JPH10325849A - Wiring substrate inspection device and method and lighting photosensitive array - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the inspection device of a wiring substrate which is miniaturized, lightweight and easy to handle without a number of cables and exclusive fixtures. SOLUTION: LED phototransistor arrays 5, 6, 7 are attached to a connector, IC and the like mounted on a substrate to be inspected 1. The LED phototransistor 5 has a connection pin connected to a pin of the connector and the like, and lighting LED 36 and the like are connected when a phototransistor 32 and the like energizing the connection pin to a power source when the connection pins receives light respectively and the connection pin are energized to the power source. The phototransistor 32 connected to wiring to be inspected on a substrate 1 is irradiated with light, and the lighting state of LEDs 36, 37 and the like is examined.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection apparatus for a wiring board, and more particularly, to an inspection apparatus and method for a wiring board on which components are mounted, and a lighting photosensitive array used in the apparatus and method.

[0002]

2. Description of the Related Art Conventionally, an inspection of a wiring board on which a connector or an electric component is mounted has been performed by using an inspection apparatus as described below.

One is an inspection apparatus for connecting a large number of connectors mounted on a wiring board to be inspected to a main body of the inspection apparatus with a large number of cables. In this case, the inspection device is designed to inspect the shape, type, and quantity of the connectors mounted on the substrate to be inspected, in addition to the inspection device itself for opening and shorting the pattern of the substrate to be inspected and performing a functional inspection of the electrical components. A large number of cables with a combined length of several meters are required, and the board to be inspected and the inspection device are all connected by a large number of cables, and then the electrical inspection of the board to be inspected is performed. Cable had been removed.

Another one is an inspection apparatus for connecting a wiring board to be inspected and an inspection apparatus main body via a fixture having a large number of contact probes. In this case, in addition to the inspection device body, a dedicated fixture in which a large number of contact probes are fixed according to the external size of the board to be inspected, the shape of the mounted connectors and electrical components, and the positions of the pins, and this dedicated fixture A large number of cables are required to connect many contact probes of the fixture to the main body of the inspection device.The board to be inspected is set on a dedicated fixture, and many contact probes are attached to the board using the force of vacuum or the like. To perform electrical inspection by connecting to a connector or an electrical component, and after the inspection is completed, the force such as vacuum is released and the substrate to be inspected is removed from the dedicated fixture.

[0005]

A first problem is that a conventional inspection apparatus in which a wiring board to be inspected on which connectors and electric components are mounted and an inspection apparatus main body are connected by using a large number of cables is used. Poor productivity and low productivity. In addition, the inspection apparatus becomes large.

The reason is that a large number of cables having a length of several meters have a considerable weight, and the workability of connecting them to a board to be inspected and removing them after the inspection is completed is poor, and the number of inspection steps is increased, resulting in low throughput. Because it had become. Also, because there were many cables with several meters,
The inspection equipment has become large.

[0007] The second problem is that, in a conventional inspection apparatus for connecting a wiring board to be inspected on which connectors and electric components are mounted using a dedicated fixture, the structure of the fixture is complicated. The device also becomes large.

[0008] The reason is that the fixture itself produces a large number of contact probes with high positional accuracy, and when connecting the substrate to be inspected to the contact probes, the interior is made airtight to utilize the force of vacuum or the like. This is because the structure became complicated and the production cost became high. In addition, the inspection apparatus becomes large because many contact probes of the fixture and the inspection apparatus main body are connected by many cables.

The present invention eliminates the need for a large number of cables of several meters for connecting a wiring board to be inspected and an inspection device as in a conventional inspection device, and makes the substrate inspection device smaller and lighter. It is another object of the present invention to eliminate the need for a complicated dedicated fixture and to simplify the device configuration of a wiring board inspection device. In addition, the present invention connects a large number of cables to the wiring board to be inspected, and after the inspection,
An object of the present invention is to provide a board inspection apparatus which eliminates the work of disconnecting a large number of cables, facilitates the inspection work, improves the number of operators, reduces the number of inspection steps, and improves the productivity.

[0010]

The lighting photosensitive array according to the present invention comprises a pin (40 in FIG. 1) of a component (2, 3, 4 in FIG. 1) mounted on a wiring board to be inspected (1 in FIG. 1). There are connection pins (18 in FIG. 2 and 20 in FIG. 3) to be connected to the respective connection pins. At least some of the connection pins are connected to a power supply (27 in FIG. 5) by receiving light corresponding to each of the connection pins. 2) and a light-emitting element (1 in FIGS. 2 and 3) that emits light when the connection pin is turned on.
7) (see 29 and 30 in FIG. 4).
..), The light-emitting photosensitive block connects the connection pin between the photosensitive element and the light-emitting element, and the light-emitting element and the photosensitive element are power supply pins of the component among the connection pins. For example, the light emitting element may be an LED, and the photosensitive element may be a phototransistor.

The lighting photosensitive array may be provided with a claw for gripping a component mounted on the wiring board to be inspected.

A wiring board inspection apparatus of the present invention selectively connects a substrate holding table for holding a wiring board to be inspected and the photosensitive element of the above-described lighting photosensitive array connected to a component mounted on the wiring board to be inspected. And a light source for irradiating light to the light source.

A wiring board inspection apparatus according to the present invention selectively connects a substrate holding table for holding a wiring board to be inspected and the photosensitive elements of the above-described light-sensitive photosensitive array connected to components mounted on the wiring board to be inspected. A light source that irradiates light; and an image processing unit that images a lighting state of the photosensitive element on the wiring board to be inspected and inspects wiring on the wiring board to be inspected.

The light source of the above-described wiring board inspection apparatus may change the direction of light to selectively irradiate the photosensitive element.
It is also possible to selectively irradiate the photosensitive element by changing the relative position with respect to the wiring substrate to be inspected, and furthermore, this light source irradiates a laser beam or irradiates light using an optical fiber. You may do so.

According to a wiring board inspection method of the present invention, the above-mentioned lighting photosensitive array is attached to a component mounted on a wiring board to be inspected, and the light emitting element is turned on or off when the photosensitive element is selectively irradiated with light. The wiring of the wiring board to be inspected is inspected by lighting.

[0016]

Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a configuration diagram of a wiring board inspection apparatus according to an embodiment of the present invention.

Connector 2 mounted on wiring board 1 to be inspected
Is connected to the LED phototransistor array 5, the connector 3 is connected to the LED phototransistor array 6,
The LED phototransistor array 7 is mounted on the upper part of C4, the connection pins 20 of the LED phototransistor array 7 are brought into contact with the pins 40 of the IC 4, and the wiring substrate 1 to be inspected is mounted and fixed on the substrate holder 8. Next, the power supply 15 is connected to the wiring board 1 to be inspected, and the LED phototransistor array 5 is
Power is supplied to the LED phototransistor arrays 6 and 7.

FIG. 2 is a perspective view of the LED phototransistor arrays 5 and 6. Connector connection pins 18 are provided on the lower surfaces of the LED phototransistor arrays 5 and 6 to be in contact with the contacts of the connectors 2 and 3. The connector connection pins 18 are connected in a one-to-one correspondence. Each of the connectors 2 and 3 has a power supply pin connected to a power supply pattern on the wiring board 1 in addition to the pin to be inspected.
The power is supplied to the LED phototransistor array 6.

FIG. 3 is a perspective view of the LED phototransistor array 7. LED phototransistor array 7
IC connection pins 20 are implanted on both sides of the. IC
The IC connection pin 20 is brought into contact with the
IC connection pin 2 in one-to-one correspondence with C4 pin to be inspected
1 is connected. A part of the pin 40 is a power supply pin connected to a power supply pattern on the wiring board 1, and a part of the IC connection pin 20 is brought into contact with the power supply pin to supply power to the LED phototransistor array 7. In addition, elastic IC clamp claws 21 provided at both ends of the LED phototransistor array 7 are used to stably contact the test pins of the LED phototransistor array 7 with the IC 4. L to grab
The ED phototransistor array 7 is fixed on the IC 4.

LED phototransistor arrays 5, 6,
7, an LED phototransistor block 19 comprising one LED 17 and one phototransistor 16 is provided corresponding to the connector connection pin 18 or the IC connection pin 20 connected to the connector 2, 3 or the pin to be inspected of the IC 4. 5 is shown in FIG.

In FIG. 5, the wiring 24 on the wiring board 1 is connected to the connection pins 26 and 41. Connection pin 26,
LED phototransistor block 2 corresponding to 41
9 and 30 are provided, and blocks 29 and 30 each have L
An ED 36 and a phototransistor 32, an LED 37 and a phototransistor 33 are provided.

In the LED phototransistor block 29, the LED 36 is connected to the phototransistor 32 via two resistors 25, and these are connected in series by connecting pins (not shown in FIG. 5) and a conductor pattern on the wiring board 1. The power supply 27 is connected to a ground pattern 28 via a power supply 27. L in the LED phototransistor block 30
The ED 37 and the phototransistor 33 are similarly connected.

When the phototransistor 32 is irradiated with the laser beam, the LED 36 is driven and turned on. At this time, if the wiring 24 is normal, the LED 37 connected to the wiring 24 via the connection pin 26 is also turned on at the same time. When the wiring 24 is open, the LED 37 does not light. Similarly, when the phototransistor 33 is irradiated with laser light, if the wiring 24 is normal, the LED 36 is turned on.

FIG. 1 will be continued. Inspection substrate 1
The position information of all the phototransistors of the LED phototransistor arrays 5, 6, and 7 and the LED is stored in the control unit 14 in advance. An ultrafine laser light irradiating section 9 and a camera section 12 are arranged above the wiring substrate 1 to be inspected, and the driving direction of the ultrafine laser light 10 from the ultrafine laser light irradiating section 9 can be changed by a driving section 11.

The control unit 14 controls the LED phototransistor array 5 and the LED connected to the wiring to be inspected on the substrate 1.
The position data of one phototransistor in the phototransistor array 6 and the LED phototransistor array 7 is sent to the driving unit 11, and the direction of the ultrafine laser light irradiation unit 9 is changed by applying the direction of the ultrafine laser light irradiation unit 9 to this phototransistor. To match. Then, the control unit 14 sends the ultrafine laser light irradiation ON signal to the ultrafine laser light irradiation unit 9 and irradiates the ultrafine laser light 10 to the one phototransistor connected to the wiring to be inspected. At this time, if the wiring to be inspected is normal, the LE of the same LED phototransistor block as the phototransistor irradiated with the ultrafine laser beam 10 is used.
D, and only the LEDs of the other LED phototransistor blocks connected to this LED phototransistor block and the wiring under test on the test substrate 1 are turned on. If the wiring under test is open, the other LED does not light. Further, when the wiring to be inspected is short-circuited with another wiring, the LED of the LED phototransistor block connected to the other wiring is also turned on.

The image of the LED is taken in by the camera unit 12 and the presence or absence of lighting of the LED is detected by the image processing unit 13.
The control unit 14 compares the detected data indicating whether the LED is lit or not and the non-defective data of the inspected substrate 1 stored in advance, and determines whether the inspected substrate 1 is defective.

FIG. 4 is a plan view of the substrate 1 to be inspected for explaining the inspection principle in the present embodiment.

An LED font transistor block 29 arranged in the LED font transistor array 5,
LED phone and LE arranged in transistor array 6
The D phototransistor block 30 is connected by the wiring 22 on the wiring substrate 1 to be inspected. In addition, LED
The phototransistor blocks 46 and 47 adjacent to the phototransistor block 29 and the phototransistor blocks 48 and 49 adjacent to the phototransistor block 30 are connected by wirings 42 and 43 adjacent to the wiring 22, respectively.

The LED phototransistor array 5
LED phototransistor block 41 arranged in
And the phototransistor block 31 arranged in the LED phototransistor array 7 are connected by the wiring 23 on the wiring substrate 1 to be inspected. The phototransistor blocks 50 and 51 adjacent to the LED phototransistor block 41 and the phototransistor blocks 52 and 53 adjacent to the LED phototransistor block 31 are connected by wirings 44 and 45 adjacent to the wiring 23, respectively. .

When performing an open / short inspection of the wiring 22, the phototransistor 32 of the LED phototransistor block 29 is irradiated with the ultrafine laser beam 10. If the wiring 22 is normal, only the LED 36 of the LED phototransistor block 29 and the LED 37 of the LED phototransistor block 30 are turned on. Wiring 22
Is open, only the LED 36 is turned on, and the LED 37 is not turned on. When the wiring 22 is short-circuited with one of the adjacent wirings 42 and 43, L
The ED 36, the LED 37, and the LED of the LED phototransistor block connected to the wiring short-circuited with the wiring 22 among the LED phototransistor blocks 46 to 49 adjacent thereto are turned on. Similarly, when inspecting the wiring 23 between the connector 2 and the IC 4, the phototransistor 35 of the LED phototransistor block 41 is irradiated with the ultrafine laser light 10. If the wiring 23 is normal, only the LED 39 of the LED phototransistor block 41 and the LED 38 of the LED phototransistor block 31 are turned on. When the wiring 23 is open, only the LED 39 is lit, and LE
D38 does not light. Also, the wiring 23 is adjacent to the wiring 4
LED3 if short circuit with any of 4,45
9, among the LED phototransistor blocks 51 to 53 and the LED phototransistor blocks 51 to 53 adjacent thereto, the LED of the LED phototransistor block connected to the wiring short-circuited to the wiring 23 is turned on.

The lighting photosensitive array of the present invention is not limited to LEDs as lighting elements, but may be incandescent lamps or the like.
Light emitting elements are not limited to phototransistors.

The wiring board inspection apparatus of the present invention can use an incandescent lamp or the like instead of a laser as a light source. Further, if the lighting state of the light emitting element when the photosensitive element is irradiated with light is visually observed and inspected, the image processing unit becomes unnecessary.

Instead of changing the direction of the laser beam or the like as shown in FIG. 1, the photosensitive element can be selectively irradiated with light by changing the relative position between the light source and the wiring board to be inspected. .

Further, light can be emitted from the optical fiber to irradiate the light to the photosensitive element.

Further, it is possible to shorten the inspection time by providing a plurality of light sources and simultaneously irradiating a plurality of photosensitive elements.

[0037]

The first effect is that the size and weight of the wiring board inspection apparatus can be reduced, and the structure can be simplified.

The reason is that in the conventional inspection apparatus, in order to connect the wiring board to be inspected and the inspection apparatus, a large number of cables of several meters are used to connect between the wiring board to be inspected and the inspection apparatus. Or a dedicated fixture equipped with a large number of contact probes was used, but in the wiring board inspection apparatus of the present invention, the light emitting element of the light emitting photosensitive block is irradiated with a laser beam or the like, and the light emitting element that conducts with the light emitting element is irradiated with the laser element. This is because, by turning on the light emitting elements of the photosensitive block, it is not necessary to manufacture a large number of cables and dedicated fixtures for connecting the wiring board to be inspected and the inspection apparatus.

The second effect is that the operability is improved, the number of inspection steps can be reduced, and the productivity can be improved.

The reason is that, like the conventional inspection apparatus, a large number of cables for connecting a large number of meters for connecting the wiring board to be inspected and the inspection apparatus and a huge amount of cables for removing after the inspection is completed. This is because no man-hour is required.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a wiring board inspection apparatus according to an embodiment of the present invention.

FIG. 2 shows an LED phototransistor array 5 shown in FIG.
6 is a perspective view of FIG.

FIG. 3 is a perspective view of the LED phototransistor array 7 in FIG.

FIG. 4 is a plan view of the wiring board 1 in FIG.

5 is an LED phototransistor block 2 in FIG.
It is a circuit diagram of 9,30.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wiring board to be inspected 2 Connector 3 Connector 4 IC 5 LED phototransistor array 6 LED phototransistor array 7 LED phototransistor array 8 Substrate holder 9 Ultrafine laser light irradiation part 10 Ultrafine laser light 11 Drive part 12 Camera part 13 Image processing part 14 Control Unit 15 Power Supply 16 Phototransistor 17 LED 18 Connector Connection Pin 19 LED Phototransistor Block 20 IC Connection Pin 21 IC Clamp Claw 22 Wiring 23 Wiring 24 Wiring 25 Resistance 26 Connection Pin 27 Power Supply 28 Ground Pattern 29 LED Phototransistor Block 30 LED phototransistor block 31 LED phototransistor block 32 phototransistor 33 phototransistor 35 phototransistor 36 LED 37 LED 38 LED 39 LED 40 pin

Claims (11)

[Claims] 1. A power supply system comprising: a contact pin corresponding to each pin of a component mounted on a wiring board to be inspected; and a power supply corresponding to at least some of the connection pins by receiving light. And a light emitting photosensitive block comprising a light emitting element which emits light when the connection pin is electrically connected to a power supply. 2. The light-emitting photosensitive block connects the connection pin between the photosensitive element and the light-emitting element, and connects the light-emitting element and the photosensitive element to a power supply pin of the component among the connection pins. The lighting photosensitive array according to claim 1, wherein the lighting photosensitive array is connected between the light emitting elements. 3. The lighting photosensitive array according to claim 1, wherein said light emitting element is an LED, and said photosensitive element is a phototransistor. 4. The illuminated photosensitive array according to claim 1, further comprising a claw for gripping a component mounted on the wiring board to be inspected. 5. A board holding table for holding a wiring board to be inspected, and a light source for selectively irradiating light to the photosensitive elements of the lighting photosensitive array connected to components mounted on the wiring board to be inspected. A wiring board inspection apparatus using the lighting photosensitive array according to claim 1. 6. A substrate holder for holding a wiring board to be inspected, a light source for selectively irradiating light to the photosensitive element of the lighting photosensitive array connected to a component mounted on the wiring board to be inspected, The image processing unit according to any one of claims 1 to 4, further comprising: an image processing unit configured to image a lighting state of the photosensitive element on the wiring board to be inspected and inspect wiring on the wiring board to be inspected. Wiring board inspection equipment using a light-sensitive photosensitive array. 7. The wiring board inspection apparatus according to claim 5, wherein the light source changes the direction of light to selectively irradiate the photosensitive element. 8. The wiring board inspection apparatus according to claim 5, wherein the light source selectively irradiates the photosensitive element by changing a relative position with respect to the wiring board to be inspected. 9. The wiring board inspection apparatus according to claim 5, wherein the light source emits a laser beam. 10. The wiring board inspection apparatus according to claim 5, wherein the light source emits light using an optical fiber. 11. The lighting photosensitive array is attached to a component mounted on the wiring board to be inspected, and when the light emitting element is selectively irradiated with light, the light emitting element is turned on or off, and the light emitting element is turned on or off. 5. A method for inspecting a wiring board using a lighting photosensitive array according to claim 1, wherein the wiring is inspected.