JPH1098024A5 - - Google Patents
Info
- Publication number
- JPH1098024A5 JPH1098024A5 JP1996251433A JP25143396A JPH1098024A5 JP H1098024 A5 JPH1098024 A5 JP H1098024A5 JP 1996251433 A JP1996251433 A JP 1996251433A JP 25143396 A JP25143396 A JP 25143396A JP H1098024 A5 JPH1098024 A5 JP H1098024A5
- Authority
- JP
- Japan
- Prior art keywords
- hydrocarbon group
- formula
- rcox
- substituent
- derivative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25143396A JP3667893B2 (ja) | 1996-09-24 | 1996-09-24 | 半導体装置の製造方法 |
| US08/934,759 US5897377A (en) | 1996-09-24 | 1997-09-22 | Semiconductor device manufacturing method with use of gas including acyl-group-containing compound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25143396A JP3667893B2 (ja) | 1996-09-24 | 1996-09-24 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH1098024A JPH1098024A (ja) | 1998-04-14 |
| JPH1098024A5 true JPH1098024A5 (enExample) | 2004-09-30 |
| JP3667893B2 JP3667893B2 (ja) | 2005-07-06 |
Family
ID=17222774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25143396A Expired - Fee Related JP3667893B2 (ja) | 1996-09-24 | 1996-09-24 | 半導体装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US5897377A (enExample) |
| JP (1) | JP3667893B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3409984B2 (ja) * | 1996-11-14 | 2003-05-26 | 東京エレクトロン株式会社 | 半導体装置及び半導体装置の製造方法 |
| TW428045B (en) * | 1997-08-20 | 2001-04-01 | Air Liquide Electronics Chemic | Plasma cleaning and etching methods using non-global-warming compounds |
| JP4627843B2 (ja) | 1999-07-22 | 2011-02-09 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US6749763B1 (en) | 1999-08-02 | 2004-06-15 | Matsushita Electric Industrial Co., Ltd. | Plasma processing method |
| JP3403373B2 (ja) * | 2000-05-26 | 2003-05-06 | 松下電器産業株式会社 | 有機膜のエッチング方法、半導体装置の製造方法及びパターンの形成方法 |
| US6743732B1 (en) | 2001-01-26 | 2004-06-01 | Taiwan Semiconductor Manufacturing Company | Organic low K dielectric etch with NH3 chemistry |
| JP3914452B2 (ja) * | 2001-08-07 | 2007-05-16 | 株式会社ルネサステクノロジ | 半導体集積回路装置の製造方法 |
| US20050241669A1 (en) * | 2004-04-29 | 2005-11-03 | Tokyo Electron Limited | Method and system of dry cleaning a processing chamber |
| US10103008B2 (en) * | 2016-01-12 | 2018-10-16 | Fei Company | Charged particle beam-induced etching |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4215005A (en) * | 1978-01-30 | 1980-07-29 | Allied Chemical Corporation | Organic stripping compositions and method for using same |
| JPS58150429A (ja) * | 1982-03-03 | 1983-09-07 | Hitachi Ltd | ドライエツチング方法 |
| EP0232167B1 (en) * | 1986-02-07 | 1988-12-28 | Nippon Telegraph And Telephone Corporation | Photosensitive and high energy beam sensitive resin composition containing substituted polysiloxane |
| US4732837A (en) * | 1986-05-02 | 1988-03-22 | Hoechst Celanese Corporation | Novel mixed ester O-quinone photosensitizers |
| JP2703432B2 (ja) * | 1991-10-08 | 1998-01-26 | シャープ株式会社 | ペロブスカイト型酸化物膜のドライエッチング方法 |
| JP3297974B2 (ja) * | 1995-07-26 | 2002-07-02 | ソニー株式会社 | ペロブスカイト型酸化物薄膜のプラズマエッチング方法および半導体装置の製造方法 |
-
1996
- 1996-09-24 JP JP25143396A patent/JP3667893B2/ja not_active Expired - Fee Related
-
1997
- 1997-09-22 US US08/934,759 patent/US5897377A/en not_active Expired - Fee Related
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