JPH1079455A - Ic insertion-sampling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To measure a board index before B/I boards are carried to the IC sampling position decision part of a device main body by a method, wherein a board loading part for feeding the B/I boards prior to a B/T process to the device main body is provided with a means for measuring the board index. SOLUTION: B/I boards 1 are fed to a board loading part 6, the boards 1 are positioned to the loading part 6, a board index measuring means slide 7a is made to slide to a position for corresponding to board index measuring parts provided on the B/I boards 1, and a board index is measured. After the measured data on the boards 1 is transmitted to a device control part and is stored in memory, the boards 1 are carried and positioned to an IC sampling position decision part of a device main body and an IC sampling work is executed. During this sampling work the same measurement as that of the data on the above B/I boards 1 is made on the boards 1 following B/I. Thereby a throughput can be enhanced as overall IC sampling device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC insertion / extraction device.

[0002]

2. Description of the Related Art In a sorting process, which is one of the IC manufacturing processes, there is a process called B / T, which is important for quality assurance of screening all the manufactured ICs.
IC 2 manufactured in a plurality of sockets 3 provided on a printed circuit board for electrical characteristics test called an I board 1
After the B / I board 1 is inserted and mounted, the B / I board 1 is housed in a B / T device, and B / T, which is a kind of high-temperature acceleration test, is performed. B
After the end of / T, IC2 from socket 3 on B / I board 1
Then, IC2 is stored in a storage jig according to B / T result data according to B / T failure and IC quality grade.

In this step, the IC 2 is taken out from the tray 11 or a magazine (not shown), which is a supply jig, inserted into the socket 3 on the B / I board 1, extracted from the socket 3, and transferred to the storage jig 11. The sorting and storing operation is performed by the IC insertion / extraction device 4.

An example of a method of inserting the IC 2 stored in the tray 11 in the IC insertion / extraction device 4 into the socket 3 on the B / I board 1 will be described with reference to FIGS.

[0005] First, in the IC insertion operation, the tray 11 containing the IC 2 before B / T is transported and positioned to the tray positioning unit 13, and the B / I board 1 on which the empty socket 3 is placed is placed.
Is transported and positioned by the IC insertion positioning unit 12, and the up-and-down and twistable shafts 10 mounted on the rectangular coordinate system transporting device 8 are moved.
The IC 2 is taken out from the tray positioning unit 13 by the suction head 15 provided at the tip of the IC, and is inserted and mounted in the empty socket 3 on the B / I board 1 so that the lead 2b of the IC 2 and the contact 3c of the socket come into contact with each other, thereby providing electrical continuity. Is obtained. At this time, if the shape of the IC package 2 and the number or pitch of the leads 2b are different, the IC 2 becomes a different type,
Since the corresponding socket 3 is another type, B /
The I board 1 is a different type.

[0006] Similarly, the IC extraction operation is performed by the IC after the B / T.
The B / I board 1 containing the IC 2 is transported and positioned in the IC insertion position determining unit 12, and the IC is extracted by the suction head 15.
The paper is stored in the empty tray 11 positioned by the tray positioning unit 13.

At present, IC2 manufactured by an IC manufacturer
Are very diversified, the corresponding socket 3 and B / I board 1 are also very diversified, and several hundred B / I boards are required for each IC in production. Therefore, IC manufacturers are obliged to possess and manage an enormous variety and quantity of B / I boards 1.

In the IC insertion / extraction device 4, the multi-type IC
It is necessary to manage huge numbers and types of B / I boards 1 with different types of sockets 3 and the number of sockets arranged on the B / I board 1 and the number of sockets arranged on the B / I board 1 corresponding to For each B / I board 1, the type name and the number (referred to as board code) of each type are registered and stored and stored as a board index. Actually, immediately after the transfer position is determined by the IC insertion position determination unit 12, the board index corresponding to the type of the IC2 is measured and registered, and
The position of the socket 3 on the / I board 1 is represented as the insertion / extraction point 12a by coordinates from the reference point of the rectangular coordinate system transfer device 8, and is registered by initial setting.

[0009]

Electronic devices such as personal computers, copiers, facsimile machines, and mobile phones, which are large demands for ICs, have been rapidly increasing in quantity and are becoming smaller and lighter. IC2 built in electronic equipment
And the number of products has rapidly increased, and there has been a demand for smaller, lighter and thinner ICs. In the IC manufacturing process, the number of ICs produced has increased rapidly, especially small, lightweight and thin SOPs (leads 2b shown in FIG. 5 extend in two directions) and QFPs (leads 2b shown in FIG. 2 extend in four directions). As the number of ICs increases rapidly, the difficulty in handling them during production causes a drastic decrease in IC manufacturing throughput and productivity. In addition, diversification of ICs necessitates frequent product changeover setups on production lines, resulting in lower production yields. There is a problem that the cost is increased due to the decrease. In particular, in recent years, the number of IC productions and sales have become enormous, which has become a more serious problem.

[0010] Although it has been described above that all the B / I boards 1 are registered and managed by the board index, if another type of IC 2 that does not correspond to the corresponding type is inserted into the socket 3 on the B / I board 1, the lead of the IC is read. When the contact 3c of the socket 2b and the socket 3c become unmatched, a serious product defect such that the IC lead 2b is bent occurs.
2 can be electrically destroyed, or overcurrent can flow, resulting in a socket failure called latch-up or a serious defect of breaking the printed circuit on the board. Therefore, the board index is an important element connecting the type of the IC2 and the type of the B / I board 1, and is a lifeline for preventing defects in the IC manufacturing process.

[0011] Therefore, the device maker determines how accurately the board index is measured in a short time, and how the measured data is transmitted to the device control unit 5 and stored.
The problem is to improve the throughput while maintaining the reliability of the C insertion / extraction device.

[0012]

According to the present invention, there is provided an IC insertion / extraction apparatus for measuring a board index in a board loading section for supplying a B / I board before B / T to the apparatus main body. Is provided, the board index can be measured before the B / I board 1 is transported to the IC insertion / extraction position determination unit 12 on the apparatus main body 4.

The rectangular coordinate system transfer device 8 and the device main body 4 are connected to the device control section 5 so as to be capable of transmitting electric power, and board index measurement data, that is, B / I data for a large number of products and a large number of B / Is.
Device control of a board code specific to the board registered in advance, a type of socket 3 on the board, and defective socket coordinate data such as breakage (data indicating what number of X and what number of Y is defective). It has means for transmitting to the unit 5 and storing and storing it inside the control unit 5, and means for arbitrarily reading out the stored and stored data as needed. Similarly, B
The B / I board 1 after the / T is supplied to the board loading section 6, and the board index is measured before the B / I board 1 is transported to the IC insertion / extraction positioning section 12 on the apparatus main body 4, and the measurement is performed. The data is transmitted to the device control unit 5, stored and saved, and B / T result data from the B / T tester, that is,
Coordinate data of IC2 quality grade and defective IC by B / T (data of what number of X and what number of Y is defective)
Have means to give and receive.

By providing the board loading section 6 with means 7 for measuring a board index, the board index is measured while the IC insertion / extraction apparatus main body 4 performs the operation of inserting or extracting the IC 2 and performs the operation. It is characterized in that the measured data can be transmitted, stored and stored, and the throughput of the entire apparatus is improved.

[0015]

FIG. 1 is a perspective view of an entire IC insertion / extraction apparatus showing an embodiment of the present invention, and FIG. 2 is a view for explaining a situation in which an IC 2 is inserted into a socket 3 on a B / I board 1. It is a perspective view of. FIG. 3 is a side view of the board loading section 6 for supplying the B / I board 1 to the main body 4 of the IC insertion / extraction device, which is partially cut away and shown. FIG. 4 shows B / I
FIG. 2 is a perspective view illustrating an example of a board 1.

In this embodiment, for example, a bar code is printed near the printed circuit on the surface of the B / I board 1,
A board index measuring unit 9 indicating a board code unique to each B / I board 1, a type of the corresponding socket 3, an address of the socket 3 arranged on the board 1, and the like is provided.
A board index measuring means 7, for example, a bar code reader, is provided in a board loading section 6 for supplying to the C insertion / extraction positioning section 12, so that a board index can be measured before board loading. Further, the board index measuring means 7 is evacuated to a position where it does not contact the B / I board 1 during board loading, and is moved to a position opposite to the board index measuring section 9 of the B / I board 1 only during measurement. Measuring means slide 7a is provided. The operation of the IC insertion / extraction device having such a configuration will be described. First, the B / I board 1 is supplied to the board loading section 6, the B / I board 1 is positioned, and the board index measuring means slide 7a corresponds to the board index measuring section 9 provided on the B / I board 1. The B / I board 1 is slid to the position, the board index is measured, the measurement data is transmitted to the device control unit 5 and stored and stored. Inserting or removing work. During the insertion or removal of the IC 2, the next B / I board 1 is positioned on the board loading unit 6 in the same manner as described above, the board index is measured, and the measurement data is transmitted to the device control unit 5 and stored and stored. Therefore, the overall throughput of the IC insertion / extraction device 4 can be improved.

[0017]

According to the present invention, the board loading section 6 for supplying the B / I board to the apparatus main body 4 includes the board index measuring means 7 and the measuring means slide 7a for retracting the measuring means at the time of actual loading of the board. By arranging the board, the board index is measured before the B / I board 1 is transported to the IC insertion / extraction position determining unit 12 of the apparatus main body. The board index of the I board 1 can be measured, and the throughput of the entire apparatus can be reduced.

Further, by transmitting the measured data to the device control unit 5 and storing it therein so as to be readable at any time, the B / I board 1 corresponding to the type of IC 2 can be inserted before the IC insertion or extraction operation. By performing self-diagnosis and checking, the mismatch between the IC 2 and the socket 3 can be found, and the yield of IC manufacturing can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an entire IC insertion / extraction device showing one embodiment of the present invention.

FIG. 2 is an explanatory diagram of an operation of inserting an IC into a socket on a B / I board.

FIG. 3 is a side view of a B / I board loading unit showing one embodiment of the present invention.

FIG. 4 is a perspective view showing a B / I board and a board index measuring unit provided on the B / I board.

FIG. 5 is a perspective view of an SOP which is a kind of IC.

FIG. 6 is a perspective view of a magazine that is a type of an IC storage jig.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... B / I board, 2 ... IC, 3 ... Socket, 4 ... IC insertion / extraction apparatus main body, 5 ... Insertion / extraction apparatus control part, 5a ... Operation panel, 6 ... B / I board loading part, 8 ... Rectangular coordinate system Conveyance device, 10: up and down, twistable shaft, 13: tray positioning unit, 14: tray loading unit

 ──────────────────────────────────────────────────続 き Continued on front page (72) Inventor Takashi Suzuki 800 Tomita, Ohira-cho, Ohira-machi, Shimotsuga-gun, Tochigi Prefecture Within the cooling division of Hitachi, Ltd.

Claims (2)

[Claims] A right-angle coordinate system transfer device on which a suction head for sucking and transferring an IC is mounted so as to be vertically and twistably movable;
A tray positioning unit for transporting and positioning a tray for supplying and storing the IC, a board loading unit for supplying a burn-in board having a socket for mounting the IC thereon, and an IC for transporting and positioning the burn-in board The apparatus main body on which the insertion / extraction positioning unit is mounted and the apparatus control unit for storing and storing data relating to the work position and work order of the rectangular coordinate system transfer apparatus and controlling the apparatus main body are communicably connected. A function to measure the pre-registered unique data relating to the type and a large number of burn-in boards is provided in the board loading section arranged in front of the IC insertion / extraction positioning section, and the measured unique data is transmitted to the apparatus control section. IC insertion and removal characterized by having a function of storing and storing and reading out the stored data at any time. Apparatus. 2. A rectangular coordinate system transfer device having a gripper head for gripping and transporting the IC mounted vertically and twistably, and a magazine positioning unit for transporting and positioning a magazine for supplying and storing the IC. 2. The IC insertion and extraction device according to claim 1, which is mounted on the device main body.