectric means 16005 is shown, but there is no need to apply a separate vibration force as a means for applying vibration.
The same means can be applied, and a configuration in which vibration is applied to only one of them may be used. The transfer material by the mass transfer device described with reference to FIGS. 12 to 16 is, for example, a component of various elements, a fine part such as a micromachine, an electrode of a wiring board, and an electrical connection between an electrode formed on the substrate and the element. It is needless to say that the present invention can be applied to the production of such a structure.

[0037]

As described above, the material transfer device and method of the present invention selectively heat and melt a part of a solid-state material and transfer it in a molten state. In addition to being able to freely control the state of shape, physical properties, composition, etc., it is particularly suitable for melt transfer of a substance having a high melting point, thus exhibiting an excellent effect in fine processing of a metal material.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional perspective view illustrating a conceptual configuration of a mass transfer device of the present invention.

FIG. 2 is a partial sectional perspective view illustrating a heating operation of the mass transfer apparatus of the present invention.

FIG. 3 is a partial cross-sectional perspective view illustrating a melting operation of the mass transfer device of the present invention.

FIG. 4 is a partial cross-sectional perspective view illustrating a transfer operation of the mass transfer device of the present invention.

FIG. 5 is a partial cross-sectional perspective view illustrating a replenishing operation of the mass transfer device of the present invention.

FIG. 6 is a partial cross-sectional perspective view illustrating another conceptual configuration of the mass transfer device of the present invention.

FIG. 7 is a partial cross-sectional perspective view illustrating another conceptual configuration of the material transfer device of the present invention.

FIG. 8 is a partial cross-sectional perspective view illustrating another conceptual configuration of the material transfer device of the present invention.

FIG. 9 is a partial cross-sectional perspective view illustrating another conceptual configuration of the material transfer device of the present invention.

FIG. 10 is a partial cross-sectional view illustrating another conceptual configuration of the material transfer device of the present invention.

FIG. 11 is a cross-sectional view illustrating an example of an apparatus for manufacturing a structure using the material transfer device of the present invention.

FIG. 12 is a partial cross-sectional perspective view illustrating another conceptual configuration of the material transfer device of the present invention.

FIG. 13 is a partial cross-sectional view illustrating another conceptual configuration of the material transfer device of the present invention.

FIG. 14 is a cross-sectional view of a principal part explaining another conceptual configuration of the mass transfer apparatus of the present invention.

FIG. 15 is a cross-sectional view of a main part illustrating another conceptual configuration of the mass transfer apparatus of the present invention.

FIG. 16 is a cross-sectional view of a principal part explaining another conceptual configuration of the material transfer device of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1001 substance 1002 holding means 1004 projecting substance 1005 gap 1006 facing means 1007 reference plane 1008 contact means 1009 heating means 1010 transfer means 5001 replenishing means 7001 heat resistant layer 8001 facing material layer

Claims (24)

[Claims] 1. A holding means, an opposing means having a reference surface opposed to one end face of the holding means via a predetermined gap, and a protruding substance held by the holding means and protruding from the one end face of the holding means. A contacting means for contacting the opposing substance on the reference surface of the opposing means, and at least one of the protruding substance and the opposing substance is heated and melted at least at an abutting portion between the protruding substance and the opposing substance. A substance transfer device, comprising: a heating unit; and a transfer unit that transfers a melt heated and melted by the heating unit from at least the contact portion. 2. The substance transfer apparatus according to claim 1, further comprising a replenishing means for replenishing at least one of the protruding substance and the counter substance by an amount of the melt transferred by the transfer means. . 3. The substance transfer device according to claim 1, further comprising an opening unit that releases a holding force of the holding unit with respect to the protruding substance in synchronization with the replenishing unit. 4. The substance transfer device according to claim 1, further comprising a moving means for moving at least a predetermined time of the opposing substance of the contact portion with which the protruding substance contacts. . 5. The mass transfer device according to claim 1, wherein the protruding material and the counter material are made of the same material. 6. A heat-resistant layer is provided on at least one of the one end face of the holding means, the reference surface of the projecting object, or the contact portion of the facing substance.
The mass transfer device according to the above. 7. The substance transfer device according to claim 6, wherein the heat-resistant layer is made of a heat conductive material. 8. The mass transfer apparatus according to claim 1, wherein said heating means is at least one of energy beam irradiation and electric current. 9. The material of any combination of the protruding substance, the holding means, and the opposing substance, or any combination of the protruding substance, the holding means, and the heat-resistant layer of the contact portion is a conductive material. The material transfer device according to any one of claims 1 to 8, wherein: 10. The substance transfer apparatus according to claim 1, wherein the transfer means uses at least one of a flow force and an oscillating force. 11. A projecting material held by a holding member and protruding from one end surface of the holding member, and an opposing material of an opposing member facing the one end surface via a predetermined gap by a contact member on a reference surface. Abutting, at least at the abutting portion between the protruding material and the facing material, heating and melting at least one of the protruding material and the facing material, and transferring the molten material from at least the abutting portion. Mass transfer method. 12. The material transfer method according to claim 11, wherein after transferring the melt, at least one of the protruding material and the counter material is replenished by a replenishing member in an amount of the melt. . 13. The material transfer method according to claim 11, wherein the holding force of the holding member with respect to the protruding substance is released in synchronization with the supply of the protruding substance by the replenishing member. 14. The material transfer method according to claim 11, wherein at least the opposed material at the contact portion is moved for a predetermined time. 15. The material transfer method according to claim 11, wherein the protruding material and the counter material are made of the same material. 16. The material transfer method according to claim 11, wherein a heat-resistant layer is provided on at least one of the one end face of the holding member, the abutting portion of the protruding material or the facing material. 17. The material transfer method according to claim 16, wherein the heat-resistant layer is made of a heat conductive material. 18. The material transfer method according to claim 11, wherein the molten material is heated and melted by either energy beam irradiation or electric current. 19. All of the combination of the protruding substance / the holding member / the opposing substance or the protruding substance / the holding member / at least the heat-resistant layer provided on the reference surface is a conductive material. The method according to claim 11, wherein
19. The material transfer method according to any one of claims 18 to 18. 20. The material transfer method according to claim 11, wherein the transfer force for transferring the melt uses at least one of a flow force and an oscillating force. 21. The method according to claim 1, further comprising the step of transferring a substance to a substance to be transferred using the substance transfer apparatus according to claim 1.
A method of manufacturing a structure, comprising forming a substance of at least one component of the structure on the transferred object. 22. The method according to claim 11, further comprising the step of transferring a substance to a substance to be transferred, wherein the substance of at least one component of the structure is placed on the substance to be transferred. A method of manufacturing a structure, characterized by forming the structure. 23. A structure manufactured by the manufacturing method according to claim 21. 24. A structure manufactured by the manufacturing method according to claim 22.