JPH1082797A - Probe card and reinforcement used therein - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a probe card having a light weight, suitable for burn-in test wherein a substrate together with the whole probe card itself is not deformed, and a reinforcement used therefor by providing a support mechanism ring wherein reinforcement a divided into a plurality of small compartments is attached to a substrate having wiring patterns to which a plurality of probes are connected so that the probes are supported. SOLUTION: The reinforcement 400 has a honeycomb structure wherein thin aluminum plates each having a hexagonal shape are engaged and arranged and each of hexagonal small compartments is filled with carbon fibers. Aluminum plates are bonded to upper and lower faces of the reinforcement 400, respectively. A prescribed aperture section 410 is provided to the reinforcement 400 and the shape is formed corresponding to an aperture 310 of a substrate 300 and the size is smaller than that of the aperture 310 by a predetermined dimension. A ring 200 is attached to the reinforcement 400 from the rear side via the aperture 310. The ring 200 is not directly attached to the substrate 300 but connected thereto via the reinforcement 400. The ring 200 is a support mechanism that supports a probe 100 and forms a taper face 210. As a result, the load of the probe 100 to the substrate 300 is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a probe card used for measuring various electrical characteristics of an LSI chip and a reinforcing material used for the probe card.

[0002]

2. Description of the Related Art As shown in FIG. 4, a conventional probe card has an LSI chip 61 formed on a wafer 600 fixed on a movable table 650 by vacuum suction or the like.
The substrate 300 on which the predetermined pattern wiring 320 is formed is measured for electrical characteristics of the substrate 300.
The ring 100 includes a ring 200 made of ceramics or the like as a support mechanism for supporting the probe 100 attached to the probe 100, and a plurality of probes 100 attached to the ring 100 with an epoxy adhesive 220.

A probe card is a recent LSI chip 6
With the increase in the density of the wafer 10 and the diameter of the wafer 600, the number of LSI chips 610 that can be measured simultaneously is increasing.
For example, 16 or 32 LSI chips 610 are measured simultaneously. For this reason, the number of probes 100 used in the probe card and the number of wiring patterns 320 are also increasing, so that the wiring patterns 320 are becoming finer and the substrate 300 is being made more multilayered and larger.

[0004]

However, the substrate 3
When the layer 00 is multi-layered and large, the weight naturally increases.
In addition, as the number of probes 100 increases, the size of the ring 200 (support mechanism) increases, and the weight naturally increases. For this reason,
If the diameter of the substrate 300 exceeds 30 cm, the substrate 300 is distorted by weight. In particular, the substrate 30
The central part of 0 is greatly distorted. If the substrate 300 is distorted, the contact pressure of the contact portion 110 of the probe 100 with respect to the electrode pad 611 of the LSI chip 610 cannot be kept constant and may cause a position shift. Characteristic measurement becomes impossible.

For this reason, there has been a probe card reinforced with a reinforcing material such as a stainless steel plate having a thickness of several millimeters so that the substrate is not distorted. However, when the reinforcing material such as a stainless steel plate is used in this way, the problem of distortion due to the weight of the probe card is solved to some extent, but the weight of the probe card increases. In a burn-in test for measuring various electrical characteristics while the wafer is heated to a predetermined temperature, the probe card itself has heat due to radiant heat. Further, since the substrate and the stainless steel reinforcing material have different thermal expansion coefficients, a problem arises in that the probe card itself is distorted.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a probe card which is lightweight, does not cause distortion of the substrate, and hence the entire probe card, is suitable for a burn-in test, and a reinforcing material used therefor. I have.

[0007]

A probe card according to the present invention comprises: a substrate on which a predetermined pattern wiring is formed; a plurality of probes connected to the pattern wiring; a reinforcing member attached to the substrate; A supporting mechanism attached to the reinforcing member to support the probe, wherein the reinforcing member is divided into a plurality of small rooms.

The reinforcing member in the probe card according to the second aspect is a honeycomb structure.

It is preferable that the small room of the reinforcing material is filled with a material having excellent heat conductivity.

It is preferable that the reinforcing member is made of a material having a small coefficient of thermal expansion.

Further, as the reinforcing material, there is a plate-like material made of a material having a small coefficient of thermal expansion.

On the other hand, the reinforcing material used in the probe card according to the present invention is a reinforcing material attached to a substrate constituting the probe card, and is divided into a plurality of small rooms.

[0013] The reinforcing member is formed of a honeycomb structure.

The reinforcing material used in the probe card is preferably filled with a material having excellent thermal conductivity in a small room, and is preferably made of a material having a small coefficient of thermal expansion.

[0015]

FIG. 1 is a schematic sectional view of a probe card according to an embodiment of the present invention, FIG. 2 is a schematic bottom view of the probe card according to an embodiment of the present invention, and FIG. FIG. 7 is a schematic partially broken perspective view of a reinforcing member used for the probe card according to the embodiment.

The probe card according to the embodiment of the present invention includes a substrate 300 on which a predetermined pattern wiring 320 is formed.
A plurality of probes 100 connected to the pattern wiring 320, a reinforcing member 400 attached to the substrate 300, and a ring 200 as a supporting mechanism attached to the reinforcing member 400 and supporting the probe 100. doing.

First, the substrate 300 is a multilayer substrate made of glass epoxy resin or the like, and the respective layers are electrically connected by through holes 330. Further, a pattern wiring 320 is formed in each layer.

At the center of the substrate 300, an opening 310 is provided.
Has been established. The opening 310 is for visually recognizing the LSI chip 610 formed on the wafer 600 to be inspected, and is set in an oval or rectangular shape as required.

A connector 340 to which an end of the pattern wiring 320 is connected is arranged on the upper peripheral edge of the substrate. Further, on the periphery of the substrate 300,
A through hole 350 is provided. This through hole 350
The substrate 300 is mounted on the mounting substrate 800 by mounting screws 810.

The probe 100 is formed by sharpening the tip of a tungsten wire, for example, as a contact portion 110 and bending the contact portion 110 to a length of 0.2 to 0.5 mm and about 100 °. . The arrangement of the probes 100, in particular, the arrangement of the contact portions 110 must correspond to the arrangement of the electrode pads 611 formed on the LSI chip 610.

The reinforcing member 400 is a so-called honeycomb structure in which a number of thin aluminum plates combined in a hexagonal column are arranged. For example, as the thin plate, aluminum having a thickness of 1 mm and a width of 10 mm is used.

The hexagonal small chamber 410 of the reinforcing member 400 is filled with carbon fiber 420, which is a material having excellent heat conductivity, as shown in FIG. For example, a very light carbon fiber 420 having a bulk density of about 0.005 is used. For this reason, the total weight is not largely influenced by the filled carbon fiber 420.

As shown in FIG. 3, an aluminum plate 4 having a thickness of 1 mm is provided on the upper and lower surfaces of the reinforcing member 400.
30 is attached by an epoxy adhesive.
Thereby, the carbon fiber 420 filled in the small room 410
Is prevented from falling off.

The reinforcing member 400 has a predetermined opening 4
10 are provided. The opening 410 is formed in the substrate 30
The shape is set to correspond to the shape of the opening 310 and the size thereof is set smaller than the opening 310 by a predetermined dimension.

The reinforcing member 400 is mounted on the upper surface of the substrate 300 by mounting screws 450. On this occasion,
Opening 310 of substrate 300 and opening 410 of reinforcing material 400
And the edge of the opening 410 of the reinforcing member 400 can be seen through the opening 310 of the substrate 300.

In the above description, the reinforcing member 400
Is a so-called honeycomb structure divided into a plurality of hexagonal small rooms 410, but the present invention is not limited to this. The shape of the small rooms 410 may be other shapes such as a triangle or a quadrangle, and it is not necessary that all the small rooms 410 have the same shape.

A ring 200 is attached to the reinforcing member 400 through the opening 310 from the back side of the substrate 300. That is, the ring 200 is
Is connected directly to the substrate 300 via the reinforcing member 400 without being directly attached to the substrate. The ring 200 is set in accordance with the size and shape of the opening 310.

The ring 200 is provided with the probe 10
It constitutes a support mechanism for supporting the O. 0, and is made of insulating ceramics or the like. The ring 200 has a tapered surface 210 which is inclined downward from the outside toward the inside. This tapered surface 210 is the portion where the probe 100 is attached.

The probe 100 is attached to the ring 200 by using an epoxy resin adhesive 220 having an insulating property.
Done by

Next, the operation of measuring the various electrical characteristics of the LSI chip 610 using the probe card configured as described above will be described. First, the wafer 600 is fixed on the movable table 650 by vacuum suction or the like. Thereafter, the movable table 650 is raised, and the contact portion 110 of each probe 100 is brought into contact with the electrode pad 611 of the LSI chip 610 at a predetermined contact pressure.

In this state, signals are exchanged between a flow bar (not shown) and the LSI chip 610 to measure various electrical characteristics. This operation is repeated, and the measurement of the electrical characteristics of all the LSI chips 610 formed on one wafer 600 is performed.

If the probe card uses thousands of probes 100, the weight of the probe 100 is
0 directly to the reinforcement 400. Since the reinforcing member 400 is connected to the substrate 300 over a wide area, the weight of the probe 100 per unit area of the substrate 300 is much smaller than that of the conventional one. That is, in the case of a conventional probe card, as shown in FIG. 1, the ring 200 is directly attached to the substrate 300, and the area where the ring 200 and the substrate 300 are in contact is small. The weight of the probe 100 added per area is much larger than that of the probe card according to the present invention. Therefore, even if the probe card according to the present invention has the same weight of the probe 100, the distortion of the substrate 300, that is, the distortion of the probe card is significantly reduced.

Further, even if the substrate is used in an atmosphere of a hundred and several tens of degrees in a burn-in test as a high temperature test, the substrate 300
The difference in the degree of expansion due to the difference in the thermal expansion coefficient between the substrate 300 and the reinforcing member 400 is absorbed by the slip between the substrate 300 and the reinforcing member 400. Therefore, in the burn-in test, there is no problem that the substrate 300 is distorted and the probe card itself is distorted.

In the above description, the reinforcing member 400 is made of aluminum, but may be made of a material having an extremely low coefficient of thermal expansion, that is, an iron-nickel alloy called Invar. The typical composition of Invar is Mn
Is 0.4%, C is 0.2%, Ni is 36% and the balance is Fe
It has become.

Further, the reinforcing member 400 may be not a honeycomb structure but an ordinary plate. In this case, it is desirable to use a material having an extremely small coefficient of thermal expansion, for example, an iron-nickel alloy called Invar, instead of aluminum as in the related art.

[0036]

According to the probe card of the present invention, a substrate on which a predetermined pattern wiring is formed, a plurality of probes connected to the pattern wiring, a reinforcing member attached to the substrate, A supporting mechanism attached to support the probe, wherein the reinforcing member is composed of a plurality of small rooms.

Then, even if the probe card is large and has thousands of probes, the weight per unit area of the probes with respect to the substrate can be significantly reduced as compared with the conventional one. For this reason, even with a large probe card, the distortion due to the weight of the probe can be greatly reduced as compared with the conventional one, and the contact pressure between the probe and the electrode pad is maintained at a predetermined value. Therefore, it is possible to more accurately measure various electrical characteristics of the LSI chip.

Further, in the probe card according to the second aspect, since the reinforcing member is formed of a honeycomb structure,
The number of small rooms can be increased, and the entire shape of the reinforcing member can be easily formed into an appropriate shape.

In the probe card according to the third aspect, the reinforcing material is filled in the small room with a material having excellent heat conductivity. For this reason, since the radiation heat from the wafer can be efficiently radiated, the distortion due to the thermal expansion of the probe card can be minimized.

Further, in the probe card according to the fourth aspect, a material having a small coefficient of thermal expansion is used for the reinforcing member. According to this, since the thermal expansion of the reinforcing material due to the radiant heat applied to the probe card in the burn-in test is reduced, the distortion of the entire probe card is reduced,
It is possible to accurately measure various electrical characteristics of the LSI chip.

Further, in the probe card according to the fifth aspect, the reinforcing member is formed of a material having a small thermal expansion coefficient in a plate shape. The distortion of the entire probe card due to the thermal expansion of the reinforcing material is reduced, and the structure is simpler than the reinforcing material of the honeycomb structure, so that the cost can be reduced. Further, since the reinforcing material is plate-shaped, it can be easily attached to the substrate, and the thickness of the entire probe card can be reduced.

On the other hand, the reinforcing material used in the probe card according to the present invention is a reinforcing material attached to the substrate constituting the probe card and is divided into a plurality of small rooms. In the probe card, even if the probe card is enlarged, distortion due to the weight of the probe can be greatly reduced as compared with the conventional one, and the contact pressure between the probe and the electrode pad is maintained at a predetermined value. Therefore, it is possible to more accurately measure the electrical characteristics of the LSI chip.

Further, since the reinforcing member used in the probe card according to the seventh aspect is a honeycomb structure, the number of small rooms can be increased, and the entire shape of the reinforcing member is appropriately formed. It will be easier.

In the reinforcing material used in the probe card according to the eighth aspect, since the small room is filled with a material having excellent heat conductivity, the radiant heat from the wafer can be efficiently radiated. It is possible to minimize distortion due to thermal expansion of the card.

Further, since the reinforcing material used in the probe card according to the ninth aspect is made of a material having a small thermal expansion coefficient, the thermal expansion of the reinforcing material due to radiant heat applied to the probe card in the burn-in test is small. Therefore, the distortion of the entire probe card is reduced, and L
It is possible to accurately measure various electrical characteristics of the SI chip.

Further, the reinforcing material used in the probe card according to the tenth aspect is a plate-like material made of a material having a small thermal expansion integer. For this reason, the distortion of the entire probe card due to the thermal expansion of the reinforcing material is reduced, and the structure is simpler than the reinforcing material of the honeycomb structure, so that the cost can be reduced. In addition, since the reinforcing material is a plate-like material, it can be easily attached to a substrate,
The thickness dimension of the entire probe card can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a probe card according to an embodiment of the present invention.

FIG. 2 is a schematic bottom view of the probe card according to the embodiment of the present invention.

FIG. 3 is a schematic partially cutaway perspective view of a reinforcing member used in the probe card according to the embodiment of the present invention.

FIG. 4 is a schematic sectional view of a conventional probe card.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 probe 200 ring (supporting mechanism) 300 substrate 310 pattern wiring 400 reinforcing material

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Genichi Wakata 2-5-13-1 Nishi-Nagasu-cho, Amagasaki-shi, Hyogo Japan Electronic Materials Co., Ltd. (72) Inventor Hiroshi Iwata 2, Nishi-Nagasu-cho, Amagasaki-shi, Hyogo 5-13 Nippon Electronic Materials Co., Ltd.

Claims (10)

[Claims] 1. A substrate on which a predetermined pattern wiring is formed, a plurality of probes connected to the pattern wiring, a reinforcing member mounted on the substrate, and a support mounted on the reinforcing member to support the probe. A probe card comprising a mechanism, wherein the reinforcing material is divided into a plurality of small rooms. 2. The probe card according to claim 1, wherein the reinforcing member is a honeycomb structure. 3. The probe card according to claim 1, wherein the small room of the reinforcing member is filled with a material having excellent heat conductivity. 4. The probe card according to claim 1, wherein the reinforcing member is made of a material having a small coefficient of thermal expansion. 5. A substrate on which a predetermined pattern wiring is formed, a plurality of probes connected to the pattern wiring, a reinforcement attached to the substrate, and a support attached to the reinforcement to support the probe. A probe card comprising a mechanism, wherein the reinforcing member is a plate-like member made of a material having a small coefficient of thermal expansion. 6. A reinforcing material used for a probe card, wherein the reinforcing material is attached to a substrate constituting the probe card and is divided into a plurality of small rooms. 7. The reinforcing member used for a probe card according to claim 6, wherein the reinforcing member is formed of a honeycomb structure. 8. The reinforcing material used for a probe card according to claim 6, wherein the small room is filled with a material having excellent heat conductivity. 9. The reinforcing material used in the probe card according to claim 6, wherein the reinforcing material is made of a material having a small coefficient of thermal expansion. 10. A reinforcing material used for a probe card, wherein the reinforcing material has a plate shape made of a material having a small thermal expansion integer.