JPH11120023A - Probe - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the probe follow up three-dimensional movement. SOLUTION: An S-shaped 6 is given to some lengthwise part of the probe 1, probe supports 10 and 10 are fixed across the part of the sag 6, and bellows 4 are fitted to both the supports 10 and 10 while covering the part of the sag 6. The bellows 4 restore themselves to hold the sag 6, and also expand and shrink within a range wherein the sag 6 is drawn, and many cuts are made in the part of the sag 6 in parallel along the length to make it possible to bend the probe, so that the probe can deform in three dimensions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a development tool for a microcomputer, and more particularly to a probe for connecting a development support device such as an in-circuit emulator (hereinafter referred to as ICE) to a target.

[0002]

2. Description of the Related Art In the development of products using microcomputers, development of both hardware and software is performed simultaneously. At this time, the microcomputer development support system quickly improves the quality of software and hardware under development, and plays an important role in shortening the development period and improving the quality of the microcomputer system.

Generally, debugging of software including a target is performed by connecting an external device (ICE) to the target.

A probe which is an object of the present invention is for connecting an ICE to a target (substrate) on which software to be debugged operates, and the probe is used to transfer signals between the ICE and the target. Done through. As a material of the probe, a substrate having a multilayered flexible printed substrate is used.

FIG. 6 shows an example of a conventional probe. The probe 1 is connected to the ICE 2 and the target 3 as shown in FIG.

FIG. 7 is a plan view of FIG. 6 as viewed from the side.
In FIG. 7, an ICE 2 is connected to a socket 5 soldered to a target 3 and a probe 1 so as to form an IC.
The signal from E2 is transmitted to the target 3 through the probe 1 and the socket 5.

The number of terminals of the solder connection portion 11 of the socket is I
The number of terminals of the microcomputer to be emulated by the CE 2 is required, and the socket 5 is connected to the target 3 only by soldering the number of terminals.

The probe 1 can be bent in a direction perpendicular to the plane, as can be seen in FIG. 7, so that the ICE 2 or the target 3 can be moved freely in the upward direction 8 or in the downward direction 9 respectively. it can. However, the ICE 2 and the target 3 cannot be moved right and left because the probe 1 cannot be moved in the horizontal direction, which is the plane direction of the probe 1.

In order to increase the processing capacity and processing speed of the target, the operating clock of the microcomputer used for the target is increased, and the transfer of signals between the ICE 2 and the target 3 is also accelerated. More easily. The probe 1 shown in FIG. 6 is a multi-layer board in which signal lines and GND are formed in different layers in a flexible printed board so as not to be affected by this noise. For this reason, since the board is thicker than a single-layer flexible printed board, the board is stiff.

[0010]

The conventional probe described above loses its overall flexibility because the flexible printed circuit board is a multi-layered board, and the operation of removing the probe from the socket, replacement of target components, etc. When the ICE or target is moved in the horizontal direction of the probe in the above operation, the probe cannot be freely moved in the horizontal direction, so the force applied to the ICE or the target is applied to the solder connection between the socket and the target. The problem is that the load is applied directly and the connection failure or disconnection occurs due to the damage of the solder connection, and the signal from the ICE cannot be transmitted to the target correctly, which hinders the development of hardware and software. Occurs.

An object of the present invention is to provide a probe capable of freely moving an ICE and a target while the ICE and the target are connected.

[0012]

In order to achieve the above object, a probe according to the present invention is a probe for connecting an in-circuit emulator and a target on which software to be debugged operates, and has a displaceable portion. The displaceable portion is a portion that absorbs a relative displacement in a three-dimensional direction generated between the in-circuit emulator or the target and the probe.

The displaceable portion is a sag formed in a part of the probe, and the sag portion has self-restoring property.

[0014] The probe is a flexible substrate, and a plurality of cuts are provided in the slack portion in parallel in the length direction.

A probe support is fixed to the probe with the sag portion interposed therebetween, and both probe supports cover the slack portion and are connected by bellows. Is to give.

[0016]

Embodiments of the present invention will be described below more specifically with reference to the accompanying drawings.

Referring to FIG. 1A, in the present invention,
The ICE 2 and the target 3 are connected by the probe 1 of the present invention. The target 3 is for operating software to be debugged with the ICE 2 and the IC 3
The transfer of the signal between E2 and the target 3 is performed via the probe 1. 6 and 7 will be described with the same reference numerals.

In the present invention, a bellows 4 is provided in the middle of the length direction of the probe 1. The target 3 side of the probe 1 has a socket 5 soldered to the target 3.
ICE2 side of the probe 1 is connected to the ICE
2 are connected.

In the present invention, the probe 1 has a part which can be displaced in the three-dimensional direction in the longitudinal direction. The displaceable portion is an S-shaped sag 6 as shown in FIG. 1 (b), and a probe support 10 is fixed on both sides of the sag 6 as shown in FIG. The supporting portions 10 and 10 are connected with the bellows 4 so as to cover the slack 6. That is, in the present invention, the probe 6
The sag 6 is formed in a part of the bellows, and the sag 6 is retained by the bellows 4. The bellows 4 is stretchable,
It has self-restoring properties and can flex freely in three-dimensional directions.

When the bellows 4 is stretched, the slack 6 of the probe 6 is also stretched. However, even when the bellows 4 is completely stretched, the probe 1 can retain the slack 6.

As shown in FIG. 3, the probe 1 is a flexible printed circuit board including a plurality of cuts 7 in the longitudinal direction including the sag 6 as shown in FIG. Therefore, the probe 1 according to the present invention can expand and contract within a range in which the slack 6 is stretched, and can be freely bent in the horizontal direction by the multiple cuts 7 provided on the flexible printed circuit board. The portion of the slack 6 is held by the bellows 4 having self-restoring properties so as to be displaceable in three-dimensional directions.

Therefore, according to the present invention, as shown in FIGS. 4 and 5, when the ICE 2 or the target 3 is careless of the user, or when the probe 1 is connected to the target 3 or when the probe is When the operation of removing the probe 1 is performed, the probe 1 is
Even if the target 2 or the target 3 moves relatively upward or downward 9, the probe 1 follows the displacement together with the bellows 4, and the relative displacement in the three-dimensional direction due to these movements is absorbed by the slack 6. In addition, no load is applied to the solder connection portion 11 of the socket 5 connected to the target 3.

[0023]

As described above, according to the present invention,
Because a displaceable part is provided in a part of the probe so as to follow the displacement in the three-dimensional direction, a force is applied to the ICE or the target connected to the probe,
Even if it is relatively displaced, no load is applied to the ICE or the target, no unreasonableness occurs in the solder connection between the target and the socket, and no contact failure or disconnection due to damage to the solder connection occurs.

Further, according to the present invention, since a part of the probe is provided with an S-shaped slack and a multi-step notch as a displaceable portion, and this is retained by a bellows having a self-restoring property, Displacement can be absorbed by smoothly following three-dimensional movement. The selection of the material of the bellows can prevent the deterioration of the signal and the influence of the nozzle.

[Brief description of the drawings]

FIG. 1A is a diagram showing an embodiment of the present invention, and FIG.
FIG. 3 is a diagram showing a configuration of a probe.

FIG. 2 is a cross-sectional view of a portion corresponding to cc in FIG. 1 (b).

FIG. 3 is a view showing a form of cutting into a probe.

FIG. 4 is a side view showing a use state.

FIG. 5 is a plan view showing a use state.

FIG. 6 is a diagram showing a conventional example of a probe.

FIG. 7 is a side view of a conventional probe.

[Explanation of symbols]

 Reference Signs List 1 probe 2 ICE (in-circuit emulator) 3 target 4 bellows 5 socket 6 slack 7 cut 8 upward 9 downward 10 probe support 11 solder connection

Claims (4)

[Claims] 1. A probe for connecting an in-circuit emulator and a target on which software to be debugged operates, the probe having a displaceable portion, wherein the displaceable portion is generated between the in-circuit emulator or target and the probe. A probe characterized in that it is a portion that absorbs relative displacement in three-dimensional directions. 2. The probe according to claim 1, wherein the displaceable portion is a sag formed on a part of the probe, and the sag portion is provided with a self-restoring property. 3. The probe is a flexible substrate,
The probe according to claim 1 or 2, wherein the slack portion has a plurality of cuts formed in parallel in a length direction. 4. A probe support is fixed to the probe so as to sandwich the slack portion, and both probe supports cover the slack portion and are connected by bellows. The probe according to claim 2, wherein the probe is provided.