JPH1096746A - Small contact for high electric current - Google Patents
Small contact for high electric currentInfo
- Publication number
- JPH1096746A JPH1096746A JP25320596A JP25320596A JPH1096746A JP H1096746 A JPH1096746 A JP H1096746A JP 25320596 A JP25320596 A JP 25320596A JP 25320596 A JP25320596 A JP 25320596A JP H1096746 A JPH1096746 A JP H1096746A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- electrode
- divided
- inspected
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は小型で大電流を制御
するスイッチング素子、パワートランジスタ等の半導体
の計測に用いる大電流用小型接触子に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small contact for a large current used for measuring a semiconductor such as a switching element and a power transistor which is small and controls a large current.
【0002】[0002]
【従来の技術】従来、耐電圧試験を行うコンタクトプロ
ーブは図5に示されるように、先端を先細とした点接触
方式の点接触子20をばねを介してホルダ21に取り付
け、該ホルダ21を図示しないロボットアーム等に取り
付け、点接触子20の先端を被検査物Wとしてのバイポ
ーラトランジスタのエミッタ電極にばね圧を介して接触
させたうえ、規定電圧を一定時間印加して、トランジス
タが破壊されずに耐えるかを検査していた。ところが、
近年、小型のスイッチング素子やパワートランジスタ等
の大出力化に伴い、流れる電流も大電流となることか
ら、電気的試験の際に流される電流も大電流となり、点
接触子20では接触抵抗が大きく、大電流を流すと発熱
や放電等が生じて検査の実施が非常に難しくなるうえ
に、発熱や放電による点接触子20の消耗が激しく繰り
返し寿命が極めて短くなるという問題があった。そこ
で、複数の点接触子20を用いて接触抵抗を小さくする
ことも考えられるが、小型の半導体の電極は小さく、複
数の点接触子20を配置させることは困難であるという
問題があった。2. Description of the Related Art Conventionally, as shown in FIG. 5, a contact probe for conducting a withstand voltage test is provided with a point contact 20 having a tapered tip and attached to a holder 21 via a spring. Attached to a robot arm or the like (not shown), the tip of the point contact 20 is brought into contact with the emitter electrode of the bipolar transistor as the inspection object W via a spring pressure, and then a specified voltage is applied for a certain period of time to destroy the transistor. I was checking if I could endure without it. However,
In recent years, as the output of small switching elements and power transistors has been increased, the current flowing therethrough also becomes large. Therefore, the current flowing at the time of the electrical test also becomes large, and the point contact 20 has a large contact resistance. In addition, when a large current is applied, heat and discharge are generated, which makes it very difficult to carry out the inspection. In addition, the point contact 20 is greatly consumed by the heat and discharge, and the repetition life is extremely shortened. Therefore, it is conceivable to reduce the contact resistance by using a plurality of point contacts 20, but there is a problem that it is difficult to arrange the plurality of point contacts 20 because a small semiconductor electrode is small.
【0003】[0003]
【発明が解決しようとする課題】本発明は発熱や放電等
による検査の実施不能が生じることがないうえに、耐久
性も良く、長期間耐用できる大電流用小型接触子を提供
することを目的とするものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a small contact for a large current, which does not prevent the inspection from being performed due to heat generation or discharge, has good durability, and can be used for a long time. It is assumed that.
【0004】[0004]
【課題を解決するための手段】前述の目的を達成するた
め本発明は、複数に分割される分割電極の接触子を被検
査物の電極面に接触するように配置させるとともに、前
記分割電極の各接触子が被検査物の電極面に個別に接触
できるよう各分割電極を可動自在とし、最小の接触面積
で接触抵抗が最小となる大電流用小型接触子を請求項1
の発明とし、請求項1の発明において、圧力センサの検
出値に基づいて接触子の接触圧を制御する大電流用小型
接触子を請求項2の発明とし、分割電極の先端に先細に
形成した接触子の接触端面を平板状とした大電流用小型
接触子を請求項3の発明とし、さらに、圧力センサの検
出値に基づいて接触圧が制御される接触子の接触端面を
平板状とした大電流用小型接触子を請求項4の発明と
し、請求項1または2また3または4の発明において、
分割電極が相互隣接面をガイド面として個別に可動自在
とされるともに、該分割電極が弾性体を介して被検査物
の電極面に向かって付勢される大電流用小型接触子を請
求項5の発明とし、請求項1または2または3または4
また5の発明において、分割電極に接触子の抵抗を測定
するセンシングプローブを内蔵させた大電流用小型接触
子を請求項6の発明とし、請求項1または2または3ま
たは4または5または6の発明において、接触子と被検
査物の電極面間に不活性ガス領域を形成した大電流用小
型接触子を請求項7の発明とするものである。SUMMARY OF THE INVENTION In order to achieve the above-mentioned object, the present invention is to dispose a contact of a divided electrode which is divided into a plurality of pieces so as to be in contact with an electrode surface of an object to be inspected. 2. A small contact for a large current, wherein each divided electrode is movable so that each contact can individually contact an electrode surface of a test object, and a contact resistance is minimized with a minimum contact area.
In the invention of claim 1, a small contact for large current that controls the contact pressure of the contact based on the detection value of the pressure sensor is provided as the invention of claim 2, and is tapered at the tip of the divided electrode. A small contact for large current, wherein the contact end face of the contact is a flat plate is the invention of claim 3, and the contact end surface of the contact, whose contact pressure is controlled based on the detection value of the pressure sensor, is flat. The small contact for large current is defined as the invention of claim 4, and in the invention of claim 1 or 2 or 3 or 4,
A small contact for large current, wherein the divided electrodes are individually movable with the adjacent surfaces as guide surfaces, and the divided electrodes are urged toward the electrode surface of the inspection object via an elastic body. The invention of claim 5, claim 1 or 2 or 3 or 4
Also, in the invention of claim 5, a small contact for a large current, in which a sensing probe for measuring the resistance of the contact is built in the split electrode, is defined as the invention of claim 6, and the method of claim 1 or 2 or 3 or 4 or 5 or 6 is considered. In the invention, a small contact for a large current in which an inert gas region is formed between the contact and the electrode surface of the object to be inspected is the invention of claim 7.
【0005】[0005]
【発明の実施の形態】次に、本発明の好ましい実施の形
態を図に基づいて詳細に説明する。1は被検査物載置用
の下部電極1aを上面に形成した下部電極ブロックであ
り、該下部電極ブロック1の下部電極1aの上方には被
検査物の電極面に接触する先細の接触子2aを先端に形
成した8個の分割電極2を抱持する電極ホルダ3が昇降
動自在に設けられている。前記分割電極2は60°の角
度で略三角ブロック状に分割し、電極ホルダ3と分割電
極2の相互間及び各分割電極間に微小な隙間を設けた相
互隣接面をガイド面として各別に可動(微小傾斜動及び
上下動)できるものとしている。また、8個の分割電極
2の中心下面には分割電極2の断面積より小さい断面積
を有する角ブロック状の接触端面2bを平板状とした8
個の接触子2aが突出され、該接触子2aは左右の隣接
面を当接させた1列4個を、前後の隣接面を当接させて
前後に並列させた2列とし、被検査物の四角形の電極面
と許容最大接触面(この場合は電極面と接触端面との接
触が略全面にわたる)をもって接触するものとしてい
る。この許容最大接触面とは、印加される試験電圧及び
電流により発熱や放電が生じない分割電極2の最小断面
積をいい、最小の接触面積で接触抵抗を最小を得ようと
するものである。Next, a preferred embodiment of the present invention will be described in detail with reference to the drawings. Reference numeral 1 denotes a lower electrode block having a lower electrode 1a for mounting an object to be inspected formed on an upper surface thereof. Above the lower electrode 1a of the lower electrode block 1, a tapered contact 2a that contacts an electrode surface of the object to be inspected. An electrode holder 3 for holding eight divided electrodes 2 formed at the tip is provided to be movable up and down. The divided electrode 2 is divided into a substantially triangular block shape at an angle of 60 °, and each movable separately as a guide surface between the electrode holder 3 and the divided electrode 2 and a mutually adjacent surface provided with a minute gap between each divided electrode. (Small tilt movement and vertical movement). On the lower surface at the center of the eight divided electrodes 2, a square block-shaped contact end face 2b having a smaller cross-sectional area than the cross-sectional area of the divided electrode 2 is formed into a flat plate shape.
The contacts 2a are protruded, and the contacts 2a are arranged in four rows in a row in which the right and left adjacent surfaces are in contact with each other, and two rows in which the front and rear adjacent faces are in contact with each other and are arranged in front and rear. And the maximum allowable contact surface (in this case, the contact between the electrode surface and the contact end surface covers substantially the entire surface). The allowable maximum contact surface refers to a minimum cross-sectional area of the divided electrode 2 in which heat and discharge do not occur due to an applied test voltage and current, and is to obtain a minimum contact resistance with a minimum contact area.
【0006】4は分割電極2の上面に当接されるゴム等
の弾性体で、該弾性体4は微小な隙間をもって隣接され
た各分割電極2の接触子2aが被検査物の電極面のうね
りや傾きに沿って自由に傾いたり上下動して密着できる
ようにするためのものである。5は電極ホルダ3と固定
される絶縁ブロックであり、該絶縁ブロック5の下面と
分割電極2の上面間に前記弾性体4は介在されている。
6は絶縁ブロック5に固定されるとともに、図示しない
ロボットアームに取り付けられるブラケットであり、該
ブラケット6には圧力センサ7が取り付けられており、
該圧力センサ7の検出値に基づいてロボットアームの被
検査物への押圧力、すなわち接触子2aの接触圧が一定
圧となり、接触抵抗が最適なものとなるように制御して
いる。Reference numeral 4 denotes an elastic body such as rubber which is brought into contact with the upper surface of the divided electrode 2. The elastic body 4 has a contact 2a of each of the divided electrodes 2 adjacent to each other with a minute gap and which is located on the electrode surface of the inspection object. It is intended to be able to freely tilt or move up and down along the swell or tilt so that it can be in close contact. Reference numeral 5 denotes an insulating block fixed to the electrode holder 3, and the elastic body 4 is interposed between the lower surface of the insulating block 5 and the upper surface of the divided electrode 2.
Reference numeral 6 denotes a bracket fixed to the insulating block 5 and attached to a robot arm (not shown). The bracket 6 has a pressure sensor 7 attached thereto.
Based on the detection value of the pressure sensor 7, the pressing force of the robot arm against the object to be inspected, that is, the contact pressure of the contact 2a is controlled to be constant, and the contact resistance is controlled to be optimal.
【0007】8は分割電極2に取り付けられる検出用の
端子で、該端子8を介して試験電圧が供給される。9は
分割電極2に取り付けられるセンシングプローブであ
り、該センシングプローブ9は接触子2aに透設される
貫通孔2cを通じて被検査物Wに形成されたエミッタセ
ンシング電極E1、ベースセンシング電極B1 及びベー
ス電極Bに接触されるものである。エミッタセンシング
電極E1は大電流試験時、分割電極2のもつ微小抵抗を
計測するものである。10は分割電極2と下部電極ブロ
ック1間に形成される不活性ガスを充満させる不活性ガ
ス領域としてのガス室であり、該ガス室10は分割電極
2の下面に取り付けられるカバー10aの下端縁を下部
電極ブロック1に密着させることにより得られるもの
で、接触子2aの接触端面2bと下部電極1aの近傍の
みをシールする最小の空間としている。11は絶縁ブロ
ック5に設けられて前記ガス室10に不活性ガスを供給
するガス注入口、12は絶縁ブロック5、弾性体4、分
割電極2に透設される不活性ガスの供給通路である。1
3は下部電極ブロック1に設けられるガス吸込口であ
り、該ガス吸込口13によりガス室10の大気を吸引す
るとともに、ガス注入口11からの不活性ガスを吸引す
ることによりガス注入タクトを短縮するものである。1
4は下部電極ブロック1の上面に透設されるガス吸引用
通路、15は分割電極2を電極ホルダ3に取り付けるた
めのプレートである。[0008] Reference numeral 8 denotes a detection terminal attached to the divided electrode 2, and a test voltage is supplied through the terminal 8. 9 is a sensing probe attached to the divided electrodes 2, the sensing probe 9 is an emitter sensing electrode E 1 formed on the object W through the through hole 2c to be Toru設the contacts 2a, the base sensing electrodes B 1 and The contact is made with the base electrode B. Emitter sensing electrode E 1 is intended to measure the time of large current testing, a small resistor having the divided electrodes 2. Reference numeral 10 denotes a gas chamber as an inert gas region filled between the divided electrode 2 and the lower electrode block 1 and filled with an inert gas. The gas chamber 10 is a lower edge of a cover 10a attached to the lower surface of the divided electrode 2. Is brought into close contact with the lower electrode block 1, and only the contact end face 2b of the contact 2a and the vicinity of the lower electrode 1a are made the minimum space for sealing. Reference numeral 11 denotes a gas inlet provided in the insulating block 5 for supplying an inert gas to the gas chamber 10, and reference numeral 12 denotes a supply passage for the inert gas provided through the insulating block 5, the elastic body 4, and the split electrode 2. . 1
Reference numeral 3 denotes a gas suction port provided in the lower electrode block 1. The gas suction port 13 sucks the atmosphere of the gas chamber 10 and suctions an inert gas from the gas injection port 11 to shorten the gas injection tact. Is what you do. 1
Reference numeral 4 denotes a gas suction passage provided on the upper surface of the lower electrode block 1, and reference numeral 15 denotes a plate for attaching the divided electrodes 2 to the electrode holder 3.
【0008】このように構成されたものは、下部電極ブ
ロック1の上面に形成した下部電極1a上に被検査物W
としてのバイポーラトランジスタのコレクタ電極Cを当
接させて載置したうえ、電極ホルダ3、ブラケット6等
を介して図示しないロボットアームに取り付けられてい
る分割電極2を下降させて、前記下部電極1a上の被検
査物Wのエミッタ電極Eに分割電極2の先細の接触子2
aを当接させれば、被検査物Wの電極面の面積と略等し
い接触面をもつ8個の接触子2aの平板状の接触端面2
bは被検査物Wのエミッタ電極Eの全面にわたって接触
することとなる。このとき、分割電極2に取り付けられ
ているカバー10aは下部電極ブロック1の上面に当接
されて、カバー10aと下部電極ブロック1との間には
小さな不活性ガス領域としてのガス室10が形成され
る。このようにしてガス室10が形成されたら、絶縁ブ
ロック5に設けられたガス注入口11より不活性ガスを
供給するとともに、下部電極ブロック1のガス吸込口1
3により吸引圧を加えれば、下部電極1aのガス吸引用
通路14を通じてガス室10には吸引圧がかかり、ガス
室10の大気は急速に吸引されるとともに、供給通路1
2を通じて不活性ガスはガス室10に供給され、ガス室
10内は短時間で不活性ガスにより充満されることとな
る。[0010] The device having such a structure is characterized in that the inspection object W is formed on the lower electrode 1 a formed on the upper surface of the lower electrode block 1.
The collector electrode C of the bipolar transistor is placed in contact with the lower electrode 1a, and the divided electrode 2 attached to a robot arm (not shown) is lowered via the electrode holder 3, the bracket 6, etc. Of the split electrode 2 on the emitter electrode E of the inspection object W
a, the flat contact end faces 2 of the eight contacts 2a having contact surfaces substantially equal to the area of the electrode surface of the inspection object W
b comes into contact with the entire surface of the emitter electrode E of the inspection object W. At this time, the cover 10a attached to the split electrode 2 is in contact with the upper surface of the lower electrode block 1, and a gas chamber 10 as a small inert gas region is formed between the cover 10a and the lower electrode block 1. Is done. When the gas chamber 10 is formed in this manner, an inert gas is supplied from the gas inlet 11 provided in the insulating block 5 and the gas inlet 1 of the lower electrode block 1 is supplied.
3, the suction pressure is applied to the gas chamber 10 through the gas suction passage 14 of the lower electrode 1a, and the air in the gas chamber 10 is rapidly sucked and the supply passage 1
The inert gas is supplied to the gas chamber 10 through 2, and the inside of the gas chamber 10 is filled with the inert gas in a short time.
【0009】そして、ロボットアームをもって分割電極
2の接触子2aを被検査物Wの電極面に押圧する。この
ときの接触子2aの接触圧はブラケット6に設けられた
圧力センサ7により検出され、常に一定圧、すなわち接
触抵抗が最小となるようロボットアームにより制御され
る。このようにして、接触子2aは被検査物Wの電極面
に押圧されることとなるが、電極面の表面に僅かな傾き
やうねりがある場合、電極面の傾きやうねりに応じて8
個の分割電極2は弾性体4及び相互隣接面としての微小
な隙間を介して微小傾斜したり、上下動して電極面と各
接触子2aとの接触面が最大となるよう可動するので、
接触子2aは被検査物Wの電極面の略全面にわたって均
一な圧力で接触されて最少の接触抵抗で接触し、各接触
子2aの接触抵抗は分割数分の1となる。このため、接
触子2aに検査用の電圧が印加された際、電流が一箇所
に集中して流れて発熱したり、放電を起こして被検査物
Wを損傷することはない。そして、大電流試験時、分割
電極2に透設されている貫通孔2cを通じてエミッタセ
ンシング電極E1にセンシングプローブ9が接触し、分
割電極2の抵抗による電圧降下を測定する。この測定値
に基づいて、耐電圧試験の際、分割電極2の抵抗により
生じる電圧降下分を補償した印加電圧を加えて正確な規
定電圧が被検査物Wのエミッタとコレクタ間に印加され
るようにしている。なお、好ましい実施の形態では分割
電極2は8個に分割されているが、8個に限定されるこ
とはなく、2個から10個以上に分割してもよいことは
勿論である。また、好ましい実施の形態では接触子2a
を被検査物Wの電極面の略全面に接触させているが、印
加される電圧や電流に応じて50%以上の接触面積を得
れるようにすればよいものである。Then, the contact 2a of the divided electrode 2 is pressed against the electrode surface of the inspection object W by the robot arm. The contact pressure of the contact 2a at this time is detected by the pressure sensor 7 provided on the bracket 6, and is controlled by the robot arm so that the pressure is always constant, that is, the contact resistance is minimized. In this manner, the contact 2a is pressed against the electrode surface of the inspection object W. If the surface of the electrode surface has a slight inclination or undulation, the contact 2a is pressed according to the inclination or undulation of the electrode surface.
Since each of the divided electrodes 2 is slightly inclined through the elastic body 4 and a minute gap as an adjacent surface, or moves up and down so that the contact surface between the electrode surface and each contact 2a is maximized,
The contacts 2a are contacted with a uniform pressure over substantially the entire surface of the electrode surface of the inspection object W and contact with a minimum contact resistance, and the contact resistance of each contact 2a is reduced to 1 / divided number. For this reason, when the voltage for inspection is applied to the contact 2a, the current does not flow to one place and generate heat, and the inspection object W is not damaged due to electric discharge. Then, when a large current test, the sensing probe 9 is in contact with the emitter sensing electrode E 1 through the through hole 2c that is Toru設split electrode 2, to measure the voltage drop due to the resistance division electrode 2. Based on this measured value, an accurate specified voltage is applied between the emitter and the collector of the inspection object W by adding an applied voltage that compensates for a voltage drop caused by the resistance of the divided electrode 2 during the withstand voltage test. I have to. In the preferred embodiment, the divided electrode 2 is divided into eight, but the number is not limited to eight, and it is needless to say that the divided electrode 2 may be divided into two to ten or more. In a preferred embodiment, the contact 2a
Is in contact with almost the entire electrode surface of the inspection object W, but it is sufficient that a contact area of 50% or more can be obtained according to the applied voltage or current.
【0010】[0010]
【発明の効果】本発明は前記説明によって明らかなよう
に、複数に分割されて個別に可動できる分割電極の接触
子を被検査物の電極面に接触させるようにしたから、接
触抵抗は小さいうえ、各接触子の接触抵抗は分割数分の
1となる。しかも、被検査物の電極面の傾きやうねりに
応じて各接触子を個別に電極面に確実に密着できるの
で、接触抵抗をより小さいものとすることができ、電流
が集中して流れて発熱したり、放電が発生することがな
いので、被検査物の損傷を防止できる。また、圧力セン
サにより接触子の接触圧を一定となるように制御すれ
ば、常に最適な接触抵抗を得ることができる。そして、
接触子の接触端面を平板状とすれば、接触子の強度を高
めることができるので、最小の接触抵抗となる充分な接
触圧を加えることができるうえに、被検査物の電極面を
傷つけることがない。しかも、分割電極より先細の接触
子を突出させたものとしているので、電極ホルダに取り
付けられている分割電極が大きいにも係わらず、被検査
物の小さな電極面にも複数の接触子を確実に接触させる
ことができる。また、弾性体を介して分割電極を付勢す
ることにより、分割電極を個別に微小傾動させたり上下
動させることができるので各接触子の接触端面を面接触
させることができ、接触抵抗を最小とすることができ
る。また、分割電極にセンシングプローブを内蔵させれ
ば、装置を大型化させることなく、分割電極のもつ抵抗
による電圧降下分の補正ができる。さらに、接触子と被
検査物の電極面にのみ不活性ガス領域を形成することに
より、大電流を流した際に生じやすくなる放電を防止で
き、しかも、接触端面と被検査物の電極面のみに不活性
ガス領域を形成することによりガス室の容積を最小と
し、使用ガス量を節約し、被検査物交換時のガス注入タ
クトを大幅に短縮できる等種々の利点を有するものであ
る。従って、本発明は従来の問題点を解決した大電流用
小型接触子として業界の発展に寄与するところ大なもの
である。According to the present invention, as is apparent from the above description, the contact of the divided electrode, which is divided into plural parts and can be individually moved, is brought into contact with the electrode surface of the inspection object. , The contact resistance of each contact becomes 1 / divided number. In addition, each contact can be individually and securely adhered to the electrode surface according to the inclination or undulation of the electrode surface of the inspection object, so that the contact resistance can be reduced, and the current flows intensively and generates heat. And no discharge occurs, so that damage to the inspection object can be prevented. If the pressure sensor controls the contact pressure of the contact to be constant, an optimum contact resistance can be always obtained. And
If the contact end surface of the contact is made flat, the strength of the contact can be increased, so that sufficient contact pressure for minimum contact resistance can be applied and the electrode surface of the inspection object is damaged. There is no. In addition, since the tapered contacts are projected from the split electrodes, even if the split electrodes attached to the electrode holder are large, multiple contacts can be reliably formed on the small electrode surface of the inspection object. Can be contacted. In addition, by urging the divided electrodes through the elastic body, the divided electrodes can be individually slightly tilted or vertically moved, so that the contact end surfaces of the respective contacts can be brought into surface contact, and the contact resistance can be minimized. It can be. In addition, if the sensing probe is built in the split electrode, the voltage drop due to the resistance of the split electrode can be corrected without increasing the size of the device. Furthermore, by forming an inert gas region only on the contact and the electrode surface of the object to be inspected, it is possible to prevent a discharge which is likely to occur when a large current is applied, and furthermore, only the contact end surface and the electrode surface of the object to be inspected are formed. By forming an inert gas region, the volume of the gas chamber can be minimized, the amount of gas used can be saved, and the tact time of gas injection at the time of replacing the inspection object can be greatly reduced. Therefore, the present invention greatly contributes to the development of the industry as a small contact for a large current that solves the conventional problems.
【図1】本発明の好ましい実施の形態を示す一部切欠正
面図である。FIG. 1 is a partially cutaway front view showing a preferred embodiment of the present invention.
【図2】本発明の好ましい実施の形態を示す一部切欠平
面図である。FIG. 2 is a partially cutaway plan view showing a preferred embodiment of the present invention.
【図3】本発明の好ましい実施の形態における分割電極
を示す一部切欠斜視図である。FIG. 3 is a partially cutaway perspective view showing a divided electrode according to a preferred embodiment of the present invention.
【図4】被検査物としてのバイポーラトランジスタを示
す斜視図である。FIG. 4 is a perspective view showing a bipolar transistor as an inspection object.
【図5】従来のコンタクトプローブを示す一部切欠正面
図である。FIG. 5 is a partially cutaway front view showing a conventional contact probe.
2 分割電極 2a 接触子 2b 接触端面 4 弾性体 7 圧力センサ 10 センシングプローブ 2 Split electrode 2a Contact 2b Contact end face 4 Elastic body 7 Pressure sensor 10 Sensing probe
Claims (7)
(2a)を被検査物の電極面に接触するように配置させると
ともに、前記分割電極(2) の各接触子(2a)が被検査物の
電極面に個別に接触できるよう各分割電極(2) を可動自
在とし、最小の接触面積で接触抵抗が最小となるように
したことを特徴とする大電流用小型接触子。A contact of a divided electrode (2) divided into a plurality of parts
(2a) is arranged so as to be in contact with the electrode surface of the object to be inspected, and each of the divided electrodes (2a) is so arranged that each contact (2a) of the divided electrode (2) can individually contact the electrode surface of the object to be inspected. ) Is movable, and the contact resistance is minimized with the smallest contact area.
子(2a)の接触圧を制御する請求項1に記載の大電流用小
型接触子。2. The small contact according to claim 1, wherein the contact pressure of the contact is controlled based on a value detected by the pressure sensor.
触子(2a)の接触端面(2b)を平板状とした請求項1または
2に記載の大電流用小型接触子。3. The small contact for large current according to claim 1, wherein the contact end face (2b) of the contact (2a) tapered at the tip of the split electrode (2) is formed in a flat plate shape.
圧が制御される接触子(2a)の接触端面(2b)を平板状とし
た請求項1に記載の大電流用小型接触子。4. The small contact for high current according to claim 1, wherein the contact end face (2b) of the contact (2a) whose contact pressure is controlled based on the detection value of the pressure sensor (7) is flat. .
して個別に可動自在とされるともに、該分割電極(2) が
弾性体(4) を介して被検査物の電極面に向かって付勢さ
れる請求項1また2または3または4に記載の大電流用
小型接触子。5. The divided electrodes (2) are individually movable with the adjacent surfaces as guide surfaces, and the divided electrodes (2) face the electrode surface of the inspection object via the elastic body (4). 5. The small contact for a large current according to claim 1, wherein the contact is energized.
電圧降下を測定するセンシングプローブ(10)を内蔵させ
た請求項1または2または3または4また5に記載の大
電流用小型接触子。6. A large current sensor according to claim 1, wherein a sensing probe (10) for measuring a voltage drop due to the resistance of the contact (2a) is incorporated in the split electrode (2). Small contact.
性ガス領域を形成した請求項1または2または3または
4または5または6に記載の大電流用小型接触子。7. The small contact for a large current according to claim 1, wherein an inert gas region is formed between the contact (2a) and the electrode surface of the object to be inspected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25320596A JP2969086B2 (en) | 1996-09-25 | 1996-09-25 | Small contact for large current |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25320596A JP2969086B2 (en) | 1996-09-25 | 1996-09-25 | Small contact for large current |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH1096746A true JPH1096746A (en) | 1998-04-14 |
JP2969086B2 JP2969086B2 (en) | 1999-11-02 |
Family
ID=17248022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25320596A Expired - Fee Related JP2969086B2 (en) | 1996-09-25 | 1996-09-25 | Small contact for large current |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2969086B2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9117880B2 (en) | 2013-05-20 | 2015-08-25 | Mitsubishi Electric Corporation | Method for manufacturing semiconductor device |
US9335371B2 (en) | 2013-01-28 | 2016-05-10 | Mitsubishi Electric Corporation | Semiconductor evaluating device and semiconductor evaluating method |
KR20160113718A (en) | 2014-03-06 | 2016-09-30 | 미쓰비시덴키 가부시키가이샤 | Semiconductor device and method for testing same |
US9678143B2 (en) | 2013-10-31 | 2017-06-13 | Mitsubishi Electric Corporation | Semiconductor evaluation apparatus |
CN108254667A (en) * | 2016-12-27 | 2018-07-06 | 三菱电机株式会社 | Evaluating apparatus and evaluation method |
US10192797B2 (en) | 2014-03-06 | 2019-01-29 | Mitsubishi Electric Corporation | Semiconductor device and electrical contact structure thereof |
CN113725131A (en) * | 2021-11-02 | 2021-11-30 | 西安奕斯伟材料科技有限公司 | Wafer pretreatment device and wafer defect detection method |
-
1996
- 1996-09-25 JP JP25320596A patent/JP2969086B2/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9335371B2 (en) | 2013-01-28 | 2016-05-10 | Mitsubishi Electric Corporation | Semiconductor evaluating device and semiconductor evaluating method |
US9117880B2 (en) | 2013-05-20 | 2015-08-25 | Mitsubishi Electric Corporation | Method for manufacturing semiconductor device |
US9678143B2 (en) | 2013-10-31 | 2017-06-13 | Mitsubishi Electric Corporation | Semiconductor evaluation apparatus |
KR20160113718A (en) | 2014-03-06 | 2016-09-30 | 미쓰비시덴키 가부시키가이샤 | Semiconductor device and method for testing same |
US10192797B2 (en) | 2014-03-06 | 2019-01-29 | Mitsubishi Electric Corporation | Semiconductor device and electrical contact structure thereof |
US10228412B2 (en) | 2014-03-06 | 2019-03-12 | Mitsubishi Electric Corporation | Semiconductor device and method for testing same |
CN108254667A (en) * | 2016-12-27 | 2018-07-06 | 三菱电机株式会社 | Evaluating apparatus and evaluation method |
CN113725131A (en) * | 2021-11-02 | 2021-11-30 | 西安奕斯伟材料科技有限公司 | Wafer pretreatment device and wafer defect detection method |
CN113725131B (en) * | 2021-11-02 | 2022-02-08 | 西安奕斯伟材料科技有限公司 | Wafer pretreatment device and wafer defect detection method |
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---|---|
JP2969086B2 (en) | 1999-11-02 |
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