JPH1070376A - Waterproof packing structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a fin from being dipped in a dip soldering tank, to prevent impurities from being mixed in the dip soldering tank and to prevent the deformation of the fin or the like from being generated at the time of a dip soldering by a method wherein when a potting agent is injected in a case, a notch formed in the case is interrupted by the fin provided integrally with a waterproof packing and an outflow of the potting agent is prevented from being generated. SOLUTION: First, a packing 15 with a fin is fitted into a connector 121 and the connector 121 mounted with the packing 15 is incorporated in a substrate 52 to be formed with an electronic component. At the time of a dip soldering, the fin 152 of the packing 15 is bent in the direction of a protrusion 17 formed on the connector 121 and the protrusion 17 is inserted in an engaging hole 153 and is made to engage with the hole 153. Then, when a potting agent is injected in a case, the fin 152 is put in an erect state. Therefore, the potting agent is interrupted by the fin 152 so as to prevent the potting agent from flowing out through a notch part formed in the case. Accordingly, the outflow of the potting agent can be prevented and at the same time, at the time of the dip soldering, the fin 152 can be prevented from being dipped in a dip soldering tank.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a waterproof structure for electronic equipment, and more particularly, to a waterproof packing structure for preventing water from leaking from the periphery of external connection terminals (connectors) of a case containing electronic parts and the like. About.

[0002]

2. Description of the Related Art Various electronic devices are required to have waterproofness and moisture-proofness, and in particular, high performance such as a case for a vehicle-mounted device which accommodates electronic components and the like mounted outside a vehicle compartment. In, waterproofing and moistureproofing are performed by filling a potting agent. FIG. 5 is a cross-sectional view showing a waterproof structure of a conventional case, and FIG. 6 is a perspective view showing a filled state of a potting agent. FIGS. 7A and 7B are explanatory views showing the packing with fins, wherein FIG. 7A is a perspective view showing a state before mounting to a connector, and FIG. 7B is a cross-sectional view showing a solder dip state of the board after mounting.

[0003] In a case 51 made of metal or the like, a substrate 52 on which electric parts and the like are mounted is inserted through an opening 511, and a potting agent 53 made of urethane, epoxy, or the like is injected through the opening 511. . A connector 521 attached to the substrate 52 is provided on the side surface of the case 51.
Is provided with a notch 512 for projecting outward, and the vicinity of the tip of the connector 521 is exposed to the outside of the case 51.

As shown in FIG. 6, an opening 51 of a case 51 is provided.
1, the case 51 is filled with the liquid potting agent 53, and the connector 521 in the notch 512
There is a problem that the potting agent 53 flows out from the upper part of the device.
Therefore, as shown in FIG. 7, a fin 552 is provided on a packing 55 for closely adhering a connector 521 made of rubber or the like to the case 51, and the fin 552 is used to fill the case 51 with the potting agent 53. A method of blocking the liquid potting agent 53 from flowing out from the notch portion 512 is used.

[0005]

SUMMARY OF THE INVENTION Packing with fins 5
5, the connector 521 is connected to the
It is desirable to attach it before fixing (soldering). However, in this case, in the soldering process using a dip solder bath, the fins 552 of the finned packing 55 are immersed in the solder, and there is a problem that impurities are mixed in the solder and the fins 552 are deformed.

The present invention solves the above problem.

[0007]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a case for housing an electronic circuit, wherein a case in which a potting agent is filled and hardened in order to enhance the internal waterproofness, and a case in which the case is cut off. In a waterproof packing which is attached to a connector fixed to a notch so as to make close contact between the case and the connector, the notch is provided integrally with the waterproof packing and closes the notch when a potting agent is injected to prevent the potting agent from flowing out. A fin and a holding means for holding the fin in a predetermined bent state are provided.

Further, the holding means comprises a locking hole provided in the fin, and a projection provided in the connector and engaging with the locking hole. Further, the holding means comprises a projection provided on the fin, and a locking hole provided on the connector and engaging with the projection. Further, the holding means comprises a hook provided at a tip of the fin and hooked on a peripheral portion of the connector.

Further, the holding means is provided on the fin, and comprises a detent portion which comes into contact with the connector when the fin is bent to inhibit the fin from returning. A case for storing an electronic circuit, wherein the case is filled and hardened with a potting agent in order to enhance internal waterproofness, and a case is attached to a connector fixed to a notch of the case, and the case and the connector are in close contact with each other. A fin that is provided integrally with the waterproof packing, closes the notch when the potting agent is injected, and prevents the outflow of the potting agent, and at least a part of the outer periphery of the connector is formed in a circular shape. And a ring-shaped closely contacting portion that forms a portion of the waterproof packing that is in close contact with the packing fixing portion, wherein the waterproof packing is rotatable with respect to the connector.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1A and 1B are perspective views showing a waterproof packing structure according to a first embodiment of the present invention, wherein FIG. 1A shows a connector and packing structure, and FIG. Note that this embodiment has the same configuration as that of FIGS. 5 and 6 except for the packing structure, and a description thereof will be omitted.

The connector 121 serving as an external connection terminal of an electronic device or the like is provided with a cylindrical projection 17. Finned packing 15 made of flexible rubber or the like
Is provided with a connector insertion hole 151 and a fin 152. And the outer periphery is in the notch 512 of the case 51,
The connector insertion hole 151 is formed so as to be in close contact with the connector 121. In the fin 152, near the center,
The cylindrical projection 17 of the connector 121 is held so as to hold the fin 152 in a bent state during the dip soldering of the substrate 52.
A circular locking hole 153 is provided at a position corresponding to the projection 17 so as to be bent and locked.

Next, a method of using the waterproof packing having the above configuration will be described. First, the finned packing 15 is connected to the connector 12.
Fit into 1. Next, the connector 121 having the finned packing 15 attached to the substrate 52 forming the electronic circuit is assembled. At the time of dip soldering, the fin 152 of the finned packing 15 is connected to the connector 1 as shown in FIG.
21 is bent in the direction of the projection 17, and the locking hole 153 is formed in the projection 1
7 and lock it.

When the soldering step is completed, the engagement between the projection 17 and the locking hole 153 is released, and the fin 152 is erected. Then, the substrate 52 is inserted through the opening 511 of the case 51,
The board 52 is attached to the case 51 with screws (not shown) so that the connector 121 is fixed to the notch 512 of the case 51. Next, the potting agent 53 is injected. At this time, the fins 152 of the packing 15 with the fins are in an upright state as shown in FIG. It is blocked so as not to flow out.

As described above, in this embodiment, the fins 152
When the potting agent 53 is injected, the notch 5
Block the potting agent 53 from leaking from 12,
At the time of solder dipping, the projection 17 and the engagement hole 153 are bent so as to be bent.
Can be prevented, and the fins 152 can be prevented from being immersed in the dip soldering tank at the time of dip soldering.

In this embodiment, the connector 17 has the projection 17 and the finned packing 15 has the locking hole 153. However, the connector 121 may have the locking hole 153 and the finned packing 15 may have the projection 17. The same effect as in the present embodiment can be expected. FIG. 2 is a perspective view showing a waterproof packing structure according to a second embodiment of the present invention, wherein FIG.
(B) shows the packing structure before the solder dip of the substrate. Note that the present embodiment has the same configuration as that of FIGS. 5 and 6 except for the packing structure, and thus the description thereof is omitted.

A finned packing 25 made of flexible rubber or the like has a connector insertion hole 251 and a fin 2.
52 are provided. And packing 2 with fins
5 is formed so as to be in close contact with the notch 512 of the case 51, and the connector insertion hole 251 is formed so as to be in close contact with the connector 221. The fin 252 has a hook-shaped hooking portion 25 which is hooked on the peripheral portion 222 of the connector 221 (the end of the case portion of the connector 221) near the center of the upper end thereof.
4 are provided so that the fins 252 of the substrate 52 during the dip soldering can be held in a state of being bent toward the connector 221 side.

Next, a method of using the waterproof packing having the above configuration will be described. First, the finned packing 25 is connected to the connector 22.
Fit into 1. Next, the connector 221 having the finned packing 25 attached to the substrate 52 forming the electronic circuit is assembled. At the time of dip soldering, the fin 252 of the finned packing 25 is connected to the connector 2 as shown in FIG.
The bending hook 254 is hooked on the peripheral edge 222 of the connector 221 in the direction 21.

When the soldering process is completed, the hook-shaped hook 25
4 and the peripheral portion 222 of the connector 221 are released, and the fin 252 is erected. Then, the substrate 52 is connected to the case 51.
Of the case 51 is inserted through the opening 511 of the case 51.
The board 52 is attached to the case 51 with screws (not shown) so that the connector 221 is fixed to the case 51. Next, the potting agent 53 is injected. At this time, the fins 252 of the packing 25 with the fins are in an upright state as shown in FIG. It is blocked so as not to flow out.

As described above, in this embodiment, the fin 252
When the potting agent 53 is injected, the notch 5
Block the potting agent 53 from leaking from 12,
At the time of solder dip, since the bent portion is formed by hooking the hooking portion 254 to the peripheral portion 222 of the connector 221, the outflow of the potting agent 53 can be prevented. Can be protected from immersion.

FIGS. 3A and 3B are diagrams showing a waterproof packing structure according to a third embodiment of the present invention. FIG. 3A is a packing structure, FIG. 3B is a state when solder is dipped, and FIG. The state at the time is shown. Note that this embodiment has the same configuration as FIGS. 5 and 6 except for the packing structure.
The description is omitted. A connector insertion hole 351 and a fin 352 are provided in the finned packing 35 formed of flexible rubber or the like. The fin 352 is provided with a detent portion 355 for preventing the fin 352 bent toward the connector insertion hole from returning. In addition, AA '
Indicates a portion that can be bent during solder dip. As shown in FIG. 3B, the detent 355 contacts the connector 321 during the solder dip (bend of the fin 352) to maintain the bent state of the fin 352, and injects a potting agent (the fin 352 stands upright). At the time, it is formed so as to fit into the groove 323 provided in the connector 321, and these two states can be switched by deforming the fin 352 by applying a slight force. The outer periphery of the finned packing 35 is formed in the notch portion 512 of the case 51, and the connector insertion hole 351 is formed in close contact with the connector 321.

Next, a method of using the waterproof packing having the above configuration will be described. First, the finned packing 35 is connected to the connector 32.
Fit into 1. At this time, the detent 355 fits into the groove 323. Next, a connector 321 having the finned packing 35 attached to a substrate 52 forming an electronic circuit is assembled. Then, at the time of dip soldering, the fins 352 of the finned packing 35 are bent so as to come into contact with the connector 321 as shown in FIG. At this time, the detent 355 comes off the groove 323 due to the bending stress of the fin 352, and the connector 3
21, and the bent state of the fin 352 is maintained.

When the soldering process is completed, the fins 352 are lifted upright and upright.
55 is slightly deformed and fitted into the groove 323 again, and the fin 3
The upright state of 52 is maintained. Then, the substrate 52 is
The board 52 is attached to the case 51 by screws (not shown) so that the connector 321 is fixed to the notch 512 of the case 51 through the opening 511 of the case 51. Next, the potting agent 53 is injected. At this time, the finned packing 35 has the detent 355 inserted into the groove 323 of the connector 321 and the fin 352 is in an upright state as shown in FIG. , Potting agent 53 in case 5
It is blocked so that it does not flow out of the notch 512 of one.

As described above, in this embodiment, the fins 352
When the potting agent 53 is injected, the notch 5
Block the potting agent 53 from leaking from 12,
The fins 352 are held in a bent state by the contact between the fins 352 and the connector 321 at the time of solder dip, so that the potting agent 53 can be prevented from flowing out, and the fins 352 are not immersed in the dip solder bath at the time of dip soldering. be able to.

FIG. 4 is a structural view showing a waterproof packing structure according to a fourth embodiment of the present invention, in which (a) is a packing structure, (b) is a state when solder is dipped, and (c) is a potting agent injection. The state at the time is shown. Note that this embodiment has the same configuration as FIGS. 5 and 6 except for the packing structure.
The description is omitted. The connector 421, which is a terminal for external connection of an electronic device or the like, has a cylindrical outer shape at the front portion (left side in FIG. 4B) into which the finned packing 45 is inserted. A finned packing 45 made of flexible rubber or the like has a connector insertion hole 451 and a fin 4.
52 are provided. When the connector 421 is inserted, the connector insertion hole 451 is formed in a circular shape so as to be in close contact with the cylindrical outer shape of the connector 421.
Is formed in such a shape as to be able to close off. Then, the finned packing 4 inserted into the connector 421
5 has a circular engaging portion, so that the fin 452 can be rotatably rotated around the connector 421.

Next, a method of using the waterproof packing having the above configuration will be described. First, the finned packing 4 is attached to the connector 421.
5 is inserted. Next, a connector 421 in which the packing 45 with fins is attached to the substrate 52 forming an electronic circuit is assembled. At the time of dip soldering, the fin 452 of the finned packing 45 is connected to the connector 4 as shown in FIG.
21 so that the fin 452 is positioned on the lower side of the drawing (the fin 452 is on the side opposite to the dip solder surface of the substrate 52).

Next, when the soldering process is completed, the fin 45
2 is rotated to a position where the fins 452 close the cutout portions 512 of the case 51 when the substrate 52 is mounted on the case 51 (FIG. 4C). Then, the substrate 52 is connected to the case 51.
Through the opening 511 of the case 51 and the notch 512 of the case 51.
The board 52 is attached to the case 51 by screws (not shown) so that the connector 421 is fixed to the case 51. In this state,
As shown in FIG. 4 (c), the finned packing 45 has the fin 452 positioned above the connector 421 in the drawing (the position where the fin 452 can close the cutout portion 512 of the case 51). Occasionally, the fins 452 block the potting agent 53 from flowing out of the notch 512 of the case 51.

As described above, in this embodiment, the fin 452
When the potting agent 53 is injected, the potting agent 53 can be prevented from leaking out by blocking the notching portion 512 so that the potting agent 53 does not leak. Also, at the time of solder dip, the fin 352 is rotated to the opposite side of the connector 321 so that the fin 452 Can be prevented from being immersed in the dip solder bath.

[0028]

As described above, according to the waterproof packing structure of the present invention, the fins provided on the waterproof packing prevent the potting agent from flowing out of the notch of the case when the potting agent is injected, and the fins during the dip soldering. Can be prevented from being immersed in the solder, mixing impurities with the solder, and deforming the fins.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a waterproof packing structure according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a waterproof packing structure according to a second embodiment of the present invention.

FIG. 3 is a configuration diagram showing a waterproof packing structure according to a third embodiment of the present invention.

FIG. 4 is a configuration diagram illustrating a waterproof packing structure according to a fourth embodiment of the present invention.

FIG. 5 is a sectional view showing a waterproof structure of the case.

FIG. 6 is a perspective view showing a filling state of a potting agent.

FIG. 7 is an explanatory view showing a finned packing.

[Explanation of symbols]

 121 ··· Connector 15 ···· Packing with fin 151 ··· Connector insertion hole 152 ··· Fin 153 ··· Locking hole 17 ··· Projection 52 ··· substrate

Claims (6)

[Claims] 1. A case for accommodating an electronic circuit, wherein the case is filled with a potting agent and hardened in order to enhance waterproofness inside, and a case is attached to a connector fixed to a notch of the case. A fin provided integrally with the waterproof packing, which closes the notch at the time of injecting the potting agent to prevent the outflow of the potting agent; and holding the fin in a predetermined bent state. Means for providing a waterproof packing structure. 2. The waterproof packing structure according to claim 1, wherein said holding means comprises a locking hole provided in said fin, and a projection provided in said connector and engaging with said locking hole. . 3. The waterproof packing structure according to claim 1, wherein the holding means comprises a projection provided on the fin, and a locking hole provided on the connector and engaging with the projection. 4. The waterproof packing structure according to claim 1, wherein said holding means comprises a hook provided at a tip of said fin and hooked on a peripheral portion of said connector. 5. The holding means is provided on the fin,
2. The waterproof packing structure according to claim 1, further comprising a detent portion that abuts on the connector when the fin is bent to prevent the fin from returning. 6. A case for accommodating an electronic circuit, wherein the case is filled with a potting agent and hardened in order to enhance internal waterproofness, and the case and the connector are attached to a connector fixed to a notch of the case. A fin that is provided integrally with the waterproof packing, closes the notch during injection of the potting agent and prevents the outflow of the potting agent, and at least a part of the outer periphery of the connector is circular. A seal fixing portion formed as a ring, and an annular close contact portion forming a portion of the waterproof packing that is in close contact with the packing fixing portion, wherein the waterproof packing is rotatable with respect to the connector. Waterproof packing structure.