JPH10329887A - Embossed carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To dampen a shock received when a product is stored and in turn prevent a size accuracy at a product storing part from being reduced even under a manufacturing operation for a long period of time by a method wherein a base section is made to have a gradual recess extending from its circumferential edge toward its center and the product is supported at both ends of the recess from its lateral sides and lower side. SOLUTION: A plurality of product storing sections 2 are recessed and formed from above along a longitudinal direction of a tape main body 1 in a specified space, only a substantial central part of a bottom part 3 of each of the product storing sections 2 is projected toward an upper surface side to form a base section 4. This base section 4 is formed to become a gradual recess from its circumferential edge toward its central part, wherein it is formed such that the product is supported at both ends of the recess at its lateral sides and lower side. Thus, in the case that the product is mounted on the base 4, the base 4 is indented to realize a resilient characteristic, so that shock received when the product is stored is released and in turn a die during press formation is hardly worn out even under a manufacture for a long period of time and so a size accuracy at the product storing sections 2 is not reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a product storage section for storing a product such as a semiconductor device, which is formed at regular intervals, and the product is stored in the product storage section. The present invention relates to an embossed carrier tape in which a cover tape is covered along a longitudinal direction of a tape main body so as to cover a storage portion, and both ends of the tape are thermally welded to the tape main body.

[0002]

2. Description of the Related Art Conventionally, as shown in FIGS. 3 and 4, a plurality of embossed carrier tapes are depressed from an upper surface at regular intervals along a longitudinal direction of a tape body 1 so that a product storage section 2 is formed. It is known that a pedestal portion 4 is formed by projecting a substantially central portion of the bottom portion 3 of the product storage portion 2 from the other bottom portion toward the upper surface side, and a projection 6 is formed around the pedestal portion 4. (See JP-A-9-95388).
In the drawings, reference numeral 7 denotes a transport winding sprocket formed at one end in the width direction of the tape main body 1 at a constant interval, and reference numeral D denotes a semiconductor device as a product.

In such an embossed carrier tape, after a product D is stored on the pedestal portion 4, a cover tape 3 is placed along the longitudinal direction of the tape body 1 so as to cover the product storage portion 2. The tape body 1
The product D is housed by being thermally welded to the substrate.

The tape body 1 is made of PVC (polyvinyl chloride resin), PS (polystyrene resin), AP
The main material is ET (amorphous polyethylene terephthalate resin), PC (polycarbonate resin), etc.
The product storage section 2 is formed by press molding using a mold or thermal vacuum molding.

[0005]

In the above-mentioned product storage section 2, it is necessary to arrange the product D at a predetermined position as shown in FIG. If it is too soft (or too thin), there is a problem that the pedestal portion 4 is recessed downward.
Conversely, if the tape body itself is hard, there is a problem that the product D jumps up and rides on the protrusion 6 due to a slight misalignment, so that the product D cannot be arranged at a predetermined position.

Further, when the product storage section 2 is formed by press molding using a mold, the mold is worn by long-time manufacture, and the dimensional accuracy of the product storage section 2 is reduced as the product is manufactured. There was a problem of doing it. 0.1
This was an important issue for embossing tapes that required dimensional accuracy in the order of μm.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems relating to the conventional embossing tape, and alleviates the impact received when storing a product. It is an object of the present invention to provide an embossing tape which does not decrease (a mold is hardly worn during press molding).

[0008]

According to the present invention, there is provided an embossing tape having a plurality of product storage portions formed by being depressed from an upper surface at regular intervals along a longitudinal direction of a tape main body to form a product storage portion. A base portion is formed by projecting only a substantially central portion of a bottom portion of the tape main body to the upper surface side, and after a product is stored on the base portion, in a longitudinal direction of the tape body so as to cover the product storage portion. In an embossed carrier tape in which both ends are heat-welded to the tape main body along with a cover tape, the pedestal portion is formed as a gentle recess from the periphery to the center, and the product is laterally and laterally held at both ends of the recess. It is characterized by being supported from below.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, the pedestal for holding a product to be housed is formed as a gentle depression from its periphery to the center. While the product is stored to some extent, the impact received when the product is stored is reduced in the entire pedestal portion. In addition, by reducing the unevenness of the pedestal itself, the unevenness of the mold for molding the product storage portion can be reduced, so that even when manufactured for a long time, the degree of mold wear is small, and the size of the product storage portion is small. Accuracy does not decrease.

Further, in the present invention, the product is supported from the side and below at both ends of the recess of the product storage portion, so that the impact when the product is placed on the pedestal portion is reduced while being stable. Can be fixed. The specific shape of the recess is appropriately selected depending on the shape of the product to be stored, and when the product is a semiconductor device, when the metal terminals protrude in parallel in two directions, When the metal terminal has a shape gradually concaved from two directions, and the metal terminal protrudes in all directions, the metal terminal has a shape concaved from four directions and a mortar shape.

If the elasticity is insufficient even if the recess is provided, the elasticity of the recess can be adjusted by providing an opening in the pedestal having the recess.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 and 2 show a first embodiment of an embossing tape according to the present invention.

The embossed carrier tape in this embodiment is formed by depressing a plurality of products from the upper surface at regular intervals along the longitudinal direction of the tape body 1 to form a product storage section 2.
A pedestal portion 4 is formed by projecting only a substantially central portion of the bottom portion 3 of the product storage portion 2 toward the upper surface side. After the product D is stored on the pedestal portion 4, the product storage portion 2 is removed. The tape main body 1 is covered with a cover tape 5 along the longitudinal direction of the tape main body 1 so as to cover the tape main body 1, and both ends thereof are thermally welded to the tape main body 1. The product storage section 2 is formed by die press molding or thermal vacuum molding.

In this embossed carrier tape,
The pedestal part 4 of the product storage part 2 is formed as a gentle depression from the periphery to the center, and is formed so as to support the product from the side and below at both ends of the depression. In the drawing, reference numeral 7 denotes a transport winding sprocket formed at one end in the width direction at regular intervals on the tape body 1, and reference numeral D denotes a semiconductor device as a product.

In the case of the embossed carrier leap of this embodiment, when the semiconductor device as a product is mounted on the pedestal portion, the pedestal portion is depressed to exhibit elasticity. In addition, the dimensional accuracy of the product storage section does not decrease even after long-term production (the mold during press molding is hardly worn).

FIG. 3 discloses an embossing rearleap according to a second embodiment. In addition, the XX cross section in FIG. 3 is a view similar to FIG. The feature of this embodiment is that the pedestal portion 4 in the first embodiment is formed in a mortar shape.
Even if metal terminals are provided on all sides of the semiconductor device,
The same effect as in the first embodiment can be exhibited.

[0017]

The embossing tape according to the present invention forms a product storage portion by depressing a plurality of products from the upper surface at regular intervals along the longitudinal direction of the tape body to form a product storage portion. A pedestal portion is formed by projecting only the center portion to the upper surface side, and after a product is stored on the pedestal portion, a cover tape is provided along the longitudinal direction of the tape main body so as to cover the product storage portion. In the embossing carrier tape whose both ends are heat-welded to the tape body, the pedestal portion is formed as a gentle depression from the periphery to the center, and the product is supported laterally and below at both ends of the depression. Thus, while reducing the impact received when storing the product, an excellent effect is obtained in that the dimensional accuracy of the product storage portion does not decrease even after a long manufacturing time (the mold is hardly worn during press molding). That.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing a first embodiment of an embossed carrier tape according to the present invention.

FIG. 2 is a sectional view taken along line XX of FIG.

FIG. 3 is a perspective view schematically showing a second embodiment of the embossed carrier tape according to the present invention.

FIG. 4 is a perspective view schematically showing an example of a conventional embossing tape.

FIG. 5 is a sectional view taken along line XX of FIG. 4;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Tape main body 2 Product storage part 3 Bottom part 4 Base part 5 Cover tape D Product

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Yoshiyuki Fujimaki, Inventor 2- 13-1, Dai, Kamakura-shi, Kanagawa Prefecture Inside Toyo Kagaku Co., Ltd. (72) Inventor Yasunobu Shiroishi 2-3-1, Dai, Kamakura-shi, Kanagawa Prefecture Toyo Chemical Co., Ltd.

Claims (1)

[Claims] 1. A product storage part (2) is formed by depressing a plurality of pieces from an upper surface at regular intervals along a longitudinal direction of a tape main body (1) to form a product storage part (2), and a bottom part (3) of the product storage part (2). ) So that only the substantially central portion thereof protrudes toward the upper surface side, and
After the product (D) is stored on the pedestal (4), a cover tape (5) is formed along the longitudinal direction of the tape body (1) so as to cover the product storage (2). ), The both ends of which are heat-welded to the tape body (1), wherein the pedestal (4) is formed into a gentle recess from the periphery to the center, and the product is provided at both ends of the recess. An embossing tape which supports (D) from the side and below.