JPH11101451A - Floor heating structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a floor heating structure capable of forming a flat floor surface without causing a step thereon in case a tile and a wooden board which is thicker than the tile are used as a flooring material. SOLUTION: In constructing a floor heating structure, on a floor board 16 is laid a piping embedding layer 18 of a specified thickness having a piping 30 for flowing a floor heating medium and a holding body 26 thereof, a floor surface material is further laid on the piping embedding layer 18, a specified portion of a floor surface is consisted of a thin ceramic tile 20, and other portion of the floor surface is consisted of a wooden board 22 which is thicker than the ceramic tile 20. Under the ceramic tile 20 is inserted a spacer board 34 between the piping embedding layer 18 and the floor board 16 thereby to finish the entire floor surface to a flat plane.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a floor heating structure.

[0002]

2. Description of the Related Art In warm air heating generally used in the past, warm air becomes lighter and rises, and heavy and cold air enters near the floor surface, so that the temperature near the ceiling is high and the floor temperature is high. There is a problem that the temperature becomes low in the vicinity of the surface, that is, in a normal living level space.

On the other hand, in the case of floor heating, this method heats by radiation and heat conduction from the floor surface.
There is an advantage that the living level space near the floor is warm and the temperature difference near the ceiling is small, so that a substantially uniform temperature distribution can be obtained. In addition, there is an advantage that there is no driving noise from the blower fan, the operation is quiet, and dust and dirt are not scattered.

Conventionally, a construction structure for general floor heating is as shown in FIG. FIG. 4A shows an example of a case where the floor is installed on a joist 200. In this example, a pipe buried layer 203 is formed above a floor plate (floor base material) 202 on the joist 200, and a floor surface material 210 is further formed thereon. And a floor heating structure was constructed.

[0005] Here, the pipe burying layer 203 is composed of a pipe 204 for flowing a medium for floor heating, a heat spreader (metal plate) 206 for holding the pipe, and a heat insulating material 208. The pipe 204 is made of a metal heat transfer plate 21 similar to the heat spread plate 206.
4 is inserted and held downward in a holding groove 212 having an upper surface opened, and is fixed to the heat spread plate 206 by fixing the heat transfer plate 214 to the heat spread plate 206. ing. Incidentally, reference numeral 216 denotes a large number.

On the other hand, FIG. 4 (B) shows an example of a case in which a joist is installed. In this example, a holding groove 212 is formed in a heat spreader plate 206, and a pipe 204 is inserted and held in the holding groove 212 in that state. Then, they are inserted between the joists 200 and 200 together with the heat insulating material 208 to form a pipe buried layer 203, and a floor plate 202 and a floor surface material 210 are laid thereon to construct a floor heating structure. .

However, in the case of these floor heating structures,
There is a problem that on-site construction including connection between the pipes 204 is difficult, and the work requires skill. Therefore, a panel having a predetermined arrangement of holding grooves for accommodating and holding the pipes is prepared in advance, the panel (piping module) is carried into the construction site, laid and constructed, and the pipes are inserted and set in the holding grooves. It has been proposed to form a floor heating structure by forming a pipe buried layer and laying and constructing a floor surface material from above.

FIG. 5 shows an example in which a tile is used as a floor surface material in this kind of floor heating structure. In the figure, reference numeral 218 denotes a panel in which a plurality of holding grooves 212 are formed in a predetermined arrangement in advance. A pipe 204 is inserted and held in each of the holding grooves 212 from the upper side downward, and a metal heat spreader 206 is adhesively fixed on the upper surface.
Is configured. The tiles 220 serving as floor surface materials are arranged in a predetermined arrangement on the upper surface of the heat spreader 206, and are fixed to the heat spreader 206 with an adhesive.

Here, the heat spreader 206 serves both as a heat spreader for diffusing heat from the pipe 204 and as a backing material for the tile 220 as a floor surface material. , The strength of the tile 220 is effectively increased, and sufficient strength is given to the tile floor surface.

When such a ceramic tile is used as a floor surface material, the thermal conductivity is remarkably superior to that of a wooden floor, so that the floor heating is quickly started up and, in the summer, it feels cool. Many advantages are obtained, such as good floor surface resistance to wetness.

[0011]

By the way, in this type of floor heating structure, for example, about half of the floor surface is not a tile floor, and for example, about half is a tile floor, and the other half is flooring, that is, a wooden board floor. Conceivable.

However, for example, in the case of a tile, the thickness is generally about 9 mm.
The thickness is usually different between the two, for example, the one with a thickness of about 2 mm is often used. Therefore, if the floor heating structure is constructed as it is, there is an inconvenience that a step occurs between the tile floor surface and the wood board floor surface. Occurs.

The case where the floor is composed of two types of floor surface materials, tiles and wood boards, has been described above. This problem is common when the floor surface is composed of two types of floor surface materials having different thicknesses. This is a problem that arises.

[0014]

The invention of the present application has been made to solve such a problem. According to the floor heating structure of the first aspect, a pipe burying layer having a predetermined thickness having a pipe for circulating a floor heating medium and a holder for the floor heating medium is laid on a floor base material, and the floor surface is further laid thereon. In a floor heating structure constructed by laying materials, a predetermined range portion of the floor surface is a thin first floor surface material, and another range portion is relatively thick relative to the first floor surface material. A spacer plate having a thickness constituted by a thick second floor surface material and eliminating a difference in thickness between the first floor surface material and the second floor surface material below the pipe burying layer, It is characterized in that it is interposed below the first floor surface material on the thinner side.

In the floor heating structure according to a second aspect of the present invention, a pipe burying layer having a predetermined thickness having a pipe for flowing a floor heating medium and a holding member is laid on a floor base material, and the floor surface is further laid thereon. In a floor heating structure in which materials are laid, a predetermined area of the floor is constituted by a floor surface material made of a ceramic tile, and another area is constituted by a floor surface material made of a wood board. .

According to a third aspect of the present invention, in the floor heating structure according to the first aspect, the pipe buried layer below the first floor surface material and the pipe buried layer below the second floor surface material are formed. A predetermined interval is formed between them.

According to a fourth aspect of the present invention, in the floor heating structure according to any one of the first and third aspects, the first floor surface material is made of a wood board and the second floor surface material is made of a ceramic tile. And

[0018]

As described above, in the floor heating structure of the first aspect, the floor surface is formed by two types of floor surface materials having different thicknesses of the first floor surface material and the second floor surface material. And, under the pipe burying layer, a spacer plate having a thickness to eliminate the difference in thickness between the first floor surface material and the second floor surface material is provided below the thinner side first floor surface material. According to this floor heating structure, even when floor materials having different thicknesses are used, the floor surface can be finished in a flat state without creating a step on the floor surface. it can.

Incidentally, it is conceivable to insert a spacer plate between the first floor surface material and the pipe buried layer below the first floor surface material. In this case, for example, the first floor surface material is made of ceramics. When tiles are used, the transfer of heat from the pipe buried layer, specifically from the pipes, to the first floor surface material is interrupted or suppressed by the spacer plate interposed therebetween, which is a characteristic of the tiles. There is an inconvenience that the characteristics of the good thermal conductivity and the rising speed at the start of floor heating are reduced.

However, by interposing the spacer plate below the pipe burying layer, it is possible to form the tile surface evenly and without any inconvenience.

In the floor heating structure according to a second aspect of the present invention, a predetermined area of the floor surface is constituted by a floor surface material made of a ceramic tile, and another area is constituted by a floor surface material made of a wood board.

That is, a certain part of the floor surface is a tile floor, and the other part is a flooring floor made of a wood board. In this way, the same heating floor can be used as a tile floor and a flooring floor. The heating floor can be divided, and the convenience of the heating floor can be improved.

In the floor heating structure according to the third aspect, a predetermined space is formed between the pipe buried layer below the first floor surface material and the pipe buried layer below the second floor surface material. By doing so, the piping for flowing the heat medium,
When straddling the pipe buried layer below the first floor surface material and the pipe buried layer below the second floor surface material, it is caused by a step (by interposition of a spacer plate) between the pipe buried layers. The bending of the pipe can be favorably absorbed in the interval.

That is, the formation of such an interval allows the pipe to be bent gently, thereby preventing an excessive force from acting on the pipe. In addition, as this interval, 5 mm ~
20 mm is appropriate.

As described above, the floor heating structure of the first and third aspects is such that a spacer plate for eliminating the difference in the thickness of the floor surface material is interposed below the pipe buried layer, and such a floor heating structure is provided. Is particularly effective when applied to a case where a wood board is used as the first floor surface material and a ceramic tile is used as the second floor surface material.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described in detail with reference to the drawings. In FIG. 1, 10 is a large discount, and 12 is a large discount.
Joists fixed on 0, 14 are joists 12 and 1
Reference numeral 16 denotes a heat insulating material filled between the base material 2 and the floor board 16 as a floor base material laid on the joist 12.

On the floor board 16, a pipe burying layer 18 is laid, and on the pipe burying layer 18, a ceramic tile 20 and a wood board 22 as floor surface materials are laid. In this example, a portion on the right side of the drawing from the boundary P is a tile floor, and a portion on the left side is a floor of a wood board, that is, a flooring floor.

In this example, the tile 20 has a thickness T ₁ =
9 mm, and the wood floor 22 has a thickness T
₂ = 12 mm is used. That is, in this example,
Two types of floor surface materials having a thickness difference of 3 mm are used as floor surface materials. However, the tile floor and the wood floor are formed flush with each other without any step, and the tile floor and the wood floor are in close contact with substantially no gap.

The pipe burying layer 18 includes a panel (piping module) 26 as a holding body made of a heat insulating material, in which a holding groove 24 (see FIG. 2) having an open upper surface is formed in a predetermined pattern, and a tile 20. And a pipe (in this example, a pipe made of crosslinked polyethylene) 30 for flowing a floor heating medium (in this example, hot water).

The heat spreader 28 has a U-shaped cross section at a portion corresponding to the holding groove 24 in the panel 26, and has a groove 32 formed therein. A pipe 30 is fitted into the groove 32 to hold the groove. Have been.

The panel 26 and the heat spreader 28
The tile 20 is separated and blocked in the left-right direction in the figure, and the tile 20 is bonded and fixed to the upper surface of the heat spreader 28 with an adhesive on the tile floor side. Here, a predetermined interval d (d = 5 to 10 mm in this example) is formed between the lower panel 26 of the tile 20 and the lower panel 26 of the wood board 22.

As described above, the thickness of the tile 20 is different from that of the wood board 22, and a step is formed between the lower face of the tile 20 and the lower face of the wood board 22, as shown in FIG. ing. On the other hand, the lower panel 26 (strictly speaking, the pipe burying layer 18) of the tile 20 and the lower panel 26
The pipe burying layer 18 below the tile 20 is directly bonded and fixed to the lower surface of the tile 20. As a result, a gap is created between the pipe buried layer 18 below the tile 20 and the floor plate 16 by the difference in thickness between the tile 20 and the wood plate 22.

In this embodiment, a spacer plate having a thickness to eliminate the difference in thickness between the pipe burying layer 18 and the floor plate 16 under the tile 20, specifically, a thickness of 3 mm is provided. 34 are inserted. As a result,
The upper surface of the tile 20 and the upper surface of the wood board 22 are finished to have a flat surface despite the difference in thickness.

As described above, the pipe 30 is provided across the tile floor and the floor of the wood board. Here, there is a vertical step between the pipe buried layer 18 below the tile 20 and the pipe buried layer 18 below the wood board 22.
As shown in (B), since the space d is formed between the pipe buried layers 18, the pipe 30
Can be bent and deformed gently due to the presence of, and the application of excessive strain or force to the pipe 30 is avoided.

As described above, in the floor heating structure of the present embodiment, a predetermined area of the floor surface is a tile floor made of the ceramic tiles 20,
The other range portion is configured as a flooring floor made of a wood plate 22. By doing so, the same heating floor can be used separately for a tile floor and a flooring floor, and the usability of the heating floor is improved. Can be done. Despite the difference in thickness between the tile 20 and the wood board 22, the spacer board 34 is interposed so that the tile floor and the wood board are flush with each other. Can be finished.

Further, in the floor heating structure of the present embodiment, the spacer plate 34 is not interposed between the tile 20 and the pipe buried layer 18 under the tile 20, but between the pipe buried layer 18 and the floor plate 16 under the tile. Since it is inserted, heat from the pipe buried layer 18, specifically, the pipe 30 can be transmitted well to the tile 20, and without losing the advantage of using the ceramic tile 20 as a floor surface material, Its features can be exhibited well.

In addition, in the floor heating structure of the present embodiment, the tile 20
Since a predetermined distance d is formed between the lower pipe burying layer 18 and the lower pipe burying layer 18 of the wood board 22,
In the case where the pipe 30 for flowing the heat medium is laid across the tile floor and the floor of the wood board, the pipe 30 can be gently deformed without excessive strain or force being applied thereto, and the pipe 30 is damaged. Can be prevented from occurring.

The embodiment of the present invention has been described in detail above, but this is merely an example. For example, in the above embodiment, the heat spreader 28
The heat spread plate 28 is formed in a flat plate shape without such a groove 32 as shown in FIG. It is also possible to directly fit and hold the 30 inside the holding groove 24 of the panel 26, and to arrange a flat plate-like heat spreader 28 on the upper side.

In the above embodiment, a wood board and a ceramic tile are used as the floor surface material, but a tile made of a stone material can be used as such a tile. In this case, when the thickness of the tile is thicker than the thickness of the wood board, the floor surface is inserted by inserting a spacer board below the pipe burying layer 18 below the wood board. The surface can be formed without steps.

In addition, the present invention can be applied to a case where a plurality of types of floor surface materials having different thicknesses and different materials and forms other than those described above are used.
6 instead of laying the pipe buried layer 18 on
2 is directly used as a floor base material, and a pipe buried layer 18 is laminated thereon, or a pipe buried layer 18 is further laid on an existing floor surface, and a new floor surface material is laid thereon. The present invention can be configured in a form in which various changes are made without departing from the spirit thereof, for example, a floor heating structure can be constructed.

[Brief description of the drawings]

FIG. 1 is a diagram showing a floor heating structure according to one embodiment of the present invention.

FIG. 2 is an exploded view of the floor heating structure of FIG.

FIG. 3 is a diagram showing a floor heating structure according to another embodiment of the present invention.

FIG. 4 is a diagram showing a conventional example of a floor heating structure.

FIG. 5 is a diagram showing a construction example of a floor heating structure when a tile is used as a floor surface material.

[Description of Signs] 18 Piping buried layer 20 Ceramic tile (floor surface material) 22 Wood board (floor surface material) 26 Panel (piping module) 30 Piping 34 Spacer plate d Interval

Claims (4)

[Claims] 1. A floor comprising a pipe buried layer of a predetermined thickness having a pipe for flowing a floor heating medium and a holder for the medium for floor heating on a floor base material, and further laying a floor surface material thereon. In the heating structure, a predetermined range portion of the floor surface is a first floor surface material having a small thickness, and another range portion is a second floor surface material having a relatively large thickness relative to the first floor surface material. And a spacer plate having a thickness that eliminates a difference in thickness between the first floor surface material and the second floor surface material below the pipe burying layer, A floor heating structure that is inserted under the surface material. 2. A floor formed by laying a pipe burying layer having a predetermined thickness having a pipe for flowing a floor heating medium and a holder thereof on a floor base material, and further laying a floor surface material thereon. A floor heating structure, wherein a predetermined area of the floor surface is made of a floor surface material made of a ceramic tile, and another area is made of a floor material made of a wood board. 3. A predetermined space is formed between the pipe buried layer below the first floor surface material and the pipe buried layer below the second floor surface material according to claim 1. Floor heating structure characterized by doing. 4. The floor heating structure according to claim 1, wherein the first floor surface material is made of a wood board, and the second floor surface material is made of a ceramic tile.