JPH11102423A - Production of printed antenna circuit for contactless ic card using conductive paste and the contactless ic card - Google Patents
Production of printed antenna circuit for contactless ic card using conductive paste and the contactless ic cardInfo
- Publication number
- JPH11102423A JPH11102423A JP26040897A JP26040897A JPH11102423A JP H11102423 A JPH11102423 A JP H11102423A JP 26040897 A JP26040897 A JP 26040897A JP 26040897 A JP26040897 A JP 26040897A JP H11102423 A JPH11102423 A JP H11102423A
- Authority
- JP
- Japan
- Prior art keywords
- drying
- card
- circuit
- antenna circuit
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000001035 drying Methods 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 238000007639 printing Methods 0.000 abstract description 12
- 238000004891 communication Methods 0.000 abstract description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 5
- 239000013034 phenoxy resin Substances 0.000 abstract description 4
- 229920006287 phenoxy resin Polymers 0.000 abstract description 4
- 238000009835 boiling Methods 0.000 abstract description 3
- 239000003960 organic solvent Substances 0.000 abstract description 3
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 239000004332 silver Substances 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000003851 corona treatment Methods 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- ONVGIJBNBDUBCM-UHFFFAOYSA-N silver;silver Chemical compound [Ag].[Ag+] ONVGIJBNBDUBCM-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、導電ペーストを用
いた非接触ＩＣカードの印刷アンテナ回路の製造方法及
びこの製造方法により得られた印刷アンテナ回路を有す
る非接触ＩＣカードに関する。The present invention relates to a method for manufacturing a printed antenna circuit of a non-contact IC card using a conductive paste, and a non-contact IC card having a printed antenna circuit obtained by the manufacturing method.
【０００２】[0002]
【従来の技術】非接触ＩＣカードの印刷アンテナ回路に
は、銅線やエッチングした銅箔に匹敵する特性を得るた
めの３０μΩｃｍ以下の低い比抵抗と、生産性を向上す
るための高い印刷作業性と、生産性向上のため短時間の
乾燥性が要求される。一方、従来、回路等に用いられて
きた導電ペーストは、銀粉末や銀メッキした銅粉末とフ
ェノール樹脂やエポキシ樹脂やメラミン樹脂等の熱硬化
性樹脂と溶剤、又は銀粉末や銀メッキした銅粉末とアク
リル樹脂やブチラール樹脂やポリエステル樹脂等の熱可
塑性樹脂と溶剤、を主成分とする。熱硬化性樹脂を使用
した導電ペーストは、熱硬化に長時間を有するための短
時間の乾燥が不可能であり、生産性を向上することがで
きないという問題点があった。また、アクリル樹脂、ポ
リエステル樹脂、ブチラール樹脂を用いた従来の熱可塑
性樹脂を用いた導電ペーストは、乾燥するだけで導電性
が得られるので生産性は良いが、耐熱性が低すぎるの
で、ＩＣを異方導電性フィルムで接続しようとうすると
印刷回路がつぶれてしまい使用できないという問題点が
あった。2. Description of the Related Art A printed antenna circuit of a non-contact IC card has a low specific resistance of 30 .mu..OMEGA.cm or less for obtaining characteristics comparable to a copper wire or an etched copper foil, and a high printing workability for improving productivity. In addition, short-time drying property is required to improve productivity. On the other hand, conductive pastes conventionally used for circuits and the like are silver powder or silver-plated copper powder and thermosetting resin such as phenol resin, epoxy resin or melamine resin and a solvent, or silver powder or silver-plated copper powder. And a thermoplastic resin such as an acrylic resin, a butyral resin, or a polyester resin, and a solvent. A conductive paste using a thermosetting resin has a problem that it cannot be dried in a short time because of having a long time for thermosetting, so that productivity cannot be improved. In addition, a conductive paste using a conventional thermoplastic resin using an acrylic resin, a polyester resin, or a butyral resin has good productivity because conductivity can be obtained only by drying, but the heat resistance is too low. There is a problem in that when the connection is made with an anisotropic conductive film, the printed circuit is crushed and cannot be used.
【０００３】従来の熱硬化性樹脂を単独で用いた導電ペ
ーストの問題点及び熱可塑性樹脂を単独で用いた樹脂の
問題点を解決するために、ブチラール樹脂とフェノール
樹脂の混合系が提案されている。しかし、このペースト
では、比抵抗が３０μΩｃｍより小さくならず、また熱
硬化性であるために十分な特性を得るための乾燥硬化時
間も３０分以下にするのは困難であった。また、比抵抗
を小さくするために、回路印刷後に低温で乾燥した後、
ヒートロールや熱プレスで回路を押して比抵抗を小さく
する方法があるが、この方法では、ＩＣとの接触抵抗が
増加してしまうという問題があった。また、イソシアナ
ト基をブロックしたブロック型イソシアネートとブチラ
ール樹脂の混合系も提案されており、このものは、比抵
抗は３０μΩｃｍ以下にはなるが、短時間の乾燥硬化で
は、ガラス転移温度が元のブチラール樹脂よりも低下し
てしまい、異方導電フィルムを用いてＩＣを接続しよう
とすると回路がつぶれてしまうため使用できないという
問題があった。[0003] In order to solve the problems of the conventional conductive paste using a thermosetting resin alone and the problem of the resin using a thermoplastic resin alone, a mixed system of a butyral resin and a phenol resin has been proposed. I have. However, with this paste, the specific resistance did not become less than 30 μΩcm, and since it was thermosetting, it was difficult to reduce the drying and curing time to 30 minutes or less to obtain sufficient properties. Also, in order to reduce the specific resistance, after drying at low temperature after circuit printing,
There is a method of reducing the specific resistance by pressing the circuit with a heat roll or a hot press. However, this method has a problem that the contact resistance with the IC increases. Also, a mixed system of a blocked isocyanate in which an isocyanato group is blocked and a butyral resin has been proposed. In this system, the specific resistance becomes 30 μΩcm or less. There is a problem in that it is lower than resin, and if an attempt is made to connect an IC using an anisotropic conductive film, the circuit is crushed and cannot be used.
【０００４】[0004]
【発明が解決しようとする課題】本発明の目的は、従来
の導電ペーストを用いた非接触ＩＣカードの印刷アンテ
ナ回路の製造方法の問題点であった、回路抵抗が高く、
通信距離が短いという問題を解決することができる非接
触ＩＣカードの印刷アンテナ回路の製造方法を提供する
ことにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a conventional method for manufacturing a printed antenna circuit for a non-contact IC card using a conductive paste.
An object of the present invention is to provide a method of manufacturing a printed antenna circuit of a non-contact IC card which can solve the problem of a short communication distance.
【０００５】本発明の他の目的は、従来の印刷アンテナ
回路を用いた非接触ＩＣカードよりも通信距離が長く、
かつ印刷回路の乾燥硬化時間が短いので生産性に優れ、
かつ、異方導電性フィルムによるＩＣ接続時に回路がつ
ぶれる不良がなく、かつ、大幅にＩＣとの接続抵抗が低
下したため接続部分での損失や誤作動が少ない、印刷ア
ンテナ回路を有する非接触ＩＣカードを提供することに
ある。Another object of the present invention is to provide a communication distance longer than that of a non-contact IC card using a conventional printed antenna circuit.
In addition, because the drying and curing time of the printed circuit is short, it has excellent productivity,
A non-contact IC card having a printed antenna circuit, which has no failure in which a circuit is broken when an IC is connected by an anisotropic conductive film and has a greatly reduced connection resistance with the IC, so that there is little loss or malfunction at a connection portion. Is to provide.
【０００６】[0006]
【課題を解決するための手段】本発明は、基板上に導電
ペーストを印刷して回路パターンを形成し、これを乾燥
して非接触ＩＣカード用の印刷アンテナ回路を製造する
際に、乾燥工程が（１）５０℃〜１００℃の初期乾燥及
び（２）１２０℃〜１８０℃の本乾燥からなることを特
徴とする非接触ＩＣカード用の印刷アンテナ回路の製造
方法を提供するものである。SUMMARY OF THE INVENTION The present invention relates to a method of forming a printed antenna circuit for a non-contact IC card by forming a circuit pattern by printing a conductive paste on a substrate and drying the circuit pattern. The present invention provides a method for manufacturing a printed antenna circuit for a non-contact IC card, which comprises (1) initial drying at 50 ° C. to 100 ° C. and (2) main drying at 120 ° C. to 180 ° C.
【０００７】[0007]
【発明の実施の形態】本発明において用いられる導電ペ
ーストの好ましい粘度範囲は、１万センチポイズから１
５万センチポイズであり、さらに好ましくは、２万セン
チポイズから１０万センチポイズである。１万センチポ
イズより粘度が低いと印刷した回路が印刷後に広がって
しまう傾向にあり、１５万センチポイズを超えると印刷
時のスクリーン抜け性が悪くなる傾向にある。DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred viscosity range of the conductive paste used in the present invention is from 10,000 centipoise to 1 centipoise.
It is 50,000 centipoise, and more preferably 20,000 to 100,000 centipoise. If the viscosity is lower than 10,000 centipoise, the printed circuit tends to spread after printing, and if it exceeds 150,000 centipoise, the screen removability during printing tends to deteriorate.
【０００８】本発明において用いられる導電ペーストの
好ましい例としては、扁平化した銀粉末又は扁平化した
銀メッキ銅粉末の混合物４０〜８０重量％、フェノキシ
樹脂などの熱硬化性樹脂２〜２０重量％、ブチルカルビ
トールなどの沸点が好ましくは１８０〜２５０℃の有機
溶剤１５〜４５重量％の混合物を、らいかい機や三本ロ
ール、ディスクミル、ビーズミル等を用いて上記の好ま
しい粘度になるように混合して得られる導電ペーストが
挙げられる。Preferred examples of the conductive paste used in the present invention include 40 to 80% by weight of a flattened silver powder or a mixture of flattened silver-plated copper powder, and 2 to 20% by weight of a thermosetting resin such as a phenoxy resin. And a mixture of 15 to 45% by weight of an organic solvent having a boiling point of preferably 180 to 250 ° C., such as butyl carbitol, using a rapier, a three-roll mill, a disc mill, a bead mill or the like so that the above-mentioned preferable viscosity is obtained. A conductive paste obtained by mixing is included.
【０００９】本発明においては、基板上に導電ペースト
を印刷して回路パターンを形成し、これを乾燥して非接
触ＩＣカード用の印刷アンテナ回路を製造する際に、乾
燥工程を（１）５０℃〜１００℃の初期乾燥及び（２）
１２０℃〜１８０℃の本乾燥とした点が重要である。In the present invention, when a conductive pattern is printed on a substrate to form a circuit pattern, and the circuit pattern is dried to produce a printed antenna circuit for a non-contact IC card, the drying step (1) 50 Initial drying at 100C to 100C and (2)
It is important that the main drying is performed at 120 to 180 ° C.
【００１０】初期乾燥は、５０℃〜１００℃とすること
が必要で、５０℃〜７０℃とすることが好ましい。より
好ましくは５０℃である。初期乾燥時間は好ましくは５
〜３０分とする。初期乾燥温度が１００℃を超えると印
刷物の導電ペースト内で激しく有機溶剤が揮発し扁平化
銀粉がランダムに並び扁平化銀粉同士の接触が減るため
に回路抵抗が増加し非接触ＩＣカードの特徴である通信
距離が低下する。初期乾燥温度が５０℃未満だと回路抵
抗が小さくなるものの室温の温度変化に敏感になり温度
制御が難しくなる。また乾燥温度が変化すると回路抵抗
のバラツキが発生する。また、初期乾燥温度を下げすぎ
ると導電ペーストに使用されている溶剤が高沸点のため
乾燥時間が長時間になり生産性が低下し好ましくない。The initial drying is required to be carried out at 50 to 100 ° C., preferably at 50 to 70 ° C. More preferably, it is 50 ° C. The initial drying time is preferably 5
30 minutes. If the initial drying temperature exceeds 100 ° C, the organic solvent will violently volatilize in the conductive paste of the printed matter, and the flattened silver powder will be randomly arranged to reduce the contact between the flattened silver powders. A certain communication distance decreases. If the initial drying temperature is lower than 50 ° C., the circuit resistance will be small, but it will be sensitive to temperature changes at room temperature, making temperature control difficult. When the drying temperature changes, the circuit resistance varies. On the other hand, if the initial drying temperature is too low, the solvent used for the conductive paste has a high boiling point, so that the drying time becomes long and the productivity decreases, which is not preferable.
【００１１】本乾燥は、１２０℃〜１８０℃とすること
が必要で、１２０℃〜１５０℃とすることが好ましい。
より好ましくは１５０℃である。本乾燥時間は好ましく
は５〜３０分とする。本乾燥温度が１８０℃を超えると
印刷基材のガラス転移点を超えてしまい寸法安定性が著
しく変化し導電ペーストを印刷した後行うＩＣ実装時に
位置ズレ等の問題があり生産歩留り低下の原因になる。
また、本乾燥温度が１２０℃℃未満だと乾燥時間が長く
なり生産性が低下する。[0011] The main drying must be carried out at a temperature of from 120 to 180 ° C, preferably from 120 to 150 ° C.
More preferably, it is 150 ° C. The main drying time is preferably 5 to 30 minutes. If the final drying temperature exceeds 180 ° C., it exceeds the glass transition point of the printing base material, and the dimensional stability changes significantly. There is a problem such as misalignment when mounting the IC after printing the conductive paste, which may cause a reduction in production yield. Become.
On the other hand, if the main drying temperature is lower than 120 ° C., the drying time is prolonged, and the productivity is reduced.
【００１２】本発明により得られた印刷アンテナ回路を
有する非接触ＩＣカードの好ましい製造方法の一例を示
すと、印刷アンテナ回路用導電ペーストでアンテナ回路
を形成した回路基板上に、チップ（ＩＣ及びコンデン
サ）を異方導電性フィルム等でフェースダウン実装し、
その後、チップが実装された回路基板の上に、チップの
外形寸法よりやや大きめの面積のくり抜き穴を設けてあ
ってチップと同等の厚みを有し、接着剤を塗布してある
スペーサを重ね、さらに、上部のカバーとして、樹脂フ
ィルムに接着剤を塗布したカバーフィルムを重ねて、ラ
ミネータでラミネートすると、積層構造の非接触ＩＣカ
ードが得られる。An example of a preferred method of manufacturing a non-contact IC card having a printed antenna circuit obtained by the present invention is as follows. A chip (IC and capacitor) is mounted on a circuit board on which an antenna circuit is formed with a printed antenna circuit conductive paste. ) Is mounted face down with an anisotropic conductive film, etc.
After that, on the circuit board on which the chip is mounted, a cutout hole with an area slightly larger than the external dimensions of the chip is provided, the thickness is equal to that of the chip, and the spacers coated with adhesive are stacked, Further, as a cover on the top, a cover film obtained by applying an adhesive to a resin film is overlaid and laminated with a laminator to obtain a non-contact IC card having a laminated structure.
【００１３】本発明における印刷、乾燥後の比抵抗
（ρ、単位Ωｃｍ）は、平面コイル状の回路をスクリー
ン印刷で形成し、乾燥して溶剤を揮発させた後に、マル
チメータ等の測定装置で両端間の回路抵抗（Ｒ、単位
Ω）を測定し、回路膜厚（ｔ、単位ｃｍ）と回路幅
（Ｗ、単位ｃｍ）を触針式の表面粗さ計等で測定して、
回路長さ（Ｌ、単位ｃｍ）から、以下の第（１）式にて
求められる。 ρ＝Ｒ×ｔ×Ｗ／Ｌ （Ωｃｍ）・・・・第（１）式 印刷、乾燥後の比抵抗は３０μΩｃｍ以下であることが
好ましく、さらに好ましくは２５μΩｃｍ以下であり、
最も好ましくは２２μΩｃｍ以下である。３０μΩｃｍ
以上であると、非接触ＩＣカードの通信可能距離が短く
なる傾向にある。The specific resistance (ρ, unit Ωcm) after printing and drying in the present invention is measured by a measuring device such as a multimeter after a flat coil-shaped circuit is formed by screen printing and dried to evaporate the solvent. The circuit resistance (R, unit Ω) between both ends is measured, and the circuit thickness (t, unit cm) and the circuit width (W, unit cm) are measured by a stylus type surface roughness meter or the like.
From the circuit length (L, unit: cm), it can be obtained by the following equation (1). ρ = R × t × W / L (Ωcm) (1) The specific resistance after printing and drying is preferably 30 μΩcm or less, more preferably 25 μΩcm or less,
Most preferably, it is 22 μΩcm or less. 30μΩcm
With the above, the communicable distance of the non-contact IC card tends to be short.
【００１４】[0014]
【実施例】以下、本発明を実施例に基づいて詳細に説明
するが、本発明はこれに限定されるものではない。The present invention will be described below in detail with reference to examples, but the present invention is not limited to these examples.
【００１５】実施例１ 銀粉（平均粒径５μｍ、扁平化度１０）２０ｇ、及びブ
チルカルビトールに濃度３３％で溶解したフェノキシ樹
脂（ＵＮＩＯＮ ＣＡＲＢＩＤＥ ＣＯＲＰＯＲＡＴＩ
ＯＮ、商標ＵＣＡＲ Ｐｈｅｎｏｘｙ Ｒｅｓｉｎ Ｐ
ＫＨＣ）６．７ｇを乳鉢に入れ、らいかい機にセット
し、粘度が２０万センチポイズ以下になるように適度に
ブチルカルビトールを加えながら約３０分間混合した。
得られたペーストに、Ｂ型粘度計でシェアレートが毎分
２４０ｍｍのときの粘度が約１０万センチポイズににる
ように、ブチルカルビトールをさらに加えて、実施例１
の印刷アンテナ回路用導電ペーストを得た。Example 1 20 g of silver powder (average particle size 5 μm, flattening degree 10) and phenoxy resin (UNION CARBIDE CORPORATE) dissolved in butyl carbitol at a concentration of 33%
ON, trademark UCAR Phenoxy Resin P
6.7 g of (KHC) was placed in a mortar, set in a grinder, and mixed for about 30 minutes while adding butyl carbitol appropriately so that the viscosity became 200,000 centipoise or less.
To the obtained paste, butyl carbitol was further added so that the viscosity at a shear rate of 240 mm / min with a B-type viscometer was about 100,000 centipoise.
A conductive paste for a printed antenna circuit was obtained.
【００１６】このペーストを、スクリーン印刷機でポリ
エチレンテレフタレートフィルム（厚み１００μｍ、幅
５４ｍｍ、長さ８６ｍｍ、延伸処理有り、両面コロナ放
電処理有り）にコイル状（２０ターン、長さ２８０ｃ
ｍ、回路幅の設計値４００μｍ、回路スペースの設計値
２５０μｍ）に印刷し、初期乾燥温度５０℃で１０分乾
燥した後、本乾燥１５０℃で１０分乾燥して印刷アンテ
ナ回路を形成し、印刷アンテナ回路を形成した印刷基板
を得た。初期乾燥後の乾燥性を表１に示す。なお、表１
において○はタックなし、×はタックありを示す。The paste was applied to a polyethylene terephthalate film (thickness: 100 μm, width: 54 mm, length: 86 mm, stretched, corona discharge treatment on both sides) in a coil form (20 turns, length: 280 c) using a screen printer.
m, circuit width design value 400μm, circuit space design value 250μm), dried at an initial drying temperature of 50 ° C for 10 minutes, and then dried at 150 ° C for 10 minutes to form a printed antenna circuit and printed. A printed board on which an antenna circuit was formed was obtained. Table 1 shows the drying properties after the initial drying. Table 1
In the table, ○ indicates no tack and × indicates tack.
【００１７】得られた印刷アンテナ回路の両端間の抵抗
を測定し、第（１）式から比抵抗を計算した。得られた
アンテナ回路抵抗値及び比抵抗を表１に示す。The resistance between both ends of the obtained printed antenna circuit was measured, and the specific resistance was calculated from the equation (1). Table 1 shows the obtained antenna circuit resistance values and specific resistances.
【００１８】さらに、厚さ２５０μｍのチップ（ＩＣ、
コンデンサ）を異方導電フィルム（日立化成工業（株）
製 ΑＣ−８３０１）を用いて１９０℃、６０ｋｇ／ｃ
ｍ2で印刷アンテナ回路に接続し、チップと印刷アンテ
ナ回路を形成した印刷基板を得た。接続部分の観察結果
（ＩＣ接続性）を表１に示す。○はＩＣまわりの回路つ
ぶれなしを、×はＩＣまわりの回路つぶれありを示す。Further, a chip having a thickness of 250 μm (IC,
Capacitor) to anisotropic conductive film (Hitachi Chemical Industries, Ltd.)
190 ° C, 60 kg / c
Connect the print antenna circuit in m 2, and obtain a printed substrate with the chip and printed antenna circuit. Table 1 shows the observation results (IC connectivity) of the connection portion. ○ indicates no circuit collapse around the IC, and x indicates circuit collapse around the IC.
【００１９】さらに、前記チップと印刷アンテナ回路を
形成した印刷基板のチップが形成してある部分より、幅
方向も長さ方向も１００μｍずつ広くくり抜いてあるポ
リエチレンテレフタレートフィルム（厚み５０μｍ、幅
５４ｍｍ、長さ８６ｍｍ、延伸処理有り、両面コロナ放
電処理有り）に粘着剤を２５μｍ形成したフィルムをチ
ップ部分が露出するように重ね合わせ、さらに、ポリエ
チレンテレフタレートフィルム（厚み２００μｍ、幅５
４ｍｍ、長さ８６ｍｍ、延伸処理有り、両面コロナ放電
処理有り）に粘着剤を２５μｍ形成したフィルムを上下
に重ね合わせ、ロール温度が１２０℃のラミネータでラ
ミネートして約７６０μｍ厚みの、実施例１のＩＣカー
ドを得た。実施例１のＩＣカードの通信試験結果を表１
に示す。○は通信距離が５０ｍｍを超える、△は通信距
離が４５〜５０ｍｍ、×は通信距離が４５ｍｍ未満を示
す。Further, a polyethylene terephthalate film (thickness: 50 μm, width: 54 mm, length: 100 μm) is widened in the width direction and the length direction from the portion of the printed board on which the chip and the printed antenna circuit are formed. A film having a thickness of 86 mm, a stretching treatment, a double-sided corona discharge treatment) and a film formed with an adhesive of 25 μm are superposed so that the chip portion is exposed, and a polyethylene terephthalate film (thickness 200 μm, width 5)
4 mm, length 86 mm, with stretching treatment, with double-sided corona discharge treatment), a film formed with an adhesive of 25 μm is superimposed on top and bottom, and laminated with a laminator having a roll temperature of 120 ° C. to have a thickness of about 760 μm. IC card was obtained. Table 1 shows the communication test results of the IC card of the first embodiment.
Shown in ○ indicates that the communication distance exceeds 50 mm, Δ indicates that the communication distance is 45 to 50 mm, and X indicates that the communication distance is less than 45 mm.
【００２０】実施例２ 初期乾燥温度８０℃で１０分乾燥した後、本乾燥１５０
℃で１０分乾燥した以外は、実施例１と同様にして実施
例２の印刷アンテナ回路、及びＩＣカードを得た。実施
例２の印刷アンテナ回路の乾燥性、抵抗値、比抵抗、Ｉ
Ｃ接続後の回路形状の観察結果、ＩＣカードの特性を表
１に示す。Example 2 After drying at an initial drying temperature of 80 ° C. for 10 minutes, main drying was performed for 150 minutes.
A printed antenna circuit of Example 2 and an IC card were obtained in the same manner as in Example 1 except that drying was performed at 10 ° C. for 10 minutes. Drying property, resistance value, specific resistance, I of the printed antenna circuit of Example 2
Table 1 shows the characteristics of the IC card as a result of observation of the circuit shape after the C connection.
【００２１】実施例３ 初期乾燥温度１００℃で１０分乾燥した後、本乾燥１７
０℃で１０分乾燥した以外は、実施例１と同様にして実
施例３の印刷アンテナ回路、及びＩＣカードを得た。実
施例３の印刷アンテナ回路の乾燥性、抵抗値、比抵抗、
ＩＣ接続後の回路形状の観察結果、ＩＣカードの特性を
表１に示す。Example 3 After drying at an initial drying temperature of 100 ° C. for 10 minutes, main drying 17
A printed antenna circuit of Example 3 and an IC card were obtained in the same manner as in Example 1 except that the printed antenna circuit was dried at 0 ° C. for 10 minutes. Drying property, resistance value, specific resistance of the printed antenna circuit of the third embodiment,
Table 1 shows the characteristics of the IC card as a result of observation of the circuit shape after the IC connection.
【００２２】比較例１ 比較例１として、初期乾燥温度３０℃で１０分乾燥した
後、本乾燥１５０℃で１０分乾燥した以外は、実施例１
と同様にして比較例１の印刷アンテナ回路、及びＩＣカ
ードを得た。比較例１の印刷アンテナ回路の乾燥性、抵
抗値、比抵抗、ＩＣ接続後の回路形状の観察結果、ＩＣ
カードの特性を表１に示す。Comparative Example 1 Comparative Example 1 was performed in the same manner as in Example 1 except that the initial drying temperature was 30 ° C. for 10 minutes, and then the main drying was performed at 150 ° C. for 10 minutes.
In the same manner as in the above, a printed antenna circuit of Comparative Example 1 and an IC card were obtained. Observation result of drying property, resistance value, specific resistance, circuit shape after IC connection of the printed antenna circuit of Comparative Example 1, IC
Table 1 shows the characteristics of the card.
【００２３】比較例２ 比較例２として、初期乾燥温度５０℃で１０分乾燥した
後、本乾燥２００℃で１０分乾燥した以外は、実施例１
と同様にして比較例２の印刷アンテナ回路、及びＩＣカ
ードを得た。比較例２の印刷アンテナ回路の乾燥性、抵
抗値、比抵抗、ＩＣ接続後の回路形状の観察結果、ＩＣ
カードの特性を表１に示す。Comparative Example 2 Comparative Example 2 was performed in the same manner as in Example 1 except that the initial drying temperature was 50 ° C. for 10 minutes, and then the main drying was performed at 200 ° C. for 10 minutes.
In the same manner as in the above, a printed antenna circuit of Comparative Example 2 and an IC card were obtained. Observation result of drying property, resistance value, specific resistance, circuit shape after IC connection of the printed antenna circuit of Comparative Example 2, IC
Table 1 shows the characteristics of the card.
【００２４】[0024]
【表１】 表１の結果から、実施例からなる印刷アンテナ回路用導
電ペーストは、回路抵抗が小さく、比抵抗、ＩＣ接続後
の回路形状、ＩＣの接続抵抗値がいずれも良好であり、
実施例からなる印刷アンテナ回路用導電ペーストを用い
て作製したＩＣカードの通信試験結果もいずれも良好で
あった。一方、比較例からなる導電ペーストは、回路抵
抗、比抵抗、ＩＣ接続状態、乾燥性のいずれかの問題が
生じた。[Table 1] From the results shown in Table 1, the conductive paste for a printed antenna circuit according to the example has a small circuit resistance, a good specific resistance, a circuit shape after IC connection, and a good connection resistance value of IC.
The communication test results of the IC cards manufactured using the conductive paste for printed antenna circuits according to the examples were all good. On the other hand, the conductive paste according to the comparative example had any of the following problems: circuit resistance, specific resistance, IC connection state, and drying property.
【００２５】[0025]
【発明の効果】本発明の非接触ＩＣカード用の印刷アン
テナ回路の製造方法は、印刷後の乾燥条件を初期乾燥と
本乾燥を組合せることにより大幅に回路抵抗を小さくす
ることができ、かつ、非接触ＩＣカードの通信距離を長
くすることができる。According to the method of manufacturing a printed antenna circuit for a non-contact IC card of the present invention, the circuit resistance can be significantly reduced by combining the initial drying and the main drying with the drying conditions after printing, and The communication distance of the non-contact IC card can be increased.
【００２６】本発明の非接触ＩＣカードは、従来の印刷
アンテナ回路を用いた非接触ＩＣカードよりも通信距離
が長く、かつ印刷回路の乾燥硬化時間が短いので生産性
に優れ、かつ、異方導電性フィルムによるＩＣ接続時に
回路がつぶれる不良がなく、かつ、大幅にＩＣとの接続
抵抗が低下したため接続部分での損失や誤作動が少ない
優れた非接触ＩＣカードである。The non-contact IC card of the present invention has a longer communication distance and a shorter drying and curing time of the printed circuit than conventional non-contact IC cards using a printed antenna circuit, so that it is excellent in productivity and anisotropic. An excellent non-contact IC card which is free from a failure to break a circuit at the time of IC connection by a conductive film and has a greatly reduced connection resistance with the IC, so that there is little loss or malfunction at a connection portion.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ // Ｈ０１Ｑ 1/38 Ｇ０６Ｋ 19/00 Ｋ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification symbol FI // H01Q 1/38 G06K 19/00 K
Claims (2)
ターンを形成し、これを乾燥して非接触ＩＣカード用の
印刷アンテナ回路を製造する際に、乾燥工程が（１）５
０℃〜１００℃の初期乾燥及び（２）１２０℃〜１８０
℃の本乾燥からなることを特徴とする非接触ＩＣカード
用の印刷アンテナ回路の製造方法。When a conductive pattern is printed on a substrate to form a circuit pattern and then dried to produce a printed antenna circuit for a non-contact IC card, the drying step includes (1) 5.
Initial drying at 0 ° C to 100 ° C and (2) 120 ° C to 180 °
A method for producing a printed antenna circuit for a non-contact IC card, comprising: main drying at ℃.
た印刷アンテナ回路を有する非接触ＩＣカード。2. A non-contact IC card having a printed antenna circuit manufactured by the manufacturing method according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26040897A JPH11102423A (en) | 1997-09-25 | 1997-09-25 | Production of printed antenna circuit for contactless ic card using conductive paste and the contactless ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26040897A JPH11102423A (en) | 1997-09-25 | 1997-09-25 | Production of printed antenna circuit for contactless ic card using conductive paste and the contactless ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11102423A true JPH11102423A (en) | 1999-04-13 |
Family
ID=17347517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26040897A Pending JPH11102423A (en) | 1997-09-25 | 1997-09-25 | Production of printed antenna circuit for contactless ic card using conductive paste and the contactless ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11102423A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027353A (en) * | 2005-07-15 | 2007-02-01 | Toko Inc | Method of manufacturing laminated electronic component |
| JP2007157434A (en) * | 2005-12-02 | 2007-06-21 | Shoei Chem Ind Co | Conductor forming method |
| US20100021625A1 (en) * | 2008-07-22 | 2010-01-28 | E. I. Du Pont De Nemours And Company | Polymer thick film silver electrode composition for use in thin-film photovoltaic cells |
| US20150009606A1 (en) * | 2012-03-29 | 2015-01-08 | Murata Manufacturing Co., Ltd. | Conductive paste and solid electrolytic capacitor including the same |
-
1997
- 1997-09-25 JP JP26040897A patent/JPH11102423A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027353A (en) * | 2005-07-15 | 2007-02-01 | Toko Inc | Method of manufacturing laminated electronic component |
| JP2007157434A (en) * | 2005-12-02 | 2007-06-21 | Shoei Chem Ind Co | Conductor forming method |
| US20100021625A1 (en) * | 2008-07-22 | 2010-01-28 | E. I. Du Pont De Nemours And Company | Polymer thick film silver electrode composition for use in thin-film photovoltaic cells |
| CN102056973A (en) * | 2008-07-22 | 2011-05-11 | E.I.内穆尔杜邦公司 | Polymer thick film silver electrode composition for use in thin-film photovoltaic cells |
| US20150009606A1 (en) * | 2012-03-29 | 2015-01-08 | Murata Manufacturing Co., Ltd. | Conductive paste and solid electrolytic capacitor including the same |
| US9666376B2 (en) * | 2012-03-29 | 2017-05-30 | Murata Manufacturing Co., Ltd. | Conductive paste and solid electrolytic capacitor including the same |
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