JPH1035774A - Electronic parts carrying box - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make a carrying box resistant to a shock of drop or the like and make it capable of preventing trouble caused by static electricity, shutting out dust, etc., and dealing with electronic parts differing in size. SOLUTION: An electronic parts carrying box 10 comprises a parts holding part 12 consisting of a plurality of grooved board members 20 put together in a manner of being superposed one member on another laterally, a bottom part 16 for holding the parts holding part 12, and a lid part 14 for closing the opening through which the parts holding part 12 is held on the bottom part 16. This electronic parts carrying box 10, in carrying electronic parts, is designed to hold them in grooved parts 22 formed between laterally superposed grooved board members 20. At the two end parts of the grooved board members 20 in this electronic parts carrying box 10 there are provided a spacer part 28 and a positioning part 30, the former for deciding the space left between the grooved parts 22 by the grooved board members 20 superposed on one another laterally and the latter for deciding the position at which the grooved board members 20 are superposed on one another laterally.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transport box for transporting electronic components, and more particularly, to a transport box for transporting plate-shaped electronic components such as liquid crystal components and printed circuit boards, which require protection against impact and static electricity.

[0002]

Conventionally, for transporting plate-like electronic components such as liquid crystal components and printed circuit boards, which require protection against impact and static electricity, trays containing the electronic components are stacked vertically. In many cases, it was transported. The method of stacking trays is suitable for general use because the work is relatively easy and the structure of components is relatively simple, but the stored electronic components, especially plate-shaped electronic components, are There was a problem of being easily impacted. That is, when a trouble such as a drop occurs, the plate-like electronic component in the tray receives an impact in the thickness direction, and thus damage such as breakage is likely to occur.

For this reason, there has been proposed a transport box in which a plurality of plate-shaped electronic components are erected and a plurality of them are arranged in a horizontal direction. However, the structure for separating the plate-shaped electronic components becomes complicated, resulting in cost reduction. There has been a problem that it causes an increase. If a simple structure is used to reduce the cost, the dimensional accuracy of the space for accommodating the plate-like electronic component must be reduced, and the protection function against impacts is reduced.

It is widely known that a conductive material is used as a countermeasure against static electricity. However, in order to obtain an effective result, it is necessary to conduct completely from the vicinity of the electronic component to be transported to the outside of the transport box. Must. However, at present, there is no specific measure that satisfies both the function of preventing electrostatic damage and the cost of manufacturing.

Further, it is important to secure airtightness in transporting electronic components. If dust or moisture is mixed during transport and adheres to electronic components, it may cause trouble such as malfunction. Conventionally, while this need has been recognized, the practical factor is too large because the negative factor such as the structure of the transport box becomes complicated, the workability such as assembling deteriorates, and the cost increases becomes too large. No countermeasures have been found.

Therefore, the inventor of the present invention is resistant to impacts such as dropping,
Static electricity can be prevented, no dust etc.
In addition, as a result of intensive studies on an electronic component transport box capable of handling electronic components having different sizes, the present invention has been achieved.

[0007]

The present invention takes the following means to solve the above-mentioned problems. That is, the gist of the electronic component transport box of the present invention is as follows: a housing component in which a plurality of groove plate members are overlapped in the lateral direction; a bottom component for housing the housing component; and a housing component for the bottom component. The electronic component is accommodated in a groove formed between the superposed groove plate members, and is transported.

In this electronic component transport box, at both ends of the groove plate member, a spacer portion for determining a gap width of a groove portion formed by overlapping the groove plate member, and an overlapping position of the groove plate member are defined. A positioning portion for determining the position is provided, and the positioning portion is composed of a long groove and a ridge-like projection which are fitted into and recessed from each other.

In this electronic component transport box, the bottom component is formed in a U-shaped cross section with an upper surface and two side surfaces opened, and the bottom component is joined to three surfaces of the U-shaped opening to form the housing component. In the bottom part.

Further, in the electronic component transport box, the accommodating component adjusts a buffer plate insertion groove for adjusting a depth of a groove formed by overlapping the groove plate members, or adjusts a width of the groove. One or both of the buffer plate insertion grooves are provided.

Further, in this electronic component transport box, one side of the buffer plate inserted into the buffer plate insertion groove for adjusting the depth of the groove portion of the housing component has an integral multiple of the overlapping interval of the groove plate members. And a projection inserted into the groove of the housing component is provided.

Further, in the electronic component transport box, the groove plate member has a function of holding the electronic component.

Further, in this electronic component transport box, the groove plate member, the bottom component, the lid component, and the cushioning material are all formed of a conductive foam material.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The gist of the present invention is to arrange plate-shaped electronic components in a vertical position in order to increase the strength of protection against impacts such as dropping, and a groove for accommodating the plate-shaped electronic components. Is composed of a plurality of parts, thereby ensuring the dimensional accuracy of the parts and reducing the manufacturing cost of the parts. Furthermore, the size of the groove according to the size of the electronic component is to be adjusted by inserting a buffer plate at the bottom or side of the groove, and all joining of the electronic component storage member, the lid component, and the bottom component is performed. The purpose of the present invention is to prevent foreign matter such as dust from being mixed by engaging the concave and convex portions at the portions. Furthermore, by using a conductive foam material, there is a function of holding an electronic component on the groove plate member itself in order to eliminate electrostatic interference and improve impact resistance, and to automate processes before and after conveyance. Is to be provided.

An embodiment of an electronic component transport box according to the present invention will be described below in detail with reference to the drawings.

FIG. 1 shows an example of the configuration of an electronic component transport box according to the present invention. This electronic component transport box 10 includes a housing component 12 for housing electronic components, a lid component 14, and a bottom component 1
6 is comprised. The bottom part 16 has a U-shaped cross section with an open top surface and two side faces, that is, a bottom member 17 and side wall members 18 and 18 disposed at opposing positions. The member 18 is formed integrally. Then, the housing component 12 is attached to the bottom component 16.
As shown in FIG. 2, as shown in FIG. Therefore, as shown in FIG. 2, the surface of the electronic component transport box 10 has a top surface composed of the lid component 14, a bottom surface composed of the bottom component 16 and two side surfaces,
It will be constituted by two side surfaces composed of the housing component 12.

First, as shown in FIG. 3, the accommodating component 12 is constituted by erecting a plurality of groove plate members 20 and superimposing them laterally. A groove 22 is formed between the superposed groove plate members 20, and the groove 22 becomes a space for accommodating the electronic component. A groove 26 for fitting the backing plate 24 is formed on the side surface of the housing component 12, that is, the side surface of the groove plate member 20 constituting the housing component 12. The backing plate 24 not only functions as a backing plate for banding performed in a later process, but also has a function of fitting the backing plate 24 into the groove 26 to enhance the overlaying accuracy of the groove plate member 20.

As shown in FIG. 4, a groove 27 for accommodating a plate-like electronic component is provided in the groove plate member 20, and the groove 27 is formed on both sides of the groove 27 when the groove plate member 20 is overlapped.
A spacer portion 28 for determining the interval width of the groove 22 formed by the above-mentioned method and a positioning portion 30 for determining the position of the overlap are provided. Positioning part 3
Reference numeral 0 denotes a structure that is formed of vertically long grooves and ridge-shaped protrusions provided on the front and back of both ends of the groove plate member 20, and has a structure in which two or more groove plate members 20 can be continuously overlapped. ing. The groove plate member 2 is formed by fitting the long groove and the ridge-shaped protrusion.
Accuracy of the overlapping position between zeros is improved, and it is possible to prevent dust and moisture from entering the groove 22 from the outside.

Next, as shown in FIG. 5, a ridge-shaped projection 32 is provided on the upper surface of the bottom member 17 of the bottom part 16 having a U-shaped cross section. The pitch of the ridge-shaped projections 32 is
2 are formed at an integral multiple of the overlap interval of the groove plate members 20 constituting the second groove plate member 20. The ridge-shaped projection 32 receives the groove plate member 20 and supports the weight of the housing component 12, but the accommodated plate-shaped electronic component does not touch the ridge-shaped projection 32, and
It is configured to be stored in the groove portion between the two. When the housing component 12 is housed in the side wall member 18 integrally provided opposite to both ends of the bottom member 17, a positioning portion 30 composed of a long groove and a ridge-like projection is fitted. An uneven fitting portion 31 formed of a ridge-shaped protrusion and a long groove is formed to prevent dust, moisture, and the like from entering. Further, a groove-shaped recess 33 to be fitted to the lid component 14 is formed on the upper part of the side wall member 18 so that the lid component 14 does not shift.

When the size (vertical and horizontal dimensions) of the electronic components housed in the groove 22 formed by the groove plate member 20 of the housing component 12 is different, the size of the groove 22 must also be changed. In the present invention, the size of the groove portion 22 can be adjusted by inserting buffer plates having different thicknesses into the side portion and the bottom portion of the housing component 12. That is, as shown in FIG. 6, when the buffer plate 34 is inserted into the buffer plate insertion groove 38 provided on the side of the housing component 12, the width of the groove portion 22 becomes narrow, and the groove portion 22 is provided at the bottom of the housing component 12. If the buffer plate 36 is inserted into the buffer plate insertion groove 40, the depth becomes shallower. Therefore, the buffer plate 3
By changing the thicknesses of the grooves 4 and 36, the size of the groove 22 can be adjusted according to the size of the electronic component.
The electronic component is configured not to move in the groove 22.

The upper end of the buffer plate 36 inserted into the buffer plate insertion groove 40 provided at the bottom of the housing component 12 has
It is preferable that a projection 42 is provided as shown in FIG. The projections 42 provided at a pitch of an integral multiple of the overlapping interval of the groove plate members 20 are inserted into the groove portions 22 from below, and
This is to make the intervals of the characters uniform. As a result, the groove 22 is fixed to the designed value by the two spacer portions 28 and the protrusions 42 at three sides thereof. Therefore, the gap width of the groove 22 changes due to an impact during transportation or the like, and troubles such as damage to the housed electronic components do not occur.

The housing part 12 is housed in the bottom part 16, and is configured so as to be fitted into three sides of the U-shaped opening of the bottom part 16. For example, as shown in FIG. 8, a positioning portion 30 provided on the groove plate member 20 is provided.
According to the shape, the side wall member 18 of the bottom part 16 is provided with an uneven fitting portion 31 as shown in FIG. Also, the bottom component 16 is provided at the lower end of the groove plate member 20 so as to fit into the ridge-shaped protrusion 46 formed by overlapping the plurality of groove plate members 20.
Is provided with a groove-shaped recess 48. By pressing the housing component 12 from above so as to widen the U-shaped opening of the bottom component 16, the positioning portion 30 and the uneven fitting portion 3 are pressed.
1 and the fitting between the ridge-shaped protrusion 46 and the groove-shaped recess 48 are achieved, and the three sides are completely joined. At this time, the groove plate members 20 constituting the housing component 12 are pressed against each other and are brought into close contact with each other, so that the concave-convex fitting of the positioning portion 30 is further strengthened. As a result, the variation in the gap width of the groove 22 is reduced, and the airtightness of the groove 22 is also improved.

Further, a groove-shaped concave portion 50 provided at the upper end of the housing component 12 and a groove-shaped concave portion 33 provided at the upper end of the bottom component 16 and a lower portion 4 of the lid component 14 shown in FIG. The ridges 54 provided on the sides are also fitted with unevenness. Upper two sides and bottom part 16 of housing part 12
The upper two sides and the lower four sides of the lid part 14 are concavely and convexly fitted by a long groove and a ridge-shaped projection, so that all the outer surfaces of the transport box finally assembled as shown in FIG. It is sealed and the airtightness in the transport box is maintained.

To perform the fitting between the housing component 12 and the bottom component 16, the fitting between the lid component 14 and the housing component 12, and the fitting between the lid component 14 and the bottom component 16, the respective members must have a certain degree. It must be deformed and the material needs some elasticity. Considering that the effect of improving impact resistance can be expected, a foamed material is a preferable material.

It is important to take measures against static electricity when transporting electronic components, especially liquid crystal panels and substrates. For this reason, the usefulness of using a conductive foam material has been known, but in the present invention, a particularly large static electricity leak effect can be expected. The groove plate member 2 which is closely fitted to and recessed and fitted to each other.
If all of the bottom part 16, the bottom part 16 and the lid part 14 are made of a conductive foam material, the area from the vicinity of the housed electronic parts to the outer surface of the transport box is completely electrically connected. Therefore,
Static electricity generated by friction or the like leaks out of the transport box immediately, so that electronic components are not damaged electrostatically.

In the electronic component transport box 10 having the above-described configuration, in order to accommodate the electronic component in the accommodation component 12, the plate-like electronic component is inserted into the groove 22 of the accommodation component 12, which is assembled by previously stacking the groove plate members 20. Just insert it. This insertion of the electronic components may be automated by hand or by machine.
Alternatively, in order to accommodate the electronic component in the accommodation component 12, the electronic component can be held in each of the groove plate members 20, and the accommodation component 12 can be assembled by overlapping them. In particular, this method is preferable for automating the process including the transport process and the electronic component processing process before and after the transport.

Although the embodiment of the electronic component transport box according to the present invention has been described above, the present invention is not limited to the above-described embodiment.

For example, in order to automate a process including a transport process and a process of processing an electronic component before and after transport, it is necessary to devise a method of providing the groove plate member 20 with a function of holding the electronic component. As shown in FIG.
A receiving member 56 is provided on the lower side, and in a process before and after the conveyance, the receiving member 56 is turned sideways to hold an electronic component as a tray and adjust to automation. Then, when assembling into a transport box, the groove plate members 20 holding the electronic components are stacked on each other, switched to a stand, and stored in the bottom component 16.

Further, the bottom component, the lid component, the cushioning plate, and the groove plate member that comes into contact with the electronic component may be formed of a single material, respectively. It can be made of a material with excellent elasticity and elasticity or a foam with a high foaming ratio, and the surface side to be supported under external force or load can be made of a material with excellent rigidity or strength or a foam with a low foaming ratio. It is possible. Others
The present invention can be implemented in various modified, modified, and modified forms based on the knowledge of those skilled in the art, such as the configuration and shape of each part, without departing from the spirit of the present invention.

Embodiments of the present invention will be described in detail below.

First Embodiment An electronic component transport box 1 having the same structure as shown in FIGS. 1 and 2
0 was made. The accommodating part 12 was formed by superposing 20 groove plate members 20 in the same manner as shown in FIG. 3 and fitting four contact plates 24 made of conductive cardboard plastic into the grooves 26. Groove plate member 20, bottom part 1
6. The lid component 14 was formed from conductive foamed polyethylene containing granular carbon. The expansion ratio was 14 times, and the compressive strength was 2.0 kgf / cm ² . Further, the surface resistance value was 10 ⁷ Ω / cm ² .

The shape of the groove plate member 20 was the same as that shown in FIG. 4, having a width of 250 mm and a height of 220 mm.
The thickness of the spacer portion 28 at the end is 11.5 mm, and the positioning portion 30 is 150 mm in length, is composed of a long groove having a depth of 5 mm, and a ridge having a height of 5 mm. The width of the groove portion 22 formed by overlapping the groove plate members 20 was 200 mm, and the gap was 4 mm.

The bottom part 16 is similar to that shown in FIG. The housing component 12 is stored to a depth of 220 mm from above. Eight ridge-shaped projections 32 at the bottom 23 mm pitch
, And supports the groove plate member 20 of the housing component 12 at its tip.

As shown in FIG. 9, a concave / convex fitting portion 31 having a length of 150 mm is formed in the U-shaped opening of the bottom component 16 so as to fit with the positioning portion 30 provided on the housing component 12. Is provided. Furthermore, since the groove-shaped recess 48 is also provided so as to fit with the ridge-shaped projection 46 below the housing component 12, the housing component 12 is pushed in so that the upper part of the bottom component 16 is expanded, so that the bottom component 16 is pressed. The concave and convex can be fitted on the three sides of the opening, and the housing component 12 and the bottom component 16 can be integrated. In addition, accommodating part 1
By pressing the groove 2, the groove plate members 20 adhered to each other, and it was visually confirmed that the airtightness of the groove portion 22 was improved.

Twenty LCD cells were manually inserted into the grooves 22 in the housing part 12 integrated and housed in the bottom part 16. The size of the LCD cell was 198 mm in width, 260 mm in height, and 2.8 mm in thickness. After the insertion, the cell protruded from the groove 22 by about 2.5 cm.

Next, as shown in FIG. 10, the lid component 14 provided with ten ridge-shaped projections 54 was placed around the lower opening and pressed downward. The opening slightly widens due to the flexibility of the foam material, and the ridge-shaped projections 54 and the groove-shaped recesses 50 and 33 at the upper end of the groove plate member 20 and the upper end of the bottom part 16 are fitted in an uneven manner, and the lid part 14 and the bottom part Article 16 and groove plate member 20
And were integrally joined. The band 19 was hung and packed in the transport box 10 as shown in FIG.

An evaluation test for shock and vibration was performed using the transport box of this example. In any of the drop test with a drop height of 75 cm, the random vibration test for each axis vibration time of 15 minutes, and the resonance point endurance test of acceleration at each axis resonance point of 0.5 G × 15 minutes, the LCD cell contained in the LCD cell contains no problem. It was confirmed that there was no damage. Furthermore,
Perform environmental tests for overseas transport at -40 ° C to +80
C. and RH 5 to 95%, no abnormality was found in the performance of the LCD cell.

Second Embodiment As shown in FIG. 6, a buffer plate 3 for adjusting the size of the groove 22 is provided.
4 and 36, except that the transport box 10 is the same as that of the first embodiment.
Was made. The buffer plate made of conductive expanded polyethylene having an expansion ratio of 25 times has a thickness of the buffer plate 34 in the width direction of 28 m.
m, the thickness of the buffer plate 36 in the depth direction was 32 mm.
As shown in FIG. 7, a protrusion 42 for fitting with the groove 22 is provided on the upper end of the buffer plate 36.
Are provided at the same pitch of 11.5 mm. The transport box 10 of this example has a width of 170 mm and a height of 222 mm.
When a drop test, a vibration test, and a resonance point endurance test were performed while accommodating an LCD cell having a thickness of 2 mm, no abnormalities were found.

Third Embodiment A groove plate member 20 having a function of holding an electronic component was manufactured. A groove plate member 20 similar to that shown in FIG.
The height of the receiving member 56 was 4 mm. The groove plate member 20 functioning as the tray on which the LCD cells are placed is moved by the conveyor from the inspection process of the previous process, stacked, and all the work of putting it on the stand and placing it in the bottom part 16 is automatically performed by the machine. Could be done.

[0040]

According to the electronic component transport box of the present invention, the plate-shaped electronic components are arranged upright and arranged side by side, so that the impact resistance against impact due to a drop or the like can be greatly improved. Further, since the groove for accommodating the plate-shaped electronic component is composed of a plurality of components, the dimensional accuracy can be improved and the component manufacturing cost can be reduced, and the plate-shaped electronic component can be accommodated without rattling. be able to.

Further, the size of the groove can be adjusted by inserting the buffer into the buffer plate insertion groove provided on the side or bottom of the groove, so that it is possible to cope with plate-shaped electronic components of various sizes. I can do it. Furthermore, since the housing component, the bottom component, and the lid component can be integrated by the concave-convex fitting, the inside airtightness is enhanced, and the entry of foreign substances such as dust and moisture can be prevented. Furthermore,
By using a conductive foam material, it is possible to eliminate static electricity damage and improve impact resistance. Further, by using a groove plate member having a function of holding an electronic component, automation of a process including a transport process and processes before and after the transport process can be facilitated.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of the configuration of an electronic component transport box of the present invention.

FIG. 2 is a perspective view showing an example of an electronic component transport box of the present invention.

FIG. 3 is a perspective view illustrating an example of a configuration of a housing component according to the present invention.

4A and 4B are views for explaining an example of a groove plate member according to the present invention. FIG. 4A is a perspective view, and FIG. 4B is a cross-sectional view showing both ends in an enlarged manner.

FIG. 5 is a sectional view showing an example of a bottom component according to the present invention.

FIG. 6 is a perspective view showing an example of a method of attaching a buffer plate according to the present invention.

FIG. 7 shows an example of a buffer plate according to the present invention.
FIG. 1A is a plan view, and FIG. 1B is a side view.

FIG. 8 is an elevation view illustrating an example of a groove plate member according to the present invention.

FIG. 9 is a cross-sectional view illustrating another example of the bottom component according to the present invention.

FIG. 10 is a bottom view illustrating an example of a lid component according to the present invention.

FIG. 11 is a perspective view illustrating another example of the groove plate member according to the present invention.

[Explanation of symbols]

 10: Electronic component transport box 12: Housing component 14: Lid component 16: Bottom component 18: Band 20: Groove plate member 22: Groove portion 24: Patch plate 26, 38, 40: Groove 28: Spacer portion 30: Positioning portion 31: Concavo-convex fitting portions 32, 46, 54: ridge-shaped projections 34, 36: buffer plate 42: projections 33, 48, 50: groove-shaped recess 56: receiving member

Claims (7)

[Claims] 1. A storage component comprising a plurality of groove plate members superposed in a horizontal direction, a bottom component for storing the storage component, and a lid component for closing an opening for storing the storage component of the bottom component. An electronic component transport box, wherein electronic components are accommodated and transported in grooves formed between the superposed groove plate members. 2. A spacer portion for determining a gap width of a groove formed by overlapping the groove plate members, and a positioning portion for determining an overlapping position of the groove plate members at both end portions of the groove plate member. 2. The electronic component transport box according to claim 1, wherein the positioning portion is constituted by a long groove and a ridge-shaped projection which are fitted into and recessed from each other. 3. The bottom part is formed in a U-shape in cross section with an upper surface and two side faces opened, and is joined to three sides of the U-shaped opening so that the housing part is housed in the bottom part. The electronic component transport box according to claim 1 or 2, wherein: 4. The storage component according to claim 1, wherein the buffer plate includes a buffer plate insertion groove for adjusting a depth of a groove formed by overlapping the groove plate members, or a buffer plate insertion groove for adjusting a width of the groove. 4. The electronic component transport box according to claim 1, wherein one or both of the electronic component transport boxes are provided. 5. A buffer plate inserted into a buffer plate insertion groove for adjusting a depth of a groove portion of the housing component, provided on one surface of the buffer plate at intervals of an integral multiple of an overlap interval of the groove plate members, The electronic component transport box according to any one of claims 1 to 4, wherein a projection inserted into the groove of the housing component is provided. 6. The electronic device according to claim 1, wherein said groove plate member has a function of holding an electronic component.
Electronic component transport box according to any of the above. 7. The apparatus according to claim 1, wherein each of the groove plate member, the bottom part, the lid part, and the cushioning material is formed of a conductive foam material. Electronic parts transport box.