JPH1079565A - Printed circuit board etching method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the etching efficiency and to prevent a printed circuit from being under-cut, by jetting an etching liquid in an etching liquid so as to cause a jet flow and extending an etching area of a printed circuit board, so as to obtain a uniform etching effect. SOLUTION: Numerous jet pipes 4 jetting an etching liquid 5 are arranged along a carrying mechanism 2 for continuously carrying a printed circuit board 3. A carrying path of the printed circuit board, the carrying mechanism 2, the printed circuit board 3 and each jet pipe 4 are immersed in the etching liquid 5, the etching liquid 5 is jetted from the jet pipes 4 in the form of a straight water column so as to produce a jet stream in the etching liquid, and a chemical substitution reaction is produced, while washing the surface of the printed circuit board 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for etching a PC board (printed circuit board).

[0002]

2. Description of the Related Art In a conventional PC board etching method, as shown in FIG. 1, a plurality of pairs of rollers 1 are arranged in parallel at appropriate intervals and are arranged in parallel so that their outer peripheral portions are almost in contact with each other.
2, the roller 12 is rotated and the PC board 11 is pinched and transferred from both sides, and then the etching liquid 13 is sprayed directly onto the surface of the PC board 11 from the nozzle 14 to perform etching. However, this conventional method has the following disadvantages. Since the spray area of each nozzle 14 has a circular distribution, a non-uniform etching area occurs between the adjacent spray areas. Since the transfer roller 12 blocks the etching liquid 13, the processing efficiency is low. Since the etchant is sprayed directly on the PC board surface 11,
The circuit tends to be undercut due to the impact. Because the spraying force is too strong and uneven, the thin plate is lifted or sunk during the spraying and shakes,
It is easy to deviate from the transfer route. Sometimes, the spraying impact force destroys the corrosion-resistant protective film, resulting in a lower product yield.

[0003]

SUMMARY OF THE INVENTION In view of the above-mentioned problems in the conventional etching development of a PC board, the present invention sprays an etching solution while dissolving the etching solution to cause a jet action, so that both surfaces of the PC board are entirely covered. It is an object of the present invention to provide a PC board etching method capable of obtaining a uniform processing effect by being brought into contact with an etching solution which is jetted to improve etching efficiency and preventing a circuit from being undercut.

[0004]

In order to achieve the above object, the present invention provides a transfer mechanism for continuously transferring a PC board and a P mechanism.
The transfer mechanism, the PC board and each jet pipe are immersed in the etching liquid dissolution, and the etching liquid is straightened from the jet pipe. A jet is formed in a water column to form a jet action during the dissolution of the etching solution.
It is configured to cause a chemical displacement reaction while washing the plate surface.

[0005] The transfer mechanism is formed by a number of rollers arranged so as to be substantially in contact with each other in a pair between the adjacent two jet pipes. It is more preferable to arrange them relative to each other so as to form a pair on the transfer path and below. In the present invention configured as described above, a PC plate, a transfer mechanism for continuously transferring the PC plate, and a number of jet pipes that are disposed on a transfer path of the PC plate and eject an etchant are formed during the dissolution of the etchant. It is immersed, and the etching liquid is jetted out from each jet pipe in a linear water column form to form a jet action during the dissolution of the etchant. Since a reactive substitution reaction is generated, the etching area is enlarged, a uniform etching effect is obtained, the operation efficiency is improved, and the undercut of the circuit can be prevented.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be specifically described based on embodiments, but the present invention is not limited to these embodiments. As shown in FIG. 2 and FIG.
And a plurality of jet pipes 4 arranged in the transfer path of the printed circuit body 3 for jetting out the etching liquid 5. The transfer mechanism 2, the PC board 3 and each jet pipe 4 are The etching liquid 5 is immersed in the etching liquid, and the etching liquid 5 is jetted from the jet pipe 4 through the nozzle 41 into a straight water column to form a jet action in the etching liquid 5 to wash the surface of the PC board 3. In addition, a chemical substitution reaction is caused while the etching area is enlarged to obtain a uniform etching effect, thereby improving the working efficiency and preventing the circuit from being undercut.

That is, the present invention comprises a transfer mechanism 2 for continuously transferring the PC board 3, and the transfer mechanism 2 is arranged in a pair between each of the adjacent jet pipes 4 and is arranged in a large number so as to be substantially in contact with each other. The PC board 3 is transferred by the set of rollers 21, and a number of jet pipes 4 are provided at appropriate intervals on the transfer path of the PC board 3, and the etching liquid 5 is sprayed on the PC board 3. , The PC board 3 is a double-sided PC
When the board is a board, the jet pipes 4 are disposed in a pair on the transfer path of the PC board 3 in a downward direction, and are arranged in pairs.
The etching liquid 5 is sprayed from both sides.

According to the present invention, the transfer mechanism 2, the PC board 3 and the jet pipes 4 are immersed in the etching solution 5,
For example, a chemical solution tank 6 is provided in the transfer mechanism 2 to inject the etching solution 5, and the etching solution 5 is sufficiently supplied to the transfer mechanism 2.
The PC board 3 and the respective jet pipes 4 are covered and immersed, so that the etching liquid 5 is jetted from the jet pipes 4 through the nozzles 41 into a straight water column, and jetted during the dissolution of the etching liquid 5 in the chemical liquid tank 6. The surface of the PC board 3 transferred by the transfer mechanism 2 is washed to carry out a chemical substitution reaction, thereby enlarging an etching area to obtain a uniform etching effect, improving work efficiency, and improving circuit efficiency. Prevent undercut.

[0009]

The present invention configured as described above has the following effects. Since the entire PC board is immersed in an etching solution and a water column is jetted from a jet pipe to generate a jet action during the dissolution of the etching solution, the entire surface of the PC board is washed to cause a chemical reaction. There is no non-uniform etching area between adjacent spray areas. Since the entire PC board is immersed in the etching solution, defects in which the transfer roller blocks the etching solution are greatly reduced, and the etching efficiency is further improved. Since the etching liquid ejected from the jet pipe causes a jet action on the PC board surface to perform etching, the pressure is gentle and the working area is wide, so that there is no large pressure that the conventional etching liquid directly impacts the PC board. There is no worry that the circuit will be undercut. In addition, since the conventional etching solution does not have a large pressure that directly impacts the PC board, the thin plate does not vibrate, e.g., lift or sink in the gap of the transfer path, and there is no possibility of being deviated from the transfer path. . Since the etching liquid ejected from the jet pipe causes a jet action on the surface of the PC board to perform etching, the ejection pressure of the etching liquid is low, the working area is widened, and the corrosion-resistant protective film is destroyed. No, PC
Plate quality is improved and production efficiency is increased.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a conventional PC board etching method.

FIG. 2 is a display diagram of a relatively preferred embodiment of the present invention.

FIG. 3 is a display diagram of a jet action in the embodiment.

[Explanation of symbols]

 2 Transfer Mechanism 21 Transfer Roller 3 PC Body 4 Jet Pipe 41 Nozzle 5 Etching Solution 6 Chemical Solution Tank

Claims (3)

[Claims] A transfer mechanism for continuously transferring a PC board;
A plurality of jet pipes are provided in the transfer path of the C plate to jet the etchant, the transfer mechanism, the PC board and each jet pipe are immersed in the etchant solution, and the etchant is supplied from the jet pipe with a straight water. A PC board etching method in which a jet is formed in a columnar shape to form a jet action in the etching solution, thereby causing a chemical substitution reaction while cleaning the PC board surface. 2. The PC board etching method according to claim 1, wherein said transfer mechanism is formed by a number of rollers arranged in a pair between each of the adjacent jet pipes and substantially in contact with each other. . 3. The method of etching a PC board according to claim 1, wherein the plurality of jet pipes are relatively arranged so as to form a pair below the transfer path of the PC board.