JPH10321134A - Manufacture of plasma display panle - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a film-like phosphor excellent in position and height accuracy with high efficiency by arranging conductive films and counter electrodes formed on a cell inside surface on a glass substrate through slurry of phosphor powder, electrodepositing a phosphor on the conductive films by impressing DC voltage between both electrodes, and burning away the conductive films or its electric conductivity by baking. SOLUTION: Partition walls 6 are formed on a back glass substrate 5, and next, a resist film of a prescribed pattern is formed on a cell inside surface, and a metallic film is stuck by sputtering or the like, or a conductive high polymer film is stuck by a vacuum evaporation method, and conductive films 13 are formed. Next, the back glass substrate 5 on which the conductive films 13 are formed and counter electrodes are soaked and arranged in a suspension of phosphor powder so that the conductive films 13 and the counter electrodes are opposed to each other, and electrodeposition layers 14 of phsophor powder are formed on the conductive layers 13 by impressing DC voltage of about 100 to 600 V between the conductive films 13 and the counter electrodes. After the electrodeposition layers 14 are formed on the whole cells, the back glass substrate 5 is dried and baked.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a plasma display panel, and more particularly, to forming a phosphor film on a substrate of a plasma display panel by using an electrodeposition method to easily and accurately emit a fluorescent film. The present invention relates to a method for forming a body film.

[0002]

2. Description of the Related Art Plasma display
Is an image display device using gas discharge, and usually,
A large number of minute discharge cells are arranged vertically and horizontally (in a matrix), and a required portion of cells is discharged to emit light to display characters and figures. This flat display panel is called a plasma display panel (plasma display panel, PDP). The plasma display panel has various advantages such as simple structure and easy enlargement; has a memory function; can be colored; and is much more than a CRT used in a television or the like. Research and development of a large and small depth PDP is being pursued.

FIG. 2 is an exploded perspective view showing a general structure of a plasma display panel, and FIG. 3 is an enlarged sectional view showing details of a part III when the glass substrates 1 and 5 of FIG. 2 are assembled.

On a front glass substrate 1, a display electrode 2, a dielectric layer 3, and a protective film 4 such as MgO (magnesium oxide) are provided. On the back glass substrate 5, partition walls 6 are formed at predetermined intervals. An address electrode 7 and a film-like phosphor 8 are formed in a fine space (discharge cell) defined by the front glass substrate 1, the rear glass substrate 5, and the partitions 6, 6, and a discharge gas 9 is injected. ing.

In such a plasma display panel, by applying a voltage between the electrodes 2 and 2 to selectively discharge and emit light from the phosphors 8 in the discharge cells formed between the partitions 6 and 6, characters and characters can be displayed. Display a shape.

Conventionally, as a method of forming the phosphor 8 in the discharge cell, there are a method of directly forming the film-like phosphor 8 by screen printing, and a method of filling the cell with the phosphor by screen printing and then forming the phosphor. A method of forming a film-like phosphor 8 having a predetermined thickness by excavating the body by sandblasting is adopted.

[0007]

In the method of directly forming a film phosphor by screen printing, it is difficult to adjust the printing position and to adjust the printing characteristics (viscosity, thixotropic property, etc.) of the paste as the screen size increases. Become.
On the other hand, in the method of excavating by sandblasting after filling the phosphor into the cell by printing, uniform excavation is difficult because the blast excavation properties of the three color phosphors are different,
Troubles such as dropouts are also likely to occur.

As described above, it is very difficult to form a uniform phosphor film in a cell by any of the conventional phosphor forming methods.

An object of the present invention is to solve the above-mentioned conventional problems and to provide a method for easily and accurately forming a film phosphor of a plasma display panel.

[0010]

A method of forming a partition of a plasma display panel according to the present invention is directed to a method of manufacturing a plasma display panel having a step of forming a phosphor in a film on a cell on a glass substrate of the plasma display panel. After forming a conductive film on the inner surface of the cell on the glass substrate, the conductive film and the counter electrode are arranged via a slurry of phosphor powder, and a DC voltage is applied between the conductive film and the counter electrode. Then, a phosphor is electrodeposited on the conductive film, and then fired, so that the conductive film is lost or the conductivity of the conductive film is lost.

According to the present invention, by forming a phosphor by an electrodeposition method, a film phosphor can be formed with high efficiency, high positional accuracy and high accuracy.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of a method of manufacturing a plasma display panel according to the present invention.

In the present invention, first, a partition 6 is formed on a glass substrate (back glass substrate) 5 of a plasma display panel. Next, a conductive film is formed only on the inner surface of the cell where the phosphor film is to be formed. To form this conductive film,
A resist film may be formed on the surface on which the phosphor film is not formed, a conductive film may be formed on the entire surface, and then the resist film may be removed. In order to form the resist film in a predetermined pattern, an ordinary method may be used, such as attaching an organic resist in the form of a film, exposing the organic resist to a predetermined pattern, and then removing an unexposed portion.

After forming the resist film having the predetermined pattern, sputtering, CVD, ion plating,
A metal film is attached by various methods such as printing, and a conductive polymer film is attached by a vacuum deposition method or the like. Thereafter, the resist film is dissolved and removed with a solvent, so that the conductive film 13 is formed only on the inner surface of the portion where the phosphor film is to be formed.

When the conductive film 13 is a metal film, preferable metals include W (tungsten) and Al (aluminum). The thickness of the metal film is 200 to 200
It is preferably in the range of 0 °, especially 300 to 1000 °. If the thickness is less than 200 °, it is difficult to uniformly adhere the phosphor powder. On the other hand, if the thickness is more than 2000 °, the processing time for oxidizing this metal film to make it non-conductive in a later step is unnecessarily long.

After the conductive film 13 is formed on the inner surface of the cell in this manner, an electrodeposition layer of a phosphor is deposited on the conductive film 13 by an electrodeposition method.

The phosphor powder used in the electrodeposition method includes:
The following are preferred:

As the red phosphor, (Y, Gd) BO ₃ :
Eu ³⁺ and Y ₂ O ₃ : Eu ³⁺ are preferred.

As the blue phosphor, (Ba, Mg) Al ₁₀
O ₁₇ : Eu ^{2+ and the} like are preferable.

The green phosphor is Zn ₂ SiO ₄ : Mn.
Are preferred.

The average particle size of the powder is preferably 2 μm or less.

As a dispersion medium for dispersing the powder, an organic solvent such as isopropyl alcohol and acetone, or a mixture thereof is preferable.

The concentration of the suspension in which the phosphor powder is dispersed in this medium is preferably 1 to 2% by weight.

In the present invention, the glass substrate 11 on which the conductive film 13 is formed is placed in the suspension of the phosphor powder.
And a counter electrode are immersed and arranged so that the conductive film 13 and the counter electrode face each other.
An electrodeposition layer 14 of a phosphor powder is formed on the conductive film 13 by applying a DC voltage of about 600 V, preferably about 200 to 500 V (the conductive film 13 is made negative).

As the counter electrode, Pt, Al, SUS or the like is preferable. This counter electrode is preferably in the form of a mesh (perforated) or plate.

Note that, for example, a red phosphor is formed on a red cell, a blue phosphor is formed on a blue cell, and then a green phosphor is formed on a green cell. . In order to deposit a phosphor of a certain color on a specific cell, a current is applied only to the address electrode of that cell, and no current is applied to the address electrode of another cell.

After the electrodeposited layer 14 is formed to a desired thickness in all cells, the glass substrate is dried and fired. When the conductive film is a metal film, the conductive film is fired in an oxidizing atmosphere to oxidize the metal and lose conductivity. When the conductive film is a polymer film, the conductivity is lost (or the conductive film itself is lost) by being thermally decomposed or oxidized and lost by baking.

[0029]

The present invention will be described more specifically with reference to the following examples.

Example 1 A phosphor for a plasma display panel was formed according to the method of the present invention shown in FIG.

First, a partition having a height of 150 μm is set to 700 μm.
After a resist film is formed on a surface other than the inner surface of the cell of a 50 mm × 75 mm glass (soda glass) substrate provided at a pitch, an Al metal film is formed by sputtering as a metal film serving as an electrode necessary for electrodeposition between the resist films. 300-400
Å was formed. Thereafter, the resist film was peeled off with a solvent and sufficiently washed.

Separately, a phosphor dispersion suspension in which the following phosphors were dispersed was prepared. The medium used was A: acetone / IPA = 7/3 (vol ratio) and B: 2% Mg (NO ₃ ) ₂ aqueous solution, and A 100
A mixture of 15 ml of B with respect to 0 ml was prepared. 10 g of the phosphor was suspended in the above solution.

Red phosphor suspension Phosphor: Composition (Y, Gd) BO ₃ : Eu particle size average 2 μm Blue phosphor suspension Phosphor: Composition (Ba, Mg) Al ₁₀ O ₁₇ : Eu particle size average 2 μm green phosphor suspension Phosphor: composition Zn ₂ SiO ₄ : Mn Particle size average 2 μm First, in the red phosphor suspension,
A counter electrode made of a Pt plate of 60 mm × 80 mm is arranged so that the surface of the glass plate on which the Al metal film is formed and the counter electrode face each other, and an Al electrode is provided between the metal plate and the Al metal film of the red cell.
A DC voltage of 300 V was applied so that the metal film became positive to form an electrodeposition layer of a red phosphor powder on the Al metal film. The electrodeposition time was 1 minute.

Subsequently, a blue phosphor and a green phosphor were electrodeposited on the blue cell and the green cell, respectively.

After the completion of all the electrodepositions, the glass plate was sufficiently dried and fired at 540 ° C. for 10 minutes to form a phosphor. As a result, a phosphor film could be uniformly formed on each cell.

[0036]

As described above in detail, according to the method of manufacturing a plasma display panel of the present invention, a phosphor film of a plasma display panel can be easily and efficiently formed at a desired position uniformly and precisely. Can be.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a method for manufacturing a plasma display panel according to the present invention.

FIG. 2 is an exploded perspective view showing a general configuration of a plasma display panel.

FIG. 3 is an enlarged view of a section taken along a line III in FIG. 3;

DESCRIPTION OF SYMBOLS 1 Surface glass substrate 2 Display electrode 3 Dielectric layer 4 Protective film 5 Back glass substrate 6 Partition 7 Address electrode 8 Phosphor 9 Discharge gas 11 Glass substrate 12 Resist film 13 Conductive film 14 Electrodeposition layer

Claims (1)

[Claims] 1. A method for manufacturing a plasma display panel, comprising: forming a phosphor in the form of a film in a cell on a glass substrate of a plasma display panel, after forming a conductive film on the inner surface of the cell on the glass substrate. The conductive film and the counter electrode are arranged via the phosphor powder slurry, and a DC voltage is applied between the conductive film and the counter electrode to electrodeposit the phosphor on the conductive film and then fired. A method for manufacturing a plasma display panel, comprising: removing a conductive film by conducting the method or removing the conductivity of the conductive film.