JPH11158659A - Copper remover and method for removing copper using same - Google Patents
Copper remover and method for removing copper using sameInfo
- Publication number
- JPH11158659A JPH11158659A JP33315697A JP33315697A JPH11158659A JP H11158659 A JPH11158659 A JP H11158659A JP 33315697 A JP33315697 A JP 33315697A JP 33315697 A JP33315697 A JP 33315697A JP H11158659 A JPH11158659 A JP H11158659A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- thiourea
- layer
- stripping
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 65
- 239000010949 copper Substances 0.000 title claims abstract description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims description 11
- 238000007747 plating Methods 0.000 claims abstract description 48
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052709 silver Inorganic materials 0.000 claims abstract description 20
- 239000004332 silver Substances 0.000 claims abstract description 20
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 19
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 14
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 14
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 14
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 19
- 150000003585 thioureas Chemical class 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 7
- 239000002344 surface layer Substances 0.000 claims 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
- 238000004090 dissolution Methods 0.000 abstract description 5
- 150000001735 carboxylic acids Chemical class 0.000 abstract description 4
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- 239000000956 alloy Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 230000009931 harmful effect Effects 0.000 abstract description 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 abstract 2
- 239000000203 mixture Substances 0.000 description 15
- 239000000243 solution Substances 0.000 description 14
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 5
- 238000007654 immersion Methods 0.000 description 4
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000003002 pH adjusting agent Substances 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- YIROYDNZEPTFOL-UHFFFAOYSA-N 5,5-Dimethylhydantoin Chemical compound CC1(C)NC(=O)NC1=O YIROYDNZEPTFOL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 150000003138 primary alcohols Chemical class 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、銅剥離剤及びそれを用
いた銅剥離方法に関し、特に、リードフレームの表面に
施される銅ストライクめっきの剥離に有用な剥離剤及び
それを用いた剥離方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper stripping agent and a copper stripping method using the same, and more particularly to a stripping agent useful for stripping copper strike plating applied to the surface of a lead frame and a stripping strip using the same. About the method.
【０００２】[0002]
【従来の技術】一般に、リードフレームやコネクターピ
ン等の電子部品または樹脂製品への装飾用の銀めっきま
たは錫めっき等を施す場合、めっきの密着性向上および
被めっき物の素材保護を目的として、銅ストライクめっ
きが前処理として用いられており。この銅ストライクめ
っきには、シアン化銅浴が多く使用されてきた。特に、
鉄系金属、鉛、亜鉛等の素材金属に銀めっきを行う前処
理として、シアン化銅ストライクめっきが有効である。2. Description of the Related Art In general, when silver or tin plating for decoration is applied to electronic parts such as lead frames and connector pins or resin products, for the purpose of improving the adhesion of plating and protecting the material to be plated. Copper strike plating is used as pretreatment. For this copper strike plating, a copper cyanide bath has often been used. Especially,
Copper cyanide strike plating is effective as a pretreatment for performing silver plating on a base metal such as an iron-based metal, lead, or zinc.
【０００３】ここで、リードフレームの銀めっき工程を
例に採ると、最初にシアン化銅ストライクめっきがリー
ドフレームの全面に施され、続いてシアン浴銀めっきを
行い、シアン系銅剥離剤で表面に残留するシアン化銅ス
トライクめっきの銅層の剥離を行って、銀めっき工程が
完了する。これらの工程で使用される溶液は、いずれも
シアン系溶液が使用されている。シアン系溶液を用いる
と、めっき条件および溶解条件の制御が容易で且つ優れ
た溶液安定性が容易に確保できるためである。[0003] Taking the silver plating process of a lead frame as an example, first, copper cyanide strike plating is applied to the entire surface of the lead frame, followed by cyan bath silver plating, and the surface is coated with a cyan copper-releasing agent. Then, the copper layer of the copper cyanide strike plating remaining is stripped off, and the silver plating step is completed. As the solution used in these steps, a cyan solution is used. This is because, when a cyan solution is used, plating conditions and dissolution conditions can be easily controlled, and excellent solution stability can be easily secured.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うなシアン系溶液の使用は、人体に有害な毒性を持つシ
アンを含むものであるとともに、シアン系銅剥離剤で表
面に残留するシアン化銅ストライクめっきの銅層の剥離
を行う際に、銀めっき層に損傷を与えることがあり工程
管理が複雑且つ困難であった。However, the use of such a cyan-based solution contains cyanide which is harmful to the human body, and a copper-cyanide strike plating which remains on the surface with a cyan-based copper stripping agent. When the copper layer is peeled, the silver plating layer may be damaged, and the process control is complicated and difficult.
【０００５】従って、本出願の発明者らは、特願平５ー
３４５６６６号で開示したように、非シアン系の銀めっ
き工程を提唱してきた。この非シアン系の銀めっき工程
で使用した非シアン系銅剥離剤は、直鎖型一級アルコー
ルを使用した電解剥離工程で使用するものであった。そ
こで、本発明では、銅の浸漬剥離に用いることができ、
安全で確実に銅の選択的剥離が可能で、且つ安定性に優
れた銅剥離溶液の提供を目的とするものである。Accordingly, the inventors of the present application have proposed a non-cyan silver plating process as disclosed in Japanese Patent Application No. 5-345666. The non-cyanic copper stripping agent used in the non-cyanide silver plating step was used in the electrolytic stripping step using a linear primary alcohol. Therefore, in the present invention, it can be used for immersion peeling of copper,
It is an object of the present invention to provide a copper stripping solution that is capable of safely and surely selectively stripping copper and has excellent stability.
【０００６】本発明は、特に、リードフレームに施され
る銀めっきにおいて、不要銅ストライクめっき部を溶解
剥離除去した後にＩＣ、ＴＡＢ等の電子部品との接点と
されるため、銀めっき部の銀層の銅剥離剤による損傷の
有無は、製品価値を左右する重要な要素となる。In the present invention, in particular, in silver plating applied to a lead frame, unnecessary copper strike plating portions are dissolved and peeled off and then contacted with electronic components such as ICs and TABs. Whether or not the layer is damaged by the copper stripping agent is an important factor in determining product value.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明の銅剥離液は、チオ尿素またはチオ尿素誘導
体を必須成分とし、必要に応じて硫酸、塩酸、リン酸ま
たはカルボン酸のいずれかの１種または２種以上の組合
せにより、ｐＨ２．０以下に調整してなるものである。
即ち、この発明に係る剥離液は、銅を溶解させることの
できる硫酸、リン酸、塩酸またはクエン酸等の酸性溶液
を主成分として、これに必須成分としてチオ尿素または
チオ尿素誘導体を添加することにより調整されるもので
ある。In order to achieve the above object, the copper stripping solution of the present invention contains thiourea or a thiourea derivative as an essential component and, if necessary, contains sulfuric acid, hydrochloric acid, phosphoric acid or carboxylic acid. The pH is adjusted to 2.0 or less by any one or a combination of two or more.
That is, the stripping solution according to the present invention comprises, as a main component, an acidic solution such as sulfuric acid, phosphoric acid, hydrochloric acid, or citric acid capable of dissolving copper, to which thiourea or a thiourea derivative is added as an essential component. It is adjusted by:
【０００８】ここで使用した、チオ尿素またはチオ尿素
誘導体は、ストライク銅メッキ層の銅と異なるイオン化
傾向を持つ銀または銀合金層とが表層に存在する被処理
物表面より、銅の溶解速度を適正に調整し、ストライク
銅メッキ層の銅以外の金属めっき層に損傷を与えること
無く銅の選択的剥離を可能とするものであり、併せてレ
ベリング剤としての効果を果たすものでもある。このよ
うな組成の溶液であれば、シアンを含まず、環境をおよ
び人体に与える悪影響を確実に低減することができる。The thiourea or thiourea derivative used here has a dissolution rate of copper from the surface of the workpiece in which the copper of the strike copper plating layer and the silver or silver alloy layer having a different ionization tendency are present on the surface. It is appropriately adjusted to enable selective peeling of copper without damaging metal plating layers other than copper of the strike copper plating layer, and also serves as a leveling agent. A solution having such a composition does not contain cyan and can reliably reduce adverse effects on the environment and the human body.
【０００９】このチオ尿素またはチオ尿素誘導体は、
０．５〜１００ｇ／ｌの範囲で使用される。０．５ｇ／
ｌより少ない量では銅の溶解速度が著しく遅くなり、１
００ｇ／ｌを越える量では、銀メッキ層に損傷を引き起
し、その下地の銅層までも影響を受けるためである。The thiourea or thiourea derivative is
It is used in the range of 0.5 to 100 g / l. 0.5g /
When the amount is less than 1 liter, the dissolution rate of copper becomes extremely slow,
If the amount exceeds 00 g / l, the silver plating layer will be damaged, and the underlying copper layer will be affected.
【００１０】次に、必要に応じて硫酸、塩酸、リン酸ま
たはカルボン酸のいずれかの１種または２種以上の組合
せにより、ｐＨ２．０以下に調整を行うのは、ストライ
ク銅メッキ層の銅以外の金属めっき層の受ける損傷をよ
り低く抑え、より確実な銅の選択的剥離が可能となるた
めである。ここでｐＨ調整剤として使用する、硫酸、塩
酸、リン酸またはカルボン酸のいずれかの１種または２
種以上を組合せた混酸を使用するとしたのは、剥離剤と
しての機能に何ら変化を引き起こすこと無く、ｐＨ調整
剤として十分な機能を備えたものを適正に選択した結果
である。The adjustment of the pH to 2.0 or less by one or more of sulfuric acid, hydrochloric acid, phosphoric acid and carboxylic acid, if necessary, is performed by adjusting the copper content of the strike copper plating layer. This is because damage to the metal plating layers other than the above can be suppressed lower, and more reliable selective peeling of copper can be performed. Any one or two of sulfuric acid, hydrochloric acid, phosphoric acid or carboxylic acid used here as a pH adjuster
The use of a mixed acid of a combination of more than one species is a result of properly selecting a compound having a sufficient function as a pH adjuster without causing any change in the function as a release agent.
【００１１】以上に述べた銅の選択的剥離を可能とした
銅剥離剤は、特に、リードフレーム、中でもインバー合
金を使用したリードフレームの銀めっき工程で使用する
銅ストライクめっきの剥離の為に使用することが有用で
ある。また、その溶液組成を極めて単純化することで工
程管理を容易にすることができる。[0011] The above-mentioned copper stripping agent capable of selectively stripping copper is used particularly for stripping copper strike plating used in a silver plating step of a lead frame, especially a lead frame using an Invar alloy. It is useful to do. Also, the process control can be facilitated by extremely simplifying the solution composition.
【００１２】[0012]
【発明の実施の形態】以下に、本発明のうち最良と思わ
れる実施の形態について説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiment of the present invention will be described below.
【００１３】第１実施形態 本発明の実施は、インバー
合金製リードフレームを用いて行った。まず最初にピロ
リン酸系のメッキ浴により、ストライク銅メッキをリー
ドフレームの全面におこなった。このときの浴組成およ
びメッキ条件は以下のとうりである。 First Embodiment The present invention was carried out using an Invar alloy lead frame. First, strike copper plating was performed on the entire surface of the lead frame using a pyrophosphate-based plating bath. The bath composition and plating conditions at this time are as follows.
【００１４】ストライク銅メッキ浴の組成およびメッキ
条件 非シアン浴である荏原ユージライト製キュープラルを用
いてストライク銅メッキを行った。 浴温 ５０℃ 電流密度 ５Ａ／ｄｍ2 電解時間 １０ｓｅｃ． Composition and plating of strike copper plating bath
It was strike copper plating using the conditions are non-cyanide bath Ebara Udylite made Kyupuraru. Bath temperature 50 ° C Current density 5A / dm 2 Electrolysis time 10sec.
【００１５】ストライク銅メッキを行ったのち、高速部
分メッキ装置を用いてリードフレームのボンディングエ
リア内に銀の部分メッキを行った。ここで使用した銀メ
ッキの浴組成およびメッキ条件は以下のとうりである。After the strike copper plating, silver was partially plated in the bonding area of the lead frame using a high-speed partial plating apparatus. The bath composition and plating conditions of the silver plating used here are as follows.
【００１６】銀メッキ浴の組成およびメッキ条件 硝酸銀 ９５ｇ／ｌ ジメチルヒダントイン ２５０ｇ／ｌ ｐＨ値 １０ 浴温 ６５℃ 電流密度 ５０Ａ／ｄｍ2 電解時間 １０ｓｅｃ． Silver plating bath composition and plating conditions Silver nitrate 95 g / l Dimethylhydantoin 250 g / l pH value 10 Bath temperature 65 ° C. Current density 50 A / dm 2 Electrolysis time 10 sec.
【００１７】銀メッキが終了すると、銀の部分メッキ部
以外の、リードフレームの表面に残留する余分なストラ
イク銅メッキを浸漬銅剥離剤により剥離除去した。ここ
で使用した浸漬銅剥離剤は以下の組成のものを使用し
た。When the silver plating was completed, the extra strike copper plating remaining on the surface of the lead frame other than the silver partial plating portion was peeled off and removed with an immersion copper peeling agent. The immersion copper stripping agent used here had the following composition.
【００１８】 剥離剤組成１ 硫酸 ５０ｍｌ／ｌ チオ尿素 ０．５ ｇ／ｌ ｐＨ値 １ 以下 浴温 ４０ ℃ 処理時間 ５ ｓｅｃ． 剥離剤組成２ リン酸 １００ｍｌ／ｌ チオ尿素 １０ ｇ／ｌ ｐＨ値 １ 以下 浴温 ４０ ℃ 処理時間 ３ ｓｅｃ． 剥離剤組成３ クエン酸 ２００ｍｌ／ｌ チオ尿素 １ ｇ／ｌ ｐＨ値 ２．０ 浴温 ２５ ℃ 処理時間 １０ ｓｅｃ． 剥離剤組成４ 塩酸 １００ｍｌ／ｌ チオ尿素 １００ ｇ／ｌ ｐＨ値 １ 以下 浴温 ２５ ℃ 処理時間 ６０ ｓｅｃ．Stripping agent composition 1 Sulfuric acid 50 ml / l Thiourea 0.5 g / l pH value 1 or less Bath temperature 40 ° C. Treatment time 5 sec. Release agent composition 2 Phosphoric acid 100 ml / l Thiourea 10 g / l pH value 1 or less Bath temperature 40 ° C Treatment time 3 sec. Release agent composition 3 Citric acid 200 ml / l Thiourea 1 g / l pH value 2.0 Bath temperature 25 ° C Treatment time 10 sec. Release agent composition 4 Hydrochloric acid 100 ml / l Thiourea 100 g / l pH value 1 or less Bath temperature 25 ° C Treatment time 60 sec.
【００１９】以上に示す各々の組成及び操作条件でスト
ライク銅メッキの溶解剥離を行ったところ、全ての組成
浴において、銀めっき層に何ら損傷を与えること無く、
リードフレームの表面に残留する余分なストライク銅メ
ッキは完全に除去され、銅の選択的剥離がうまくいった
ことを示した。When the dissolution and peeling of the strike copper plating was performed under the respective compositions and operating conditions described above, the silver plating layer was not damaged in any of the composition baths without any damage.
The extra strike copper plating remaining on the surface of the leadframe was completely removed, indicating successful selective copper stripping.
【００２０】[0020]
【発明の効果】本発明に係る銅の浸漬剥離液及びそれを
用いた電解剥離方法は、非シアン系であり、チオ尿素ま
たはチオ尿素誘導体を使用することで、銀メッキ層の存
在下でも、銅を選択的に剥離することを可能とし、かつ
溶液安定性に優れているため、環境または人体に悪影響
を与えることが無く、しかも溶液組成を単純化できたこ
とで工程管理を容易にし、更に溶液の安定性も良好であ
るためコスト的に有利なものとなる。The copper immersion stripping solution and the electrolytic stripping method using the same according to the present invention are non-cyan, and by using thiourea or a thiourea derivative, it can be used even in the presence of a silver plating layer. It enables copper to be selectively peeled off, and has excellent solution stability, so that it has no adverse effect on the environment or human body, and can simplify the process composition by simplifying the solution composition. Since the stability of the solution is also good, it is advantageous in terms of cost.
Claims (4)
存在する被処理物表面より、銅層の銅のみを選択的に剥
離するためのチオ尿素またはチオ尿素誘導体を含むこと
を特徴とする銅剥離剤。1. A thiourea or thiourea derivative for selectively stripping only copper of a copper layer from a surface of an object to be processed in which a copper layer and at least one other metal layer are present on a surface layer. A copper release agent characterized by the following:
〜１００ｇ／ｌの範囲で含有し、硫酸、塩酸、リン酸ま
たはカルボン酸のいずれかの１種または２種以上の組合
せにより、ｐＨ２．０以下に調整して成る請求項１記載
の銅剥離剤。2. The method according to claim 2, wherein the thiourea or the thiourea derivative is 0.5
The copper stripper according to claim 1, which is contained in the range of 100 to 100 g / l and is adjusted to a pH of 2.0 or less by one or a combination of two or more of sulfuric acid, hydrochloric acid, phosphoric acid and carboxylic acid. .
層の剥離のために請求項１または請求項２いずれかに記
載の銅の剥離剤を用いる銅剥離方法。3. A copper stripping method using the copper stripping agent according to claim 1 for stripping a copper strike plating layer on a lead frame.
する被処理物表面から、銅層の銅のみを選択的に剥離す
るために請求項１または請求項２いずれかに記載の銅の
剥離剤を用いる銅剥離方法。4. The method according to claim 1, wherein only the copper of the copper layer is selectively peeled off from the surface of the workpiece on which the silver or silver alloy layer and the copper layer are present on the surface layer. A copper stripping method using a copper stripping agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33315697A JPH11158659A (en) | 1997-12-03 | 1997-12-03 | Copper remover and method for removing copper using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33315697A JPH11158659A (en) | 1997-12-03 | 1997-12-03 | Copper remover and method for removing copper using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11158659A true JPH11158659A (en) | 1999-06-15 |
Family
ID=18262922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33315697A Pending JPH11158659A (en) | 1997-12-03 | 1997-12-03 | Copper remover and method for removing copper using same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11158659A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110983336A (en) * | 2019-11-15 | 2020-04-10 | 哈焊所华通（常州）焊业股份有限公司 | Deplating solution for copper-plated welding wire and copper deplating method thereof |
-
1997
- 1997-12-03 JP JP33315697A patent/JPH11158659A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110983336A (en) * | 2019-11-15 | 2020-04-10 | 哈焊所华通（常州）焊业股份有限公司 | Deplating solution for copper-plated welding wire and copper deplating method thereof |
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