JPH1041593A - Printed wiring board, and its boring method - Google Patents

Printed wiring board, and its boring method

Info

Publication number
JPH1041593A
JPH1041593A JP21438096A JP21438096A JPH1041593A JP H1041593 A JPH1041593 A JP H1041593A JP 21438096 A JP21438096 A JP 21438096A JP 21438096 A JP21438096 A JP 21438096A JP H1041593 A JPH1041593 A JP H1041593A
Authority
JP
Japan
Prior art keywords
hole
small
diameter
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21438096A
Other languages
Japanese (ja)
Other versions
JP3843497B2 (en
Inventor
Toru Furuta
徹 古田
Tsutomu Sato
努 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP21438096A priority Critical patent/JP3843497B2/en
Publication of JPH1041593A publication Critical patent/JPH1041593A/en
Application granted granted Critical
Publication of JP3843497B2 publication Critical patent/JP3843497B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching

Abstract

PROBLEM TO BE SOLVED: To bore a specified size of slot which has a smooth inwall, easily and surely in the specified position. SOLUTION: In a printed wiring board where a slot 1 is bored in an insulating board, the above slot 1 is made by boring a large-diameter hole 2 at the center position and two pieces each of small-diameter holes 11-14 at the right and left of this large-diameter hole 2. Moreover, the centers of the circles of the large-diameter hole 2 and the small-diameter holes 11-14 are arranged at regular intervals on the same axis, and besides the interval between the centers of the outermost small-diameter holes 11 and 14 positioned at the right and left outermost parts is smaller than the radii R of the small-diameter holes 11-14.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【技術分野】本発明は,プリント配線板,特にはそれに
穿設した長穴の形状及び該長穴の穴明け方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, and more particularly to a shape of a long hole formed in the printed wiring board and a method of drilling the long hole.

【0002】[0002]

【従来技術】例えば図5に示すごとく,プリント配線板
9は,絶縁基板91の中央部分に回路形成部92を有す
ると共に,周縁部に多数の長穴8を有している。上記長
穴8は,プリント配線板9にスルーホールの穿設を行な
ったり,多くの回路形成工程を施す場合等において,プ
リント配線板9を所定の基準位置に位置決めするために
設けてある。
2. Description of the Related Art For example, as shown in FIG. 5, a printed wiring board 9 has a circuit forming portion 92 at a central portion of an insulating substrate 91, and has a number of elongated holes 8 at a peripheral portion. The slot 8 is provided for positioning the printed wiring board 9 at a predetermined reference position when a through-hole is formed in the printed wiring board 9 or when many circuit forming steps are performed.

【0003】そのため,長穴8は,その大きさ,その長
手方向の軸線が,正規の状態にあるように設けることが
必要である。また,上記長穴8は,プリント配線板9に
モールディング,半田付け等の処理を施す場合等におい
て,その熱によってプリント配線板が膨張,収縮する際
の応力や歪みを回避するために,長円状に穿設してあ
る。
[0003] Therefore, it is necessary to provide the long hole 8 such that its size and its longitudinal axis are in a normal state. The oblong hole 8 is used to avoid stress and distortion when the printed wiring board 9 expands and contracts due to heat when the printed wiring board 9 is subjected to processing such as molding and soldering. It is drilled in a shape.

【0004】そして,従来,上記長穴は,ドリルによる
ステップ加工,或いはルーター加工により穿設されてい
る。上記ドリルによるステップ加工は,図6(A)に示
すごとく,長手方向が軸線85(図5)に沿った長穴8
を穿設するに当たって,数回のドリル穿設を行なう方法
である。この方法では,ドリルを数〜数10μm単位で
その中心位置を移動させ,数回のステップで穴明けし,
長円又は円の連続穴を形成する(特開平4−35248
7号)。
[0004] Conventionally, the long hole is formed by step processing using a drill or router processing. As shown in FIG. 6 (A), the step processing by the above-mentioned drill is performed in a longitudinal direction along the axis 85 (FIG. 5).
In this method, several drills are drilled. In this method, the center of the drill is moved in units of several to several tens of micrometers, and the drill is made in several steps.
An oval or circular continuous hole is formed (JP-A-4-35248)
No. 7).

【0005】[0005]

【解決しようとする課題】しかしながら,上記ドリルに
よるステップ加工法では,図6(B)に示すごとく,最
初の円穴81は正規に穿設できるものの,2回目以降
は,回転するドリル99と絶縁基板との接触により,絶
縁基板がドリル回転方向990と反対方向の矢印911
の方向に逃げる。そのため,出来上がった長穴82の軸
線821は,図6(C)に示すごとく,得ようとする長
穴8の軸線85(図5,図6A)とは異なる方向となっ
てしまい,目的とする長穴が穿設されないという問題が
ある。又,長穴の中央部に明けられるべき穴は,左右の
あらかじめ穿設された穴の方向に逃げて穴明けされる
為,中央部が正規の直径2Rを有しないという問題があ
る。
However, in the stepping method using a drill, as shown in FIG. 6 (B), the first circular hole 81 can be formed normally, but after the second round, it is insulated from the rotating drill 99. The contact with the substrate causes the insulating substrate to move in the direction of the arrow 911 opposite to the drill rotation direction 990.
Escape in the direction of. Therefore, as shown in FIG. 6C, the axis 821 of the completed elongated hole 82 is in a different direction from the axis 85 of the elongated hole 8 to be obtained (FIGS. 5 and 6A). There is a problem that a long hole is not formed. Further, since the hole to be drilled at the center of the elongated hole escapes in the direction of the left and right pre-drilled holes, there is a problem that the center does not have a regular diameter 2R.

【0006】一方,ルーター加工の場合には,基準とな
る穴から,再度位置出しをして穴加工を行なうため,回
路形成部との間の位置精度が悪くなるという問題があ
る。また,上記いずれの場合にも,ドリルの移動,ルー
ターの移動による穴明けのため,長穴の内壁に凹凸が生
じ易い。そのため,プリント配線板の長穴を位置決めピ
ンに挿入して,種々の処理を行なう際に,熱によりプリ
ント配線板が伸縮するとき,長穴の内壁と位置決めピン
との間の摺動がスムーズに行なわれないという問題があ
る。
On the other hand, in the case of the router processing, since the hole is used as a reference hole and the hole is processed again, there is a problem that the positional accuracy with the circuit forming portion is deteriorated. In any of the above cases, the inner wall of the elongated hole is likely to have irregularities because the hole is drilled by the movement of the drill and the movement of the router. Therefore, when the printed wiring board expands and contracts due to heat during various processes by inserting the elongated hole of the printed wiring board into the positioning pin, the sliding between the inner wall of the elongated hole and the positioning pin is performed smoothly. There is a problem that is not.

【0007】本発明はかかる従来の問題点に鑑み,長穴
が円滑な内壁を有し,所定の大きさの長穴を,所定位置
に容易,確実に穿設することができる,プリント配線板
及びその穴明け方法を提供しようとするものである。
SUMMARY OF THE INVENTION In view of the above-mentioned conventional problems, the present invention provides a printed wiring board having a long hole having a smooth inner wall, and allowing a long hole of a predetermined size to be easily and reliably drilled at a predetermined position. And a method for drilling the same.

【0008】[0008]

【課題の解決手段】請求項1の発明は,絶縁基板に長穴
を穿設してなるプリント配線板において,上記長穴は,
その中心位置に大径穴を,また該大径穴の左右にそれぞ
れ2個以上の小径穴を穿設することにより形成してあ
り,また,上記大径穴及び小径穴の円中心は同一軸線上
に等間隔に配置されており,かつ,左右の最外部に位置
する最外小径穴の間の中心間隔は,小径穴の半径Rより
も小さいことを特徴とするプリント配線板にある。
According to a first aspect of the present invention, there is provided a printed wiring board having a long hole formed in an insulating substrate.
A large-diameter hole is formed at the center thereof, and two or more small-diameter holes are formed on each of the left and right sides of the large-diameter hole. The printed wiring board is arranged at equal intervals on a line, and a center interval between outermost small-diameter holes located on the left and right outermost sides is smaller than a radius R of the small-diameter hole.

【0009】本発明において,上記大径穴と,その左右
にそれぞれ2つ以上形成される複数個の小径穴とは,そ
の全ての円中心が同一軸線にあり,しかもこれら複数個
の穴の円中心は等間隔に形成されていることが必要であ
る(図1〜図3)。これにより,長穴の直径方向が上記
軸線に沿って形成されている長穴を得ることができる。
In the present invention, the large-diameter hole and the plurality of small-diameter holes formed two or more on each of the left and right sides have the center of all the circles on the same axis line. The centers need to be formed at equal intervals (FIGS. 1 to 3). This makes it possible to obtain a long hole whose diametrical direction is formed along the axis.

【0010】次に,本発明の作用効果につき説明する。
本発明においては,上記長穴が上記形状を有している。
そのため,長穴の内壁が円滑である。それ故,プリント
配線板を位置決めピンにセットし,プリント配線板に各
種の処理を施す際に,熱によりプリント配線板が伸縮し
ても,プリント配線板は自由に伸縮し,拘束されない。
Next, the operation and effect of the present invention will be described.
In the present invention, the long hole has the above shape.
Therefore, the inner wall of the elongated hole is smooth. Therefore, when the printed wiring board is set on the positioning pins and various processes are performed on the printed wiring board, even if the printed wiring board expands and contracts due to heat, the printed wiring board expands and contracts freely and is not restrained.

【0011】また,上記長穴は,上記のごとく,1つの
大径穴を中心として,その左右に各2つづつの小径穴を
穿設することにより形成してあるため,所定の大きさの
長穴を所定位置に,容易確実に穿設することができ,穴
明けが容易である。
Further, as described above, the long hole is formed by drilling two small-diameter holes on the left and right sides of one large-diameter hole, respectively, as described above. A hole can be easily and reliably drilled at a predetermined position, and drilling is easy.

【0012】次に,請求項2の発明のように,上記大径
穴の半径は,小径穴の半径R+0.0125〜0.05
mmの範囲にあることが好ましい。これにより,長穴の
内壁を一層円滑にすることができる。なお,上記小径穴
の半径Rは,得ようとする長穴の大きさによって異なる
が,通常は0.5〜1.5mmの範囲である。それ故,
大径穴の半径は,通常0.5125〜1.55mmの範
囲にある。
Next, as in the second aspect of the present invention, the radius of the large-diameter hole is equal to the radius R of the small-diameter hole + 0.0125 to 0.05.
mm. Thereby, the inner wall of the elongated hole can be further smoothed. The radius R of the small hole varies depending on the size of the long hole to be obtained, but is usually in the range of 0.5 to 1.5 mm. Therefore,
The radius of the large diameter hole is usually in the range of 0.5125 to 1.55 mm.

【0013】次に,請求項3の発明のように,上記プリ
ント配線板における長穴を穿設するに当たり,まず,上
記最外小径穴をそれぞれ穿設し,次いで最外小径穴と大
径穴との間に,両者の間隔を2等分する位置に,中間小
径穴をそれぞれ穿設し,その後大径穴を穿設することを
特徴とするプリント配線板の穴明け方法がある。
Next, in forming the long hole in the printed wiring board as in the third aspect of the present invention, the outermost small diameter holes are first formed, and then the outermost small diameter holes and the large diameter holes are formed. There is a method for drilling a printed wiring board characterized in that an intermediate small-diameter hole is formed at a position where the distance between the two is equally divided, and then a large-diameter hole is formed.

【0014】上記小径穴,大径穴の穴明けは,例えばド
リル,パンチを用いて小径穴又は大径穴の各穴毎に行な
う。上記穴明け方法においては,最外小径穴から中心に
向かって順次,小径穴の穿設を行ない,最後に大径穴を
穿設している。そのため,所定の大きさの長穴を所定位
置に,容易,確実に穿設することができる。また,大径
穴は最後に穿設するので,大径穴用のドリル,パンチは
最後に交換すれば良く,作業性が向上する。また,得ら
れる長穴の内壁が円滑である。
Drilling of the small-diameter hole and the large-diameter hole is performed for each small-diameter hole or large-diameter hole using, for example, a drill or a punch. In the above-described drilling method, small-diameter holes are sequentially drilled from the outermost small-diameter hole toward the center, and finally, a large-diameter hole is drilled. Therefore, a long hole of a predetermined size can be easily and reliably drilled at a predetermined position. In addition, since the large-diameter hole is drilled last, the drill and punch for the large-diameter hole can be replaced last, which improves workability. Also, the inner wall of the obtained elongated hole is smooth.

【0015】次に,請求項4の発明のように,上記プリ
ント配線板における長穴を穿設するに当たり,まず長穴
の中心位置に大径穴を穿設し,次いで最外小径穴をそれ
ぞれ穿設し,その後中間小径穴をそれぞれ穿設すること
を特徴とするプリント配線板の穴明け方法がある。この
場合にも,上記請求項3の発明と同様の作用効果を得る
ことができる。但し,大径穴用のドリル等は最初に用
い,その後は小径穴用のドリル等を用いる。更に,本発
明の場合には,最初に,長穴の中心位置に大径穴を穿設
するので,穿設しようとする長穴の中心位置決めが容易
である。
Next, when drilling a long hole in the printed wiring board, a large-diameter hole is first drilled at the center of the long hole, and then the outermost small-diameter hole is formed. There is a method for drilling a printed wiring board, which comprises drilling holes and then drilling intermediate small-diameter holes. In this case, the same operation and effect as the third aspect of the invention can be obtained. However, use a drill for large diameter holes first, and then use a drill for small diameter holes. Furthermore, in the case of the present invention, since a large-diameter hole is first formed at the center position of the long hole, the center of the long hole to be formed can be easily positioned.

【0016】[0016]

【発明の実施の形態】BEST MODE FOR CARRYING OUT THE INVENTION

実施形態例1 本発明の実施形態例にかかるプリント配線板及びその穴
明け方法について,図1〜図3を用いて説明する。ま
ず,上記プリント配線板における長穴1は,図1に実線
で示すごとく,大径穴2と小径穴11〜14によって形
成されている。また,上記長穴1の穿設は,図3に示す
ごとく,まず最外小径穴11,14を順次穿設し,次い
で中間小径穴12,13を穿設し,最後に大径穴2を穿
設することにより行なう。上記穿設は,ドリルを用いて
行なう。
Embodiment 1 A printed wiring board according to an embodiment of the present invention and a method for punching the same will be described with reference to FIGS. First, the elongated hole 1 in the printed wiring board is formed by a large-diameter hole 2 and small-diameter holes 11 to 14 as shown by a solid line in FIG. As shown in FIG. 3, first, the outermost small-diameter holes 11, 14 are sequentially formed, then the intermediate small-diameter holes 12, 13 are formed, and finally, the large-diameter hole 2 is formed. This is done by drilling. The drilling is performed using a drill.

【0017】以下,これらにつき詳しく説明する。即
ち,本例は,絶縁基板に長穴を穿設してなるプリント配
線板において,上記長穴1は,その中心位置に大径穴2
を,また該大径穴の左右にそれぞれ2個の小径穴11〜
14を穿設することにより形成してある。また,上記大
径穴2及び小径穴11〜14の円中心C11,C12,
C2,C13,C14は,同一の軸線10上に等間隔に
配置されている(図1,図2)。また,左右の最外部に
位置する最外小径穴11,14の間の中心間隔は,図2
(B)に示すごとく,小径穴の半径Rよりも小さい
Hereinafter, these will be described in detail. That is, in this example, in a printed wiring board having a long hole formed in an insulating substrate, the long hole 1
And two small holes 11 to left and right of the large hole, respectively.
14 is formed. The circular centers C11 and C12 of the large-diameter hole 2 and the small-diameter holes 11 to 14,
C2, C13 and C14 are arranged at equal intervals on the same axis 10 (FIGS. 1 and 2). The center distance between the outermost small-diameter holes 11 and 14 located on the left and right outermost sides is shown in FIG.
As shown in (B), smaller than the radius R of the small diameter hole

【0018】また,上記長穴1の穿設に当たっては,図
3(A)に示すごとく,まず長穴1の中心位置C2か
ら,上記図2に示すC2〜C11の間の中心間隔を置い
た位置を中心位置として,半径Rのドリルを用いて,左
方の最外小径穴としての小径穴11を穿設する。次に,
図3(B)に示すごとく,右方の最外小径穴としての小
径穴14を穿設する。
In drilling the long hole 1, as shown in FIG. 3A, first, a center interval between C2 and C11 shown in FIG. A small-diameter hole 11 as a left outermost small-diameter hole is drilled using a drill having a radius R with the position as the center position. next,
As shown in FIG. 3B, a small-diameter hole 14 is formed as the rightmost outermost small-diameter hole.

【0019】次に,図3(C),(D)に示すごとく,
中間小径穴としての左方の小径穴12,右方の小径穴1
3を順次穿設する。これらは,全て同じドリル(半径
R)を用いて行なう。その後,ドリルを半径=R+0.
02の大径穴用のドリルに変えて,長穴の中心位置を円
中心として,大径穴2を穿設する(図3E)。これによ
り,図3(F)に示す長穴1が得られる。この長穴1
は,上記図1に示した長穴と同じである。本例において
は,上記小径穴11〜14の半径Rは1.0mmとし
た。それ故,大径穴2の半径は1.0+0.025=
1.025mmとなる。
Next, as shown in FIGS. 3C and 3D,
Left small hole 12 as intermediate small hole, right small hole 1
3 are sequentially drilled. These are all performed using the same drill (radius R). Then, drill the radius = R + 0.
In place of the drill for the large-diameter hole No. 02, the large-diameter hole 2 is formed with the center position of the long hole as the center of the circle (FIG. 3E). Thereby, the elongated hole 1 shown in FIG. 3 (F) is obtained. This long hole 1
Is the same as the slot shown in FIG. In this example, the radius R of the small holes 11 to 14 was 1.0 mm. Therefore, the radius of the large diameter hole 2 is 1.0 + 0.025 =
1.025 mm.

【0020】本発明においては,上記長穴1が上記形状
を有している。そのため,長穴の内壁が円滑である。そ
のため,プリント配線板を位置決めピンにセットし,プ
リント配線板に各種の処理を施す際に,熱によりプリン
ト配線板が伸縮しても,プリント配線板は自由に伸縮
し,拘束されない。また,上記長穴1は,上記のごと
く,1つの大径穴2を中心として,その左右に各2つづ
つの小径穴11〜14を穿設することにより形成してあ
るため,所定の大きさの長穴を所定位置に,容易確実に
穿設することができ,穴明けが容易である。
In the present invention, the elongated hole 1 has the above shape. Therefore, the inner wall of the elongated hole is smooth. Therefore, when the printed wiring board is set on the positioning pins and various processes are performed on the printed wiring board, even if the printed wiring board expands and contracts due to heat, the printed wiring board expands and contracts freely and is not restrained. As described above, the long hole 1 is formed by drilling two small-diameter holes 11 to 14 on the left and right sides of one large-diameter hole 2 as a center. Can be easily and reliably drilled at predetermined positions, and drilling is easy.

【0021】上記穴明け方法においては,最外小径穴1
1〜14から中心に向かって順次,小径穴の穿設を行な
い,最後に大径穴12を穿設している。そのため,所定
の大きさの長穴1を所定位置に,容易,確実に穿設する
ことができる。また,大径穴2は最後に穿設するので,
大径穴用のドリル,パンチは最後に交換すれば良く,作
業性が向上する。また,得られる長穴1の内壁が円滑で
ある。
In the above drilling method, the outermost small-diameter hole 1
Small holes are drilled sequentially from 1 to 14 toward the center, and finally a large hole 12 is drilled. Therefore, the long hole 1 of a predetermined size can be easily and reliably drilled at a predetermined position. Also, since the large diameter hole 2 is drilled last,
Drills and punches for large diameter holes only need to be replaced last, which improves workability. Further, the inner wall of the obtained long hole 1 is smooth.

【0022】実施形態例2 本例は,図4に示すごとく,大径穴と小径穴の穴明け順
序を実施形態例と逆にした方法を示している。即ち,図
4(A)に示すごとく,まず長穴の中心位置に大径穴2
を穿設し,次いで大径穴2の右側,次いで左側に最外小
径穴14,11を穿設する(図4(B),(C))。そ
の後,中間小径穴13,12を穿設する(図4(D),
(E))。これにより,実施形態例1と同様の長穴1が
得られる(図4(F))。
Embodiment 2 As shown in FIG. 4, this embodiment shows a method in which the order of drilling the large-diameter holes and the small-diameter holes is reversed from that of the embodiment. That is, as shown in FIG.
Then, outermost small diameter holes 14 and 11 are formed on the right side of the large diameter hole 2 and then on the left side (FIGS. 4B and 4C). Thereafter, the intermediate small diameter holes 13 and 12 are formed (FIG. 4 (D),
(E)). As a result, an elongated hole 1 similar to that of the first embodiment is obtained (FIG. 4F).

【0023】本例においても,実施形態例1と同様の効
果を得ることができる。また,本例では,まず長穴の中
心位置に大径穴2を穿設し,次いで最外小径穴14,1
1,中間小径穴13,12を穿設するので,長穴の中心
位置を選定し易く,その位置決めが容易である。
In this embodiment, the same effects as in the first embodiment can be obtained. In this example, first, the large-diameter hole 2 is formed at the center of the long hole, and then the outermost small-diameter holes 14 and 1 are formed.
1, since the intermediate small diameter holes 13 and 12 are formed, it is easy to select the center position of the long hole and the positioning thereof is easy.

【0024】[0024]

【発明の効果】本発明によれば,長穴が円滑な内壁を有
し,所定の大きさの長穴を,所定位置に容易,確実に穿
設することができる,プリント配線板及びその穴明け方
法を提供することができる。
According to the present invention, there is provided a printed wiring board and a hole thereof, wherein the long hole has a smooth inner wall, and a long hole of a predetermined size can be easily and reliably drilled at a predetermined position. A dawn method can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】実施形態例1における,長穴の穿設状態を示す
説明図。
FIG. 1 is an explanatory diagram showing a state in which a long hole is drilled in a first embodiment.

【図2】実施形態例1における,(A)大径穴及び小径
穴の円中心の中心間隔,(B)左右の最外小径穴の間の
中心間隔を示す説明図。
FIGS. 2A and 2B are explanatory diagrams showing (A) the center distance between the centers of the large diameter holes and the small diameter holes and (B) the center distance between the left and right outermost small diameter holes in the first embodiment.

【図3】実施形態例1における,長穴の形成順序を示す
説明図。
FIG. 3 is an explanatory diagram showing the order of forming long holes in the first embodiment.

【図4】実施形態例2における,長穴の形成順序を示す
説明図。
FIG. 4 is an explanatory view showing the order of forming long holes in the second embodiment.

【図5】従来例における,プリント配線板及び長穴の説
明図。
FIG. 5 is an explanatory view of a printed wiring board and a long hole in a conventional example.

【図6】従来例における,長穴穿設の問題点を示す説明
図。
FIG. 6 is an explanatory view showing a problem of drilling a long hole in a conventional example.

【符号の説明】[Explanation of symbols]

1...長穴, 11,12,13,14...小径穴, 10...軸線, 2...大径穴, 9...プリント配線板, 1. . . Slots, 11, 12, 13, 14. . . Small diameter holes, 10. . . Axis, 2. . . Large diameter hole, 9. . . Printed wiring board,

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 絶縁基板に長穴を穿設してなるプリント
配線板において,上記長穴は,その中心位置に大径穴
を,また該大径穴の左右にそれぞれ2個以上の小径穴を
穿設することにより形成してあり,また,上記大径穴及
び小径穴の円中心は同一軸線上に等間隔に配置されてお
り,かつ,左右の最外部に位置する最外小径穴の間の中
心間隔は,小径穴の半径Rよりも小さいことを特徴とす
るプリント配線板。
1. A printed wiring board having a long hole formed in an insulating substrate, wherein the long hole has a large-diameter hole at a center position thereof, and two or more small-diameter holes at right and left sides of the large-diameter hole, respectively. The center of the large diameter hole and the small diameter hole are arranged at equal intervals on the same axis, and the outermost small diameter holes located on the left and right outermost are formed. A printed wiring board characterized in that a center interval between them is smaller than a radius (R) of a small-diameter hole.
【請求項2】 請求項1において,上記大径穴の半径
は,小径穴の半径R+0.0125〜0.05mmの範
囲にあることを特徴とするプリント配線板。
2. The printed wiring board according to claim 1, wherein the radius of the large-diameter hole is in the range of the radius R of the small-diameter hole + 0.0125 to 0.05 mm.
【請求項3】 請求項1又は2に記載のプリント配線板
における長穴を穿設するに当たり,まず,上記最外小径
穴をそれぞれ穿設し,次いで最外小径穴と大径穴との間
に,両者の間隔を2等分する位置に,中間小径穴をそれ
ぞれ穿設し,その後大径穴を穿設することを特徴とする
プリント配線板の穴明け方法。
3. The method of forming a long hole in the printed wiring board according to claim 1 or 2, wherein the outermost small diameter holes are first formed, and then the outermost small hole and the large diameter hole are formed. And a method of drilling a printed wiring board, wherein an intermediate small-diameter hole is formed at a position where the distance between the two is equally divided, and then a large-diameter hole is formed.
【請求項4】 請求項1又は2に記載のプリント配線板
における長穴を穿設するに当たり,まず長穴の中心位置
に大径穴を穿設し,次いで最外小径穴をそれぞれ穿設
し,その後中間小径穴をそれぞれ穿設することを特徴と
するプリント配線板の穴明け方法。
4. When drilling a long hole in the printed wiring board according to claim 1 or 2, a large hole is first drilled at the center position of the long hole, and then an outermost small hole is drilled. And a method of drilling a printed wiring board, wherein an intermediate small-diameter hole is formed thereafter.
JP21438096A 1996-07-24 1996-07-24 Printed wiring board and drilling method thereof Expired - Fee Related JP3843497B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21438096A JP3843497B2 (en) 1996-07-24 1996-07-24 Printed wiring board and drilling method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21438096A JP3843497B2 (en) 1996-07-24 1996-07-24 Printed wiring board and drilling method thereof

Publications (2)

Publication Number Publication Date
JPH1041593A true JPH1041593A (en) 1998-02-13
JP3843497B2 JP3843497B2 (en) 2006-11-08

Family

ID=16654835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21438096A Expired - Fee Related JP3843497B2 (en) 1996-07-24 1996-07-24 Printed wiring board and drilling method thereof

Country Status (1)

Country Link
JP (1) JP3843497B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005032224A1 (en) * 2003-09-23 2005-04-07 Endress+Hauser Gmbh+Co. Kg Printed circuit board comprising a holding device for retaining wired electronic components, method for the production of such a printed circuit board, and use thereof in a soldering furnace
JP2009125837A (en) * 2007-11-21 2009-06-11 Hitachi Aic Inc Machining method for printed circuit board
JP2010153629A (en) * 2008-12-25 2010-07-08 Hitachi Chem Co Ltd Method of manufacturing wiring board
CN102427668A (en) * 2011-11-14 2012-04-25 江苏同昌电路科技有限公司 Technology of processing large hole with diameter of more than 5.0 mm on circuit board
CN104284519A (en) * 2014-09-23 2015-01-14 梅州市志浩电子科技有限公司 Printed circuit board depth control gong device and method
CN105307396A (en) * 2015-09-08 2016-02-03 东莞生益电子有限公司 Preparation method for PCB with square hole
CN108650791A (en) * 2018-04-11 2018-10-12 大连崇达电路有限公司 The processing method of square groove or special-shaped groove of the knuckle radius less than 0.30mm in printed wiring board

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005032224A1 (en) * 2003-09-23 2005-04-07 Endress+Hauser Gmbh+Co. Kg Printed circuit board comprising a holding device for retaining wired electronic components, method for the production of such a printed circuit board, and use thereof in a soldering furnace
US8631569B2 (en) 2003-09-23 2014-01-21 Endress + Hauser Gmbh + Co. Kg Circuit board with holding mechanism for holding wired electronic components method for manufacture of such a circuit board and their use in a soldering oven
JP2009125837A (en) * 2007-11-21 2009-06-11 Hitachi Aic Inc Machining method for printed circuit board
JP2010153629A (en) * 2008-12-25 2010-07-08 Hitachi Chem Co Ltd Method of manufacturing wiring board
CN102427668A (en) * 2011-11-14 2012-04-25 江苏同昌电路科技有限公司 Technology of processing large hole with diameter of more than 5.0 mm on circuit board
CN104284519A (en) * 2014-09-23 2015-01-14 梅州市志浩电子科技有限公司 Printed circuit board depth control gong device and method
CN105307396A (en) * 2015-09-08 2016-02-03 东莞生益电子有限公司 Preparation method for PCB with square hole
CN108650791A (en) * 2018-04-11 2018-10-12 大连崇达电路有限公司 The processing method of square groove or special-shaped groove of the knuckle radius less than 0.30mm in printed wiring board

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