JPH10339824A - Platform for optical module and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a highly accurate and small-sized platform for an optical module at a low production cost. SOLUTION: This platform for the optical module is provided with a silicon substrate 1, a V groove 1V formed on the silicon substrate by anisotropic etching so as to position and fix an optical fiber and a metallic stopper 5 formed on the silicon substrate by plating so as to position and fix another optical component to be optically connected with the optical fiber.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a platform capable of manufacturing a small and inexpensive optical module desired in the field of optical communication and the like.

[0002]

2. Description of the Related Art There is a growing demand for a small and inexpensive optical module in a fiber-to-the-home (FTTH) concept for expanding an optical communication network into ordinary homes. In order to realize this, it is considered important to reduce the number of components for fabricating the optical module to a minimum and to simplify the assembly process of the module.

In assembling an optical module, it is considered difficult to reduce the price of the optical module to less than 10,000 yen per channel by the conventional active alignment method. In the active alignment method, for example, when assembling an optical module in which an optical element such as a laser diode and an optical fiber are combined on a platform, the laser diode is actually driven and the laser light output through the optical fiber is changed. This is a method of aligning the optical fiber relative to the laser diode and fixing the optical fiber on the platform so as to maximize it.

In recent years, a passive alignment method for assembling an optical module without driving an optical element has been developed. Some examples of passive alignment methods are described in OPTCOM, June 1996, pp. 139-143. 1
6-22 and OPTRONICS, 1996, no. 7,
pp. 133-138.

[0005] In FIG. 19 and FIG.
An example of the passive alignment method disclosed in M. is illustrated in a schematic perspective view. In FIG. 19, a plurality of V-grooves 21V for positioning and fixing a fiber array 26 including a plurality of optical fibers 26a are formed in an optical module platform 21 made of silicon. After a part of the left end face of each optical fiber 26a is applied to the left side face of the fiber stop groove 21E, the fiber array 26 is fixed on the platform 21.
When the fiber array 26 and the laser diode array 27 are combined on the platform 21, the electrodes 23 corresponding to each laser diode 27a are provided on the platform 21.

When positioning the laser diode array 27 on the platform 21, as shown in FIG. 20, respective positioning marks 27M and 28M provided in advance on each laser diode 27a and the platform 21 are used. You. At this time, mark 27M
And 28M are observed using infrared light transmitted through silicon. The positioning mark 27M of the silicon laser diode 27a does not transmit infrared rays. On the other hand, the positioning mark 28M of the silicon platform 21 is, for example, an opening provided in the infrared shielding film 28 formed on both sides of the electrode 23,
It is at a predetermined position relatively determined with respect to 1V and the fiber stop groove 21E. Then, infrared rays are irradiated from below the platform 21 to illuminate these marks 27.
While observing M and 28M, the laser diode array 2
7 is positioned and fixed on the platform 21.

In FIG. 21, the above-mentioned OPTRONI
An example of the passive alignment method disclosed in CS is illustrated in a schematic perspective view. In the passive alignment method shown in FIG. 21, the optical fiber is positioned and fixed in the V groove on the platform in FIG.
20. However, the positioning marks on the platform are different from those in FIG. In the method shown in FIG. 21, the positioning mark 3 is placed on the platform.
2 and 33 are provided.
One front edge 31E on the laser light emission side is aligned with a line defined by the plurality of positioning marks 32.
Thereafter, the laser diode 31 is positioned and fixed so that the mesa 31M of the laser light emitting portion matches the optical axis alignment mark 33.

Further, as shown in a schematic perspective view of FIG. 22, SPIE, Vol. 2610,199
6, pp. 108-116 also attempts to mechanically position the laser diode on the platform. This method is also a kind of the passive alignment method. Here, the mechanical alignment method is distinguished from the former two methods. The platform 41 shown in FIG. 22 is made of single crystal silicon, and the upper surface has a (100) crystal plane. The silica stopper 45 for positioning the laser diode 47 is formed by using a CVD method, photolithography, and reactive ion etching. The surface of the V groove 41V for fixing the optical fiber has a (111) crystal plane, and is formed by anisotropically etching the (100) crystal surface of the platform 41 using a resist mask formed by photolithography. . The fiber stop groove 41E is formed by mechanical processing.

In the platform as shown in FIG. 22, the optical fiber is positioned and fixed in the V-groove 41V as in FIG. On the other hand, the laser diode 47 can be easily positioned by bringing its side surface into contact with the side surface of the silica stopper 45.

[0010]

In the passive alignment method as shown in FIGS. 20 and 21, the relationship of positioning the optical fiber with respect to the laser diode in the active alignment method is simply reversed. There is no aspect. That is, the alignment accuracy in the passive alignment method depends on the accuracy of the observation system for recognizing the mark on the laser diode and the mark on the platform and the accuracy of the fine adjustment mechanism of the position of the laser diode. At this time, a high cost is required to improve the accuracy of these observation systems and the accuracy of the fine adjustment mechanism. Further, in the passive alignment method, since the laser diode is positioned by repeating precise image processing of the observed mark, it is difficult to shorten the work time for the positioning.

On the other hand, the mechanical alignment method as shown in FIG. 22 is preferable in that the laser diode can be positioned more easily and in a shorter time than the passive alignment method. However, to produce a platform as shown in FIG.
In order to form the stopper 45 of silica and to form the V-shaped groove 41V, it is necessary to perform two times of photoresist lithography for each production of each platform, which is troublesome. The accuracy of the relative positional relationship between the silica stopper 45 and the V groove 41V is affected by the accuracy of the alignment of the mask used in these two photolithography operations. Further, since the side surface of the silica stopper 45 is formed by reactive ion etching, it is difficult to form the side surface with a vertical plane with high precision. Therefore, on the platform 41, the V groove 41V and the silica stopper 45
High accuracy (for example, ±
(Error of 1 μm or less).

In view of the above-mentioned problems in the prior art, the present invention is capable of easily and inexpensively manufacturing and positioning and fixing an optical fiber and other optical components easily and with high precision. It is an object of the present invention to provide an optical module platform and a manufacturing method thereof.

[0013]

According to one aspect of the present invention, an optical module platform includes a silicon substrate, a V-groove formed by anisotropic etching on the silicon substrate for positioning and fixing an optical fiber. ,
A metal stopper formed by plating on a silicon substrate for positioning and fixing another optical component to be optically coupled with the optical fiber is provided.

According to another aspect of the present invention, there is provided a method of manufacturing a platform for an optical module, comprising: forming a resist layer having a predetermined thickness on a conductive underlayer; patterning the resist layer by X-ray lithography; A metal mold was formed by metal plating to a thickness covering the resist layer using the conductive underlayer exposed from the pattern as a plating electrode, and the mold was separated from the conductive underlayer and the resist layer, and subjected to a conductive treatment. A mold is positioned on a silicon substrate having a surface area and a non-conductive treated surface area, and a mold resin is injected between the mold and the silicon substrate to form a mold resin having a predetermined thickness on the silicon substrate. A layer pattern is formed, the mold is removed, and the conductive treated surface area on the silicon substrate exposed from the mold resin layer pattern is plated with an electrode. Then, a metal stopper for positioning the optical component is formed by plating to a predetermined thickness smaller than the thickness of the mold resin layer pattern, and the non-conductive treatment on the silicon substrate exposed from the mold resin pattern is performed. A V-groove is formed by performing anisotropic etching on the surface region.

[0015]

FIG. 1 is a schematic perspective view showing an optical module platform according to an embodiment of the present invention. This platform is a platform for a transmission module and is used for combining a laser diode and an optical fiber.

The platform shown in FIG.
The upper surface of the silicon substrate 1 is covered with the silicon nitride film 2. The silicon substrate 1 also has a V groove 1 for positioning and fixing an optical fiber.
A fiber stop groove 1E having a side surface with which V and a part of the end face of the fiber abut is formed. On the silicon nitride film 2, a laser diode electrode 3 and a laser diode stopper 5 are formed. The stopper 5 is made of metal formed by plating, and is used to position the laser diode easily and accurately. The metal stopper 5 has a notch 5a, which is provided to prevent a short circuit between the upper and lower electrodes of the laser diode.

FIG. 2 is a schematic perspective view showing a mold used for manufacturing a platform for an optical module as shown in FIG. This mold 15 is also made by plating, and the protrusions 15V, 15E and 1
5S. This protrusion 15V corresponds to the position of the V groove 1V of the platform of FIG. 1, the protrusion 15E corresponds to the position of the fiber stop groove 1E, and the protrusion 1
5S corresponds to the position of the laser diode stopper 5.

In the following, an example of a method for manufacturing a mold as shown in FIG. 2 and an example of a method for manufacturing a platform for an optical module as shown in FIG. 1 using the mold will be described. explain. The dimensions of each element shown in each drawing of the present application are appropriately changed for clarity and simplification of the drawings, and do not reflect an actual dimensional relationship.

First, regarding the method of manufacturing a mold, FIG.
FIG. 4 shows a broken line A in FIG. ₁ -B₁ -C₁ Along
Arrow X₁ The state seen in the direction is shown enlarged.
You. In these figures, a conductive silicon is used as a substrate 11.
Con is used. This is because the substrate 1
This is because 1 is also used as a plating electrode. But,
The substrate 11 may be made of intrinsic semiconductor silicon.
It is possible. However, in this case, the top surface of the substrate
Metals such as titanium and chromium formed by the sputtering method
Covered by a membrane.

A fine copper region 13 corresponding to the notch 5a of the stopper 5 in FIG. 1 is formed on the substrate 11 by using SR (synchrotron radiation) lithography and plating. As the X-ray resist layer 12, PMMA (polymethyl methacrylate) or MMA (methyl methacrylate) / MAA (methacrylic acid) copolymer can be used. As the X-ray mask, a pattern of a tungsten layer formed on a silicon nitride support film having good X-ray transmittance can be used (see FIG. 7).

In FIG. 4, the copper micro-region 13 formed by plating in the opening formed in the resist layer 12 by SR lithography is adjusted to a predetermined thickness by polishing. For example, when the distance between the upper and lower electrodes of the laser diode positioned by the stopper 5 in FIG. 1 is 10 μm, the thickness of the copper minute region 13 is about 20 μm.
m.

In FIG. 5, after removing the resist 12 in FIG.
The m-thick resist layer 12a is applied again. FIG.
The thick resist layer 12a in FIG. 5 may be formed by applying an additional resist layer thereon without removing the resist layer 12 therein.

An X-ray mask as shown in FIG. 6 is superimposed on the thick resist layer 12a shown in FIG.
By R lithography, a resist layer pattern 12b as shown in FIG. 7 is formed. FIG. 7 is a sectional view taken along a broken line A ₁ -B ₁ -C ₁ in the plan view of FIG.
_This shows a state viewed in _one direction.

Referring to FIGS. 6 and 7, X-ray mask 14
Includes a support film 14a made of silicon nitride that transmits X-rays, and a pattern 14b of a tungsten layer formed thereon to shield X-rays. The resist layer pattern 12b formed by SR lithography using such an X-ray mask 14 has an opening 12V at a position corresponding to the V groove 1V and an opening 12E at a position corresponding to the fiber stop groove 1E in FIG. , An opening 12 </ b> S at a position corresponding to the metal stopper 5. Then, in the opening 12S, the copper minute region 13 is exposed at a position corresponding to the notch 5a of the stopper 5 in FIG.

At this time, the opening 12V corresponding to the V groove 1V
The dimensional accuracy and relative positional accuracy of the X-ray mask 14 and the opening 12S corresponding to the metal stopper 5 are substantially determined by the accuracy of the X-ray mask 14.
High accuracy within an error range of 0.5 μm or less is possible.

On the other hand, the opening 1 corresponding to the metal stopper 5
The relative positional accuracy between the 2S and the copper micro-region 13 corresponding to the notch 5a depends on the accuracy of the alignment between the X-ray mask 14 and the silicon substrate 11, and an accuracy within an error range of about 2 μm is possible. . Here, what is important as a platform for the optical module is the accuracy of the relative size and position between the V-groove 1V and the metal stopper 5, and the notch 5a provided in the metal stopper 5 is a short circuit between the upper and lower electrodes of the laser diode. Since it is intended only for prevention, high precision is not required for the notch depth in the lateral direction. Therefore, each of the copper micro regions 13 can be formed to be larger than the designed length and width of the cutout portion 5a by about 5 μm, and the alignment accuracy between the X-ray mask 14 and the silicon substrate 11 is 2 μm. Even within the error range of
Notch 5a in opening 12S corresponding to metal stopper 5
It is possible to ensure that the copper minute region 13 protrudes as a region corresponding to. Note that the alignment between the X-ray mask 14 and the silicon substrate 11 is performed using alignment marks provided on them in advance, as in the case of ordinary photolithography.

Next, in FIG. 8, the nickel layer 15 is plated to a thickness exceeding the resist layer pattern 12b while using the conductive silicon substrate 11 as a plating electrode. The nickel plating layer 15 has its upper surface ground and polished in order to adjust its thickness and make it uniform. For example, the entire thickness of the nickel layer 15 is adjusted to about 2 mm. At this time, the mold 15 thus formed includes:
Alignment marks, which are used later to align the mold with the platform silicon substrate, are also made.

Thereafter, the silicon substrate 11, the resist layer pattern 12b and the copper fine region 13 shown in FIG.
Is obtained, a mold as shown in the sectional view of FIG. 9 is obtained. In the nickel mold 15 of FIG. 9, the relative size and position accuracy between the protrusion 15V corresponding to the V groove 1V and the protrusion 15S corresponding to the metal stopper 5 in FIG. Mainly X-ray mask 1
Depending on the precision of the pattern No. 4, it can be increased to within an error range of ± 0.5 μm or less.

FIG. 10 is a plan view showing a method for manufacturing the optical module platform as shown in FIG. 1 using the precision mold as shown in FIG. 2 obtained as described above. represents, Figure 11 is an enlarged view when viewed a section along the broken line a ₂ -B ₂ -C ₂ in FIG. 10 in direction of arrow X _2. In these figures, the substrate 1
Is a conductive type single crystal silicon. Conductive silicon is used because the substrate 1 is also used as a plating electrode in a later plating step. But,
When a plating electrode is provided separately from the substrate 1 in a later step, intrinsic semiconductor silicon can be used as the substrate 1. On the other hand, single crystal silicon is used as the substrate 1 in order to form a precise V-groove on the upper surface of the substrate 1 by anisotropic etching in a later step.

10 and 11, first, the entire upper surface of the silicon substrate 1 is covered with a silicon nitride film 2 by CVD.
Covered by Then, the metal stopper 5 shown in FIG.
An opening 2S having a size of, for example, 300 × 300 μm ² is formed in the silicon nitride film 2 by photolithography or reactive ion etching (RI
E) is formed. A metal wiring pattern 3 for a laser diode is formed on the silicon nitride film 2 by a known method. As the metal wiring 3, for example, a two-layer structure of a titanium layer having a thickness of 100 nm and a gold layer having a thickness of 500 nm can be used. The wiring pattern 3 in FIG. 11 is slightly changed from that in FIG. 1, and it goes without saying that a convenient pattern can be used as appropriate. Further, since the opening 2S in the silicon nitride film 2 is for using the conductive silicon substrate 1 as a plating electrode, a wiring pattern for a plating electrode similar to the wiring pattern 3 for a laser diode is provided on the silicon nitride film 2. The formation of the opening 2S can be omitted.

FIG. 12 is a schematic plan perspective view showing a state in which a precision mold is superposed on the substrate of FIG. 10 and resin-molded. FIG. 13 is a broken line A ₂ -B ₂ -C in FIG. _Two
2 shows an enlarged view of a cross section taken along line X2 in the direction of arrow X2. The accuracy of alignment between the mold 15 and the substrate 1 is 10μ.
It is possible within an error range of m or less. As described above, the most important V-groove 1V as a platform for an optical module
The positional relationship between the metal mold 5 and the metal stopper 5 has already been
5, the wiring pattern 3, the opening 2S of the silicon nitride film, and the protrusion 1 of the mold.
Since an error of about 10 μm is sufficiently within an allowable range in the positional relationship with 5S, etc., it is sufficient that the accuracy of the alignment between the mold 15 and the substrate 1 is within an error range of 10 μm or less.

A resin is injected into a space between the mold 15 and the substrate 1 to form a mold resin pattern 4. Thereafter, the mold 15 is removed, and furthermore, the protrusion 1 of the mold is removed.
The thin resin film remaining at the bottom of the opening formed in the mold resin pattern 40 corresponding to 5V, 15E and 15S is removed by RIE.

Referring to FIG. 14, a metal stopper is formed by using conductive silicon substrate 2 exposed at the bottom of opening 4S formed in mold resin pattern 4 corresponding to protrusion 15S of mold 15 as a plating electrode. 5 is formed by plating. At this time, in the mold resin pattern 4,
Since the conductive silicon substrate 1 is covered with the silicon nitride film 2 at the bottom of the opening 4V corresponding to the protrusion 15V of the mold and at the bottom of the opening corresponding to the protrusion 15E, no plating occurs. The metal stopper 5
For example, copper or nickel can be preferably used as the material.

As shown in FIG. 15, after the metal stopper 5 is formed by plating, the opening 4 corresponding to the protrusion 15V of the mold is formed in the mold resin pattern 4.
At the bottom of V and the bottom of the opening corresponding to protrusion 15E, silicon nitride film 2 is removed by RIE to form openings 2V and the like. Thereafter, as shown in FIG. 16, the entire mold resin pattern 4 is removed.

In FIG. 17, single-crystal silicon 1 is made of potassium hydroxide (KO) using silicon nitride film 2 as a mask.
H) Anisotropic etching is performed using a solution to form a V groove 1V at the position of the opening 2V. The width and length of the V groove 1V
For example, they can be formed to 140 μm and 2 mm, respectively.
At the same time as the V-groove 1V is formed by etching, a groove is also formed at a position corresponding to the fiber stop groove 1E. The fiber stop groove 1E is finished as a groove having vertical side walls by digging the etching groove with a dicing saw. As a result, the optical module platform as shown in FIG. 1 is completed.

In the above embodiment, one optical module platform is illustrated and its manufacture is described. However, in practice, a precision die having a plurality of platforms having a repetitive pattern on a large silicon wafer is described. , And after they are completed, they are used by being divided into individual platforms by a dicer. In the above embodiment, the platform having a single V-groove has been described. However, the present invention provides a platform for combining an optical fiber array as shown in FIG. 19 with another optical element array. Needless to say, it can be applied to

By the way, when assembling the optical module using the platform as shown in FIG. 1, for example, a die bonder can be used. For example,
The laser diode mounted on the electrode 3 on the platform 1 is adjusted in the axial direction of the V-groove 1V while the side surface of the diode is in contact with the vertical side surface of the metal stopper 5 where the notch 5a is formed. It can be fixed by soldering at the set position. After the optical fiber is placed in the V-groove 1V, it can be moved in the axial direction so that the fiber end face abuts against the side surface of the fiber stop groove 1E, and then fixed with a holding plate using an ultraviolet curable resin. The wiring for the laser diode can be performed by bonding using a gold wire. Finally, the entire optical module is completed by packaging.

In the above description, a platform for a transmitting optical module in which a laser diode is incorporated is exemplified. However, the present invention relates to a receiving optical module in which a photodiode is incorporated or an optical module in which an optical switch is incorporated. It will be understood that the present invention can also be applied to other platforms. Further, as for the optical fiber, it goes without saying that the present invention can be applied to an optical module platform incorporating any one of a single mode fiber, a multimode fiber, a single mode fiber including a fiber grating, and a multimode fiber including a fiber grating. .

Further, as shown in the schematic plan view of FIG. 18, the present invention can be applied to an optical module platform including a planar waveguide. On the platform 1 shown in FIG. 18, the planar waveguide 7 in a plate shape is positioned and fixed in contact with the metal stopper 5. The planar waveguide 7 is a splitter, and includes a waveguide 7a branched from one to a plurality. That is, an optical signal input to one waveguide 7a from one optical fiber fixed to the right V-groove 1V is split into four equivalent signals and fixed to the four left V-grooves 1V. It is output to four optical fibers. Since the planar waveguide has no electrode, the notch 5 of the stopper 5 as shown in FIG.
a and the wiring pattern 3 are not required.

[0040]

As described above, according to the present invention, a small-sized optical module platform having high accuracy can be provided at low cost. That is, according to the present invention, after a precision mold is formed, the mold can be easily formed at a low cost with high precision using a resin mold and metal plating without using photolithography without the need for photolithography. A platform for an optical module can be provided. As a result, the present invention can be expected to accelerate the development of the optical communication network based on the FTTH concept. Further, it can be expected that the present invention can contribute to the spread of optical interconnection between boards and devices, which is currently in progress.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing an optical module platform according to an example of an embodiment of the present invention.

FIG. 2 is a schematic perspective view showing a precision mold that can be used for manufacturing the optical module platform of FIG. 1;

FIG. 3 is a schematic plan view showing the upper surface of a substrate for producing a precision mold.

4 is a schematic enlarged sectional view of a section along the broken line A ₁ -B ₁ -C ₁ in FIG. 3 represents the state seen in the direction of arrow X _1.

5 is a cross-sectional view showing a state of the precision mold manufacturing substrate in a step subsequent to FIG. 4;

FIG. 6 is a plan view showing a state in which an X-ray mask is overlaid on a precision mold manufacturing substrate.

7 is an enlarged cross-sectional view of a section along the broken line A ₁ -B ₁ -C ₁ in FIG. 6 shows a state seen in the direction of arrow X _1.

FIG. 8 is a sectional view showing a mold formed by plating so as to cover a resist pattern on a substrate.

FIG. 9 is a sectional view showing a completed precision mold.

FIG. 10 is a schematic plan view showing the upper surface of a substrate for forming an optical module platform.

11 is an enlarged sectional view of a section along the broken line A ₂ -B ₂ -C ₂ in Fig. 10 shows a state seen in direction of arrow X _2.

FIG. 12 is a schematic plan perspective view showing a state where a precision mold is overlaid on a platform substrate and resin-molded.

13 is an enlarged sectional view of a section along the broken line A ₂ -B ₂ -C ₂ in FIG. 12 shows a state seen in direction of arrow X _2.

FIG. 14 is a cross-sectional view showing a state where a metal stopper 5 is formed on a platform substrate by plating.

FIG. 15 is a cross-sectional view showing a state in which the silicon nitride film in the V-groove forming region has been removed after forming the metal stopper 5 on the platform substrate.

FIG. 16 is a cross-sectional view showing a state in which an opening for forming a V-groove is opened in a silicon nitride film and then a mold resin pattern is removed.

FIG. 17 is a cross-sectional view showing a state where a V-groove is formed on a silicon substrate.

FIG. 18 is a schematic plan view showing an optical module platform according to another embodiment of the present invention, which is a platform for incorporating a planar waveguide.

FIG. 19 is a schematic perspective view showing an example of a platform for an optical module according to the prior art.

FIG. 20 is a schematic perspective view showing a passive alignment method in assembling an optical module according to the prior art.

FIG. 21 is a schematic perspective view showing another example of the passive alignment method according to the prior art.

FIG. 22 is a schematic perspective view showing another example of an optical module platform according to the prior art.

[Description of Signs] 1 Conductive silicon single crystal substrate 1V Optical fiber fixing V groove 1E Fiber stop groove 2 Silicon nitride film 2S Opening for forming metal stopper 5 by plating 2V V groove formed by anisotropic etching Opening 3 electrode pattern 4 mold resin pattern 5 metal stopper 5a notch 7 planar waveguide 7a waveguide 11 silicon substrate 12 silicon nitride film 12S opening corresponding to metal stopper 5 12V opening corresponding to V groove 13 Copper micro-region corresponding to cut 5a 14 X-ray mask 14a Silicon nitride support film 14b Tungsten mask pattern 15 Precision mold 15S Projection corresponding to metal stopper 5 15V Projection corresponding to V-groove 15E Fiber stop Projection corresponding to groove

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Toshiyuki Numazawa 1431-12 Kanadechi, Kamigori-cho, Ako-gun, Hyogo Prefecture Harima Research Laboratory, Sumitomo Electric Industries, Ltd.

Claims (4)

[Claims] 1. A silicon substrate, a V-groove formed on one main surface of the silicon substrate by anisotropic etching for positioning and fixing an optical fiber, and a V-groove to be optically coupled to the optical fiber. And a metal stopper formed by plating on said one main surface of said substrate for positioning and fixing said optical component. 2. The optical module platform according to claim 1, wherein the other optical component is one selected from a laser diode, a photodiode, an optical switch, and a planar waveguide. 3. The optical fiber according to claim 1, wherein the optical fiber is one selected from a single mode fiber, a multimode fiber, a single mode fiber including a fiber grating, and a multimode fiber including a fiber grating. 3. The optical module platform according to item 2. 4. A method of manufacturing a platform for an optical module, comprising: forming a resist layer having a predetermined thickness on a conductive underlayer; patterning the resist layer by X-ray lithography; A metal mold is formed by metal plating to a thickness covering the resist layer using the conductive underlayer as a plating electrode, and the mold is separated from the conductive underlayer and the resist layer, and is subjected to a conductive treatment. The mold is aligned on a silicon substrate having a surface area and a non-conductive treated surface area, and a mold resin is injected between the mold and the silicon substrate to form a predetermined position on the silicon substrate. Forming a mold resin layer pattern having a thickness, removing the mold, and removing the mold from the mold resin layer pattern on the silicon substrate; A metal stopper for positioning and fixing the optical component is formed by metal plating the surface region that has been subjected to the electrical treatment as a plating electrode, and the non-conductive portion on the silicon substrate exposed from the mold resin pattern is formed. A method for manufacturing a platform for an optical module, comprising forming a V-groove by performing anisotropic etching on a treated surface region.