JPH10313151A - Flexible board with various metal conductor path - Google Patents

Flexible board with various metal conductor path

Info

Publication number
JPH10313151A
JPH10313151A JP9119573A JP11957397A JPH10313151A JP H10313151 A JPH10313151 A JP H10313151A JP 9119573 A JP9119573 A JP 9119573A JP 11957397 A JP11957397 A JP 11957397A JP H10313151 A JPH10313151 A JP H10313151A
Authority
JP
Japan
Prior art keywords
metal conductor
metal
conductor paths
power
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9119573A
Other languages
Japanese (ja)
Other versions
JP3815524B2 (en
Inventor
Toshihiko Matsuo
敏彦 松尾
Masutarou Murata
益太朗 村田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FUJI FILM SELLTEC KK
Fujifilm Holdings Corp
Original Assignee
FUJI FILM SELLTEC KK
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FUJI FILM SELLTEC KK, Fuji Photo Film Co Ltd filed Critical FUJI FILM SELLTEC KK
Priority to JP11957397A priority Critical patent/JP3815524B2/en
Publication of JPH10313151A publication Critical patent/JPH10313151A/en
Application granted granted Critical
Publication of JP3815524B2 publication Critical patent/JP3815524B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0254High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405Edge mounted components, e.g. terminals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Abstract

PROBLEM TO BE SOLVED: To provide a flexible board which is enhanced in connection reliability, so as to enable a desired current to flow safely. SOLUTION: Power metal conductor paths 12 to 16, formed of nickel thin plate and control metal conductor paths 20 to 24 formed of copper foil subjected to etching, are formed on an insulating flexible board 11. The power metal conductor paths 12 and 14 are partly projected from the insulating flexible board 11. The tips of 12a and 14a of the projecting parts of the conductor paths 12 and 14 are spot-welded to the electrodes of a lithium ion cell. Power supply terminals 30 and 31 made of phosphor bronze thin plate are soldered to the one end of the power metal conductor paths 13 and 16. A voltage detection circuit, is connected to the control metal conductor paths 20 and 23 by soldering, an overdischarge prevention circuit 33 and an overcharge prevention circuit 34 are connected to the control metal conductor paths 21 and 22 by soldering respectively.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、複数種の金属導体
路を持つフレキシブル基板に関し、特にリチウムイオン
電池に取り付けられる電源回路に好適なフレキシブル基
板に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible substrate having a plurality of types of metal conductor paths, and more particularly to a flexible substrate suitable for a power supply circuit attached to a lithium ion battery.

【0002】[0002]

【従来の技術】リチウムイオン電池は、電力が大きく、
また発火性があるために、充放電の保護回路を設けたフ
レキシブル基板が用いられる。このフレキシブル基板に
は、銅箔を用いた複数の金属導体路が片面又は両面に形
成されている。これらの金属導体路は、電力用金属導体
路と制御用金属導体路とに分けることができる。
2. Description of the Related Art A lithium ion battery has a large electric power,
In addition, a flexible substrate provided with a charge / discharge protection circuit is used because of its ignitability. A plurality of metal conductor paths using copper foil are formed on one or both sides of the flexible substrate. These metal tracks can be divided into power metal tracks and control metal tracks.

【0003】電力用金属導体路は、リチウムイオン電池
からの大きな電流を流すためのものであり、幅が広い銅
箔で構成されている。また、この電力用金属導体路中
に、過放電防止回路,過充電防止回路,温度ヒューズ等
が接続されている。
[0003] The power metal conductor path is for passing a large current from a lithium ion battery, and is made of a wide copper foil. Further, an overdischarge prevention circuit, an overcharge prevention circuit, a temperature fuse, and the like are connected in the power metal conductor path.

【0004】制御用金属導体路は、小さな電流を流すた
めのものであり、幅が狭い線状の銅箔で構成されてい
る。この制御用金属導体路は、電圧検出回路を電力用金
属導体路に接続したり、電圧検出回路に過放電防止回路
と過充電防止回路とを接続したり、各回路に抵抗やコン
デンサ等を外付けするために用いられる。
[0004] The control metal conductor path is for passing a small current, and is made of a narrow linear copper foil. This control metal conductor path connects the voltage detection circuit to the power metal conductor path, connects the overdischarge prevention circuit and the overcharge prevention circuit to the voltage detection circuit, and removes resistors and capacitors from each circuit. Used to attach.

【0005】電力用金属導体路の一端には、電極接続端
子が半田付けされる。この電極接続端子は、リチウムイ
オン電池の電極にスポット溶接され、電極に強固に接合
される。この電極接続端子としては、スポット溶接のし
やすさと、大きな電流の流しやすさとから、打ち抜き加
工したニッケル薄板が用いられている。
[0005] An electrode connection terminal is soldered to one end of the power metal conductor path. This electrode connection terminal is spot-welded to the electrode of the lithium ion battery, and is firmly joined to the electrode. As the electrode connection terminal, a punched nickel thin plate is used because of ease of spot welding and ease of flowing a large current.

【0006】また、電力用金属導体路の他端には、電源
端子が半田付けされている。この電源端子としては、例
えば電子カメラにリチウムイオン電池を装填したとき
に、電子カメラ内のコンタクトピンとの接触を良好にす
るために、弾性を有するりん青銅薄板が用いられる。
A power supply terminal is soldered to the other end of the power metal conductor path. For example, an elastic phosphor bronze thin plate is used as the power supply terminal in order to make good contact with a contact pin in the electronic camera when a lithium ion battery is loaded in the electronic camera.

【0007】他方、ニッカド電池や、ニッケル水素電池
等では、充放電での危険性が少ないために、過放電防止
回路,過充電防止回路等の制御回路が不要である。この
ような電池では、打ち抜き加工したニッケル薄板の両面
を絶縁性フイルムでラミネートしたフレキシブル基板が
用いられる。
On the other hand, a nickel-cadmium battery, a nickel-metal hydride battery, or the like does not require a control circuit such as an over-discharge prevention circuit and an over-charge prevention circuit because there is little danger in charging and discharging. In such a battery, a flexible substrate in which both surfaces of a punched nickel thin plate are laminated with an insulating film is used.

【0008】[0008]

【発明が解決しようとする課題】前述したフレキシブル
基板では、銅箔の電力用金属導体路に大きな電流を流す
ことができないという問題がある。
However, the above-mentioned flexible board has a problem that a large current cannot flow through the power metal conductor path of the copper foil.

【0009】また、リチウムイオン電池の電極にはニッ
ケルが用いられているが、ニッケルは酸化膜が形成され
やすいので、リチウムイオン電池の電極と銅箔の電力用
金属導体路とを半田付けする場合には、酸化膜によって
リチウムイオン電池を保持するに十分な強い接合力を得
ることができない。また、酸化膜を還元するためのフラ
ックスが多量に必要になったりして、半田付け作業がし
にくい等の問題がある。更に、半田はリチウムイオン電
池の使用中に発生した熱で溶けるおそれがある。そこ
で、フレキシブル基板と電極との接合を確実なものにす
るために、従来はニッケル薄板の電池接続端子を用い、
その一端を電極にスポット溶接し、そして他端を銅箔の
電力用金属導体路に半田付けをしている。しかし、この
場合でも電池接続端子の使用により工程数が多くなると
いう問題の他に、電力用金属導体路に半田付けしている
から、この接合の信頼性に問題があった。
Nickel is used for an electrode of a lithium ion battery. However, since an oxide film is easily formed on nickel, nickel is used to solder the electrode of the lithium ion battery to a power metal conductive path of copper foil. In this case, it is not possible to obtain a bonding strength strong enough to hold the lithium ion battery by the oxide film. In addition, there is a problem that a large amount of flux for reducing the oxide film is required, and the soldering operation is difficult. Further, the solder may be melted by heat generated during use of the lithium ion battery. Therefore, in order to secure the connection between the flexible substrate and the electrode, the battery connection terminal of the nickel thin plate was used conventionally,
One end is spot welded to the electrode and the other end is soldered to a copper metal power conductor track. However, even in this case, in addition to the problem that the number of steps is increased due to the use of the battery connection terminal, there is a problem in the reliability of the joining because the soldering is performed to the power metal conductor path.

【0010】電力用金属導体路には、温度ヒューズが半
田で接続されているが、この半田付け作業中の熱で温度
ヒューズが半壊したり、完全に切れたりするという問題
もある。温度ヒューズは、チューブにパッケージされて
いるが、半壊状態の場合には見ても分からないため、検
査工程が必要になる等の不便さを招く。
[0010] The thermal fuse is connected to the power metal conductor path by soldering. However, there is a problem that the thermal fuse is partially broken or completely blown by the heat during the soldering operation. Although the thermal fuse is packaged in a tube, it is invisible in the case of a semi-broken state, so that an inconvenience such as requiring an inspection process is caused.

【0011】他方、ニッケル薄板を金属導体路としたフ
レキシブル基板では、打ち抜き加工した金属導体路を絶
縁性基板に接着するため、細かな配線パターンを形成す
ることができないという問題がある。
On the other hand, in a flexible substrate using a nickel thin plate as a metal conductor path, there is a problem that a fine wiring pattern cannot be formed because the stamped metal conductor path is bonded to an insulating substrate.

【0012】本発明は、金属導体路の用途や接合上の問
題を考慮して、各金属導体路毎に最適な金属材料を用い
たフレキシブル基板を提供することを目的とするもので
ある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a flexible substrate using an optimum metal material for each metal conductor path in consideration of the use of the metal conductor paths and problems in bonding.

【0013】また、本発明は、電力用金属導体路に対し
ては大きな電流を流すことができるようにし、制御用金
属導体路に対しては細かな配線を可能にしたフレキシブ
ル基板を提供することを目的とするものである。
Another object of the present invention is to provide a flexible substrate which allows a large current to flow through a power metal conductor path and enables fine wiring to a control metal conductor path. It is intended for.

【0014】更に、本発明は、電力用金属導体路の一部
をリチウムイオン電池に直接にスポット溶接することが
できるフレキシブル基板を提供することを目的とするも
のである。
Still another object of the present invention is to provide a flexible substrate capable of spot welding a part of a power metal conductive path directly to a lithium ion battery.

【0015】[0015]

【課題を解決するための手段】上記目的を達成するため
に、請求項1記載のフレキシブル基板では、少なくとも
第1及び第2の金属材料を用い、第1の金属材料による
金属導体路と、第2の金属材料による金属導体路とを絶
縁性基板に形成したものである。
According to a first aspect of the present invention, there is provided a flexible printed circuit board comprising at least a first metal material, a first metal material, and a first metal material. And a metal conductor path made of a second metal material formed on an insulating substrate.

【0016】請求項2記載のフレキシブル基板では、少
なくとも第1の金属材料による金属導体路を形成した第
1の絶縁性基板と、少なくとも第2の金属材料による金
属導体路を形成した第2の絶縁性基板とを用い、これら
の絶縁性基板とを貼り合わせて積層構造としたものであ
る。
According to a second aspect of the present invention, there is provided a flexible substrate having at least a first insulating substrate having a metal conductor path formed of a first metal material and a second insulating substrate having at least a metal conductor path formed of a second metal material. And an insulating substrate, which is bonded to the insulating substrate to form a laminated structure.

【0017】請求項3記載のフレキシブル基板では、第
1の金属材料としてニッケル薄板を用い、第2の金属材
料として銅箔を用いたものである。
According to a third aspect of the present invention, in the flexible substrate, a nickel thin plate is used as the first metal material, and a copper foil is used as the second metal material.

【0018】請求項4記載のフレキシブル基板では、第
1の金属材料による電力用金属導体路と、第2の金属材
料による制御用金属導体路とを絶縁性基板に形成したも
のである。
According to a fourth aspect of the present invention, there is provided a flexible substrate in which a power metal conductive path made of a first metal material and a control metal conductive path made of a second metal material are formed on an insulating substrate.

【0019】請求項5記載のフレキシブル基板では、第
1の金属材料として金属薄板を用い、第2の金属材料と
して銅箔を用いたものである。
In the flexible substrate according to the fifth aspect, a thin metal plate is used as the first metal material, and a copper foil is used as the second metal material.

【0020】請求項6記載のフレキシブル基板では、絶
縁性基板の片面に、電力用金属導体路と制御用金属導体
路とを形成したものである。
According to a sixth aspect of the present invention, there is provided a flexible substrate in which a power metal conductor path and a control metal conductor path are formed on one surface of an insulating substrate.

【0021】請求項7記載のフレキシブル基板では、絶
縁性基板の片面に電力用金属導体路を形成し、別の片面
に制御用金属導体路を形成したものである。
According to a seventh aspect of the present invention, there is provided a flexible substrate in which a power metal conductive path is formed on one side of an insulating substrate and a control metal conductive path is formed on another side.

【0022】請求項8記載のフレキシブル基板では、第
1の金属材料としてニッケル薄板を用いたものである。
In the flexible substrate according to the present invention, a nickel thin plate is used as the first metal material.

【0023】請求項9記載のフレキシブル基板では、電
力用金属導体路の一端にリチウムイオン電池を接続し、
制御用金属導体路の一端に制御回路を接続したものであ
る。
In the flexible substrate according to the ninth aspect, a lithium ion battery is connected to one end of the power metal conductor path,
The control circuit is connected to one end of the control metal conductor path.

【0024】[0024]

【発明の実施の形態】図1はリチウムイオン電池の電源
回路として用いられるフレキシブル基板を示すものであ
る。フレキシブル基板10は、可撓性を有する絶縁性基
板11を備えている。この絶縁性基板11としては、例
えばポリイミドのフイルムが用いられる。この絶縁性基
板11上に、ハッチングを施した複数の電力用金属導体
路12〜16と、複数の制御用金属導体路20〜24と
が形成されている。
FIG. 1 shows a flexible substrate used as a power supply circuit of a lithium ion battery. The flexible substrate 10 includes an insulating substrate 11 having flexibility. As the insulating substrate 11, for example, a polyimide film is used. A plurality of hatched power metal conductor paths 12 to 16 and a plurality of control metal conductor paths 20 to 24 are formed on the insulating substrate 11.

【0025】電力用金属導体路12〜16は、リチウム
イオン電池からの大きな電流(例えば数A)を流すため
に用いられる。他方、制御用金属導体路20〜24は、
ICデバイスを制御するに十分な小さな電流(例えば数
十mA)を流すために用いられる。そこで、電力用金属
導体路12〜16としては、大きな電流を流しやすく、
しかも接合力が強いスポット溶接が可能な金属材料が用
いられる。また、制御用金属導体路20〜24としては
電流が小さくても良いが、細かなパターンを作製可能な
金属材料が用いられる。
The power metal conductor paths 12 to 16 are used to pass a large current (for example, several A) from the lithium ion battery. On the other hand, the control metal conductor paths 20 to 24
It is used to flow a small current (for example, several tens mA) sufficient to control an IC device. Therefore, as the power metal conductor paths 12 to 16, it is easy to pass a large current,
In addition, a metal material that can be spot-welded with a strong bonding force is used. The control metal conductor paths 20 to 24 may have a small current, but use a metal material capable of forming a fine pattern.

【0026】この実施形態では、電力用金属導体路12
〜16として、例えば厚みが0.1mmで、幅が5mm
程度のニッケル薄板が用いられている。このニッケル薄
板は、板材からパターンに合わせた形状に打ち抜き加工
され、図2に示すように、接着剤26によって絶縁性基
板11上に接着される。
In this embodiment, the power metal conductor path 12
As ~ 16, for example, a thickness of 0.1 mm and a width of 5 mm
To this extent, nickel sheets are used. This nickel thin plate is stamped from a plate material into a shape conforming to the pattern, and is adhered to the insulating substrate 11 by an adhesive 26 as shown in FIG.

【0027】制御用金属導体路20〜24としては、例
えば厚みが0.05mmで、幅が0.5〜1mm程度の
銅箔が用いられる。これは、シート状の銅箔を接着剤2
7によって絶縁性基板11上に接着してから、エッチン
グ処理することによって作製される。
As the control metal conductor paths 20 to 24, for example, a copper foil having a thickness of about 0.05 mm and a width of about 0.5 to 1 mm is used. This is because the sheet-like copper foil is
It is manufactured by bonding to the insulating substrate 11 with an etching process 7 and then etching.

【0028】電力用金属導体路12の一端12aは絶縁
性基板11から突出しており、リチウムイオン電池の+
電極にスポット溶接で強固に接合される。同様に、電力
用金属導体路14の一端14aも絶縁性基板11から突
出しており,リチウムイオン電池の−電極にスポット溶
接される。
One end 12a of the power metal conductor path 12 protrudes from the insulating substrate 11, and is connected to the positive terminal of the lithium ion battery.
It is firmly joined to the electrode by spot welding. Similarly, one end 14a of the power metal conductor path 14 also protrudes from the insulating substrate 11, and is spot-welded to the negative electrode of the lithium ion battery.

【0029】電力用金属導体路13,16の一端には、
L字形をした電源端子30,31が半田付けされてい
る。この電源端子30,31は、コンタクトピン(図示
せず)との接触圧を高めるために、弾性を有するりん青
銅薄板が用いられる。なお、電源端子30,31のう
ち、電力用金属導体路13,16に接触する面を細長に
し、その分だけ電力用金属導体路13,16を短くして
もよい。この電源端子30,31を接着剤で絶縁性基板
11に接着してから、電力用金属導体路13,16と電
力用金属導体路13,16とを半田等で接続する。この
場合には、絶縁性基板11には、銅箔,ニッケル薄板,
りん青銅薄板の3種の金属導体路が形成されることにな
る。
At one end of the power metal conductor paths 13 and 16,
L-shaped power terminals 30, 31 are soldered. The power supply terminals 30 and 31 are made of an elastic phosphor bronze thin plate in order to increase the contact pressure with a contact pin (not shown). Note that, of the power supply terminals 30 and 31, the surfaces that contact the power metal conductor paths 13 and 16 may be elongated, and the power metal conductor paths 13 and 16 may be shortened accordingly. After bonding the power supply terminals 30 and 31 to the insulating substrate 11 with an adhesive, the power metal conductor paths 13 and 16 are connected to the power metal conductor paths 13 and 16 by soldering or the like. In this case, a copper foil, a nickel thin plate,
Three types of metal conductor tracks of phosphor bronze sheet will be formed.

【0030】電力用金属導体路12,13は、温度ヒュ
ーズ32がスポット溶接されている。この温度ヒューズ
32は,ヒューズを透明なプラスチックチューブでパッ
ケージしたものである。この温度ヒューズ32は、リチ
ウムイオン電池の充電又は放電時に、リチウムイオン電
池の異常発熱を検知してヒューズが切れるようになって
いる。
Temperature fuses 32 are spot-welded to the power metal conductor paths 12 and 13. The thermal fuse 32 is formed by packaging the fuse in a transparent plastic tube. The temperature fuse 32 is configured to detect abnormal heat generation of the lithium ion battery when the lithium ion battery is charged or discharged, and to blow the fuse.

【0031】電力用金属導体路14,15には過放電防
止回路33が接続され、また電力用金属導体路15,1
6には過充電防止回路34が接続されている。これらの
過放電防止回路33と過充電防止回路34の制御端子
は、制御用金属導体路21,22を介して電圧検出回路
35にそれぞれ接続されている。この電圧検出回路35
は、制御用金属導体路20,23を介して電力用金属導
体路12,14に接続されている。
An overdischarge prevention circuit 33 is connected to the power metal conductor paths 14 and 15, and the power metal conductor paths 15, 1
6 is connected to an overcharge prevention circuit 34. The control terminals of the overdischarge prevention circuit 33 and the overcharge prevention circuit 34 are connected to the voltage detection circuit 35 via the control metal conductor paths 21 and 22, respectively. This voltage detection circuit 35
Are connected to the power metal conductor paths 12, 14 via the control metal conductor paths 20, 23.

【0032】過放電防止回路33,過充電防止回路3
4,電圧検出回路35は、それぞれパッケージされてい
る。また、過放電防止回路33,電圧検出回路35に
は、制御用金属導体路24,23を介してコンデンサ3
6,37が接続されている。なお、電圧検出回路35
は、多数のピンを有するICデバイスが構成されている
が、図面を簡単にするために、これらのピンや制御用金
属導体路を省略してある。
Overdischarge prevention circuit 33, overcharge prevention circuit 3
4. The voltage detection circuit 35 is packaged. The capacitor 3 is connected to the overdischarge prevention circuit 33 and the voltage detection circuit 35 via the control metal conductor paths 24 and 23.
6, 37 are connected. The voltage detection circuit 35
Has an IC device having a large number of pins, but these pins and control metal conductor paths are omitted for simplification of the drawing.

【0033】リチウムイオン電池の充電中に、充電電圧
が上限値に達すると、電圧検出回路35がこれを検知し
て制御信号を過充電防止回路34に送る。この過充電防
止回路34は、電力用金属導体路14と15とに接続さ
れたスイッチング素子を備えており、制御信号に応じて
スイッチング素子をOFF状態にする。
When the charging voltage reaches the upper limit value during charging of the lithium ion battery, the voltage detection circuit 35 detects this and sends a control signal to the overcharge prevention circuit 34. The overcharge prevention circuit 34 includes a switching element connected to the power metal conductor paths 14 and 15, and turns off the switching element according to a control signal.

【0034】また、リチウムイオン電池の放電中に、放
電電圧が下限値に達すると、電圧検出回路35がこれを
検知して制御信号を過放電防止回路33に送る。この過
放電防止回路33は、電力用金属導体路15と16とに
接続されたスイッチング素子を備えており、制御信号に
応じてスイッチング素子をOFF状態にする。
When the discharge voltage reaches the lower limit during discharging of the lithium ion battery, the voltage detection circuit 35 detects this and sends a control signal to the overdischarge prevention circuit 33. The overdischarge prevention circuit 33 includes a switching element connected to the power metal conductor paths 15 and 16, and turns off the switching element according to a control signal.

【0035】図2に示すように、例えば電力用金属導体
路12と、制御用金属導体路20とは、半田40を介し
て接続されている。また、感電防止や短絡防止のため
に、絶縁性を有するフイルム41が接着剤42を介して
絶縁性基板11上に接着され、各金属導体路を覆う。ま
た、フイルム41の代わりに、電磁波を遮断するための
防磁シートを用いてもよい。
As shown in FIG. 2, for example, the power metal conductor path 12 and the control metal conductor path 20 are connected via solder 40. Further, in order to prevent electric shock and short circuit, an insulating film 41 is adhered on the insulating substrate 11 via an adhesive 42 to cover each metal conductor path. Further, instead of the film 41, a magnetic shield sheet for blocking electromagnetic waves may be used.

【0036】次に、フレキシブル基板10の製造例につ
いて簡単に説明する。絶縁性基板11としてポリイミド
のフイルムが用いられ、この片面に銅箔が接着される。
周知のエッチング処理により、不要な銅箔を除去するこ
とで、制御用金属導体路20〜24を形成する。このエ
ッチング処理を用いることで、細かな形状の制御用金属
導体路20〜24を作製することができる。なお、絶縁
性基板11の両面に、制御用金属導体路を形成する場合
には、両面に銅箔が接着され、また両面にフイルムがラ
ミネートされる。
Next, an example of manufacturing the flexible substrate 10 will be briefly described. A polyimide film is used as the insulating substrate 11, and a copper foil is adhered to one surface of the polyimide film.
Unnecessary copper foil is removed by a known etching process to form the control metal conductor paths 20 to 24. By using this etching process, the control metal conductor paths 20 to 24 having a fine shape can be manufactured. When forming the control metal conductor paths on both sides of the insulating substrate 11, copper foil is adhered on both sides, and films are laminated on both sides.

【0037】ニッケル板材をプレス機にセットして、各
電力用金属導体路12〜16を打ち抜く。これらの電力
用金属導体路12〜16を絶縁性基板11上の所定位置
に接着する。ここで、各電力用金属導体路12〜16を
個別に作製する代わりに、リードフレームの製造で実施
されているように、全ての電力用金属導体路12〜16
を連結するリブを端に設けておき、絶縁性基板11に接
着後にリブを切り落すようにすれば、製造が簡単とな
る。
The nickel sheet material is set in a press machine, and the power metal conductor paths 12 to 16 are punched. These power metal conductor paths 12 to 16 are bonded at predetermined positions on the insulating substrate 11. Here, instead of individually fabricating the power metal conductor paths 12 to 16, all the power metal conductor paths 12 to 16 are carried out as in the manufacture of a lead frame.
Is provided at the end, and the rib is cut off after bonding to the insulating substrate 11, thereby simplifying the manufacturing.

【0038】電力用金属導体路12〜16と制御用金属
導体路20〜24とを接続する。この接続の方法には、
半田付け,ジャンパー線等がある。半田付けの場合は、
図2に示すように、例えば電力用金属導体路12と制御
用金属導体路20の境界上に半田40を盛って両者を接
続する。
The power metal conductor paths 12 to 16 and the control metal conductor paths 20 to 24 are connected. This connection method includes:
There are soldering and jumper wires. For soldering,
As shown in FIG. 2, for example, solder 40 is piled on the boundary between the power metal conductor path 12 and the control metal conductor path 20 to connect the two.

【0039】図3はジャンパー線による接続状態を示
し、電力用金属導体路12と制御用金属導体路20とが
ジャンパー線44で接続される。なお、図3ではラミネ
ート用のフイルムを省略してある。
FIG. 3 shows a connection state by a jumper wire, and the power metal conductor track 12 and the control metal conductor track 20 are connected by a jumper wire 44. In FIG. 3, the film for lamination is omitted.

【0040】また、電力用金属導体路の接着剤としてホ
ットメルトを用い、そして制御用金属導体路と接続され
る部分に予め半田を持っておき、この半田を盛った部分
を制御用金属導体路に重ねた状態で絶縁性基板11上に
重ね、電力用金属導体路の上からヒータを押しつけて、
半田付けと接着とを同時に行ってもよい。
Also, a hot melt is used as an adhesive for the power metal conductor path, and solder is previously held at a portion connected to the control metal conductor path, and the portion where the solder is piled is used as the control metal conductor path. In a state of being overlapped on the insulating substrate 11 and pressing a heater from above the power metal conductor path,
Soldering and bonding may be performed simultaneously.

【0041】次に、ポリイミドのフイルム41を絶縁性
基板11上にラミネートする。このフイルム41には、
電力用金属導体路12〜16及び制御用金属導体路20
〜24の接続部分に対応する箇所に穴が形成されている
から、これらの接続部分を除いて、電力用金属導体路1
2〜16及び制御用金属導体路20〜24の露出面がフ
イルム41で覆われて絶縁される。
Next, a polyimide film 41 is laminated on the insulating substrate 11. In this film 41,
Power metal tracks 12-16 and control metal tracks 20
Holes are formed at locations corresponding to the connection portions of the power metal conductor path 1 except for these connection portions.
The exposed surfaces of 2 to 16 and the control metal conductor paths 20 to 24 are covered with the film 41 to be insulated.

【0042】電圧検出回路35等の各電子部品を絶縁性
基板11上に実装する。これらの電子部品のうち、温度
ヒューズはスボット溶接で接続されるが、これ以外のも
のは半田によって接続される。
Each electronic component such as the voltage detection circuit 35 is mounted on the insulating substrate 11. Among these electronic components, the thermal fuse is connected by sbot welding, and the other components are connected by solder.

【0043】図4を参照してリチウムイオン電池のパッ
ケージについて説明する。図1においてフレキシブル基
板10の右端にあるほぼ半円形をした部分に厚手の絶縁
シート46を接着して、電圧検出回路35等の接続部分
を絶縁する。フレキシブル基板10の裏面に制御用金属
導体路が形成されている場合には、裏面にも絶縁シート
47を接着する。
The package of the lithium ion battery will be described with reference to FIG. In FIG. 1, a thick insulating sheet 46 is adhered to a substantially semicircular portion at the right end of the flexible substrate 10 to insulate a connection portion of the voltage detection circuit 35 and the like. When the control metal conductor path is formed on the back surface of the flexible substrate 10, the insulating sheet 47 is also adhered to the back surface.

【0044】次に、フレキシブル基板10をリチウムイ
オン電池48に重ねる。電力用金属導体路12のうち絶
縁性基板11から突出している部分の一部を折り曲げて
から、一端12aをリチウムイオン電池48の+電極に
スポット溶接する。同様に,電力用金属導体路14の一
部を折り曲げてから、一端14aを−電極にスポット溶
接する。図1において右端にあるほぼ半円形をした部分
をライン49から折り曲げ、この部分をリチウムイオン
電池48の−電極に押し当てる。
Next, the flexible substrate 10 is overlaid on the lithium ion battery 48. After bending a part of the power metal conductor path 12 protruding from the insulating substrate 11, one end 12 a is spot-welded to the + electrode of the lithium ion battery 48. Similarly, after partially bending the power metal conductor path 14, one end 14a is spot-welded to the negative electrode. In FIG. 1, a substantially semicircular portion at the right end is bent from the line 49, and this portion is pressed against the negative electrode of the lithium ion battery 48.

【0045】フレキシブル基板10を取り付けたリチウ
ムイオン電池48をケース本体50に入れる。この状態
では、開口50aに電源端子30が対面し、開口50b
に電源端子31が対面する。最後に、蓋51をケース本
体50に被せて、リチウムイオン電池パックを完成す
る。
The lithium ion battery 48 to which the flexible board 10 is attached is put in the case body 50. In this state, the power supply terminal 30 faces the opening 50a and the opening 50b
Faces the power supply terminal 31. Finally, the lid 51 is put on the case main body 50 to complete the lithium ion battery pack.

【0046】図5は、2種類の金属導体路を絶縁性基板
の片面ずつに分けて設けたフレキシブル基板を示すもの
である。可撓性を有する絶縁基板54の上面には、接着
剤55を介して金属薄板を用いた電力用金属導体路56
が接着されている。また、絶縁基板54の下面には、接
着剤57を介して金属薄膜の制御用金属導体路58が接
着されている。これらの金属導体路56,58を接続す
るために、絶縁性基板54,各金属導体路56,58に
スルーホール59が形成されている。このスルーホール
59には、半田60が注入してある。なお、半田60の
代わりに、スルーホール59を金属例えば銅でメッキを
してもよい。
FIG. 5 shows a flexible substrate in which two types of metal conductor paths are provided separately on one side of an insulating substrate. On the upper surface of the flexible insulating substrate 54, a power metal conductor path 56 using a thin metal plate is provided via an adhesive 55.
Is glued. Further, a control metal conductor path 58 of a metal thin film is adhered to the lower surface of the insulating substrate 54 via an adhesive 57. In order to connect these metal conductor paths 56, 58, a through hole 59 is formed in the insulating substrate 54 and each metal conductor path 56, 58. Solder 60 is injected into the through hole 59. In place of the solder 60, the through hole 59 may be plated with metal, for example, copper.

【0047】図6は、積層構造のフレキシブル基板を示
すものである。絶縁性基板65の上面に、複数の電力用
金属導体路66〜69が形成されている。電力用金属導
体路66,67は、ニッケル薄板が用いられ、各一端が
リチウムイオン電池にスポット溶接される。電力用金属
導体路68,69としては、りん青銅薄板が用いられ
る。符号70は温度ヒューズである。この絶縁性基板6
5は、絶縁性を有するフイルム71でラミネートされ
る。絶縁性基板72の下面に金属導体路が形成されてい
ない場合は、フイルム71を省略してもよい。
FIG. 6 shows a flexible substrate having a laminated structure. A plurality of power metal conductor paths 66 to 69 are formed on the upper surface of the insulating substrate 65. The power metal conductor paths 66 and 67 are made of a nickel thin plate, and one end of each is spot-welded to a lithium ion battery. Phosphor bronze sheets are used as the power metal conductor paths 68 and 69. Reference numeral 70 denotes a thermal fuse. This insulating substrate 6
5 is laminated with a film 71 having an insulating property. When the metal conductor path is not formed on the lower surface of the insulating substrate 72, the film 71 may be omitted.

【0048】可撓性を有する絶縁性基板72の上面に、
複数の電力用金属導体路73〜75と、制御用金属導体
路76〜78とが形成されている。電力用金属導体路7
3〜75は、ニッケル薄板が用いられる。制御用金属導
体路76〜78としては銅箔が用いられる。符号79は
過放電防止回路,80は過充電防止回路,81は電圧検
出回路である。
On the upper surface of the insulating substrate 72 having flexibility,
A plurality of power metal conductor paths 73 to 75 and control metal conductor paths 76 to 78 are formed. Power metal conductor track 7
For 3 to 75, a nickel thin plate is used. Copper foil is used for the control metal conductor paths 76 to 78. Reference numeral 79 denotes an overdischarge prevention circuit, reference numeral 80 denotes an overcharge prevention circuit, and reference numeral 81 denotes a voltage detection circuit.

【0049】絶縁性基板72は、フイルム71を介して
絶縁性基板65の上に接着剤で接着され、図7に示すよ
うな2層構成のフレキシブル基板となる。なお、図7で
は、接着剤は省略してある。
The insulating substrate 72 is adhered to the insulating substrate 65 with an adhesive via the film 71 to form a two-layer flexible substrate as shown in FIG. In FIG. 7, the adhesive is omitted.

【0050】絶縁性基板72の金属導体路と、絶縁性基
板65の金属導体路とを接続する場合は、スルーホール
83〜86を設け、図5に示すように半田又はメッキに
よって接続する。
When connecting the metal conductor path of the insulating substrate 72 and the metal conductor path of the insulating substrate 65, through holes 83 to 86 are provided and they are connected by soldering or plating as shown in FIG.

【0051】上記実施形態では、リチウムイオン電池に
ついて説明したが、本発明は、その他の充電可能な電池
の電源回路を構成するフレキシブル基板にも利用するこ
とができる。また、本発明は、電池の電源回路以外のフ
レキシブル基板に対しても利用することができる。更
に、金属材料としては、銅,ニッケル,りん青銅につい
て説明したが、その他の金属材料,例えば鉄,アルミ,
金等を用いることができる。また、箔と薄板の組合せの
他に、薄板同志の組合せ,箔同志の組合せであってもよ
い。
In the above embodiment, the lithium ion battery has been described. However, the present invention can be applied to a flexible substrate constituting a power supply circuit of another rechargeable battery. Further, the present invention can be applied to a flexible substrate other than a power supply circuit of a battery. Further, as the metal material, copper, nickel and phosphor bronze have been described, but other metal materials such as iron, aluminum,
Gold or the like can be used. In addition to the combination of foil and thin plate, a combination of thin plates and a combination of foils may be used.

【0052】[0052]

【発明の効果】本発明は、各金属導体路の利用形態,接
続等,配線パターン等を考慮して最適な金属材料を選
び、複数種の金属導体路を絶縁性基板に形成するもので
あるから、接続や配線の信頼性が向上し、また焼損する
ことなく所望の電流を流すことができる。
According to the present invention, a plurality of types of metal conductor paths are formed on an insulating substrate by selecting an optimum metal material in consideration of the usage form, connection, wiring pattern, etc. of each metal conductor path. Therefore, the reliability of the connection and wiring is improved, and a desired current can be passed without burning.

【0053】電子部品が接続される制御用金属導体路に
は銅箔を用い、リチウムイオン電池からの電流を取り出
す電力用金属導体路にはニッケル薄板を用いたから、制
御用金属導体路を細かなパターンにすることができ、ま
た電力用金属導体路をリチウムイオン電池へ直接にスポ
ット溶接することができ、しかも大きな電流を安全に流
すことができる。
Since a copper foil is used for a control metal conductor path to which electronic components are connected and a nickel thin plate is used for a power metal conductor path for extracting current from a lithium ion battery, the control metal conductor path is fine. It can be patterned, and the power metal conductor track can be spot-welded directly to the lithium-ion battery, and a large current can safely flow.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のフレキシブル基板を示す平面図であ
る。
FIG. 1 is a plan view showing a flexible substrate of the present invention.

【図2】電力用金属導体路と制御用金属導体路とを半田
で接続した状態を示すフレキシブル基板の断面図であ
る。
FIG. 2 is a cross-sectional view of a flexible board showing a state where a power metal conductor path and a control metal conductor path are connected by soldering;

【図3】ジャンパー線を用いて電力用金属導体路と制御
用金属導体路とを接続した状態を示すフレキシブル基板
の断面図である。
FIG. 3 is a cross-sectional view of the flexible board showing a state in which a power metal conductor path and a control metal conductor path are connected using jumper wires.

【図4】リチウムイオン電池パックの分解斜視図であ
る。
FIG. 4 is an exploded perspective view of the lithium ion battery pack.

【図5】両面に金属導体路を形成したフレキシブル基板
の断面図である。
FIG. 5 is a cross-sectional view of a flexible substrate having metal conductor paths formed on both sides.

【図6】積層構造のフレキシブル基板の分解斜視図であ
る。
FIG. 6 is an exploded perspective view of a flexible substrate having a laminated structure.

【図7】図6に示すフレキシブル基板の断面図である。FIG. 7 is a sectional view of the flexible substrate shown in FIG.

【符号の説明】[Explanation of symbols]

10 フレキシブル基板 11 絶縁性基板 12〜16 電力用金属導体路 20〜24 制御用金属導体路 44 ジャンパー線 56 制御用金属導体路 58 電力用金属導体路 65,72 絶縁性基板 71 フイルム 66〜69,73〜75 電力用金属導体路 76〜78 制御用金属導体路 DESCRIPTION OF SYMBOLS 10 Flexible board 11 Insulating board 12-16 Power metal conductor path 20-24 Control metal conductor path 44 Jumper wire 56 Control metal conductor path 58 Power metal conductor path 65,72 Insulating substrate 71 Film 66-69, 73-75 Metal conductor track for power 76-78 Metal conductor track for control

Claims (9)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも第1及び第2の金属材料を用
い、第1の金属材料による金属導体路と、第2の金属材
料による金属導体路とを絶縁性基板に形成したことを特
徴とする複数種の金属導体路を持つフレキシブル基板。
1. An insulating substrate, wherein at least a first and a second metal material are used, and a metal conductor path made of a first metal material and a metal conductor path made of a second metal material are formed on an insulating substrate. Flexible board with multiple types of metal conductor paths.
【請求項2】 少なくとも第1の金属材料による金属導
体路を形成した第1の絶縁性基板と、少なくとも第2の
金属材料による金属導体路を形成した第2の絶縁性基板
とを用い、これらの絶縁性基板とを貼り合わせて積層構
造としたことを特徴とする複数種の金属導体路を持つフ
レキシブル基板。
2. A semiconductor device comprising: a first insulating substrate having at least a metal conductive path formed of a first metal material; and a second insulating substrate having at least a metal conductive path formed of a second metal material. A flexible substrate having a plurality of types of metal conductor paths, wherein the flexible substrate has a laminated structure formed by laminating an insulating substrate.
【請求項3】 前記第1の金属材料はニッケル薄板であ
り、第2の金属材料は銅箔であることを特徴とする請求
項1又は2記載の複数種の金属導体路を持つフレキシブ
ル基板。
3. The flexible substrate having a plurality of types of metal conductor paths according to claim 1, wherein the first metal material is a nickel thin plate and the second metal material is a copper foil.
【請求項4】 少なくとも第1及び第2の金属材料を用
い、第1の金属材料による電力用金属導体路と、第2の
金属材料による制御用金属導体路とを絶縁性基板に形成
したことを特徴とする複数種の金属導体路を持つフレキ
シブル基板。
4. An insulating substrate, wherein at least a first metal material and a second metal material are used, and a power metal conductive path made of a first metal material and a control metal conductive path made of a second metal material are formed on an insulating substrate. A flexible substrate having a plurality of types of metal conductor paths.
【請求項5】 前記第1の金属材料は金属薄板であり、
第2の金属材料は銅箔であることを特徴とする請求項4
記載の複数種の金属導体路を持つフレキシブル基板。
5. The first metal material is a metal sheet,
5. The method according to claim 4, wherein the second metal material is a copper foil.
A flexible substrate having a plurality of types of metal conductor paths as described in the above.
【請求項6】 前記絶縁性基板の片面に、電力用金属導
体路と制御用金属導体路とを形成したことを特徴とする
請求項5記載の複数種の金属導体路を持つフレキシブル
基板。
6. The flexible substrate having a plurality of types of metal conductor paths according to claim 5, wherein a power metal conductor path and a control metal conductor path are formed on one surface of the insulating substrate.
【請求項7】 前記絶縁性基板の片面に電力用金属導体
路を形成し、別の片面に制御用金属導体路を形成したこ
とを特徴とする請求項5記載の複数種の金属導体路を持
つフレキシブル基板。
7. A plurality of kinds of metal conductor tracks according to claim 5, wherein a power metal conductor track is formed on one side of the insulating substrate and a control metal conductor track is formed on another side. Flexible substrate to have.
【請求項8】 前記第1の金属材料はニッケル薄板であ
ることを特徴とする請求項4ないし7いずれか記載の複
数種の金属導体路を持つフレキシブル基板。
8. The flexible substrate having a plurality of types of metal conductor paths according to claim 4, wherein the first metal material is a nickel thin plate.
【請求項9】 前記電力用金属導体路の一端がリチウム
イオン電池に接続されており、制御用金属導体路の一端
が制御回路に接続されていることを特徴とする請求項8
記載の複数種の金属導体路を持つフレキシブル基板。
9. The power metal conductor path has one end connected to a lithium ion battery and the control metal conductor path has one end connected to a control circuit.
A flexible substrate having a plurality of types of metal conductor paths as described in the above.
JP11957397A 1997-05-09 1997-05-09 Flexible board with multiple types of metal conductor paths Expired - Fee Related JP3815524B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11957397A JP3815524B2 (en) 1997-05-09 1997-05-09 Flexible board with multiple types of metal conductor paths

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11957397A JP3815524B2 (en) 1997-05-09 1997-05-09 Flexible board with multiple types of metal conductor paths

Publications (2)

Publication Number Publication Date
JPH10313151A true JPH10313151A (en) 1998-11-24
JP3815524B2 JP3815524B2 (en) 2006-08-30

Family

ID=14764702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11957397A Expired - Fee Related JP3815524B2 (en) 1997-05-09 1997-05-09 Flexible board with multiple types of metal conductor paths

Country Status (1)

Country Link
JP (1) JP3815524B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012202820A (en) * 2011-03-25 2012-10-22 Keihin Corp Voltage detection device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012202820A (en) * 2011-03-25 2012-10-22 Keihin Corp Voltage detection device

Also Published As

Publication number Publication date
JP3815524B2 (en) 2006-08-30

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