JPH1074984A - Thermoelectric material and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermoelectric material which has a high performance index of 4.0×10<-3> (1/K) or more and its manufacture. SOLUTION: Thermoelectric material is of P-type containing at least one element selected from a group of elements composed of Bi and Sb and at least one element selected from a group of elements composed of Te and Se. In this case, the average diameter of the crystal grain is limited to 50μm or less and oxygen content, 1500wt.ppm or less. A thin film is manufactured from the material containing, at least one element selected from a group of elements composed of Bi and Sb and at least one element selected from a group of elements composed of Te and Se, by liquid quenching, the thin film is powdered, and the powder is reduced by hydrogen gas to be solidified under the condition that the crystal grain does not roughen, and the thermoelectric material is manufactured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric conversion element applied to thermoelectric power generation and thermoelectric cooling, and a method of manufacturing the same, and more particularly, to a thermoelectric material capable of improving a figure of merit and a method of manufacturing the same.

[0002]

2. Description of the Related Art As a method for manufacturing a thermoelectric material, there is a method in which a molten metal of a thermoelectric material is thinned using a liquid quenching method, and then the raw material is solidified and formed by sintering. . When the thermoelectric material manufactured in this way is quenched in the melt of the thermoelectric material or when a thin film of the thermoelectric material is powdered, the surface of the powder is oxidized, and an oxide film is formed at the interface between the powders during solidification molding. It is formed.

The properties of a thermoelectric material include a Seebeck coefficient α (μ · V / K), a specific resistance ρ (Ω · m),
When the thermal conductivity is κ (W / m · K), the thermal conductivity can be evaluated by the performance index Z shown in the following equation 1. That is,
The larger the figure of merit Z, the better the properties of the thermoelectric material.

[0004]

## EQU1 ## Z = α ² / (ρ × κ).

[0005] As shown in the above formula 1, it is necessary to reduce the specific resistance ρ or the thermal conductivity κ in order to improve the properties of the thermoelectric material.

[0006]

However, when a thermoelectric material is manufactured by a conventional method, there is a problem that the resistivity ρ of the thermoelectric material increases due to an oxide film formed on the surface of the powder. Therefore, the conventional thermoelectric material has a limited figure of merit, for example, 4.0 × 10
^-3 (1 / K).

The present invention has been made in view of the above problems, and provides a thermoelectric material capable of obtaining a high figure of merit of 4.0 × 10 ⁻³ (1 / K) or more, and a method of manufacturing the same. The purpose is to:

[0008]

The thermoelectric material according to the present invention comprises at least one element selected from the group consisting of Bi and Sb, and at least one element selected from the group consisting of Te and Se. In the P-type thermoelectric material containing, the average grain size of the crystal grains is regulated to 50 μm or less, and the oxygen content is regulated to 1500 ppm by weight or less.

Another thermoelectric material according to the present invention is Bi thermoelectric material.
And at least one element selected from the group consisting of Te and Se, at least one element selected from the group consisting of Te and Se, and I, Cl, Hg, Br, Ag, and Cu.
In an N-type thermoelectric material containing at least one element selected from the group consisting of:
It is characterized in that it is regulated to 0 μm or less and the oxygen content to 1500 ppm by weight or less.

[0010] The method for producing a thermoelectric material according to the present invention comprises the steps of:
And a raw material containing at least one element selected from the group consisting of Te and Se and at least one element selected from the group consisting of Te and Se are formed into a thin film by a liquid quenching method, and further powdered. A first step, a second step of reducing the powder obtained in the first step with hydrogen gas, and a third step of solidifying and forming the powder reduced in the second step under the condition that the crystal grains do not become coarse. And obtaining a thermoelectric material in which the average grain size of the crystal grains is regulated to 50 μm or less and the oxygen content is regulated to 1500 wt ppm or less.

[0011] Further, another method for producing a thermoelectric material according to the present invention is characterized in that at least one element selected from the group consisting of Bi and Sb and at least one element selected from the group consisting of Te and Se Step of forming a raw material containing the following into a thin film by a liquid quenching method, and further pulverizing the raw material; and obtaining a powder having a degree of vacuum of 1 × 10 ^-2 To
a second step of reducing the powder by heating at a temperature of 200 to 500 ° C. in a hydrogen gas atmosphere for 10 to 50 hours after evacuating to rr or less,
And a third step of solidifying and forming the powder reduced in the second step under the condition that the crystal grains do not become coarse.

[0012] Still another method for producing a thermoelectric material according to the present invention is a method for producing at least one element selected from the group consisting of Bi and Sb, and at least one element selected from the group consisting of Te and Se. , I, Cl, Hg, Br, Ag
And a raw material containing at least one element selected from the group consisting of Cu and a thin film by a liquid quenching method,
A first step of further pulverizing; a second step of reducing the powder obtained in the first step with hydrogen gas;
A third step of solidifying and molding the powder reduced in the step under conditions that do not coarsen the crystal grains, wherein the average particle diameter of the crystal grains is 50 μm or less and the oxygen content is regulated to 1500 wt ppm or less. It is characterized by obtaining a material.

[0013] Still another method for producing a thermoelectric material according to the present invention is a method for producing at least one element selected from the group consisting of Bi and Sb, and at least one element selected from the group consisting of Te and Se. , I, Cl, Hg, Br, Ag
And a raw material containing at least one element selected from the group consisting of Cu and a thin film by a liquid quenching method,
A first step of further pulverizing, and after evacuation of the powder obtained in the first step until the degree of vacuum becomes 1 × 10 ⁻² Torr or less, the temperature is set to 200 to 500 ° C. in a hydrogen gas atmosphere. A second step of reducing the powder by heating for 10 to 50 hours, and a third step of solidifying and forming the powder reduced by the second step under a condition that crystal grains do not become coarse. I do.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION As a result of intensive experiments and research conducted by the present inventors to solve the above-mentioned problems, it has been found that an oxide film formed at a grain boundary of powder is removed by reduction during the production of a thermoelectric material. As a result, it has been found that the specific resistance ρ of the thermoelectric material is reduced, and the figure of merit Z of the thermoelectric material can be improved.

First, the reasons for limiting the conditions for the reduction treatment in the method for producing a thermoelectric material according to the present invention will be described below.

Reduction treatment temperature: 200 to 500 ° C. If the temperature during the reduction treatment is less than 200 ° C., the reduction of the oxide on the powder surface becomes insufficient, so that the specific resistance ρ does not decrease and the performance index Z is reduced. Can't improve. On the other hand, if the reduction treatment temperature exceeds 500 ° C., Te or Se
And the like, the vacancies increase, the resistance (specific resistance ρ) increases, and the thermal electromotive force (Seebeck coefficient α) decreases due to the composition shift.

FIG. 1 is a graph showing the relationship between the reduction processing temperature and the specific resistance, with the horizontal axis representing the reduction processing temperature and the vertical axis representing the specific resistance. This is because a master alloy obtained by adding 0.2% by weight of SbI ₃ to a composition of Bi ₂ Te _2.85 Se _0.15 is quenched by liquid to produce a flaky powder having a thickness of less than 10 μm. It is a result of measuring a thermoelectric material solidified and formed by evacuation, enclosing in a Pyrex tube whose inside has been replaced with hydrogen gas, performing a heat reduction treatment, and then hot pressing. However, the reduction treatment time was 10 hours, and the heating temperature during hot pressing was 42 hours.
The temperature was 5 ° C., the pressure was 4 (tonf / cm ² ), and the heating time was 60 minutes. As shown in FIG. 1, when the reduction temperature is in the range of 200 to 500 ° C., the specific resistance decreases. The temperature range in which the specific resistance decreases is the same regardless of the composition of the raw material. Therefore, the processing temperature during the reduction processing is 200
To 500 ° C.

Reduction treatment time: 10 to 50 hours If the time during the reduction treatment is less than 10 hours, the reduction of the oxide on the powder surface becomes insufficient, so that the specific resistance ρ does not decrease and the performance index Z is reduced. Can't improve. On the other hand, if the reduction processing time exceeds 50 hours, Te or Se
And the like, the vacancies increase, the resistance (specific resistance ρ) increases, and the thermal electromotive force (Seebeck coefficient α) decreases due to the composition shift.

FIG. 2 is a graph showing the relationship between the reduction processing time and the specific resistance, with the horizontal axis representing the reduction processing time and the vertical axis representing the specific resistance. This is because a mother alloy obtained by adding 1.5% by weight of Te to a composition of Bi _0.5 Sb _1.5 Te ₃ is quenched by liquid to produce a powder, which is put into a Pyrex tube and evacuated. This is a result of measurement of a thermoelectric material solidified and formed by hot pressing after the inside of the tube is replaced with hydrogen gas and sealed, subjected to a heat reduction treatment, and then subjected to hot pressing. However, the reduction treatment temperature was 370 ° C, the heating temperature during hot pressing was 400 ° C, the pressure was 3 (tonf / cm ² ),
The heating time is 90 minutes. As shown in FIG. 2, the specific resistance ρ decreases in the range of the reduction treatment time of 10 to 50 hours. In addition, the range of the reduction treatment time in which the specific resistance decreases is the same regardless of the composition of the raw material. Therefore, the processing time during the reduction processing is set to 10 to 50 hours.

Vacuum degree: 1 × 10 ⁻² Torr or less In the present invention, the powdery material of the mother alloy is put into a Pyrex tube or the like, evacuated, then replaced with hydrogen gas and sealed, and heated to heat the powder. Raw materials can be reduced. The degree of vacuum when evacuation is 1 × 10 ^-2
If the pressure is equal to or higher than Torr, the powder oxidizes during heating due to oxygen remaining in the Pyrex tube or the like. Therefore,
The degree of vacuum during the reduction treatment is set to 1 × 10 ⁻² Torr or less.

Next, the reasons for limiting the average crystal grain size and the oxygen content in the thermoelectric material according to this embodiment will be described.

Average crystal grain size: 50 μm or less The results of an investigation on the effect of the average crystal grain size of the thermoelectric material on its properties are shown below. As the thermoelectric material, a master alloy obtained by adding 1% by weight of Te to a composition of Bi _0.5 Sb _1.5 Te ₃ is used.

FIG. 3 is a graph showing the relationship between the average crystal grain size and the thermoelectromotive force, with the horizontal axis representing the average crystal grain size of the crystal grains of the thermoelectric material and the vertical axis representing the thermoelectromotive force α. . As shown in FIG. 3, the thermoelectromotive force α is hardly affected by the average crystal grain size of the crystal grains.

FIG. 4 is a graph showing the relationship between the average crystal grain size and the thermal conductivity, with the horizontal axis representing the average crystal grain size of the crystal grains of the thermoelectric material and the vertical axis representing the thermal conductivity κ. . As shown in FIG. 4, the thermal conductivity κ increases as the average crystal grain size of the crystal grains increases, and the average crystal grain size is 50 to 100 μm.
In the range, the amount of increase in the thermal conductivity κ increases.

FIG. 5 is a graph showing the relationship between the average crystal grain size and the specific resistance, where the horizontal axis represents the average crystal grain size of the crystal grains of the thermoelectric material, and the vertical axis represents the specific resistance ρ. As shown in FIG. 5, when the average crystal grain size of the crystal grains is 50 μm or less, the specific resistance ρ hardly changes, but the average crystal grain size is 5 μm or less.
In the range exceeding 0 μm, the specific resistance ρ increases as the particle size increases.

FIG. 6 is a graph showing the relationship between the average crystal grain size and the performance index, with the horizontal axis representing the average crystal grain diameter of the crystal grains of the thermoelectric material and the vertical axis representing the performance index Z. Figure of merit Z
Is represented by the following equation: Z = α ² / (ρ × κ). Therefore, when the thermal electromotive force α is constant, the performance index Z decreases as the specific resistance ρ and the thermal conductivity κ increase. As shown in FIG. 6, when the average crystal grain size of the crystal grains exceeds 50 μm, the figure of merit Z significantly decreases. Regarding the influence of the average crystal grain size of the thermoelectric material on the performance index and the thermal conductivity, a similar tendency is obtained irrespective of the composition of the raw material. Therefore, the average crystal grain size of the thermoelectric material is set to 50 μm or less.

Oxygen content: 1500 ppm by weight or less The oxygen content in the thermoelectric material is a value from which the degree of reduction can be determined. The oxygen content in the thermoelectric material is 150
If it exceeds 0 ppm by weight, it indicates that the raw material powder was not sufficiently reduced during the reduction treatment, and the carrier was scattered by the oxide film present at the interface of the powder, so that the specific resistance ρ increased. As a result, the figure of merit Z decreases.

FIG. 7 is a graph showing the relationship between the oxygen content and the specific resistance, with the horizontal axis indicating the oxygen content in the thermoelectric material and the vertical axis indicating the specific resistance. However, as the thermoelectric material, the composition of Bi _0.5 Sb _1.5 Te ₃ has a T content of 1.5% by weight.
The mother alloy obtained by adding e is used, and the average crystal grain size is 30 μm. As shown in FIG. 7, when the oxygen content in the thermoelectric material increases beyond 1500 ppm by weight, the specific resistance also increases significantly. The range of the oxygen content at which the specific resistance decreases is the same regardless of the composition of the raw material. Therefore, the oxygen content in the thermoelectric material is 1500 weight p.
pm or less.

The thermoelectric material having such fine crystals is
Specifically, it can be manufactured by the following method.

First, a raw material is weighed to have a desired composition, and the raw material is dissolved in a vacuum to prepare a mother alloy.
At this time, when producing an N-type thermoelectric material, for example, SbI ₃ , AgI, HgBr ₂ or HgCl ₂
Etc. may be added. Next, for example, using a single roll method, the molten metal of the thermoelectric material is formed into a thin film or powder by a liquid quenching method in which the molten metal is quenched at 10 ^{3 to} 10 ⁶ (K / sec). Is set to 50 μm or less. Next, the powder is subjected to a reduction treatment.

FIG. 8 is a schematic diagram showing a method for reducing the raw material powder. As shown in FIG. 8, a raw material powder 2 is put in a Pyrex tube 1, and an opening of the Pyrex tube 1 is airtightly fitted into one opening of a T-shaped tube 3. The T-tube 3 has a three-way cock 4 at a branch portion, the other one of which is connected to an H ₂ cylinder 7 through an opening and closing plug 5, and the other tube is evacuated through an opening and closing plug 6. Device 8
It is connected to the.

In the apparatus configured as described above, first, the three-way cock 4 is adjusted so that the Pyrex tube 1 is connected to the vacuum evacuation device 8, and the degree of vacuum in the Pyrex tube 1 is 1 × 10 ⁻² Torr or less. Reduce the pressure so that Next, the three-way cock 4 was adjusted so that the Pyrex tube 1 was connected to the H ₂ cylinder 7, and H ₂ was inserted into the Pyrex tube 1.
Gas is introduced and the Pyrex tube 1 is hermetically sealed. Thereafter, the tube 1 is placed in a furnace (not shown) and, for example, 200
After heating at a temperature of about 500 ° C. for 10 to 50 hours to reduce the raw material powder 2, the tube 1 is cracked to take out the powder 2.

Thereafter, the reduced powder is hot-pressed under the condition that the crystals do not become coarse, thereby solidifying and forming the same. Conditions under which the crystals are not coarsened include, for example, a pressing pressure of 400 kgf / cm ² and a temperature of 300 to 5
Vacuum or Ar at 00 ° C. for 30 to 180 minutes
Conditions under an atmosphere can be set.

As a method of solidifying and molding the reduced powder, there are other methods such as extrusion molding and molding by discharge plasma sintering. With spark plasma sintering, while impacting ions by plasma discharge,
This is a method in which a sintered body can be obtained by applying pressure during heating without growing the structure of the raw material powder.

When the thermoelectric material of the present invention is solidified by hot pressing, the direction of heat flow may be determined in a direction parallel to the pressure direction of hot pressing (the direction in which the c-axis of the crystal grows).

In the present invention, as a raw material of the P-type thermoelectric material, one or both of Bi and Sb and one or both of Te and Se are contained. In addition, as a raw material of the N-type thermoelectric material, the above composition further includes I, Cl, Hg, Br, Ag, and Cu.
A material to which at least one element selected from the group consisting of is added is used.

[0037]

EXAMPLES Examples of the thermoelectric material according to the present invention will be specifically described below in comparison with comparative examples.

First, thermoelectric materials having various compositions were manufactured by various manufacturing methods, and the average crystal grain size and oxygen content of the samples of Examples and Comparative Examples were measured. Thermal conductivity κ and Seebeck coefficient α
Was measured, and a figure of merit Z was calculated from these values. The compositions of the thermoelectric materials are shown in the following Tables 1 to 3, the conditions of the reduction treatment and the solidification molding method are shown in the following Tables 4 to 6, and the measurement results are shown in the following Tables 7 to 9.

The oxygen content is measured to evaluate the degree of reduction, and in this embodiment,
A non-dispersive infrared absorption method was used. That is, when the sample is heated in the graphite crucible, the oxygen in the sample reacts to generate CO gas, which is conveyed by a carrier gas such as He, and the concentration is analyzed by an infrared detector and converted into oxygen concentration. .

[0040]

[Table 1]

[0041]

[Table 2]

[0042]

[Table 3]

[0043]

[Table 4]

[0044]

[Table 5]

[0045]

[Table 6]

[0046]

[Table 7]

[0047]

[Table 8]

[0048]

[Table 9]

As shown in Tables 1 to 9 above, Example N
o. Nos. 1 to 7 are Comparative Examples No. The materials correspond to 31 to 37, respectively, and are formed by forming raw materials having the same composition into thin films by a liquid quenching method, pulverizing them, and then solidifying and molding. However, in Example No. All of Nos. 1 to 25 are obtained by subjecting a powdered raw material to reduction treatment with hydrogen gas and then solidifying and forming the same. Therefore, the average crystal grain size of the obtained thermoelectric material becomes 50 μm or less and oxygen The content was 1500 ppm by weight or less. Therefore, the figure of merit was improved as compared with the comparative example, and an excellent figure of merit of 4.0 × 10 ⁻³ or more was shown.

On the other hand, Comparative Example No. Nos. 26 to 30 are those in which the reduction process is performed. 26, 28
In Nos. 30 and 30, since the oxygen content exceeded the upper limit of the range of the present invention, the figure of merit decreased. Also, in Comparative Example No. In Nos. 27 and 29, since the average crystal grain size exceeded the upper limit of the range of the present invention, the figure of merit decreased. Further, in Comparative Example No. In Nos. 31 to 42, since no reduction treatment was performed on the powdered raw material, the oxygen content exceeded the upper limit of the range of the present invention, and the figure of merit decreased.

[0051]

As described in detail above, according to the present invention,
Since the average particle size and the oxygen content of the crystal grains of the thermoelectric material are specified, a thermoelectric material having a high figure of merit of 4.0 × 10 ⁻³ (1 / K) or more can be obtained. According to the method of the present invention, a raw material having a predetermined composition is powdered,
After reducing this, by solidifying and molding, the average crystal grain size and the oxygen content are controlled, so that a thermoelectric element is obtained.
Its figure of merit can be increased.

[Brief description of the drawings]

FIG. 1 is a graph showing the relationship between the reduction processing temperature and the specific resistance, with the horizontal axis indicating the reduction processing temperature and the vertical axis indicating the specific resistance.

FIG. 2 is a graph showing the relationship between the reduction processing time and the specific resistance, with the horizontal axis indicating the reduction processing time and the vertical axis indicating the specific resistance.

FIG. 3 is a graph showing the relationship between the average crystal grain size and the thermoelectromotive force, with the horizontal axis representing the average crystal grain size of the crystal grains of the thermoelectric material and the vertical axis representing the thermoelectromotive force α.

FIG. 4 is a graph showing the relationship between the average crystal grain size and the thermal conductivity, with the horizontal axis representing the average crystal grain size of the crystal grains of the thermoelectric material and the vertical axis representing the thermal conductivity κ.

FIG. 5 is a graph showing the relationship between the average crystal grain size and the specific resistance, with the horizontal axis indicating the average crystal grain size of the crystal grains of the thermoelectric material and the vertical axis indicating the specific resistance ρ.

FIG. 6 is a graph showing the relationship between the average crystal grain size and the performance index, with the horizontal axis representing the average crystal grain diameter of the crystal grains of the thermoelectric material and the vertical axis representing the performance index Z.

FIG. 7 is a graph showing the relationship between the oxygen content and the specific resistance, with the horizontal axis indicating the oxygen content in the thermoelectric material and the vertical axis indicating the specific resistance.

FIG. 8 is a schematic view showing a method for reducing a raw material powder.

[Explanation of symbols]

1; Pyrex pipe; 2; raw material powder; 3; T-shaped pipe;
4; three-way stopcock, 5, 6; shutoff cock, 7; H ₂ gas cylinder, 8; evacuator

Claims (6)

[Claims] 1. A P-type thermoelectric material containing at least one element selected from the group consisting of Bi and Sb and at least one element selected from the group consisting of Te and Se, Is regulated to an average particle size of 50 μm or less and an oxygen content of 1500 ppm by weight or less. 2. At least one element selected from the group consisting of Bi and Sb, at least one element selected from the group consisting of Te and Se, and I, Cl, Hg,
In an N-type thermoelectric material containing at least one element selected from the group consisting of Br, Ag, and Cu, the average grain size of crystal grains is 50 μm or less, and the oxygen content is 1500
A thermoelectric material, which is regulated to be less than ppm by weight. 3. A raw material containing at least one element selected from the group consisting of Bi and Sb and at least one element selected from the group consisting of Te and Se is formed into a thin film by a liquid quenching method. A first step of further pulverizing, a second step of reducing the powder obtained in the first step with hydrogen gas, and a step of solidifying the powder reduced in the second step under the condition that crystal grains are not coarsened. Forming a thermoelectric material having an average crystal grain size of 50 μm or less and an oxygen content of 1500 ppm by weight or less. 4. A raw material containing at least one element selected from the group consisting of Bi and Sb and at least one element selected from the group consisting of Te and Se is formed into a thin film by a liquid quenching method. A first step of further pulverizing, and the powder obtained in the first step having a degree of vacuum of 1 × 1
After reducing the pressure to 0 ^-2 Torr or less, the powder is reduced by heating at 200 to 500 ° C for 10 to 50 hours in a hydrogen gas atmosphere.
A method for producing a thermoelectric material, comprising: a step of solidifying and molding the powder reduced in the second step under conditions that do not cause coarsening of crystal grains. 5. At least one element selected from the group consisting of Bi and Sb, at least one element selected from the group consisting of Te and Se, I, Cl, Hg,
A first step in which a raw material containing at least one element selected from the group consisting of Br, Ag, and Cu is formed into a thin film by a liquid quenching method and further powdered, and the powder obtained in the first step And a third step in which the powder reduced in the second step is solidified and formed under the condition that the crystal grains do not become coarse, and the average grain size of the crystal grains is 50 μm or less. And obtaining a thermoelectric material having an oxygen content regulated to 1500 ppm by weight or less. 6. At least one element selected from the group consisting of Bi and Sb, at least one element selected from the group consisting of Te and Se, and I, Cl, Hg,
A first step in which a raw material containing at least one element selected from the group consisting of Br, Ag, and Cu is formed into a thin film by a liquid quenching method and further powdered, and the powder obtained in the first step Is evacuated to a degree of vacuum of 1 × 10 ⁻² Torr or less, and then heated in a hydrogen gas atmosphere at a temperature of 200 to 500 ° C. for 10 to 50 hours to reduce the powder, and A third step of solidifying and molding the powder reduced in the second step under a condition that crystal grains are not coarsened.