JPH11126890A - Two-dimensional matrix array radiation detector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a two-dimensional matrix array radiation detector capable of enlarging a detection area, while reducing a blind part, while improving detection accuracy, improving yield at the time of manufacture and prolonging service life in use. SOLUTION: In this two-dimensional matrix array radiation detector, a unit element holder 3 is used and a plurality of unit elements 1 composed of a semiconductor radiation detection element are mounted to a two-dimensional matrix board 2. The unit element holder 3 is provided with a metallic holder main body 31 and a terminal pin 33, and a bidirectional socket terminal 23 is embedded to the two-dimensional matrix board 2. The terminal pin 33 of the unit element holder 3 is freely inserted and detached to/from the bidirectional socket terminal 23, and the exchange or repair of the unit element 1 is easily executed at a defective location.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to CdTe or Cd
The present invention relates to a two-dimensional matrix array radiation detector in which ZnTe detection elements are arranged in a two-dimensional matrix form as a unit element, and more particularly to a two-dimensional matrix array radiation detector used for high-energy radiation of several hundred KeV or more.

[0002]

2. Description of the Related Art Conventionally, two structures have been studied for a two-dimensional matrix array radiation detector using a CdTe detection element as a unit element.

The first structure is a monolithic type in which an electrode pattern is divided on one CdTe wafer. The first structure can be easily manufactured only by a process for one wafer, but requires a CdTe wafer having a desired area and excellent in-plane uniformity of characteristics, resulting in a low yield in manufacturing. There was a problem. In addition, indium bump bonding technology is usually used to connect a signal extraction line to a monolithic wafer on which an electrode pattern is formed, but the setting of bump bonding conditions, such as indium amount, bonding temperature, and bonding position accuracy, is complicated. However, the use of the indium bump bonding technique causes a reduction in yield in manufacturing. In addition, each unit element merely divides an electrode, and there is a problem such as interference between adjacent unit elements.

The second structure is a structure in which discrete elements are arranged in a two-dimensional matrix. This second structure is
There is no need for a large-area wafer required for a monolithic array type, and it can be manufactured by preparing and arranging a required number of elements having uniform characteristics. Further, the second structure has no problem such as interference between adjacent unit elements.

[0005]

However, the above-mentioned second structure has the following problems. In the second structure, a plurality of unit elements are arranged in a two-dimensional matrix on one substrate. Usually, a radiation incident surface (upper side of the arranged unit elements) in the unit elements is used as a cathode to form a common electrode. The surface opposite to the incident surface of the unit element is used as an anode, and an output signal is taken out from the anode of each unit element. In order to reduce the radiation-insensitive portion, it is desirable that the arrangement interval of the unit elements is as narrow as possible. Usually, the arrangement interval is set to 30% or less of the unit element size. It is sufficiently possible to arrange the unit elements at such an arrangement interval, but since the unit elements are fixed to the substrate, if a characteristic defect is confirmed in an evaluation test or the like after manufacturing, the defective part is determined. It was virtually impossible to replace or repair the unit element.

Furthermore, as the number of units in a two-dimensional matrix increases, higher reliability in assembly technology is required. However, it is difficult to replace or repair defective unit elements, so that it is difficult to achieve a high yield. .

In order to replace or repair the above-mentioned defective portion, it is necessary to secure a space for clamping and removing the unit element at the defective portion and for repairing the unit element at the defective portion from the periphery while being fixed to the substrate. If necessary, the arrangement interval of the unit elements must be set to 2 mm or more. However,
When the arrangement interval of the unit elements is increased, the insensitive part of the radiation increases, and the detection accuracy of the radiation decreases.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a two-dimensional matrix array radiation detector capable of realizing a large detection area while improving the detection accuracy by reducing insensitive parts. For the purpose of providing. further,
SUMMARY OF THE INVENTION An object of the present invention is to provide a two-dimensional matrix array radiation detector capable of realizing a high yield in production and a long life in use.

[0009]

In order to solve the above-mentioned problems, a two-dimensional matrix array radiation detector according to the present invention comprises a plurality of unit elements comprising semiconductor radiation detection elements and a terminal pin penetrating from the front surface to the rear surface. A two-dimensional matrix substrate in which a plurality of bidirectional socket terminals having holes are buried in a two-dimensional matrix, and terminals of the bidirectional socket terminals buried in the substrate while holding unit elements one by one or a plurality thereof A unit element holder having a terminal pin which can be freely inserted and removed from the pin insertion hole. Preferably, the unit element is CdTe or Cd _x Zn
_{A 1-x} Te detection element is used. Further, the unit element is formed in a rectangular parallelepiped shape, electrodes are formed on two opposing surfaces of the unit element, and the electrode surface is substantially perpendicular to a main surface of the substrate on which the unit elements are arranged. The unit element is mounted on the substrate via the unit element holder. One electrode of the unit element is an indium electrode, and the other electrode is a platinum electrode.

A metal plate which has a holder insertion hole at each of the arrangement positions of the bidirectional socket terminals and is electrically connected to one electrode of the unit element and used as a common electrode is formed on the main surface of the substrate. Is done.

Further, the unit element holder electrically contacts one of the electrodes of the unit element and electrically contacts the metal plate of the substrate when the substrate is mounted. And a terminal pin that is electrically connected to the other electrode of the unit element and is connected to a bidirectional socket terminal of the board. A conductive sheet directly in contact with the other electrode of the unit element and affixed to the metal holder body via an insulating material between the other electrode of the unit element and the terminal pin of the unit element holder; It is electrically connected through a conductive wire that electrically connects between the sheet and the terminal pin.

Further, the unit element holder electrically contacts one electrode of each of the two unit elements in a state where the other electrodes of the two unit elements are held facing each other, and when the substrate is mounted, A metal holder body that is in electrical contact with the metal plate of the substrate, and is disposed between the two unit elements while being electrically insulated from the metal holder body;
A metal partition plate electrically connected to the other electrode of each of the unit elements; and a terminal pin electrically connected to the metal partition plate and connected to a bidirectional socket terminal of the substrate.

Further, the metal holder main body or the metal partition plate of the unit element holder is integrally formed with a handling portion protruding from the unit element held in a direction substantially perpendicular to the main surface of the substrate. Is done.

In the two-dimensional matrix array radiation detector constructed as described above, a bidirectional socket terminal is embedded in a substrate, and a unit element is held in a unit element holder having terminal pins which can be inserted and removed from both socket terminals. Therefore, the terminal pins are inserted into the bidirectional socket terminal when the substrate is mounted, and the terminal pins are pushed out from the back side of the substrate and the terminal pins are removed from the bidirectional socket terminal when the substrate is removed. Therefore, when replacing or repairing the unit elements, it is not necessary to secure a space necessary for the replacement or repair between the unit elements, and the arrangement interval between the unit elements can be reduced, so that a portion insensitive to radiation can be reduced and uniform characteristics can be obtained. A two-dimensional matrix array radiation detector having high radiation detection accuracy can be realized.

Further, when a defective portion is confirmed during the evaluation test, the unit element at the defective portion can be easily replaced or repaired by removing the unit element holder from the two-dimensional matrix substrate, so that a high yield is obtained in manufacturing. realizable. Further, when a defective portion is confirmed during use, the unit element at the defective portion can be similarly replaced or repaired, so that a long life can be realized.

Further, by arranging a plurality of modules in a two-dimensional matrix as a two-dimensional matrix array radiation detector having a high yield and a long life as described above, a large radiation detection area can be obtained. A two-dimensional matrix array radiation detector having the same can be easily realized.

In the case where the two-dimensional matrix array radiation detector is provided with a handling part on the metal holder main body or the metal partition plate of the unit element holder, similarly, the handling part makes a space necessary for replacement or repair between the unit elements. Since it is not necessary to secure the radiation, the arrangement interval between the unit elements can be reduced, and a two-dimensional matrix array radiation detector having high radiation detection accuracy with little radiation insensitive portion can be realized. Moreover, in the two-dimensional matrix array radiation detector, a high yield can be realized in manufacturing, a long life can be realized, and a large area radiation detection region can be easily realized.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing the overall configuration of a two-dimensional matrix array radiation detector according to the first embodiment of the present invention. The two-dimensional matrix array radiation detector includes a plurality of unit elements 1 composed of semiconductor radiation detecting elements, a two-dimensional matrix substrate 2 on which the unit elements 1 are arranged in a two-dimensional matrix, and a unit element 1 individually. A unit element holder 3 to be mounted on the two-dimensional matrix substrate 2 while being held is provided. On the main surface of the two-dimensional matrix substrate 2, 10 pieces each in the vertical and horizontal directions, a total of 10
Zero unit elements 1 are individually arranged via unit element holders 3.

FIG. 2 is a perspective view of the unit element 1. As the unit element 1, a CdTe detecting element is used. This Cd
The Te detection elements are a CdTe element 11 and a CdTe element 1
It comprises an indium electrode 12 formed on one of two opposing surfaces (two opposing surfaces in the thickness direction) and a platinum electrode 13 formed on the other surface. A positive potential is applied to the indium electrode 12, and a negative potential (ground potential) is applied to the platinum electrode 13. CdTe element 11
Performs radiation detection. The unit element 1 has a length (height)
It is formed in a rectangular parallelepiped shape of 5 mm, width 2 mm, and thickness 2 mm.

FIG. 3 is a sectional view of a main part of the two-dimensional matrix substrate 2. As shown in FIG. The two-dimensional matrix substrate 2 includes an insulating phenol resin substrate 21 serving as a base, a metal plate 22, and a bidirectional socket terminal 23. Phenolic resin substrate 2
1 has a square shape of 25.4 mm in length and 25.4 mm in width. The phenol resin substrate 21 is provided with a plurality of through holes 21H penetrating in the thickness direction. The bidirectional socket terminals 23 are respectively buried in the plurality of through holes 21H. The phenolic resin substrate 21 has 10 columns in the vertical direction and 10 rows in the horizontal direction at a pitch of 2.54 mm, for a total of 100
The two bidirectional socket terminals 23 are arranged in a matrix.

The metal plate 22 is a phenol resin substrate 21
Is formed on the main surface (front surface) on the side where the unit elements 1 are arranged. The metal plate 23 is electrically connected to each of the platinum electrodes 13 of the plurality of unit elements 1 and is used as a common electrode (ground potential plate plate). In a portion of the metal plate 23 corresponding to the arrangement position of the socket terminals 23, a holder insertion hole 2 is provided.
2H are formed, and the unit element holder 3 is held in the holder insertion hole 22H with an appropriate holding force. A total of 100 holder insertion holes 22H are formed corresponding to the number of arrayed unit elements 1, and the inner diameter of the holder insertion hole 22H is set to 1 mm. The holder insertion hole 22H allows the unit element holder 3 holding the unit element 1 to be removably mounted thereon, and the indium electrode 1 of the unit element 1 is passed through the mounted unit element holder 3.
3 and the bidirectional socket terminal 23 are realized.

The bidirectional socket terminal 23 has a terminal pin insertion hole 23H penetrating from the front surface to the rear surface of the phenol resin substrate 21 at the center of the shaft. The terminal pins 33 of the unit element holder 3 to be described later can be freely inserted into and removed from the terminal pin insertion holes 23H from the front side and the rear side of the phenol resin substrate 21, respectively. The bidirectional socket terminal 23 is connected to amplifiers and the like, and measures radiation based on a signal output from the bidirectional socket terminal 23.

FIG. 4 is a perspective view of the unit element holder 3 in a state where the unit element 1 is held, and FIG. 5 is a side view of the unit element holder 3. The unit element holder 3 includes a metal holder main body 31 for holding the unit element 1 and terminal pins 33. The basic structure of the metal holder main body 31 is a U-shape sandwiching each of the indium electrode 12 and the platinum electrode 13 of the unit element 1. The platinum electrode 13 is in electrical contact with one of the side walls facing the metal holder main body 31 when the unit element 1 is held, and the bottom of the metal holder main body 31 is attached to the metal plate 22 when mounted on the two-dimensional matrix substrate 2. Electrical contact with That is, when the substrate is mounted, the platinum electrode 13 of the unit element 1 is
Is electrically connected to A conductive sheet 35 is attached to the other side wall of the metal holder main body 31 via an insulating material 34, and the conductive sheet 35 has an indium electrode 1
2 make electrical contact.

The metal holder main body 31 is formed of, for example, Kovar having conductivity. Kovar is 0.1m thick
m and a width of 2 mm are used.
Are formed with a height of 7 mm. The aforementioned insulating material 34
Is a 0.05 mm thick insulating adhesive, and the conductive sheet 35 is a 0.08 mm thick aluminum foil.

One terminal pin 33 is attached to the bottom of the metal holder main body 31 via an insulating material 37. The terminal pin 33 has a diameter of 0.5 mm and a length of 5 mm. Glass is used for the insulating material 37 and the terminal pins 33 are used.
And the metal holder main body 31 are electrically insulated.
The terminal pins 33 are electrically connected to the above-described conductive sheet 35 through the conductive wires 36, and as a result, the terminal pins 33
Is electrically connected to the indium electrode 12 of the unit element 1. A gold wire is used for the conductive wire 36, and a conductive adhesive such as a silver epoxy resin is used for connection of the gold wire.

In the unit element holder 3 thus configured, the unit element 1 is held in a state where the indium electrode 12 is in contact with the conductive sheet 35 and the platinum electrode 13 is in contact with one side wall of the metal holder body 31. The unit element 1 is mounted on the two-dimensional matrix substrate 2 via the unit element holder 3. FIG. 6 is a sectional view of a main part of the two-dimensional matrix array radiation detector showing a state where the unit element 1 is mounted on the two-dimensional matrix substrate 2. The terminal pin 33 of the unit element holder 3 is inserted into the holder insertion hole 22 formed in the metal plate 22 of the two-dimensional matrix substrate 2 as shown by an arrow A.
Terminal pin insertion hole 2 of bidirectional socket terminal 23 through H
It is inserted in 3H. With this insertion, the terminal pins 3
3 and the bidirectional socket terminal 23 are electrically connected, and the indium electrode 12 and the bidirectional socket terminal 23 are electrically connected. Further, when the insertion is completely performed, the metal holder main body 3 of the unit element holder 3 is turned on.
The bottom of 1 electrically contacts the surface of the metal plate 22, and the platinum electrode 13 of the unit element 1 is electrically connected to the metal plate 22. The insulating material 37 of the unit element holder 3 is embedded in the holder insertion hole 22H formed in the metal plate 22, the unit element holder 3 is mounted without dropping from the two-dimensional matrix substrate 2, and the unit element holder 3 is removed. Can be performed freely.

The unit element holder 3 can be removed from the back side of the two-dimensional matrix substrate 2 as shown by arrow B.
This is performed by inserting a needle-like protrusion into the terminal pin insertion hole 23H of the bidirectional socket terminal 23 and pushing out the terminal pin 33 to the front side.

In the two-dimensional matrix array radiation detector configured as described above, the external width of the unit element holder 3 is determined by the thickness of both sides of the metal holder main body 31, the thickness of the insulating material 34, and the conductive sheet 35. And the width of the unit element 1 are added, which is about 2.4 mm.
Therefore, when the unit elements 1 are arranged on the two-dimensional matrix substrate 2 via the unit element holders 3, the unit element holders 3
The unit elements 1 can be arranged at a high density only by the presence of a minute insensitive portion of about 0.14 mm between them.

Next, a second embodiment of the present invention will be described. FIG. 7 is a perspective view of a unit element mounted on the two-dimensional matrix array radiation detector according to the second embodiment of the present invention, FIG. 8 is a perspective view of a unit element holder in a state where the unit element is held, and FIG. It is a side view of the unit element holder. The two-dimensional matrix array radiation detector includes a plurality of unit elements 5 including the semiconductor detection elements shown in FIG. 7 and a two-dimensional matrix substrate 2 on which the unit elements 5 shown in FIGS. 1 and 3 are arranged in a two-dimensional matrix. And a unit element holder 6 mounted on the two-dimensional matrix substrate 2 while holding the unit elements 5 shown in FIGS. In the present embodiment, two-dimensional matrix substrate 2
10 on the main surface of the vertical direction, 20 on the horizontal direction, a total of 2
00 unit elements 5 are arranged via a unit element holder 6. One unit element holder 6 holds two unit elements 5.

As shown in FIG. 7, CdT
An e-detecting element is used. This CdTe detecting element is C
It comprises a dTe element 51, an indium electrode 52 formed on one of two opposing surfaces of the CdTe element 51, and a platinum electrode 53 formed on the other surface. A positive potential is applied to the indium electrode 52, a negative potential is applied to the platinum electrode 53, and the CdTe element 51 detects radiation. The unit element 51 has a length (height) of 5 m.
m, a width of 2 mm, and a thickness of 1 mm.
The unit element 5 has only a half thickness as compared with the unit element 1 described above.

The two-dimensional matrix substrate 2 corresponds to FIG.
Since it is the same as the two-dimensional matrix substrate 2 shown in each of FIGS. 3A and 3B, the description is omitted in the second embodiment.

As shown in FIGS. 8 and 9, the unit element holder 6 includes a metal holder main body 61 for holding two unit elements 5, a metal partition plate 62, and terminal pins 64. The basic structure of the metal holder main body 61 is a U-shape sandwiching two unit elements 5 in which the respective indium electrodes 52 face each other. The platinum electrode 53 of one unit element 5 is in electrical contact with one of the side walls facing the metal holder main body 61, and the other one of the unit elements 5 is in contact with the other side wall.
Of the platinum electrodes 53 are in electrical contact. When mounted on the two-dimensional matrix substrate 2, the bottom of the metal holder main body 61 is in electrical contact with the metal plate 22.

The metal partition plate 62 is disposed between the two unit elements 5 held by the metal holder main body 61, and two opposing surfaces of the metal partition plate 62 are each provided with an indium electrode of the unit element 5. 52 make electrical contact.

Metal holder main body 61, metal partition plate 62
Are formed of Kovar having conductivity. Kovar forming the metal holder body 61 is 0.1 m thick
m and a width of 2 mm are used.
Are formed with a height of 7 mm. The Kovar forming the metal partition plate 62 has a thickness of 0.2 mm and a width of 2 mm.
mm, and the metal partition plate 62 has a height of 7 mm.
Is set to

One terminal pin 64 is attached to a metal partition plate 62 via an insulating material 65. Terminal pin 64
Is formed with a diameter of 0.5 mm and a length of 5 mm. Glass is used for the insulating material 65, and the terminal pins 64 and the metal holder main body 61 are electrically insulated. As a result, the terminal pins 64 are electrically connected to the indium electrodes 52 of the two unit elements 5, respectively.

One unit element holder 6 configured as described above holds two unit elements 5, and the two unit elements 5 are connected via the unit element holder 6 to the above-described FIGS. It is mounted on a two-dimensional matrix substrate 2 shown in FIG. 2
The platinum electrodes 53 of the unit elements 5 are in contact with the side walls of the metal holder main body 61, and the indium electrodes 52 are in contact with the metal partition plate 62. Terminal pin 6 of unit element holder 6
Reference numeral 4 denotes a bidirectional socket terminal 23 through a holder insertion hole 22H formed in the metal plate 22 of the two-dimensional matrix substrate 2.
The bottom of the metal holder main body 61 of the unit element holder 6 is in electrical contact with the surface of the metal plate 22. The insulating material 65 of the unit element holder 6 is embedded in the holder insertion hole 22H formed in the metal plate 22, and the unit element holder 6 is mounted without dropping from the two-dimensional matrix substrate 2. Also, the terminal pins 6 of the unit element holder 6
4 allows the two-dimensional matrix board 2 to be freely inserted into and removed from the bidirectional socket terminals 23.

In the two-dimensional matrix array radiation detector configured as described above, the external width of the unit element holder 6 is determined by the thickness of both sides of the metal holder main body 61.
This is the sum of the thickness of the metal partition plate 62 and the width of the two unit elements 5 and is approximately 2.4 mm. Therefore, when the unit elements 5 are arranged on the two-dimensional matrix substrate 2 via the unit element holders 6, only a minute dead portion of about 0.14 mm exists between the unit element holders 6, and the unit elements 5 are high. Can be arranged in density.

Next, a third embodiment of the present invention will be described. FIG. 10 is a perspective view showing the overall configuration of a two-dimensional matrix array radiation detector according to the third embodiment of the present invention. The two-dimensional matrix array radiation detector includes a plurality of unit elements 1 composed of the semiconductor radiation detecting elements shown in FIG. 2, a two-dimensional matrix substrate 2 on which the unit elements 1 are arranged in a two-dimensional matrix, and one unit element 1. A unit element holder 3 is provided which is mounted on the two-dimensional matrix substrate 2 in a state where the unit elements are individually held. The two-dimensional matrix array radiation detector according to the present embodiment is the first
In the same manner as the two-dimensional matrix array radiation detector according to the embodiment, a total of 100 unit elements 1, 10 in each of the vertical and horizontal directions, are individually arranged on the main surface of the two-dimensional matrix substrate 2 via the unit element holder 3. Are arranged.

Since the unit element 1 has the same structure and the same size as the unit element 1 shown in FIG. 2 according to the first embodiment, it is used in the third embodiment. Description is omitted.

FIG. 11 is a sectional view of an essential part of the two-dimensional matrix substrate 2. The two-dimensional matrix substrate 2 has a structure basically similar to that of the two-dimensional matrix substrate 2 shown in FIG. 3 and includes an insulating phenol resin substrate 21 serving as a base, a metal plate 22, and socket terminals 24.
The phenolic resin substrate 21 is 25.4 mm long and 25.4 mm wide.
mm square shape. Phenolic resin substrate 2
1 is provided with a plurality of through holes 21H penetrating in the thickness direction. In the plurality of through holes 21H, one-way socket terminals 24 projecting as lead pins on the back surface of the phenol resin substrate 21 are embedded. Phenolic resin substrate 2
1 has 10 rows in the vertical direction at a pitch of 2.54 mm,
A total of 100 socket terminals 24 are arranged in a matrix in 10 rows in the horizontal direction.

Since the metal plate 22 has basically the same structure as the metal plate 22 shown in FIG. 3, description of the metal plate 22 according to the third embodiment will be omitted.

FIG. 12 is a perspective view of the unit element holder 3 when the unit element 1 is held, and FIG. 13 is a side view of the unit element holder 3. The unit element holder 3 includes a metal holder main body 31 that holds the unit element 1, a handling unit 32, and a terminal pin 33. The basic structure of the metal holder body 31 is the indium electrode 12 and the platinum electrode 13 of the unit element 1.
Is a U-shape sandwiching each of them. The platinum electrode 13 is in electrical contact with one of the side walls facing the metal holder main body 31 when the unit element 1 is held, and the bottom of the metal holder main body 31 is attached to the metal plate 22 when mounted on the two-dimensional matrix substrate 2. Electrical contact with A conductive sheet 35 is attached to the other side wall of the metal holder main body 31 via an insulating material 34, and the indium electrode 12 electrically contacts the conductive sheet 35.

Further, a handling portion 32 is integrally formed on the other side wall of the metal holder main body 31, and the handling portion 32 is a unit element which is held in a direction substantially perpendicular to the main surface of the phenol resin substrate 2. It is formed to protrude more than 1. That is, the entire shape of the metal holder main body 31 including the handling portion 32 is J-shaped.

The metal holder main body 31 and the handling section 32 are formed of Kovar having conductivity. Kovar having a thickness of 0.1 mm and a width of 2 mm is used, and one side wall of the metal holder body 31 is formed with a height of 7 mm.
The other side wall is 10 mm high including the handling part 32
Is formed. That is, the side wall on one side of the metal holder main body 31 is formed to be about 3 mm higher in the height direction as the handling part 32. The shape of the handling unit 32 is easy to handle so that the unit element holders 3 can be easily mounted when the unit elements 1 are arranged, and the unit element holders 3 can be easily mounted or removed during replacement or repair. It has a T-shape.

The insulating material 34 has a thickness of 0.05 mm.
Is used, and the conductive sheet 35 is made of an aluminum foil having a thickness of 0.08 mm.

One terminal pin 33 is attached to the bottom of the metal holder main body 31 via an insulating material 37. The terminal pin 33 has a diameter of 0.5 mm and a length of 5 mm. Glass is used for the insulating material 37 and the terminal pins 33 are used.
And the metal holder main body 31 are electrically insulated.
The terminal pins 33 are electrically connected to the above-described conductive sheet 35 through the conductive wires 36, and as a result, the terminal pins 33
Is electrically connected to the indium electrode 12 of the unit element 1. A gold wire is used for the conductive wire 36, and a conductive adhesive such as a silver epoxy resin is used for connection of the gold wire.

In the unit element holder 3 thus configured, the unit element 1 is held in a state where the indium electrode 12 is in contact with the conductive sheet 35 and the platinum electrode 13 is in contact with one side wall of the metal holder body 31. The unit element 1 is mounted on the two-dimensional matrix substrate 2 via the unit element holder 3. The terminal pins 33 of the unit element holder 3 are electrically connected to the socket terminals 24 through holder insertion holes 22H formed in the metal plate 22 of the two-dimensional matrix substrate 2. The bottom of the metal holder main body 31 of the unit element holder 3 is It makes electrical contact with the surface of the metal plate 22. The insulating material 37 of the unit element holder 3 is embedded in the holder insertion hole 22H formed in the metal plate 22, the unit element holder 3 is mounted without falling from the two-dimensional matrix substrate 2, and the unit element holder 3 is removed. Can be performed freely. The attachment and detachment of the unit element holder 3 are performed using the handling unit 32.

In the two-dimensional matrix array radiation detector configured as described above, the external width of the unit element holder 3 is determined by the thickness of the metal holder main body 31 on both sides.
This is a sum of the thickness of the insulating material 34, the thickness of the conductive sheet 35, and the width of the unit element 1, which is about 2.4 mm. Therefore, the unit element 1 is connected to the unit element 2 through the unit element holder 3.
When the unit elements 1 are arranged on the dimensional matrix substrate 2, the unit elements 1 can be arranged at a high density only by a small dead portion of about 0.14 mm between the unit element holders 3.

Next, a fourth embodiment of the present invention will be described. FIG. 14 is a perspective view of a unit element holder mounted on a two-dimensional matrix array radiation detector according to a fourth embodiment of the present invention, and FIG. 15 is a side view of the unit element holder. For the two-dimensional matrix array radiation detector, unit elements 1 having the same structure and the same size as the unit elements 5 shown in FIG. 7 are used, and have the same structure and the same size as the two-dimensional matrix substrate 2 shown in FIG. A two-dimensional matrix substrate 2 is used. That is, the two-dimensional matrix array radiation detector includes a plurality of unit elements 5, a two-dimensional matrix substrate 2, and a unit element holder 6 mounted on the two-dimensional matrix substrate 2 while holding the unit elements 5.
Is provided. On the main surface of the two-dimensional matrix substrate 2, a total of 200 unit elements 5, 10 in the vertical direction and 20 in the horizontal direction, are arranged via the unit element holder 6. One unit element holder 6 holds two unit elements 5.

Since the unit element 1 has the same structure and the same size as the unit element 1 shown in FIG. 7 according to the second embodiment, the unit element 1 in the fourth embodiment is used. Description is omitted. Further, since the two-dimensional matrix substrate 2 has the same structure and the same size as the two-dimensional matrix substrate 2 shown in FIG. 11 according to the third embodiment, the two-dimensional matrix substrate 2 is used in the fourth embodiment. Description of the dimension matrix substrate 2 is omitted.

As shown in FIGS. 14 and 15, the unit element holder 6 includes a metal holder main body 61 for holding two unit elements 5, a metal partition plate 62, a handling part 63, and terminal pins 64. The basic structure of the metal holder main body 61 is a U-shape sandwiching two unit elements 5 in which the respective indium electrodes 52 face each other. The platinum electrode 53 of one unit element 5 is in electrical contact with one side wall of the metal holder main body 61 facing, and the platinum electrode 53 of the other unit element 5 is in electrical contact with the other side wall. I do. When mounted on the two-dimensional matrix substrate 2, the bottom of the metal holder main body 61 is in electrical contact with the metal plate 22.

The metal partition plate 62 is disposed between the two unit elements 5 held by the metal holder main body 61. Two opposing surfaces of the metal partition plate 62 have indium electrodes of the unit element 5, respectively. 52 make electrical contact. The handling part 63 is formed integrally with the metal partition plate 62, and the handling part 63 is formed in a direction substantially perpendicular to the main surface of the two-dimensional matrix substrate 2 so as to protrude from the unit element 5 in a holding state. You. That is, the entire shape of the metal holder main body 61 including the metal partition plate 62 and the handling portion 63 becomes a chevron shape.

Metal holder main body 61, metal partition plate 62
And the handling part 32 is formed of Kovar having conductivity. A Kovar having a thickness of 0.1 mm and a width of 2 mm is used for forming the metal holder main body 61, and both side walls of the metal holder main body 61 are formed with a height of 7 mm. The Kovar that forms the metal partition plate 62 and the handling part 32 has a thickness of 0.2 mm and a width of 2 mm, and the total height of the metal partition plate 62 and the handling part 32 is set to 10 mm. That is, the metal partition plate 62 has a height of 7 mm, and the handling portion 32 has a height of 3 mm.
It is. In order to easily mount the unit element holder 6 when arranging the unit elements 5, and to easily mount or remove the unit element holder 6 during replacement or repair.
The shape of the handling portion 63 is a T-shape that is easy to handle.

One of the terminal pins 64 is attached to the metal partition plate 62 via an insulating material 65. Terminal pin 64
Is formed with a diameter of 0.5 mm and a length of 5 mm. Glass is used for the insulating material 65, and the terminal pins 64 and the metal holder main body 61 are electrically insulated. As a result, the terminal pins 64 are electrically connected to the indium electrodes 52 of the two unit elements 5, respectively.

One unit element holder 6 thus configured holds two unit elements 5, and these two unit elements 5 are mounted on the two-dimensional matrix substrate 2 via the unit element holder 6. Is done. Platinum electrode 53 of two unit elements 5
Each contacts the side wall of the metal holder main body 61, and the indium electrode 52 contacts the metal partition plate 62. The terminal pins 64 of the unit element holder 6 are
Is electrically connected to the socket terminal 24 through a holder insertion hole 22H formed in the metal plate 22 of the first embodiment, and the bottom of the metal holder main body 61 of the unit element holder 6 electrically contacts the surface of the metal plate 22. The insulating material 65 of the unit element holder 6 is embedded in the holder insertion hole 22H formed in the metal plate 22, the unit element holder 6 is mounted without dropping from the two-dimensional matrix substrate 2, and the unit element holder 6 is removed. Can be performed freely. The attachment and detachment of the unit element holder 6 are performed via the handling unit 63.

In the two-dimensional matrix array radiation detector configured as described above, the outer width of the unit element holder 6 is determined by the thickness of both sides of the metal holder main body 61,
This is the sum of the thickness of the metal partition plate 62 and the width of the two unit elements 5 and is approximately 2.4 mm. Therefore, when the unit elements 5 are arranged on the two-dimensional matrix substrate 2 via the unit element holders 6, only a minute dead portion of about 0.14 mm exists between the unit element holders 6, and the unit elements 5 are high. Can be arranged in density.

The present invention is not limited to the above-described embodiment. For example, a Cd _x Zn _{1 -x} Te detecting element can be used as the unit element 1 or 5 of the two-dimensional matrix array radiation detector.

[0058]

According to the present invention, it is possible to provide a two-dimensional matrix array radiation detector capable of realizing a large detection area while improving detection accuracy by reducing insensitive parts. further,
The present invention can provide a two-dimensional matrix array radiation detector capable of realizing a high yield in manufacturing and a long life in use.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an overall configuration of a two-dimensional matrix array radiation detector according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a unit element of the two-dimensional matrix array radiation detector.

FIG. 3 is a sectional view of a main part of a two-dimensional matrix substrate of the two-dimensional matrix array radiation detector.

FIG. 4 is a perspective view of a unit element holder in a holding state of the unit element.

FIG. 5 is a side view of the unit element holder.

FIG. 6 is a cross-sectional view of a main part of a two-dimensional matrix array radiation detector showing a substrate mounted state.

FIG. 7 is a perspective view of a unit element mounted on a two-dimensional matrix array radiation detector according to a second embodiment of the present invention.

FIG. 8 is a perspective view of a unit element holder in a holding state of the unit element.

FIG. 9 is a side view of the unit element holder.

FIG. 10 is a perspective view showing an overall configuration of a two-dimensional matrix array radiation detector according to a third embodiment of the present invention.

FIG. 11 is a sectional view of a main part of a two-dimensional matrix substrate of the two-dimensional matrix array radiation detector.

FIG. 12 is a perspective view of a unit element holder in a holding state of the unit element.

FIG. 13 is a side view of the unit element holder.

FIG. 14 is a perspective view of a unit element holder mounted on a two-dimensional matrix array radiation detector according to a fourth embodiment of the present invention.

FIG. 15 is a side view of the unit element holder.

[Explanation of symbols]

 1, 5 unit element 11, 51 CdTe element 12, 52 indium electrode 13, 53 platinum electrode 2 two-dimensional matrix substrate 21 phenol resin substrate 22 metal plate 22H holder insertion hole 23 bidirectional socket terminal 23H, 24H terminal pin insertion hole 24 socket Terminal 3, 6 Unit element holder 31, 61 Metal holder main body 32, 63 Handling part 62 Metal partition plate 33, 64, terminal pin 34, 37, 65 Insulating material 35 Conductive sheet 36 Conductive wire

Claims (9)

[Claims] A two-dimensional matrix substrate in which a plurality of unit elements each comprising a semiconductor radiation detecting element and a plurality of bidirectional socket terminals having terminal pin insertion holes penetrating from a front surface to a rear surface are embedded in a two-dimensional matrix; A unit element holder having terminal pins that can be inserted into and removed from terminal pin insertion holes of a bidirectional socket terminal embedded in the substrate while holding one or more unit elements. Two-dimensional matrix array radiation detector. 2. The unit element is CdTe or Cd _x Zn.
The two-dimensional matrix array radiation detector according to claim 1, comprising a _1-x Te detection element. 3. The unit element is formed in a rectangular parallelepiped shape, electrodes are formed on two opposing surfaces of the unit element, and the electrode surface is substantially with respect to a main surface of the substrate on which the unit elements are arranged. 2. The device according to claim 1, wherein the unit element is mounted on the substrate via a unit element holder so as to be vertical.
Or a two-dimensional matrix array radiation detector according to claim 2. 4. The two-dimensional matrix array radiation detection according to claim 1, wherein one electrode of the unit element is an indium electrode, and the other electrode is a platinum electrode. vessel. 5. A metal plate having a holder insertion hole at each of the arrangement positions of the bidirectional socket terminals on a main surface of the substrate, and electrically connected to one electrode of the unit element and used as a common electrode. The two-dimensional matrix array radiation detector according to any one of claims 1 to 4, wherein 6. The metal holder main body, wherein the unit element holder electrically contacts one electrode of the unit element and electrically contacts a metal plate of the substrate when the substrate is mounted. And a terminal pin that is attached in an electrically insulated state, is electrically connected to the other electrode of the unit element, and is connected to a bidirectional socket terminal of the board. Item 6. A two-dimensional matrix array radiation detector according to item 5. 7. A conductive member directly in contact with the other electrode of the unit element between the other electrode of the unit element and a terminal pin of the unit element holder and attached to the metal holder body via an insulating material. The two-dimensional matrix array radiation detector according to claim 6, wherein the radiation detector is electrically connected through a sheet and a conductive wire that electrically connects between the conductive sheet and the terminal pin. 8. The unit element holder electrically contacts one electrode of each of the two unit elements while holding the other electrodes of the two unit elements facing each other, and mounts the substrate. A metal holder body that is sometimes in electrical contact with the metal plate of the substrate, and is disposed between the two unit elements while being electrically insulated from the metal holder body, and each of the two unit elements is the other of the two. And a terminal pin electrically connected to the metal partition plate and connected to a bidirectional socket terminal of the substrate. 6. The two-dimensional matrix array radiation detector according to 5. 9. The metal holder main body or the metal partition plate of the unit element holder is integrally provided with a handling portion protruding from the unit element held in a direction substantially perpendicular to the main surface of the substrate. 7. Formed according to claim 6
Or a two-dimensional matrix array radiation detector according to claim 8.