JPH10317132A - Sputtering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical disk producing device capable of producing an optical disk small in defects in coating formation by suppressing the generation of arc discharge in a sputtering device and suppressing its influence. SOLUTION: An electrically conductive gap regulating frame 12 is arranged on the outer circumferential part of a target material 9 on a backing plate 10 in the cathode part, and by this regulating frame 12, the difference between the outside diameter of the backing plate 10 and the target material 9 and the space between the backing plate 10 and a dark space shield 11 provided so as to cover the outer circumferential part of the target material 9 are made capable of regulating. In the case the height of the gap regulating frame 12 from the plate 10 is defined as h1 and the thickness of the target material 9 is defined as h2 and, also, in the case the width of the regulating frame 12 is defined as d1 and the difference in the outside diameter between the target material 9 and the plate 10 is defined as d2, h1>=h2 and 0.1×d2<=d1<=d2 are satisfied, by which the rate of defects in coating formation of an optical disk to be generated can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a sputtering apparatus for forming a film on a substrate such as an optical disk and a recording medium such as an optical disk obtained by the sputtering apparatus.

[0002]

2. Description of the Related Art Conventionally, when a recording medium such as an optical disk is formed by forming a functional thin film such as a recording film on a substrate, an RF (high frequency) or DC (direct current) sputtering apparatus is generally used. For example, dielectric SiN (Si nitride)
When forming a film, a single crystal of Si as an insulator is converted to Ar
A rare gas and a N ₂ gas are mixed to form a film as reactive sputtering. In the case of DC sputtering equipment,
Since the insulator does not discharge, B (boron) or the like is added to the Si target to increase the conductivity.

Next, the configuration of a conventional general sputtering apparatus and a dark space shield according to the present invention will be described with reference to FIG. FIG. 7 is a diagram showing a schematic configuration of a sputtering apparatus.

Generally, as shown in FIG. 6, a sputtering apparatus has a vacuum chamber 1 as a film forming chamber, a vacuum controller 2 for controlling the degree of vacuum in the chamber, a power source 3 for plasma discharge, and a power source 3 for the plasma discharge. A cathode portion 5 connected by a power cable 4, an anode 6 opposed to the cathode portion 5 at a predetermined distance, and a sputtering gas supply for supplying a sputtering gas such as Ar into the vacuum chamber 1; The unit 7 is configured as a main element. An optical disk substrate 8 is fixed to the anode 6.

[0005] A sputtering target material 9 is fixed to a backing plate 10 of the cathode portion 5, and a dark space shield 11 for protecting the backing plate 10 provides a circumferential portion between the backing plate 10 and the target material 9. It is provided to cover.

[0006]

The occurrence of arc discharge is a problem in sputtering by the above apparatus. In the arc discharge, electric charges are locally concentrated, and the solid discharge of the target material 9 scattered by the arc discharge adheres to the substrate 8 to cause a disk failure. Therefore, using RF sputtering which is less likely to cause arc discharge, or in DC sputtering,
There have been targets such as making the input power zero at a certain frequency. However, even with these measures, it was not possible to sufficiently suppress the occurrence of arc discharge, and it was particularly difficult to suppress arc discharge occurring at the end of the target material 9.

[0007] Accordingly, an object of the present invention is to suppress the occurrence of arc discharge in a sputtering apparatus to suppress the influence thereof,
It is an object of the present invention to provide an optical disk manufacturing apparatus capable of manufacturing an optical disk with few film formation defects.

[0008]

The object of the present invention is attained by the following constitution. That is, a target material for sputtering the substrate on the anode is fixed on the backing plate of the cathode portion, and further, a dark space shield for protecting the backing plate covers the outer periphery of the backing plate and the target material. A sputtering apparatus used for film formation on a substrate provided, wherein a conductive gap adjustment frame is arranged on the outer peripheral portion of the target material on the backing plate, and the outer diameter of the backing plate and the target material are adjusted by the adjustment frame. Is a sputtering apparatus capable of adjusting the difference between the outer diameter of the control frame and the size of the space between the adjustment frame and the dark space shield.

The height of the gap adjusting frame from the packing plate is h1, and the thickness of the target material is h2.
When the following expression (1) h1 ≧ h2 (1) is satisfied, the incidence of film formation defects on the optical disk is small.
Similarly, assuming that the width of the gap adjustment frame is d1 and the difference between the outer diameter of the target material and the outer diameter of the backing plate is d2, the following formula (2) 0.1 × d2 ≦ d1 ≦ d2 (2) is satisfied. The incidence of film defects is reduced.

The conductive gap adjusting frame is made of a conductive material, and any material can be used as long as it is made of a non-ferrous metal member. Suitable for good conductivity.

According to the present invention, by providing a gap adjusting frame between the dark space shield and the backing plate so as to be parallel to the target material, it is possible to reduce arcing at the end of the target and suppress its influence. As a result, an optical disk with few defects can be manufactured. The present invention also includes an optical disk having a rewritable recording film obtained by the sputtering apparatus or a recording medium similar thereto.

[0012]

FIG. 1 shows an embodiment of the present invention.
This will be described with reference to FIG. In the embodiment of the present invention shown in FIGS. 1 to 6, the structure of the sputtering apparatus other than providing the gap adjusting frame 12 between the dark space shield 11 and the packing plate 10 is shown in FIG. 7 as schematically shown in FIG. The description is omitted because it is the same as the conventional one.

FIG. 1 is an enlarged sectional view of a main part of a dark space shield 11 of a sputtering apparatus according to the present invention, and FIG. 2 compares the disk defect occurrence rates of the apparatus according to the embodiment of the present invention and the prior art apparatus. FIG. FIG. 4 is a diagram illustrating the size and position of a gap adjustment frame 12 provided between the dark space shield 11 and the packing plate 10 according to the embodiment of the present invention in FIG. 3. FIG. 4 is a diagram showing the relationship between the difference between the height (h1) of the gap adjustment frame 12 and the height (h2) of the target material and the defect occurrence rate of the disk according to the embodiment of the present invention. FIG. 3 is a diagram showing a relationship between the width (d1) of the gap adjustment frame 12 and the disk defect occurrence rate according to the embodiment of the present invention.

The present inventor has found that by providing the gap adjusting frame 12 and examining the shape thereof, the occurrence of arc discharge can be reduced and its effect can be suppressed. We have developed a sputtering device that can make it possible.

The gap adjusting frame 12 for protecting the packing plate 10 according to the present invention includes the packing plate 10.
It is provided so as to surround a circumferential portion with the target material 9 above.

Next, a description will be given of the defect occurrence rate during the production of an optical disk by the sputtering apparatus having the gap adjusting frame 12 according to the present invention and the conventional sputtering apparatus having no gap adjusting frame 12. FIG. 2 shows the measurement results. The abscissa indicates the number of film forming disks with 1000 blocks as one block, and the ordinate indicates the number of defects generated in one block in a normalized manner. The standard of standardization uses the maximum value of the number of defects in one block by the conventional device. From FIG. 2, the gap adjusting frame 1 is placed on the packing plate 10 so as to face the dark space shield 11.
It can be seen that the occurrence of defects is reduced by providing 2 at the circumferential portion of the target material 9.

Next, the shape of the gap adjusting frame 12 and the occurrence of defects will be described. Here, as shown in FIG. 3, the width of the gap adjustment frame 12 is d1, the difference in the radial direction between the target material 9 and the packing plate 10 is d2, the thickness of the gap adjustment frame 12 is h1, and the thickness of the target material 9 is h2. And

First, the occurrence of a defect when the thickness h1 of the gap adjusting frame 12 is used as a parameter will be described. At this time, h2 = 6 mm, d1 = 15 mm, and d2 = 15 mm. FIG. 4 shows the result, and the vertical axis shows the defect occurrence rate when the thickness difference is arbitrary (h1-h2). FIG. 4 shows that the effect appears when the thickness is h1 ≧ h2.

Next, the occurrence of a defect when the width d1 of the gap adjusting frame 12 is used as a parameter will be described. At this time, h1 = 6.2 mm, h2 = 6.0 mm, d2 = 15 mm
It is. FIG. 5 shows the result. The horizontal axis is the width d1 of the gap adjustment frame 12, and the vertical axis is the defect occurrence rate at an arbitrary d1. As shown in FIG. 5, the effect of the occurrence of defects is exhibited by providing the gap adjustment frame 12, and the gap adjustment frame 12
It can be seen that d1 (outer diameter) decreases as it approaches that of the backing plate 10.

[0020]

According to the present invention, a sputtering apparatus for producing an optical disk with few defects can be obtained.

[Brief description of the drawings]

FIG. 1 is an enlarged sectional view of a main part of a gap adjusting frame of a sputtering apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram comparing the disk defect occurrence rates of the embodiment of the present invention and each conventional sputtering apparatus.

FIG. 3 is a diagram illustrating a size and a position where a gap adjustment frame according to the embodiment of the present invention is provided on a backing plate.

FIG. 4 is a diagram illustrating a relationship between a height of a gap adjustment frame and a disk defect occurrence rate according to the embodiment of the present invention.

FIG. 5 is a diagram illustrating a relationship between a width of a gap adjustment frame and a disk defect occurrence rate according to the embodiment of the present invention.

FIG. 6 is a diagram showing a schematic configuration of a sputtering apparatus according to an embodiment of the present invention.

FIG. 7 is a diagram showing a schematic configuration of a conventional sputtering apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Vacuum chamber 2 Vacuum control part 3 Power supply 4 Power supply cable 5 Cathode part 6 Anode 7 Sputter gas supply part 8 Substrate 9 Target material 10 Backing plate 11 Dark space shield 12 Gap adjustment frame

Claims (4)

[Claims] A target material for sputtering a substrate on an anode is fixed on a backing plate of a cathode portion, and a dark space shield for protecting the backing plate covers an outer peripheral portion between the backing plate and the target material. A sputtering apparatus used for film formation on a substrate provided so as to cover, wherein a conductive gap adjustment frame is arranged on an outer peripheral portion of a target material on a backing plate, and the outer diameter of the backing plate is adjusted by the adjustment frame. A sputtering apparatus characterized in that the difference between the outer diameter of the target material and the size of the space between the adjustment frame and the dark space shield can be adjusted. 2. When the height of the gap adjusting frame from the packing plate is h1 and the thickness of the target material is h2, the following formula (1) h1 ≧ h2 (1) is satisfied. Item 2. The sputtering apparatus according to Item 1. 3. When the width of the gap adjusting frame is d1 and the difference between the outer diameter of the target material and the outer diameter of the backing plate is d2, the following expression (2) is satisfied: 0.1 × d2 ≦ d1 ≦ d2 (2) The sputtering apparatus according to claim 1, wherein: 4. A recording medium obtained by the sputtering apparatus according to claim 1.