JPH11156705A - Carrier plate made of fiber reinforced plastics - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier plate with high durability and a long service life. SOLUTION: In a carrier plate 6 where fiber reinforced plastic layers are laminated so as to form a sheet made of fiber reinforced plastics, and a plurality of through holes 4 are provided therein, anti-separation strength is between layers required to be >=0.1 kgf/mm, and the anti-separation strength is preferably higher than 0.3 kgf/mm. If the strength is less than 0.1 kgf/mm, separation between layers takes place, and the carrier plate is broken with ease when it is in use.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fiber reinforced plastic carrier plate for holding and driving an object to be polished in a lapping machine for precisely polishing a thin brittle material such as a semiconductor wafer and glass.

[0002]

2. Description of the Related Art Precision polishing of a thin brittle material such as a semiconductor wafer and glass is carried out, for example, in Japanese Utility Model Application Laid-Open No. 60-161551.
This is performed by a polishing machine called a lapping machine as shown in FIG. 1 to FIG. In such a polishing machine, a carrier is a disc-shaped thin plate, on the outer periphery of which teeth meshing with the internal and external gears of the lapping machine are formed, and a through-hole for holding an object to be polished is formed. A plate is used. Conventionally, a metal thin plate has been used as a carrier plate. However, there has been a disadvantage that minute debris, rust, etc. of the carrier plate generated at the time of polishing have an adverse effect on the object to be polished. In addition, there is a problem that plastic deformation tends to occur due to a drop or collision during transportation, and polishing using a deformed carrier plate lowers the polishing accuracy of an object to be polished. Therefore, a carrier plate made of fiber reinforced plastic (FRP) which is chemically stable and hardly deformed plastically has been used.

[0003]

Such an FRP carrier plate is disclosed in JP-A-58-143954 and JP-A-58-186571, which are obtained by weaving reinforcing fibers such as carbon fibers. A carrier plate made of a thin FRP sheet reinforced by a reinforcing fiber cloth is disclosed. However, in these carrier plates, the material of the carrier plate was simply changed from metal to fiber reinforced plastic, and the strength of the tooth portion was particularly insufficient. Therefore, Japanese Patent Application Laid-Open No. 63-221968
Japanese Patent Application Laid-Open Publication No. H11-157, discloses a carrier plate in which reinforcing fibers are arranged along the outer shape of the teeth in order to reinforce the teeth cut on the outer periphery of the FRP carrier plate. This carrier plate was developed to compensate for the lack of strength in the tooth part. However, as described above, simply changing from metal to fiber reinforced plastic only allows the anisotropy inherent in fiber reinforced plastic. Since no consideration was given to the advantages and disadvantages of the material, even one carrier plate had a variation in rigidity for each tooth.

[0004] Further, a V-shaped groove may be formed on the side surface of the through hole of the carrier plate by polishing. This V
The U-shaped groove is formed along the wall of the through-hole because the polished object rubs against the object to be polished. This is more noticeable when the object to be polished is chamfered to improve the uniformity. The V-shaped groove not only caused breakage, but also hindered uniform polishing because an object to be polished was caught in the groove during polishing. SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a carrier plate having low durability and short life, which are problems with the conventional carrier plate.

[0005]

The fiber-reinforced plastic carrier plate of the present invention is a carrier plate in which a plurality of through-holes are provided in a fiber-reinforced plastic thin plate in which fiber-reinforced plastic layers are laminated. The delamination strength is 0.1 kgf / mm or more. 0.3k as delamination strength
It is more desirable that the value be at least gf / mm. As the matrix resin of the fiber-reinforced plastic, an epoxy resin containing a rubber component is desirable.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The carrier plate of the present invention is composed of a fiber reinforced plastic thin plate formed by laminating fiber reinforced plastic layers. In the present invention, the delamination strength needs to be 0.1 kgf / mm or more, and more preferably 0.3 kgf / mm or more. When the delamination strength is less than 0.1 kgf / mm,
This is because delamination occurs at the time of use and breakage easily occurs. Further, when the delamination strength satisfies this requirement, it becomes difficult to form a V-shaped groove on the side surface of the through hole, it becomes difficult to break, the durability is improved, the life is extended, and polishing is not only performed. Uniformity can be improved.

In the present invention, the delamination strength is measured as follows. To measure, for example, a wet cutting machine or a wet polishing machine, width 10 ± 0.5 mm, length 60 ± 0.5 m
Process the sample to a size of m. Next, the cut sample is kept under the conditions of a temperature of 80 ± 2 ° C. and a vacuum of 750 ± 10 mmHg for 24 hours ± 30 minutes to sufficiently dry out completely. Further, the sample is left in a space having a temperature of 22 ± 3 ° C. and a humidity of 50 ± 10% for 24 ± 1 hour. The sample thus conditioned is set in the measuring device shown in FIG. The sample 1 is sandwiched and fixed by the holders 2 from both sides so as to protrude from the terminal by 25 mm. Then, a steel edge 3 (blade length L: 25 mm, blade edge angle θ: 30)
゜), and the length X from the terminal to the crack tip is 15 ± 0.
Drop vertically at a speed of 5 mm / min until it is 5 mm long. The value obtained by dividing the maximum value of the loads at this time by the sample width is defined as the delamination strength. This interlaminar peel strength varies depending on the matrix resin forming the fiber-reinforced resin layer, the type of reinforcing fiber, the orientation direction of the fibers in both layers, and also the insertion angle of the edge with respect to the orientation direction of the fibers. 0.1 kgf / m between layers and directions
m or more.

[0008] The reinforcing fibers used in the fiber-reinforced plastics may be those used as reinforcing fibers of known fiber-reinforced plastics, as long as they can increase the delamination strength, such as carbon fibers, glass fibers, and aramid. Fiber, polyester fiber, polyamide fiber and the like. Among them, glass fiber is desirable. Further, two or more kinds of fibers may be used in combination. Reinforcement by reinforcing fibers include continuous reinforcing fibers aligned in one direction, continuous reinforcing fibers woven into a woven fabric,
A fiber obtained by orienting a short cut reinforcing fiber in a desired direction may be used. In order to increase the delamination strength, it is desirable to use a cloth material. .

As the matrix resin used for the fiber reinforced plastic, those which have been conventionally used as the matrix resin of the fiber reinforced plastic may be used as long as they can increase the delamination strength. Thermosetting resins such as saturated polyester, vinyl ester resin and epoxy resin, and thermoplastic resins such as polyamide and acrylic resin may be used. Of these, epoxy resins are preferred. In particular, a powder such as a rubber component or a thermoplastic resin may be mixed in order to improve the delamination strength. In particular, a rubber component that is liquid at room temperature (20 ° C.) is desirable. Such rubber components include, for example, carboxyl terminated butadiene acrylic rubber. Therefore, epoxy resin compositions containing a liquid rubber component ("NB101", "N
B102 "," NB106 ") are particularly desirable. In this case, the rubber component is preferably contained in an amount of 2.5 to 20% by weight based on the epoxy resin, and more preferably 5 to 10% by weight.

[0010] The number of fiber reinforced plastic layers is determined as necessary, and is composed of two or three or more layers. In the present invention, the fiber reinforced plastic layer is a so-called bending coupling, which is caused by the fact that the fiber reinforced plastic is an anisotropic material, in order to prevent the warpage or torsion coupling from becoming an internal structure. It is preferable that the layers are laminated mirror-symmetrically, that is, symmetrically with respect to the center plane in the thickness direction of the laminate. It is needless to say that a layer other than the fiber-reinforced plastic layer reinforced with continuous fibers may be provided between the layers or as the outermost layer as long as the characteristics of the present invention are not impaired.

In the present invention, the shape of the carrier plate is not particularly limited, and is applied to, for example, a carrier plate 6 as shown in FIG. The carrier plate 6 has a disk shape and has teeth 5 formed on an outer peripheral portion thereof.
Are drilled. The through hole 4 has a size and a shape according to the size and shape of the object to be polished. In the carrier plate, the method of forming the teeth formed on the outer periphery of the circular thin plate made of fiber reinforced plastic and the method of forming the through holes formed therein are not particularly limited. For example, a high-pressure water stream (water jet) punched with a Thomson blade is used. ), Cutting with a laser beam, and curing the fiber-reinforced plastic after curing it into a final shape with a Thomson blade or the like before curing. Among them, the method of cutting with a high-pressure water flow is most preferable in consideration of damage to the fiber-reinforced plastic, smoothness of the cut surface, and the like.

[0012]

[Example 1] An epoxy resin composition (Mitsubishi Rayon Co., Ltd.) containing 7% by weight of a carboxyl-terminated butadiene acrylic rubber ("CTBN 1300X8" manufactured by Ube Industries, Ltd.) based on an epoxy resin cured at 130 ° C. Made "N
B101 resin ”) is rolled on release paper to give a resin basis weight of 12
8 g / m ² and a glass cloth (fiber basis weight: 19
6 g / m ² , “KS2700” manufactured by Kanebo Co., Ltd.)
Glass fiber impregnated with epoxy resin 0.18mm thick
Of glass fiber prepreg (1-1) was obtained. Also, 13
Epoxy resin cured at 0 ° C ("NB1" manufactured by Mitsubishi Rayon Co., Ltd.)
01 resin)) on a release paper to give a resin basis weight of 128 g.
/ M ² and a carbon fiber cloth (fiber basis weight: 200
g / m ² , “TR3110” manufactured by Mitsubishi Rayon Co., Ltd.) and carbon fiber impregnated with epoxy resin to a thickness of 0.22.
mm of carbon fiber prepreg (1-2) was obtained. Glass fiber prepreg (1-1) and carbon fiber prepreg (1-
2) was cut, and three sheets were laminated as described below. Pre-preg (1-1): (0/90) Pre-preg (1-2): (± 45) Pre-preg (1-1): (0/90)

The laminate was placed on a flat mirror-finished iron plate on which a release film made of polyfluoroethylene was disposed. On top of that, a release film made of polyfluoroethylene was placed, and a flat iron plate was further placed. This was heated in a press at 150 ° C. at a rate of 4 ° C./min to 30 kg / cm ²
After maintaining the pressure for 1 hour, the temperature was returned to room temperature at 5 ° C./min. The thickness of the fiber reinforced plastic thin plate thus obtained was 0.58 mm. At this time, the delamination strength between the respective layers was 0.4 kg /
mm or more. The obtained thin plate was processed into a shape shown in FIG. 1 by a water jet. A silicon wafer was polished using this carrier plate, and its durability was tested. In the test, the polishing process was repeated for 30 minutes / 1 batch, and the number of batches until delamination occurred was measured.
In addition, the conventional glass fiber reinforced epoxy resin carrier plate had a limit of 200 batches. In the case of the carrier plate of Example 1, the releasability of the through-hole portion was improved about three times as compared with the related art.

Example 2 An epoxy resin cured at 130 ° C. (“# 350 resin” manufactured by Mitsubishi Rayon Co., Ltd.) was rolled on release paper to give a resin basis weight of 15 g / m ² and a plain weave of glass fiber. A glass fiber woven fabric having a basis weight of 7 g / m ² (number of shots: vertical; 1.6 / mm (40 / inch), horizontal; 1.6 / mm (40 / inch)) The woven fabric was impregnated with an epoxy resin to obtain a 0.01 mm-thick glass fiber woven prepreg (2-1). Also, 1
An epoxy resin composition containing 7% by weight of a carboxyl-terminated butadiene acrylic rubber with respect to an epoxy resin cured at 30 ° C. (“NB1” manufactured by Mitsubishi Rayon Co., Ltd.)
01 resin ") on a release paper to give a resin basis weight of 65 g /
m ² and carbon fiber (“T” manufactured by Mitsubishi Rayon Co., Ltd.)
R40 ") in one direction to give a fiber basis weight of 75 g / m.
² and carbon fibers were impregnated with an epoxy resin to obtain a carbon fiber prepreg (2-2) having a thickness of 0.095 mm. These were cut and eight sheets were laminated as described below. Prepreg (2-1): (0/90) Prepreg (2-2): (0) Prepreg (2-2): (120) Prepreg (2-2): (240) Prepreg (2) -2): (240 °) Pre-preg (2-2): (120 °) Pre-preg (2-2): (0 °) Pre-preg (2-1): (0 ° / 90 °)

The laminate was placed on a flat mirror-finished iron plate on which a release film made of polyfluoroethylene was placed. A release film made of polyfluorinated ethylene and a bleed cloth made of a woven glass fiber fabric were overlaid on top of it, the whole was sealed with a heat-resistant back film, and the inside was evacuated and held for one hour. This was transferred into an autoclave,
The temperature was raised at a rate of 2 ° C./min, a pressure of 4 kg / cm ² was applied, and the temperature was maintained for 1 hour. The thickness of the fiber reinforced plastic thin plate thus obtained was 0.59 mm. At this time, the interlayer peel strength between the respective layers was 0.3 to 0.4 kgf / mm. The resulting thin plate was trimmed on the outer periphery with a water jet, and three through holes were formed to produce a carrier plate. At this time, the fixing angle of the fiber reinforced plastic thin plate is set such that the line connecting the position of the through hole and the center of the carrier plate is equal to the orientation direction (0 °, 120 °, 240 °) of the carbon fibers of the fiber reinforced plastic thin plate. Was adjusted.
In the present invention, the position of the through hole refers to the center of the through hole. The obtained carrier plate was used for polishing a silicon wafer in the same manner as in Example 1, and the durability was tested. As a result, the life of the conventional carrier plate made of glass fiber reinforced epoxy resin was improved about twice.

Example 3 An epoxy resin cured at 130 ° C. (“# 340 resin” manufactured by Mitsubishi Rayon Co., Ltd.) was rolled on release paper to a resin weight of 128 g / m ² , and a glass cloth ( Fiber weight: 196 g / m ² , “KS2700” manufactured by Kanebo Co., Ltd.) was laminated, and the glass fiber was impregnated with an epoxy resin to obtain a glass fiber prepreg (3-1) having a thickness of 0.18 mm. This glass fiber prepreg (3-
1) was cut, and three sheets were laminated as follows. Pre-preg (3-1): (0 ° / 90 °) Pre-preg (3-1): (± 45 °) Pre-preg (3-1): (0 ° / 90 °) Separate the laminate from polyfluoroethylene. The mold film was placed on a flat mirror-surfaced iron plate. On top of that, a release film made of polyfluoroethylene was placed, and a flat iron plate was further placed. This is put in a press machine at 150 ° C for 2
The temperature was raised at a rate of 0 ° C./min, a pressure of 30 kg / cm ² was applied, the temperature was maintained for 1 hour, and then the temperature was returned to room temperature at 5 ° C./min. The thickness of the fiber reinforced plastic thin plate thus obtained was 0.54 mm. At this time, the delamination strength between the respective layers was 0.25 kg / mm or more in any orientation direction. The obtained thin plate was processed into a shape shown in FIG. 1 by a water jet. The obtained carrier plate was used for polishing a silicon wafer in the same manner as in Example 1 to test the durability. As a result, the releasability of the through-hole portion was equivalent to the conventional one.

Example 4 An epoxy resin composition ("NB101 resin" manufactured by Mitsubishi Rayon Co., Ltd.) containing 7% by weight of a carboxyl-terminated butadiene acrylic rubber based on an epoxy resin cured at 130.degree. To a resin weight of 68 g / m ² and carbon fiber (“TR30” manufactured by Mitsubishi Rayon Co., Ltd.) with a fiber weight of 8 g / m ^2.
0 g / m ² and so as to pull aligned superimposed to obtain a carbon fiber prepreg 0.09mm thickness impregnated with epoxy resin to the carbon fiber (5-1). This glass fiber prepreg (5-1) was cut, and six sheets were laminated as follows. Pre-preg (5-1): (120 °) Pre-preg (5-1): (0 °) Pre-preg (5-1): (-120 °) Pre-preg (5-1): (-120 °) Pre-preg (5- 1): (0 °) Pre-preg (5-1): (120 °) This laminate was placed on a flat mirror-surface iron plate on which a release film made of polyfluoroethylene was arranged. On top of that, a release film made of polyfluoroethylene was placed, and a flat iron plate was further placed. This is put in a press machine at 150 ° C for 2
The temperature was raised at a rate of 0 ° C./min, a pressure of 30 kg / cm ² was applied, the temperature was maintained for 1 hour, and then the temperature was returned to room temperature at 5 ° C./min. The thickness of the fiber reinforced plastic thin plate thus obtained was 0.54 mm. In this case, the delamination strength between the respective layers is 0.2 to 0.6 kgf /
mm. The obtained thin plate was processed into a shape shown in FIG. 1 by a water jet. The obtained carrier plate was used for polishing a silicon wafer in the same manner as in Example 1, and the durability was tested. As a result, the releasability of the through-hole was 1.5 times that of the related art.

Comparative Example 1 An epoxy resin cured at 130 ° C. (“340 resin” manufactured by Mitsubishi Rayon Co., Ltd.) was rolled on release paper to give a resin weight of 68 g / m ² , and a carbon fiber (Mitsubishi). "TR30" manufactured by Rayon Co., Ltd.) is aligned and stacked so that the fiber basis weight is 80 g / m ^2, and carbon fibers are impregnated with epoxy resin to obtain carbon fiber prepreg (4-1) having a thickness of 0.09 mm. Was. This glass fiber prepreg (4-1) was cut, and six sheets were laminated as follows. Pre-preg (4-1): (120 °) Pre-preg (4-1): (0 °) Pre-preg (4-1): (-120 °) Pre-preg (4-1): (-120 °) Pre-preg (4- 1): (0 °) Pre-preg (4-1): (120 °) This laminate was placed on a flat mirror-surface iron plate on which a release film made of polyfluoroethylene was arranged. On top of that, a release film made of polyfluoroethylene was placed, and a flat iron plate was further placed. This is put in a press machine at 150 ° C for 2
The temperature was raised at a rate of 0 ° C./min, a pressure of 30 kg / cm ² was applied, the temperature was maintained for 1 hour, and then the temperature was returned to room temperature at 5 ° C./min. The thickness of the fiber reinforced plastic thin plate thus obtained was 0.54 mm. At this time, the delamination strength between the layers is 0.05 to 0.4 kgf with respect to the orientation direction.
/ Mm. The obtained thin plate was processed into a shape shown in FIG. 1 by a water jet. When the obtained carrier plate was used for polishing a silicon wafer,
The releasability of the through-hole was equivalent to the conventional one.

[0019]

The fiber reinforced plastic carrier plate of the present invention has high durability and a long life.
In particular, when the delamination strength is 0.3 kgf / mm or more, the durability is further improved. When the matrix resin of the fiber-reinforced plastic is an epoxy resin containing a rubber component, it exhibits excellent durability.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example of a carrier plate of the present invention.

FIG. 2 is a side sectional view showing a test method for delamination strength.

[Explanation of symbols]

 Reference Signs List 1 sample 2 holder 3 edge 4 through hole 5 tooth 6 carrier plate

Continued on the front page (72) Inventor Taku Ishimori 4-1-1 Ushikawa-dori, Toyohashi-shi, Aichi Pref. In the Toyohashi Plant of Mitsubishi Rion Co., Ltd. (72) Inventor Yoshiharu Numata 4-1-2 Ushikawa-dori, Toyohashi-shi, Aichi (72) Inventor Hirofumi Okano 30 Soya, Hadano-shi, Kanagawa Toshiba Ceramics Co., Ltd. (72) Inventor Norio Masuda Shin-juku Nomura 1-26, Nishishinjuku, Shinjuku-ku, Tokyo Building Toshiba Ceramics Corporation

Claims (3)

[Claims] 1. A carrier plate in which a plurality of through holes are provided in a fiber reinforced plastic thin plate in which fiber reinforced plastic layers are laminated, wherein a delamination strength between all the layers is 0.1 kgf / mm or more. Carrier plate made of fiber reinforced plastic. 2. The fiber reinforced plastic carrier plate according to claim 1, wherein the delamination strength is 0.3 kgf / mm or more. 3. The carrier plate according to claim 1, wherein the matrix resin of the fiber-reinforced plastic is an epoxy resin containing a rubber component.