JPH11103002A - Heat sink - Google Patents
Heat sinkInfo
- Publication number
- JPH11103002A JPH11103002A JP26209397A JP26209397A JPH11103002A JP H11103002 A JPH11103002 A JP H11103002A JP 26209397 A JP26209397 A JP 26209397A JP 26209397 A JP26209397 A JP 26209397A JP H11103002 A JPH11103002 A JP H11103002A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- fin
- heat
- cylinder
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はヒートシンクに関
し、特にパ−ソナルコンピュ−タ等の電子機器に使用さ
れるＣＰＵ等の高発熱電子部品のヒートシンクに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink, and more particularly, to a heat sink for a high heat-generating electronic component such as a CPU used in electronic equipment such as a personal computer.
【０００２】[0002]
【従来の技術】従来、ヒートシンクの形状は、図３の従
来のヒートシンクを示す斜視図に示すようにヒートシン
ク４にフィンを多数設け表面積を増やすことにより冷却
性能を高める形状となっている。2. Description of the Related Art Conventionally, as shown in a perspective view of a conventional heat sink in FIG. 3, a heat sink 4 is provided with a large number of fins to increase the surface area, thereby improving the cooling performance.
【０００３】[0003]
【発明が解決しようとする課題】上述した従来のヒート
シンクは、第１の問題点は、ＣＰＵ等発熱デバイスの発
熱量の増加に伴いヒートシンクの大型化やファンによる
強制空冷が必要になり、筐体内での実装エリアの制限や
ファンによる騒音が発生することである。The first problem with the above-mentioned conventional heat sink is that the heat generated by a heat-generating device such as a CPU increases in size and the size of the heat sink increases and forced air cooling by a fan is required. And the noise generated by the fan.
【０００４】その理由は、固体から流体への熱伝達率は
低く、ヒートシンクのフィンから周囲の空気へは熱が伝
わりにくい為である。The reason for this is that the heat transfer coefficient from the solid to the fluid is low, and it is difficult for heat to transfer from the fins of the heat sink to the surrounding air.
【０００５】本発明の目的は、ヒートシンクのフィン形
状を円筒型にすることにより、フィンから周囲の空気へ
の熱伝達を促進する、また、フィンの下部に設けたスリ
ットによりフィン周囲の自然対流を施すヒートシンクを
提供することにある。An object of the present invention is to promote heat transfer from the fins to the surrounding air by making the fins of the heat sink into a cylindrical shape, and to reduce natural convection around the fins by slits provided below the fins. It is to provide a heat sink to be applied.
【０００６】[0006]
【課題を解決するための手段】本発明のヒートシンク
は、ヒートシンクフィンを円筒形状または筒状とし、ヒ
ートシンクフィンに囲まれた円筒または筒内の空気を集
中的に暖めることにより、ヒートシンクから空気への熱
伝達を促進する。According to the heat sink of the present invention, the heat sink fin is formed into a cylindrical shape or a cylindrical shape, and the air in the cylinder or the tube surrounded by the heat sink fin is intensively heated, so that the heat sink fin is cooled to the air. Promotes heat transfer.
【０００７】［作用］円筒または筒内の空気が暖められ
ることにより、円筒または筒の内部と外部に温度差が発
生し、ヒートシンクフィンに設けたスリットにより、円
筒または筒の外部から内部への流れが発生する。また、
円筒内では暖められた空気が上昇する為、ヒートシンク
のフィンの周囲には自然対流が得られ放熱効果が促進さ
れる。[Operation] When the air in the cylinder or the cylinder is heated, a temperature difference is generated between the inside and the outside of the cylinder or the cylinder, and the flow from the outside of the cylinder or the cylinder to the inside is formed by the slit provided in the heat sink fin. Occurs. Also,
Since the warmed air rises in the cylinder, natural convection is obtained around the fins of the heat sink, and the heat radiation effect is promoted.
【０００８】[0008]
【発明の実施の形態】次に、本発明の実施の形態につい
て図面を参照して説明する。Next, embodiments of the present invention will be described with reference to the drawings.
【０００９】図１は本発明のヒートシンクの一実施の形
態を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of a heat sink according to the present invention.
【００１０】図１を参照すると、本発明のヒートシンク
フィン１は円筒形状になっている。Referring to FIG. 1, a heat sink fin 1 of the present invention has a cylindrical shape.
【００１１】また、ヒートシンクフィン１の下部には複
数のスリット２が設けるられている。A plurality of slits 2 are provided below the heat sink fin 1.
【００１２】次に、本発明の実施の形態の動作につい
て、図２を参照して詳細に説明する。Next, the operation of the embodiment of the present invention will be described in detail with reference to FIG.
【００１３】図２は本発明のヒートシンクの一実施の形
態を示す断面図である。FIG. 2 is a sectional view showing an embodiment of the heat sink of the present invention.
【００１４】電子部品等のデバイス３の発熱により熱が
ヒートシンクフィン１に伝わった時、円筒型のヒートシ
ンクフィン１の内部と外部では内部の方が集中的に暖め
られ温度は上昇する。When heat is transmitted to the heat sink fins 1 by the heat generated by the devices 3 such as electronic components, the inside and outside of the cylindrical heat sink fins 1 are intensively warmed and the temperature rises.
【００１５】発熱デバイス３の熱は熱伝達によりヒート
シンク４に伝わった後、熱伝導により円筒型のヒートシ
ンクフィン１全体に移動する。この熱は熱伝達により周
囲の空気へと移動し、この時フィンの内部と外部に温度
差が生じ、この温度差により自然対流が発生する。After the heat of the heat generating device 3 is transmitted to the heat sink 4 by heat transfer, it moves to the entire cylindrical heat sink fin 1 by heat conduction. This heat is transferred to the surrounding air by heat transfer, and at this time, a temperature difference is generated between the inside and the outside of the fin, and a natural convection is generated due to the temperature difference.
【００１６】図２に示すように、円筒内部と外部の温度
差により外部の空気はスリット２を通り、内部へ流入す
る。内部の暖められた空気は煙突効果により円筒の上方
へと移動し、ヒートシンクフィン１の周囲に自然対流が
得られる。As shown in FIG. 2, outside air flows into the inside through the slit 2 due to a temperature difference between the inside of the cylinder and the outside. The warmed air inside moves upward of the cylinder by the chimney effect, and natural convection is obtained around the heat sink fin 1.
【００１７】以上はヒートシンクフィン１の形状は円筒
形状で説明したが同様の効果が得られる筒状の形状をし
ていればよい。In the above, the heat sink fin 1 has been described as having a cylindrical shape. However, it is sufficient that the heat sink fin 1 has a cylindrical shape capable of obtaining the same effect.
【００１８】[0018]
【発明の効果】以上説明したように、本発明のヒートシ
ンクは、第１の効果は、ヒートシンクを大型化しなくて
も熱を逃がすことが出来るという効果を有している。As described above, the first effect of the heat sink of the present invention is that heat can be released without increasing the size of the heat sink.
【００１９】その理由は、フィンを円筒形状にしフィン
の下部にスリットを設けることにより、フィンの周囲に
自然対流が得られ、フィンから周囲の空気へのの熱伝達
が向上するということである。The reason is that by forming the fin into a cylindrical shape and providing a slit at the bottom of the fin, natural convection is obtained around the fin and heat transfer from the fin to the surrounding air is improved.
【図１】本発明のヒートシンクの一実施の形態を示す斜
視図である。FIG. 1 is a perspective view showing an embodiment of a heat sink according to the present invention.
【図２】本発明のヒートシンクの一実施の形態を示す断
面図である。FIG. 2 is a sectional view showing an embodiment of a heat sink according to the present invention.
【図３】従来のヒートシンクを示す斜視図である。FIG. 3 is a perspective view showing a conventional heat sink.
１ ヒートシンクフィン ２ スリット ３ デバイス ４ ヒートシンク DESCRIPTION OF SYMBOLS 1 Heat sink fin 2 Slit 3 Device 4 Heat sink
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成１１年１月１３日[Submission date] January 13, 1999
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】特許請求の範囲[Correction target item name] Claims
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【特許請求の範囲】[Claims]
Claims (3)
とを特徴とするヒートシンク。1. A heat sink comprising a cylindrical heat sink fin.
を特徴とするヒートシンク。2. A heat sink comprising a tubular heat sink fin.
ットを設けたことを特徴とする請求項１および請求項２
記載のヒートシンク。3. The heat sink fin according to claim 1, wherein a plurality of slits are provided below the heat sink fin.
The described heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26209397A JP2908390B2 (en) | 1997-09-26 | 1997-09-26 | heatsink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26209397A JP2908390B2 (en) | 1997-09-26 | 1997-09-26 | heatsink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11103002A true JPH11103002A (en) | 1999-04-13 |
| JP2908390B2 JP2908390B2 (en) | 1999-06-21 |
Family
ID=17370945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26209397A Expired - Fee Related JP2908390B2 (en) | 1997-09-26 | 1997-09-26 | heatsink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2908390B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100925048B1 (en) * | 2008-11-17 | 2009-11-03 | 송민훈 | Heat dissipation structure of led lamp using convective flow |
| KR101101256B1 (en) * | 2009-11-27 | 2012-01-04 | (주)파트라 | light of LED |
| CN104952814A (en) * | 2015-06-10 | 2015-09-30 | 南京师范大学 | Heat-radiating type semiconductor thermoelectric module with chimney |
| US11171279B2 (en) | 2017-04-10 | 2021-11-09 | Murata Manufacturing Co., Ltd. | Thermoelectric conversion element module |
-
1997
- 1997-09-26 JP JP26209397A patent/JP2908390B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100925048B1 (en) * | 2008-11-17 | 2009-11-03 | 송민훈 | Heat dissipation structure of led lamp using convective flow |
| KR101101256B1 (en) * | 2009-11-27 | 2012-01-04 | (주)파트라 | light of LED |
| CN104952814A (en) * | 2015-06-10 | 2015-09-30 | 南京师范大学 | Heat-radiating type semiconductor thermoelectric module with chimney |
| US11171279B2 (en) | 2017-04-10 | 2021-11-09 | Murata Manufacturing Co., Ltd. | Thermoelectric conversion element module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2908390B2 (en) | 1999-06-21 |
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