JPH10320849A - Laminated type optical disk manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the laminated type optical disk manufacturing device capable of efficiently executing the continuous production from forming to laminating two kinds of both-face and single-face of laminated type optical disk. SOLUTION: This device is provided with the laminating device 8 laminating two single-face disk substrates and the disk substrate feeding device successively feeding two single-face disk substrates to this. In this case, the disk substrate feeding device is provided with the annular loop device arranging plural trays 6 at equal intervals and intermittently advancing at the interval unit of the prescribed pieces, a first carrying device alternately placing a first and a second single-face disk substrates on the tray whenever the loop device stops, a second carrying device taking out the single-face disk substrate from on two trays in the position apart by the interval of an odd number of pieces or an even number of pieces whenever the loop device stops and feeding to the disk substrate laminating device, and the controller controlling the interval unit of the advance of the loop device and the position taking out the single-face disk substrate of the second carrying device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a bonded optical disk manufactured by bonding two disk substrates, such as an optical video disk and a bonded DVD (digital video disk).

[0002]

2. Description of the Related Art A conventional optical video disc is manufactured by the following steps. First, a stamper with pits carrying information is attached to an injection molding machine, and a translucent synthetic resin such as polycarbonate or acrylic is injection-molded with this stamper, so that the translucent pits are transferred. A resin disk substrate is manufactured. Next, aluminum or an aluminum alloy is deposited on the pit formation surface (signal surface) of the substrate by a sputtering method, a vacuum evaporation method, or the like to form a reflection film. Next, a UV-curable resin is applied to the surface of the reflective film by a spin coating method and irradiated with UV light to form a protective film.

After separately manufacturing two disk substrates, a hot-melt type adhesive is applied on the protective film of each disk substrate by a roll coater or the like, and the two disk substrates are bonded. By bonding, a bonded optical disk is manufactured. Recently, DVD
A compact optical disc called a (digital video disc) capable of high-density recording has been developed, and this DVD is also manufactured in the same process as the optical video disc. That is, even in the integrated DVD production system, the A-side disk substrate and the B-side disk substrate separately produced from the A-side molding machine using the A-side signal surface stamper and the B-side molding machine B using the B-side signal surface stamper are used. , In a DVD bonding process.

[0004]

The bonded optical disk includes a double-sided reproducing optical disk having information recorded on both disk substrates, and a single-sided optical disk having information recorded on only one disk substrate. There are two types: a bonded optical disk of a reproduction system. The former is A
The pair of disk substrates of the side and the side B, and the latter, the disk substrate on which the information signal is recorded and the disk substrate on which the dummy signal is recorded are formed by two separate injection molding machines. Or, it is common that the same injection molding machine replaces the stamper and alternately molds, and thereafter, two separate pieces are bonded together.

[0005] For this reason, the difference in the water content of the two synthetic resin disk substrates to be bonded occurs due to the difference in the injection molding machine or the difference in the time from the molding of each disk substrate to the bonding. As a result, the bonded optical disk is likely to be deformed or warped. DV
In the case of D, the thickness of each disk substrate is 0.6 mm,
Since the rigidity is not sufficient, the influence of deformation and warping due to the difference in water content is further increased.

As a method for solving this problem, for example,
Although it is conceivable that each disk substrate is aged for up to about 24 hours, productivity is significantly deteriorated. Further, there is a demand for a production system capable of integrally producing the above two types of bonded optical disks from molding to bonding. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a manufacturing apparatus for a bonded optical disc capable of efficiently producing the above two types of bonded optical discs without deformation and warpage. And

[0007]

According to the present invention, there is provided an apparatus for manufacturing a bonded optical disk, comprising: a bonding means for bonding two single-sided disk substrates; and a two-sided disk substrate sequentially supplied to the bonding means. A lamination type optical disk manufacturing apparatus, comprising: a disk substrate loading means, wherein a plurality of trays are arranged at equal intervals and intermittently advance at predetermined intervals. An annular loop means, and a first and a second single-sided disk substrate are alternately placed on one tray of the loop means each time the loop means advances and stops at the interval unit. Each time the transporting means and the loop means advance and stop at the interval, the first or second single-sided disk substrate is placed and the odd or even number of the A single-sided disk substrate taken out of the two trays at positions separated by just a distance, and a second transporting unit for supplying the disk-side substrate to the disk substrate bonding apparatus; And control means for controlling a position at which the substrate is taken out.

[0008] In the bonded optical disk manufacturing apparatus, the control means advances the loop means using one of the intervals as the interval unit, and sets an even number of positions separated by the interval to one side of the second transport means. As a position where the disk substrate is taken out, the single-sided disk substrate is taken out by the second transport means. In the bonding type optical disc manufacturing apparatus, the control unit advances the loop unit using the two intervals as the interval unit, and shifts even-numbered positions separated by the interval to the single-sided disk substrate of the second transport unit. As a take-out position, the single-sided disk substrate is taken out by the second transport means.

In the bonding type optical disc manufacturing apparatus, the control means advances the loop means using one of the intervals as the interval unit, and sets even-numbered positions separated by the intervals on one side of the second transport means. As a position where the disk substrate is taken out, the single-sided disk substrate is taken out by the second transport means. In the bonding type optical disc manufacturing apparatus, the control unit advances the loop unit using one of the intervals as the interval unit, and moves an odd number of positions separated by the interval to a single-sided disk substrate of the second transport unit. As a take-out position, the single-sided disk substrate is taken out by the second transport means.

[0010] In the bonded optical disk manufacturing apparatus, the loop means is a rotary table in which the trays are arranged at equal intervals on a circumference. According to the bonded optical disk manufacturing apparatus of the present invention, if the A or B surface is bonded together, the process can be completed by one type of apparatus. In a bonded optical disc,
This is because when a signal enters only one of the single-sided disk substrates and the other side is a dummy disk substrate, processing such as printing is performed on the dummy disk substrate. In such a case, the present invention is effective because one of the AA or BB surfaces can be used as a dummy disk substrate. In addition, the A-faces and B-faces having the same physical properties have good warpage characteristics after completion.

[0011] In the integrated laminating production system, according to the lamination type optical disc manufacturing apparatus of the present invention, there is provided a laminating mode of A-side or B-side, and an A-B laminating mode. You can choose. By adopting the structure as in the present invention, it is possible to easily bond the A / A surface, the BB surface, or the A / B surface without stocking the disk substrate in the integrated molding and bonding production system.

[0012]

FIG. 1 is a schematic plan view of an apparatus for manufacturing a bonded optical disk. In the figure, reference numerals 1a and 1b denote injection molding machines, on which a stamper for surface A and a stamper for surface B on which pits for carrying information are formed are mounted, respectively, and a synthetic resin such as polycarbonate or acrylic is injection-formed on the stamper. Then, disk substrates for the surface A and the surface B on which the pits are transferred are prepared. The disk substrates are respectively supplied to the next reflection film forming apparatus via a conveyor.

Reference numerals 2a and 2b denote reflection film forming devices for forming a reflection film by depositing a metal such as aluminum or an aluminum alloy on the pit formation surface (signal surface) of the disk substrate. The reflection film forming devices 2a and 2b are composed of a sputtering device or a vacuum evaporation device. The disk substrates having the reflective film are supplied to the next protective film forming device via a conveyor.

Reference numerals 3a and 3b denote protective film forming devices, which apply a UV curable resin on the reflective film of the disk substrate, and irradiate ultraviolet rays to cure the UV curable resin to form a protective film. The protective film forming device includes a spin coater and an ultraviolet irradiation device. The disk substrate having the reflective film and the protective film is supplied to the next disk substrate loading device via a conveyor.

Reference numeral 4 denotes a carry-in arm, which is a first carrying means, which alternately places and carries the disk substrates for A-side and B-side from a conveyor to a fixed position of a loading table on a tray which advances and stops. Reference numeral 5 denotes a circular input table which is a loop means, and six trays 6 are arranged so as to be inscribed at a regular hexagonal vertex position inscribed in a circle. The input table 5 is rotated by a rotary drive device so as to advance intermittently at intervals of a predetermined number of equally spaced trays.

Reference numerals 7a and 7b denote loading arms serving as second transport means for loading the disk substrates for the surface A and the surface B from the loading table 5 into the conveyor of the bonding apparatus. The loading / unloading arm is, for example, a device having a suction suction disk at its tip and capable of storing and operating a disk substrate suction position, a movement path, and an open position. Reference numeral 8 denotes a bonding device, which applies an adhesive made of a radically polymerized ultraviolet curable resin or a cationically polymerized ultraviolet curable resin on one of the protective films of the loaded disk substrate, and superimposes the two disk substrates. It is cured by irradiating it with ultraviolet rays. The bonding device is an adhesive application device (roll coater,
Screen printing machine, spin coater, etc.), an apparatus for superposing two disk substrates, and an ultraviolet irradiation apparatus.

Reference numeral 9 denotes an injection molding machine 1a, 1b, a reflection film forming device 2a, 2b, a protective film forming device 3a, 3b, a carry-in arm 4, a rotary drive device of the loading table 5, and a loading arm 7.
a, 7b, a control device that is connected to the bonding device 8 and includes a microcomputer that senses and controls each state, and operates these devices in synchronization. The movement of the disk substrate between the devices, or the supply and removal of the disk substrate to and from each device, are automatically performed by the control device 9 using a mobile device such as a removal robot or a conveyor.

FIG. 2 is a schematic plan view showing the operation of the above-mentioned bonded optical disk manufacturing apparatus, particularly the operation of the loading table 5 in which the trays 6 are arranged in a regular hexagon and the respective arms. Here, the arrow pointing toward the X position on the input table 5 indicates that the carry-in arm 4 places the disk substrate for the A or B surface at the X position. Arrows directed outward from the Y and Z positions on the loading table 5 indicate that the loading arms 7a and 7b load the disk substrate for the A or B surface into the bonding apparatus. A broken arrow indicates intermittent rotation of the input table 5.

FIGS. 2 (a) to 2 (f) show a single-sided reproduction type bonding method in which disk substrates A (hereinafter simply referred to as A) or disk substrates B (hereinafter simply referred to as B) are bonded together. In the case of manufacturing a combined optical disk (single-sided mode), a method of loading each disk substrate into the tray of the loading table and loading it into the bonding apparatus will be described. FIG.
(G) to (j) show a method of loading each disk substrate into the loading table and loading the disk into the bonding device when a double-sided reproduction type bonded optical disk is manufactured by bonding A and B together (double-sided mode). Show.

First, in the single-sided mode, A and B are alternately carried into the X position where the loading table is rotated by an angle of 60 ° and stopped, and rotated three times from the start, as shown in FIG. 2A. . After further rotation, in the state shown in FIG.
240 degrees around the center from the X position of the input table
Two sheets A are put into the bonding apparatus from the Y and Z positions displaced by ° and 120 °, and discharged from the tray. After further rotation, in the state shown in FIG. 2C, two sheets of B are put into the bonding apparatus from the Y and Z positions and discharged from the tray. Further rotation, in the state shown in FIGS. 2D and 2E, A or B is not aligned at the Y and Z positions, so that the input arm does not operate and the substrate is not discharged from the tray.
Further rotation, as shown in FIG.
In the state shown in (b), two sheets of A are put into the bonding apparatus from the Y and Z positions and discharged from the tray. Hereinafter, FIGS. 2C to 2F are repeated, and A and A
And B and B are intermittently charged into the bonding apparatus.
To bond A and B together to form a single-sided reproduction type bonded optical disk, for example, after bonding, one of the disk substrates may be printed so that reproduction is impossible.

Next, in the double-sided mode, A and B are alternately carried into the X position where the loading table is rotated at an angle of 120 ° and stopped, and rotated once from the start, as shown in FIG. Become. Further, in the state shown in FIG. 2H, two sheets A and B are put into the bonding apparatus from the Y and Z positions, and are discharged from the tray. Further rotation, in the state shown in FIG. 2 (i), since A and B are not aligned at the Y and Z positions, the input arm does not operate, and the substrate is not discharged from the tray. When it is further rotated, as shown in FIG. 2 (j), it returns to the state shown in FIG. 2 (h), so that A and B are put into the bonding apparatus from the Y and Z positions and discharged from the tray. Hereinafter, FIGS. 2 (i) to 2 (j) are repeated, and A and B are intermittently fed into the bonding apparatus.

FIGS. 3 and 4 show the operation of the loading table and the arms in the case of a bonded optical disk manufacturing apparatus having a loading table having a regular pentagonal tray arrangement and a regular heptagonal tray arrangement as another embodiment. In this case, the other devices except the input table and each arm shown in FIG. 1 are the same, and only the arrangement is changed and the program of the control device is changed.

As shown in FIGS. 3 (a) to 3 (e), in the single-sided mode of the loading table arranged in a regular pentagonal tray, A and B are alternately carried into the X position where the loading table rotates and stops at an angle of 72 °. It is rotated three times from the start, and FIG.
, Two sheets A are put into the bonding apparatus from the Y and Z positions displaced by 216 ° and 144 ° around the center from the X position of the input table, respectively, and are discharged from the tray. By further rotating, in the state shown in FIG. 3B, two sheets of B are put into the bonding apparatus from the Y and Z positions and discharged from the tray. Turning further, FIG.
In the states shown in (c) and (d), A or B is not aligned at the Y and Z positions, so that the input arm does not operate and the substrate is not discharged from the tray. Further rotation causes the state shown in FIG. 3A again as shown in FIG. 3E.
And two sheets of A are put into the bonding apparatus from the Z position,
Discharged from the tray. Hereinafter, FIGS. 3B to 3E are repeated, and A and A and B and B are intermittently fed into the bonding apparatus.

Next, in the double-sided mode (FIGS. 3 (f) to 3 (k)) of the loading table in the regular pentagonal tray arrangement, A and B alternately appear at the X position where the loading table rotates and stops at an angle of 144 °. It is carried in and rotates 1-3 times from the start.
(F) to (h) are obtained. Turning further, FIG.
In the state shown in (i), two positions of A and B are determined from the Y and Z positions.
The sheets are put into the bonding apparatus and discharged from the tray. Further, in the state shown in FIG. 3 (j), A and B are not aligned at the Y and Z positions, so that the input arm does not operate and the substrate is not discharged from the tray. If you rotate further,
As shown in FIG. 3 (k), the state shown in FIG. 3 (i) is obtained again, so that A and B are put into the bonding apparatus from the Y and Z positions and discharged from the tray. Hereinafter, FIG.
Repeating (k), A and B are intermittently fed into the bonding apparatus.

Further, in the single-sided mode shown in FIGS. 4 (a) to 4 (e) of the loading table with the regular heptagon tray, A and B are alternately placed at the X position where the loading table is rotated at an angle of 51.4 ° and stopped. And the Y and Z positions for loading are at an angle of 1 around the center from the X position of the loading table.
It is displaced by 54.2 ° and 102.8 °. These angles can be defined within precision or adjusted by a controller. As in the above embodiment, FIGS. 4B to 4E are repeated, and A and A and B and B are intermittently fed into the bonding apparatus. In addition, in the double-sided mode (FIGS. 4F to 4K) of the input table in the regular heptagon tray arrangement, the input table is rotated by an angle of 102.8.degree. By repeating (k), A and B are intermittently charged into the bonding apparatus.

In these embodiments, a plurality of trays are arranged on the input table at equal intervals on the input table, and the input table is intermittently provided at predetermined intervals of the interval, that is, at one or two intervals. It is configured to be able to proceed. Each time the loading table advances and stops at one or two intervals, the loading arm alternately transports and loads A and B on one tray (X position) of the loading table. Each time the loading table advances and stops at intervals of one or two intervals, the loading arm is moved from two trays on which A and B are placed and an even number, that is, at a position separated by two intervals. Then, the disk substrate is taken out and supplied to the bonding apparatus. The control device controls the interval unit of the progress of the loading table and the timing of loading and removing the disk substrate of the loading arm.

That is, as shown in FIG. 5 (a), in the single-sided mode of these embodiments, in a row in which A and B are alternately arranged and intermittently progress in one interval unit as shown by a rightward arrow, Since the loading arm takes out the disk substrate every two interval units (YZ position), AA and BB
Are obtained at g and g in the figure, and are successively unavailable at-and-. On the other hand, as shown in FIG. 5B, in the double-sided mode in these embodiments, the acquisition position of the throwing arm is fixed at two interval units (YZ positions), and is set at two interval units as indicated by the rightward arrow. Since the disk substrate is taken out from the intermittently proceeding row, the set of A and B is in the order of acquisition g and non-acquisition in the figure. Therefore, the control device
As shown in (a) or (b), the unit of the progress of the input table and the timing of acquisition and non-acquisition of the loading and loading arm are controlled.

Next, in still another embodiment, as shown in FIG. 6A, the same operation as that shown in FIG. 5A is performed in the single-sided mode, while the operation shown in FIG. As shown in (b), the acquisition position of the throwing arm is changed from two interval units (Y and Z positions) to one interval unit (Y and Za positions), and one interval as indicated by a rightward arrow. The operation is performed so as to take out the disk substrate from the row that intermittently progresses in units. Also in this case, the set of A and B is in the order of acquisition g and non-acquisition of the figure. 5 and 6
In the above, only the case where the interval between A and B is 1 or 2 is shown, but the same applies to the case of odd or even numbers since A and B are alternately arranged.

As described above, according to the setting of the control device, in the double-sided mode, the loading position of the loading arm is fixed and the loading table is moved at different intervals, and the loading table is changed by changing the loading position of the loading arm. And a case where execution is performed with a fixed progress interval. That is, each time the loading table advances and stops at predetermined intervals, the single-sided disk substrate is removed from the two substrate mounting trays at a position separated by an odd number or an even number of intervals. The input table and the input arm may be controlled so as to be taken out and supplied to the bonding apparatus.

Specifically, in the case of the double-sided mode in which the disk substrate acquisition position of the input arm is changed to execute the input table at a fixed interval, the operation is changed to FIGS. 2A to 2D and FIG. (A) to (d). In this case, as in the single-sided mode, the input table rotates by an angle of 60 °,
The Y position is not different from the one-sided mode, but the Z position is changed from the X position to the Za position displaced by 180 ° around the center.

FIG. 8 illustrates the operation of a further embodiment of a loading table with a square tray arrangement. FIG.
As shown in FIG. 8 (e), in the single-sided mode, A and B are alternately carried into the X position where the loading table is rotated by an angle of 90 ° and stopped, and rotated three times from the start, as shown in FIG. 8 (a). Then, two sheets A are inserted into the bonding apparatus from the Y and Z positions displaced by angles 270 ° and 90 ° around the center from the X position of the input table, respectively, and are discharged from the tray. After further rotation, in the state shown in FIG. 8B, two sheets of B are put into the bonding apparatus from the Y and Z positions and discharged from the tray. In the state shown in FIGS. 8C and 8D, A and B are not aligned at the Y and Z positions, so that the input arm does not operate and the substrate is not discharged from the tray. When the sheet is further rotated, as shown in FIG. 8 (e), the state shown in FIG. 8 (a) is obtained again. Therefore, two sheets A are put into the bonding apparatus from the Y and Z positions and discharged from the tray. Hereinafter, FIGS. 8B to 8E are repeated, and A and A and B and B are intermittently fed into the bonding apparatus.

Next, in the double-sided mode (FIGS. 8 (f) to 8 (h)) of the loading table in the regular square tray arrangement, as in the single-sided mode, the loading table is rotated at an angle of 90.degree. B is carried in alternately. When rotated three times from the start as shown in FIG. 8F, the Y position does not change from the one-sided mode, but the Z position changes from the X position to the Za position at an angle of 180 ° around the center. Thereby, the two sheets A and B are put into the bonding apparatus and discharged from the tray. After further rotation, in the state shown in FIG.
Since A and B are not aligned at the Y and Za positions, the input arm does not operate and the substrate is not discharged from the tray. When the sheet is further rotated, as shown in FIG. 8 (h), the state shown in FIG. 8 (f) is obtained again. Therefore, A and B are put into the bonding apparatus from the Y and Za positions and discharged from the tray. Less than,
8 (g) to 8 (h) are repeated, and A and B are intermittently fed into the bonding apparatus.

In each of the above-described embodiments, the input table is circular and the trays are arranged at the vertices of a regular polygon. Obviously, a means such as an annular loop provided with a circle may be used. Further, not only one loading arm but also two loading arms may be provided for each type of disk substrate so that the disk substrates are loaded alternately. In the above embodiment, two loading arms are provided. Can be put into the bonding apparatus continuously during the intermittent stop.

In each of the above embodiments, the loading table is rotated in one direction in the counterclockwise direction. However, the rotation may be reversed, and depending on the number of annular loops and trays such as the loading table, the loading table may be intermittent. It is also possible to control such that the operation is temporarily reversed. In the embodiment shown in FIG. 3, the reflection film forming apparatus and the protective film forming apparatus are provided individually for the lines of the single-sided disk substrates for the A side and the B side, but they may be shared.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of a bonded optical disk manufacturing apparatus according to an embodiment.

FIG. 2 is a schematic plan view of a loading table in a regular hexagonal tray arrangement of the bonded optical disc manufacturing apparatus according to the embodiment.

FIG. 3 is a schematic plan view of a loading table with a regular pentagonal tray arranged in a bonded optical disk manufacturing apparatus according to another embodiment.

FIG. 4 is a schematic plan view of a loading table with a regular heptagonal tray arranged in a bonded optical disk manufacturing apparatus according to another embodiment.

FIG. 5 is an explanatory view of the operation of the closing arm of the embodiment.

FIG. 6 is a diagram illustrating the operation of a closing arm according to another embodiment.

FIG. 7 is a schematic plan view of a loading table in a regular hexagonal tray arrangement of a bonded optical disk manufacturing apparatus according to another embodiment.

FIG. 8 is a schematic plan view of a loading table with a regular square tray arranged in a bonded optical disk manufacturing apparatus according to another embodiment.

[Explanation of symbols]

 1a, 1b Injection molding machine 2a, 2b Reflective film forming device 3a, 3b Protective film forming device 4 Loading arm 5 Loading table 6 Tray 7a, 7b Loading arm 8 Bonding device 9 Control device

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hidehiro Miyazaki 2680 Nishi-Hanawa, Tatomi-cho, Nakakoma-gun, Yamanashi Prefecture Inside (72) Inventor Mitsuhiko Sasano 2680 Nishi-Hanawa, Tatomi-cho, Nakakoma-gun, Yamanashi Pioneer Video Corporation (72) Inventor Suzumi Shimizu 2680 Nishihanawa, Tatomi-cho, Nakakoma-gun, Yamanashi Prefecture Inside Pioneer Video Co., Ltd. (72) Inventor Wataru Tanaka 2680 Nishihanawa, Tatomicho, Nakakoma-gun, Yamanashi Pioneer Video Corporation (72) Inventor Noritaka Shiozawa 2680 Nishi-Hanawa, Tatomi-cho, Nakakoma-gun, Yamanashi Prefecture Inside Pioneer Video Co., Ltd. (72) Inventor Tomohiro Yoshida 2680 Nishi-Hanawa, Tatomicho, Nakakoma-gun, Yamanashi Prefecture Inside Pioneer Video Co., Ltd. 2680 Nishihanawa, Tatomi-cho, Nakakoma-gun Pioneer Video Corp. In-company (72) Inventor Asahi Watanabe 2680 Nishi-Hanawa, Tatomi-cho, Nakakoma-gun, Yamanashi Prefecture Inside Pioneer Video Co., Ltd. (72) Inventor Masahiro Nakahashi 2680 Nishi-Hanawa, Tatomicho, Nakakoma-gun, Yamanashi Prefecture Pioneer Video Corporation (72) Invention Person Kentoshi Akabane 6100 Uehara, Ina-shi, Nagano

Claims (6)

[Claims] 1. Production of a bonded optical disk comprising: a bonding means for bonding two single-sided disk substrates; and a disk substrate loading means for sequentially supplying two single-sided disk substrates to the bonding means. An apparatus, wherein the disk substrate input means includes: an annular loop means in which a plurality of trays are arranged at equal intervals and which intermittently advance at predetermined intervals of the interval; and The first transport means for alternately placing the first and second single-sided disk substrates on one tray of the loop means and the loop means proceeding in units of the interval each time the advance and stop are performed. Each time it stops, the first or second single-sided disk substrate is placed and the odd-numbered or even-numbered single-sided disk substrate is removed from the two trays at positions separated by the distance. A second transport unit that takes out and supplies the disk substrate to the disk substrate bonding apparatus; and a control unit that controls the interval unit of the progress of the loop unit and a position where the single-sided disk substrate of the second transport unit is removed. Characterized lamination type optical disc manufacturing equipment. 2. The control means causes the loop means to advance with one interval as the interval unit, and sets a position separated by an even number of the intervals as a position for taking out a single-sided disk substrate of the second transport means. 2. The apparatus according to claim 1, wherein said second transport means takes out a single-sided disk substrate.
An apparatus for manufacturing a bonded optical disk according to the above. 3. The control means advances the loop means using the two intervals as the interval unit, and sets an even number of positions separated by the interval as positions for taking out a single-sided disk substrate of the second transport means. 2. The apparatus according to claim 1, wherein said second transport means takes out a single-sided disk substrate.
An apparatus for manufacturing a bonded optical disk according to the above. 4. The control means advances the loop means with one interval as the interval unit, and sets even-numbered positions separated by the interval as positions for taking out a single-sided disk substrate of the second transport means. 2. The apparatus according to claim 1, wherein said second transport means takes out a single-sided disk substrate.
An apparatus for manufacturing a bonded optical disk according to the above. 5. The control means advances the loop means using one of the intervals as the interval unit, and sets an odd number of positions separated by the interval as positions for taking out a single-sided disk substrate of the second transport means. 2. The apparatus according to claim 1, wherein said second transport means takes out a single-sided disk substrate.
An apparatus for manufacturing a bonded optical disk according to the above. 6. The apparatus according to claim 1, wherein the loop means is a rotary table in which the trays are arranged at equal intervals on a circumference.