JPH1073666A - Radiation detector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable taking out a necessary signal without restriction of production process and the like, by reducing the number of output signal lines of a bundling/selecting means more than the number of output signal lines of a radiation detection means. SOLUTION: A switch part 35 as a bundling/selecting means of this radiation detector 11-l has 4 signal lines for supplying electric signal, for example, in the input side and has 8 switches 35a1 to 35a8. One side of each switch is connected to 4 signal lines in input side and the other side is connected to two signal lines in output side, respectively. If the switches 35a1, 35a2, 35a7 and 35a8 are turned on and the others are turned off, the electric signals inputted in each two signal lines in the left and right of the input side are bundled, respectively and outputs from the signal lines in the left and right of the output side. If the switches 35a1 and 35a6 are turned on and the others are turned off, the electric signals inputted in the two signal lines in the left of the input side are selected and outputted. In this manner, the number of electric signals of a photodiode array 33 for the number of matrix is reduced and outputted by the bundling and selecting of the switch part 35.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiation detector for directly converting radiation such as X-rays into an electric signal, or converting radiation into visible light or the like and then converting the radiation into an electric signal.

[0002]

2. Description of the Related Art As is well known, in an X-ray CT apparatus, an X-ray source that emits X-rays applies X-rays to a subject from various directions.
The X-rays that are emitted and transmitted through the subject are detected by a radiation detector placed at a position opposite to the subject with the subject interposed therebetween, and finally converted into an electric signal. This signal reflects the intensity of the transmitted X-ray, and the tomographic image is reconstructed based on the signal and displayed on the display device.

For example, as shown in FIG. 8A, in a third-generation X-ray CT apparatus 101, an X-ray source 10 for emitting X-rays is used.
3, and a radiation detector 105 for detecting X-rays emitted from the X-ray source 101 rotates in a plane substantially perpendicular to the body axis of the subject to collect data. With one rotation (about 180 ° or about 360 °), one tomographic image in the rotation plane is reconstructed and displayed.

FIG. 8B shows a schematic configuration example of one block of an X-ray detector 105 using a scintillator-photodiode used in the X-ray CT apparatus 101, that is, an X-ray detector block 105a. FIG. FIG.
As shown in (b), the X-ray detector block 105a is a printed circuit board (PCB) 10
7, a photodiode array 109 is provided on the upper surface,
Further, a scintillator 111 is provided on the upper surface of the photodiode array 109.

Usually, the scintillator 111 and the photodiode array 109 have the same number of elements,
The X-rays incident on 1 are converted into visible light, and are converted into electric signals by the photodiode array 109.

In the third-generation X-ray CT apparatus 101, a plurality of radiation detector blocks 105a are densely arranged in an arc shape in a rotation plane as shown in FIG. It is taken out from one direction by a wire 113 and supplied to a data collection device (not shown).

FIG. 10 shows a configuration in which a detection element is divided in the body axis direction so that data of a plurality of cross sections can be collected in one cycle of data collection by the radiation detector block shown in FIG.
FIG. 3 is a diagram illustrating a schematic configuration example of a radiation detector block having a two-dimensional photodiode array 109a and a two-dimensional scintillator 111a. In order to arrange a plurality of radiation detector blocks on the same arc, in this case, it is necessary to extract data for the number of divisions in the direction of the arrow shown in FIG. It can also be pulled out to the opposite side, or it can be split out into both and pulled out.

[0008]

However, FIG.
Even when using a detector having a plurality of radiation detector blocks in which the detection elements are divided in the opposite axial direction as shown in (1), connecting all the detection elements one-to-one with the data collection device is a matter of mounting the board. Or it is quite difficult on wiring. Even if the connection can be made, there may be a case where a smaller number of data collection devices than the number of detection elements are used due to the mounting convenience of the data collection device and the price problem. In such a case, it has been considered to reduce the apparent number of detection elements by switching the output of the detection elements with a switch or the like, or to select and use only necessary parts.

Therefore, as shown in FIG. 11, the switch element 1 is mounted on the same chip as the photodiode array 109a.
Although it is conceivable to provide the semiconductor device 15, it may be difficult to manufacture the semiconductor device due to a difference in semiconductor manufacturing process. Further, in actual manufacturing, chips are taken out from a silicon wafer having a certain radius. However, if the number of chips that can be taken out from one silicon wafer decreases, the cost increases. From the viewpoint of manufacturing yield, if the photodiode array 109a and the switch element 115 are one chip, if any one of the chips has a defect, the chip cannot be used, the yield becomes poor, and the cost increases.

Also, as shown in FIG. 12, even when the output of the photodiode array 109a is taken out from the connector 117 by a cable or the like, the width of the PCB 107a is larger than the width Wa of the radiation detection portion due to the wiring density of the pattern portion 121 of the PCB 107a. Wb becomes wider. FIG.
As shown in FIG. 3, even when the switch elements 115 are arranged on the same PCB 107a and are taken out after reducing the number of output elements, the width of the PCB 107a is wider than the width of the radiation detection portion due to the restriction of the pattern portion 121, The radiation detector blocks cannot be arranged on the same circumference.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and is free from restrictions on a manufacturing process and mounting.
An object of the present invention is to provide a radiation detector capable of extracting a required signal.

[0012]

In order to achieve the above object, according to the present invention, a radiation detecting means for converting incident radiation into an electric signal, and an electric signal converted by the radiation detecting means are bundled or Bundling / selecting means to be selected, wiring means for extracting an electric signal bundled or selected by the bundling / selecting means, between the radiation detecting means and the bundling / selecting means, and the bundling / selecting means and wiring means And a connection means for electrically connecting the output signal lines of the radiation detection means with the number of output signal lines of the bundling / selection means.

[0013] In the radiation detector according to the first aspect,
The number of output signal lines of the bundling / selecting means for bundling or selecting the electric signals converted by the radiation detecting means for converting incident radiation into electric signals is made smaller than the number of output signal lines of the radiation detecting means. . This allows
Necessary signals can be extracted without being restricted by a manufacturing process or mounting.

[0014] The connecting means may electrically connect the radiation detecting means and the binding / selecting means and the binding / selecting means and the wiring means by wire bonding or bump bonding. May be.

Further, the radiation detecting means includes a radiation-light converting means for converting incident radiation into light, and a light-electric signal converting means for converting light converted by the radiation-light converting means into an electric signal. May be used, or a semiconductor detector that converts incident radiation into an electric signal may be used.

According to a fifth aspect of the present invention, a scintillator in which scintillator elements for converting incident radiation into light are two-dimensionally arranged and a photodiode for converting light from the scintillator element into an electric signal are two-dimensional. A photodiode array arranged in a shape, bundling / selecting means for bundling or selecting the electric signals converted by the photodiode array, and wiring means for taking out the bundled or selected electric signals by the bundling / selecting means,
Having the number of output signal lines of the bundling / selecting means smaller than the number of output signal lines of the radiation detecting means, and between the photodiode array and the bundling / selecting means,
The gist is to electrically connect the selecting means and the wiring means by wire bonding or bump bonding.

In the radiation detector according to the fifth aspect,
The number of output signal lines of the bundling / selecting means for bundling or selecting the electric signals converted by the photodiode array is reduced from the number of output signal lines of the photodiode array, and the photodiode array, the bundling / selecting means, And the bundling / selection means and the wiring means are electrically connected by wire bonding or bump bonding. This makes it possible to extract necessary signals without being restricted by the manufacturing process or mounting.

Further, the bundling / selecting means may include switching means for switching an electric signal converted by the radiation detecting means or the photodiode array based on an external control signal.

Further, as the bundling / selecting means, one having an electric circuit on one side or one having an electric circuit on both sides with an insulating layer interposed therebetween may be used.

[0020]

FIG. 1 is a block diagram showing an example of the configuration of an X-ray CT system having a radiation detector according to the present invention. In the X-ray CT system 1 shown in FIG. 1, an operation instruction or the like is performed by an operator through the operation unit 3, and the operation of the entire X-ray CT system 1 is controlled by the CPU 5 based on the operation instruction or the like. Then, the X-rays emitted from the X-ray tube 9 under the control of the X-ray control / high voltage generator 7 are converted into electric signals by the radiation detecting unit 11 arranged opposite to the X-ray tube 9 with the subject interposed therebetween. Is done. The converted electric signal is supplied to a switch circuit 15 based on a control signal from the switch control unit 13.
After being bundled or selected by the data collection device 1
7 (DAS) and stored by the data storage device 19. Then, an image is reconstructed by the image reconstruction device 21 based on the signal collected by the data collection device 17. The reconstructed image is stored in the image storage device 23, and is subjected to image processing by the image processing device 25 as necessary, and is displayed on the image display unit 27. still,
The gantry / bed 29 a is controlled by the gantry / bed drive control device 29.

The radiation detector according to the present invention has the radiation detection section 11 and the switch circuit 15, and can extract necessary signals without being restricted by the manufacturing process or the mounting. I have to.

FIG. 2A is a plan view showing a first embodiment of the radiation detector according to the present invention, and FIG.
It is sectional drawing. FIG. 2C is an enlarged cross-sectional view of a main part.

As shown in FIGS. 2A, 2B, and 2C, the radiation detector 11-1 of the first embodiment includes a PCB 31.
A detection element (photodiode) provided on the upper surface of the PCB 31 in a two-dimensional matrix, and a photodiode array 33 for converting light converted from X-rays by a scintillator (not shown) into an electric signal;
A switch unit 35 provided on the upper surface of the PCB 31 and serving as a bundling / selection unit for bundling or selecting the electric signal converted by the photodiode array 33, and an electric device provided on the upper surface of the PCB 31 and bundled or selected by the switch unit 35 FPC (Flexible Printed Circuit Board) 37 as a wiring means for extracting a signal to the outside
And a wire bonding portion 39 as connection means for electrically connecting the photodiode array 33 to the switch portion 35 and the switch portion 35 to the FPC 37 by wires.
And Further, the FPC 37 is supported by the support portion 41.

Although the scintillator is omitted in FIG. 2, the scintillator is actually arranged on the upper surface of the photodiode array as shown in FIG. X-rays are converted to light by the scintillator, and the converted light is converted to electric signals by the photodiode array 33.

The switch unit 35 has, for example, four signal lines for supplying electric signals on the input side, and when reducing these to two signal lines, as shown in FIG.
~ 35a8. One side of the switches 35a1 to 35a4 is connected to the four signal lines on the input side, and the other side is connected to the right side signal line on the output side.
One side of a8 is connected to four signal lines on the input side, and the other side is connected to signal lines on the left side on the output side.

In this case, for example, when the switches 35a1 and 35a2 are turned on and the switches 35a7 and 35a8 are turned on and the other switches are turned off, the electric signals input to the two left signal lines on the input side are bundled. Electrical signals output from the right signal line on the output side and input to the two right signal lines on the input side are bundled and output from the left signal line on the output side. Also, for example, switch 35a1 is set to O
When N is performed and the switch 35a6 is turned on and the other components are turned off, the electric signals input to the two left signal lines on the input side are selected and output. The switch unit 35
Is not limited to the circuit configuration shown in FIG. 3, but may be another circuit configuration.

In the first embodiment, the number of electric signals (signal lines) output from the photodiode array 33 is equal to the number of the matrices. Each of the electric signals is supplied to the switch unit 35 by the wire bonding unit 39. .
In the switch unit 35, the bundle of electric signals and the selection of necessary electric signals are performed, and the number of electric signals smaller than the number of the matrices of the photodiode array 33 is output. The electric signal having the reduced number is transmitted to the wire bonding section 39.
To output to the FPC 37. The electric signal output to the FPC 37 is supplied to the data collection device via a connector, a PCB, and the like.

As described above, in the radiation detector 11-1 of the first embodiment, even if the pitch of the signal lines from the photodiode array 33 is too narrow to directly wire-bond to an FPC or the like, the switch can be used. Since the electric signal (signal line) is reduced by the unit 35, the FP
C can be wire-bonded, and a required electric signal can be taken out to the data collection device without being restricted by a manufacturing process or a PCB mounting.

FIG. 4A is a plan view showing a second embodiment of the radiation detector according to the present invention, and FIG.
It is sectional drawing. FIG. 4C is an enlarged cross-sectional view of a main part. In the second embodiment, the photodiode array 33, the switch unit 35, and the switch unit and the FPC 3
7 is electrically connected by a bump bonding section 43.

As shown in FIGS. 4A, 4B, and 4C, the radiation detector 11-2 of the second embodiment includes a PCB 31.
A detection element (photodiode) provided on the upper surface of the PCB 31 in a two-dimensional matrix, and a photodiode array 33 for converting light converted from X-rays by a scintillator (not shown) into an electric signal;
A switch unit 35 provided on the upper surface of the PCB 31 and serving as a bundling / selection unit for bundling or selecting the electric signal converted by the photodiode array 33, and an electric device provided on the upper surface of the PCB 31 and bundled or selected by the switch unit 35 It has an FPC 37 as a wiring means for extracting signals to the outside, a bump bonding part 43 as a connecting means for electrically connecting the photodiode array 33 and the switch part 35 and the switch part 35 and the FPC 37 by bumps. Further, the FPC 37 is supported by the support portion 41.

Although the scintillator is omitted in FIG. 4 as in FIG. 1, the scintillator is actually arranged on the upper surface of the photodiode array as shown in FIG. X-rays are converted to light by the scintillator, and the converted light is converted to electric signals by the photodiode array 33. Also, the switch unit 3 of the second embodiment
5 has the same configuration as the switch unit 35 of the first embodiment.

In the second embodiment, an electric signal output from the photodiode array 33 is supplied to the switch unit 35 by the bump bonding unit 43. In the switch unit 35, the bundle of electric signals and the selection of necessary electric signals are performed, and the number of electric signals smaller than the number of the matrices of the photodiode array 33 is output. The electric signal having the reduced number is subjected to FPC by the bump bonding section 43.
37. The electric signal output to the FPC 37 is supplied to the data collection device via a connector, a PCB, and the like.

As described above, in the radiation detector 11-2 of the second embodiment, even if the pitch of the signal lines from the photodiode array 33 is too narrow to be directly bump-bonded to an FPC or the like, the switch can be used. Since the electric signal (signal line) is reduced by the unit 35, the FP
B can be bump-bonded to C or the like, and a required electric signal can be taken out to the data collection device without being restricted by a manufacturing process or a PCB mounting.

FIG. 5A is a plan view showing a third embodiment of the radiation detector according to the present invention, and FIG.
It is sectional drawing. FIG. 5C is an enlarged sectional view of a main part. In the third embodiment, the photodiode array 33 and the switch unit 35 are connected to the wire bonding unit 3.
9, and the switch unit 35 and the FPC 37
Are electrically connected by a bump bonding portion 43.

As shown in FIGS. 5A, 5B, and 5C, the radiation detector 11-3 of the third embodiment includes a PCB 31.
A detection element (photodiode) provided on the upper surface of the PCB 31 in a two-dimensional matrix, and a photodiode array 33 for converting light converted from X-rays by a scintillator (not shown) into an electric signal;
A switch unit 35 provided on the upper surface of the PCB 31 and serving as a bundling / selection unit for bundling or selecting the electric signal converted by the photodiode array 33, and an electric device provided on the upper surface of the PCB 31 and bundled or selected by the switch unit 35 An FPC 37 as a wiring unit for extracting a signal to the outside; a wire bonding unit 39 as a connection unit for electrically connecting the photodiode array 33 and the switch unit 35 with wires;
And a bump bonding portion 43 as a connecting means for electrically connecting the FPC 37 to the FPC 37 by bumps. Further, the FPC 37 is supported by the support portion 41.

Although the scintillator is omitted in FIG. 5 as in FIG. 1, the scintillator is actually arranged on the upper surface of the photodiode array as shown in FIG. X-rays are converted to light by the scintillator, and the converted light is converted to electric signals by the photodiode array 33. The switch unit 3 of the third embodiment
5 has the same configuration as the switch unit 35 of the first embodiment.

In the third embodiment, the electric signal output from the photodiode array 33 is supplied to the switch unit 35 by the wire bonding unit 39. In the switch unit 35, the bundle of electric signals and the selection of necessary electric signals are performed, and the number of electric signals smaller than the number of the matrices of the photodiode array 33 is output. The electric signal having the reduced number is subjected to FPC by the bump bonding section 43.
37. The electric signal output to the FPC 37 is supplied to the data collection device via a connector, a PCB, and the like.

As described above, in the radiation detector 11-3 of the third embodiment, when the pitch of the signal lines from the photodiode array 33 is too narrow, it is impossible to perform wire bonding or bump bonding directly to an FPC or the like. However, since the number of electric signals (signal lines) is reduced by the switch unit 35, bump bonding to an FPC or the like can be performed, and the required electric power can be reduced without being restricted by a manufacturing process or a PCB mounting. The signal can be taken out to the data collection device.

FIG. 6A is a plan view showing a fourth embodiment of the radiation detector according to the present invention, and FIG.
It is sectional drawing. FIG. 6C is an enlarged sectional view of a main part. In the fourth embodiment, the photodiode array 33 and the switch unit 35 are connected to the bump bonding unit 4.
3 and electrically connected to the switch unit 35 and the FPC 37.
Are electrically connected by a wire bonding portion 39.

As shown in FIGS. 6A, 6B, and 6C, the radiation detector 11-4 of the fourth embodiment includes a PCB 31.
A detection element (photodiode) provided on the upper surface of the PCB 31 in a two-dimensional matrix, and a photodiode array 33 for converting light converted from X-rays by a scintillator (not shown) into an electric signal;
A switch unit 35 provided on the upper surface of the PCB 31 and serving as a bundling / selection unit for bundling or selecting the electric signal converted by the photodiode array 33, and an electric device provided on the upper surface of the PCB 31 and bundled or selected by the switch unit 35 An FPC 37 as a wiring unit for extracting a signal to the outside; a bump bonding unit 43 as a connecting unit for electrically connecting the photodiode array 33 and the switch unit 35 by bumps;
And a FPC 37 and a wire bonding portion 39 as a connecting means for electrically connecting the FPC 37 with a wire. Further, the FPC 37 is supported by the support portion 41.

Although the scintillator is omitted in FIG. 6 as in FIG. 1, the scintillator is actually arranged on the upper surface of the photodiode array as shown in FIG. X-rays are converted to light by the scintillator, and the converted light is converted to electric signals by the photodiode array 33. Also, the switch unit 3 of the fourth embodiment
5 has the same configuration as the switch unit 35 of the first embodiment.

In the fourth embodiment, an electric signal output from the photodiode array 33 is supplied to the switch unit 35 by the bump bonding unit 43. In the switch unit 35, the bundle of electric signals and the selection of necessary electric signals are performed, and the number of electric signals smaller than the number of the matrices of the photodiode array 33 is output. The electric signal having the reduced number is subjected to FPC by the wire bonding section 39.
37. The electric signal output to the FPC 37 is supplied to the data collection device via a connector, a PCB, and the like.

As described above, in the radiation detector 11-4 of the fourth embodiment, when the pitch of the signal line from the photodiode array 33 is too narrow, it is impossible to perform bump bonding or wire bonding directly to an FPC or the like. However, since the number of electric signals (signal lines) is reduced by the switch unit 35, it is possible to perform wire bonding to an FPC or the like. The signal can be taken out to the data collection device.

FIG. 7 is a sectional view showing a fourth embodiment of the radiation detector according to the present invention. In the fifth embodiment, the photodiode array 33 and the switch unit 35 are electrically connected by the wire bonding unit 39 and the bump bonding unit 43, and the switch unit 35 and the FPC 37 are electrically connected by the wire bonding unit 39 and the bump bonding unit 43. It is to connect to each other.

As shown in FIG. 7, the radiation detector 11-5 of the fifth embodiment is provided on a PCB 31 and an upper surface of the PCB 31, and has a two-dimensional matrix of detection elements (photodiodes). A photodiode array 33 for converting light converted from X-rays by a non-scintillator into an electric signal; and a bundling / selecting means provided on the upper surface of the PCB 31 for bundling or selecting the electric signal converted by the photodiode array 33. A switch section 35, an FPC 37 provided on the upper surface of the PCB 31 and serving as wiring means for taking out the electric signals bundled or selected by the switch section 35, a photodiode array 33, the switch section 35, and the switch sections 35 and FPC 37 And as connection means for electrically connecting by wire Wire bonding portion 39 and,
And a bump bonding portion 43 as connection means for electrically connecting by bumps. Also, the FPC 37
It is supported by the support portion 41.

Although the scintillator is omitted in FIG. 7 as in FIG. 1, the scintillator is actually arranged on the upper surface of the photodiode array as shown in FIG. X-rays are converted to light by the scintillator, and the converted light is converted to electric signals by the photodiode array 33. Further, the switch unit 3 of the fifth embodiment
5 has the same configuration as the switch unit 35 of the first embodiment.

In the fifth embodiment, an electric signal output from the photodiode array 33 is supplied to the switch unit 35 by the wire bonding unit 39 and the bump bonding unit 43. In the switch unit 35, the bundle of electric signals and the selection of necessary electric signals are performed, and the number of electric signals smaller than the number of the matrices of the photodiode array 33 is output. The switch unit 35 may generate a high circuit as a different element on the wire bonding unit 39 side and the bump bonding unit 43 side, or may be electrically connected inside and exchange electric signals. The reduced number of electrical signals is output to the FPC 37 by the wire bonding unit 39 and the bump bonding unit 43. The electric signal output to the FPC 37 is supplied to the data collection device via a connector, a PCB, and the like.

As described above, in the radiation detector 11-4 of the fifth embodiment, when the pitch of the signal lines from the photodiode array 33 is too narrow, it is impossible to perform wire bonding or bump bonding directly to an FPC or the like. However, by reducing the number of electric signals (signal lines) by the switch unit 35 and dispersing the signal lines by the wire bonding unit 39 and the bump bonding unit 43, the FPC
For example, wire bonding and bump-bump bonding can be performed, and a required electric signal can be extracted to the data collection device without being restricted by a manufacturing process or a PCB mounting.

Although the above embodiment has been described by taking as an example the case where the present invention is applied to a radiation detector using a scintillator and a photodiode, the present invention is not limited to this. The present invention can also be applied to a semiconductor detector or a gas detector arranged in a shape, and a radiation detector using a scintillator and a photomultiplier tube. In addition, in addition to electric signals from the radiation detector, signals for operation of the radiation detector, power supply, control signals for the switch unit, power supply, and other signals are also provided to each element by wire bonding, bump bonding, and other electrical connections. Supplied by

[0050]

As described above, according to the first aspect of the present invention, the number of output signal lines of the bundling / selecting means for bundling or selecting electric signals is made smaller than the number of output signal lines of the radiation detecting means. Thus, it is possible to extract necessary signals without being restricted by the manufacturing process or the mounting.

According to the fifth aspect of the present invention, the number of output signal lines of the bundling / selecting means for bundling or selecting the electric signals converted by the photodiode array is set to the number of output signal lines of the photodiode array. Since it is configured to further reduce the number of wires and electrically connect between the photodiode array and the bundling / selection means and between the bundling / selection means and the wiring means by wire bonding or bump bonding, manufacturing is performed. Necessary signals can be extracted without being affected by process restrictions or mounting restrictions.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a schematic configuration of a radiation detector according to the present invention.

FIG. 2 is a diagram showing a first embodiment of the radiation detector according to the present invention.

FIG. 3 is a diagram illustrating a wiring example of a switch unit.

FIG. 4 is a view showing a second embodiment of the radiation detector according to the present invention.

FIG. 5 is a view showing a third embodiment of the radiation detector according to the present invention.

FIG. 6 is a view showing a fourth embodiment of the radiation detector according to the present invention.

FIG. 7 is a view showing a fifth embodiment of the radiation detector according to the present invention.

FIG. 8 is a diagram showing a schematic configuration of a third-generation X-ray CT apparatus.

FIG. 9 is a diagram illustrating a schematic configuration example of a radiation detector block.

FIG. 10 is a diagram illustrating a schematic configuration example of a radiation detector block including a two-dimensional photodiode array in which a detection element is divided in a body axis direction and a two-dimensional scintillator.

FIG. 11 is a diagram illustrating a schematic configuration example of a radiation detector block including a switch element on the same chip as a photodiode array.

FIG. 12 is a diagram showing a schematic configuration example of a radiation detector block configured to extract a signal from an output of a photodiode array from a connector with a cable or the like.

FIG. 13 is a block diagram showing a schematic configuration of a conventional example in which switch elements are arranged on the same PCB and a signal is taken out after reducing the number of output elements.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Radiation detector 3 Operation part 5 CPU 7 X-ray control / high voltage generator 9 X-ray tube 11 Radiation detection part 11-1, 11-2, 11-3, 11-4, 11-5 Radiation detector 13 Switch Control unit 15 Switch circuit 17 Data collection device 19 Data storage device 21 Image reconstructing device 23 Image storage device 25 Image processing device 27 Image display unit 29a Mount / bed 29 Mount / bed drive control unit 31 PCB 33 Photodiode array 35 Switch unit 35a1, 35a1, 35a2, 35a3, 35a4, 35a5, 3
5a6, 35a7, 35a8 Switch 37 FPC 39 Wire bonding part 41 Support part 43 Bump bonding part

Claims (7)

[Claims] 1. A radiation detecting means for converting incident radiation into an electric signal; a bundling / selecting means for bundling or selecting the electric signal converted by the radiation detecting means; and a bundling / selecting means for bundling or selecting by the bundling / selecting means. Wiring means for extracting the electric signal, and a connection means for electrically connecting the radiation detection means and the bundling / selection means, and between the bundling / selection means and the wiring means, A radiation detector wherein the number of output signal lines of the bundling / selecting means is smaller than the number of output signal lines of the radiation detecting means. 2. The method according to claim 1, wherein the connection unit electrically connects the radiation detection unit and the bundling / selection unit and the bundling / selection unit and the wiring unit by wire bonding or bump bonding. The radiation detector according to claim 1, wherein: 3. A radiation-light conversion means for converting incident radiation into light, and a light-light conversion means for converting light converted by the radiation-light conversion means into an electric signal.
2. An electric signal converting means.
A radiation detector as described. 4. The radiation detector according to claim 1, wherein said radiation detection means is a semiconductor detector that converts incident radiation into an electric signal. 5. A scintillator in which scintillator elements for converting incident radiation into light are two-dimensionally arranged, and a photodiode array in which photodiodes for converting light from the scintillator element into electric signals are arranged two-dimensionally. Bundling / selection means for bundling or selecting the electric signals converted by the photodiode array, and wiring means for taking out the bundled or selected electric signals by the bundling / selection means. The number of output signal lines is reduced from the number of output signal lines of the photodiode array, and wire bonding is performed between the photodiode array and the binding / selecting means and between the binding / selecting means and the wiring means. Alternatively, a radiation detector characterized by being electrically connected by bump bonding. 6. The bundling / selecting means includes switching means for switching an electric signal converted by the radiation detecting means or the photodiode array based on an external control signal. The radiation detector according to claim 5. 7. The bundling / selecting means according to claim 1, wherein the bundling / selecting means comprises an electric circuit on one side or an electric circuit on both sides with an insulating layer interposed therebetween. Or a radiation detector according to any one of the preceding claims.