JPH10308536A - Led line light source - Google Patents
Led line light sourceInfo
- Publication number
- JPH10308536A JPH10308536A JP9131750A JP13175097A JPH10308536A JP H10308536 A JPH10308536 A JP H10308536A JP 9131750 A JP9131750 A JP 9131750A JP 13175097 A JP13175097 A JP 13175097A JP H10308536 A JPH10308536 A JP H10308536A
- Authority
- JP
- Japan
- Prior art keywords
- led
- light source
- line
- leds
- line light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【0001】[0001]
【発明が属する技術分野】本発明は、ファクシミリやス
キャナー用光源等に好適なLEDライン光源に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED line light source suitable for a light source for a facsimile or a scanner.
【0002】[0002]
【従来の技術】一般的にライン光源として、図1に示す
ようなガラスエポキシ等の配線基板1上に多数のLED
を一列に配列した構造のLEDライン光源が知られてい
る。ここで、ファクシミリやスキャナー用のLEDライ
ン光源にあっては、前記多数のLEDを同種のものとせ
ず、通常発光色の異なる2種類のLED21、22を交
互に配置した構造が採用される。これら各LEDの上面
電極とガラスエポキシ配線基板とは、金線3によりそれ
ぞれ電気的に接続されており、その表面には金線3とL
ED21、22の保護を目的とした樹脂4が塗布されて
いる。さらに、ガラスエポキシ配線基板1の前方には、
LEDより放射された光を集光して所定の配光特性を得
るためのレンズ5が設けられている。2. Description of the Related Art Generally, a large number of LEDs are mounted on a wiring board 1 such as a glass epoxy as shown in FIG.
Are known in the art. Here, in an LED line light source for a facsimile or a scanner, a structure is adopted in which the large number of LEDs are not of the same type, and two types of LEDs 21 and 22 having different normal emission colors are alternately arranged. The upper electrode of each LED and the glass epoxy wiring board are electrically connected to each other by a gold wire 3, and the gold wire 3 and L
The resin 4 for protecting the EDs 21 and 22 is applied. Further, in front of the glass epoxy wiring board 1,
A lens 5 for condensing light emitted from the LED to obtain predetermined light distribution characteristics is provided.
【0003】[0003]
【発明が解決しようとする課題】ところが上記LEDラ
イン光源において、1種類のLED21のみを点灯させ
ライン光源の光出力の測定した場合、LED21のマウ
ント部直上の領域では光出力が高いものの、点灯させた
LED21が直下に存在しない領域では光出力が低くな
る傾向が有る。即ち、その光出力分布を測定すると、図
2に示すように波状の特性を示してしまうことになる。
かかる波状特性を平滑化するにはLED21の配置間隔
を狭くすれば良いのであるが、2種のLED21,22
を交互配置せねばならない関係上、高密度化には限界が
ある。However, in the above-mentioned LED line light source, when only one type of LED 21 is turned on and the light output of the line light source is measured, the light output is high in the region immediately above the mounting portion of the LED 21, but it is turned on. The light output tends to be low in a region where the LED 21 does not exist immediately below. That is, when the light output distribution is measured, it exhibits a wave-like characteristic as shown in FIG.
In order to smooth the wavy characteristic, it is sufficient to narrow the arrangement interval of the LEDs 21. However, the two types of LEDs 21 and 22 are used.
There is a limit in increasing the density due to the need to alternately arrange them.
【0004】上記のようにLEDの存在する位置としな
い位置とで光出力の差が顕著であると、ファクシミリや
スキャナー用光源として使用した場合に、色ムラの増加
や解像度の悪化を引き起こしてしまうという問題があ
る。本発明の目的は、このような光出力ムラを可及的に
解消し得るLEDライン光源を提供することにある。If the difference in light output between the position where the LED exists and the position where the LED does not exist is significant as described above, when used as a light source for facsimile or scanner, color unevenness increases and the resolution deteriorates. There is a problem. An object of the present invention is to provide an LED line light source capable of eliminating such light output unevenness as much as possible.
【0005】[0005]
【課題を解決する手段】本発明のLEDライン光源は、
配線基板上に複数のLEDが一列のライン状に配置さ
れ、このLEDの配置ラインの両側に沿って、各LED
の側面からの出射光を配線基板前方に反射させる反射面
を形成してなる構成である。The LED line light source according to the present invention comprises:
A plurality of LEDs are arranged in a line on a wiring board, and each LED is arranged along both sides of the LED arrangement line.
And a reflection surface for reflecting the light emitted from the side surface toward the front of the wiring board.
【0006】また、上記反射面の形成態様として、配線
基板にライン状の窪みを設け、その底部に複数のLED
が一列のライン状に配置し、前記窪みの側壁面が各LE
Dの側面からの出射光を配線基板前方に反射させる反射
面となるよう構成することが好ましい。As a mode of forming the above-mentioned reflection surface, a line-shaped depression is provided in a wiring board, and a plurality of LEDs are provided at the bottom thereof.
Are arranged in a line, and the side wall surface of the recess is
It is preferable that the light-emitting device be configured so as to have a reflecting surface that reflects light emitted from the side surface of D toward the front of the wiring board.
【0007】さらに、配線基板が絶縁金属基板とするこ
と、LEDと反射面部分を樹脂によって封止することも
本発明の好ましい構成態様である。Further, it is a preferred embodiment of the present invention that the wiring substrate is an insulated metal substrate and the LED and the reflection surface are sealed with a resin.
【0008】[0008]
【作用】前述の従来構造にかかるLEDライン光源で
は、LED上面からでる光のみが専ら活用されており、
これに起因してLEDの存在部分と非存在部分とで極端
に光出力の差が発生していたと考えられる。そこで、L
ED配置ラインの両側に沿って反射面を形成することに
より、各LEDの側面より放射される光を前面に取り出
すことが可能となり、LEDの存在しない部分直上での
光出力の落ち込みを抑制することができる。In the LED line light source according to the conventional structure described above, only the light emitted from the upper surface of the LED is exclusively used.
It is considered that this resulted in an extreme difference in light output between the existing portion and the non-existing portion of the LED. Then, L
By forming reflection surfaces along both sides of the ED arrangement line, light emitted from the side surface of each LED can be extracted to the front surface, and a drop in light output immediately above a portion where no LED is present can be suppressed. Can be.
【0009】また、配線基板自体にライン状の窪みを設
け、その底部に複数のLEDが一列のライン状に配置
し、前記窪みの側壁面を前記の反射面とするよう構成す
れば、別途反射面構成部材を準備する必要がなく、部品
点数を減少させることができる。この場合、基板として
絶縁金属基板を用いれば、前記の窪みを絞り加工等で比
較的容易に形成できるため好ましい。If a line-shaped depression is provided in the wiring substrate itself, and a plurality of LEDs are arranged in a line at the bottom of the depression, and the side wall surface of the depression is used as the above-mentioned reflection surface, the reflection is made separately. There is no need to prepare surface components, and the number of parts can be reduced. In this case, it is preferable to use an insulated metal substrate as the substrate, since the above-mentioned depression can be formed relatively easily by drawing or the like.
【0010】さらに、LEDと反射面部分を樹脂にて封
止することにより、反射機構部分内部において発光光の
拡散が起こり、これにより基板前面への取り出し光をさ
らに平滑化することができる。Further, by sealing the LED and the reflection surface portion with resin, the emitted light is diffused inside the reflection mechanism portion, whereby the light taken out to the front surface of the substrate can be further smoothed.
【0011】[0011]
【発明の実施の形態】以下図面に基づいて本発明の実施
態様につき説明する。図3は本発明にかかるLEDライ
ン光源の一例を示す斜視図である。この実施例では、ガ
ラスエポキシ等の配線基板1の表面に、発光波長の異な
る2種のLED21、22を交互に一列のライン状に配
置し、このLED21、22の配置ラインの両側に沿っ
て反射器6a、6bを付設している。この反射器6a、
6bはテーパ状の反射面61を有し、これらをLED配
置ラインを挟んで対向して一対配置することで、各LE
D21,22にコーン状の反射面を提供している。Embodiments of the present invention will be described below with reference to the drawings. FIG. 3 is a perspective view showing an example of the LED line light source according to the present invention. In this embodiment, two kinds of LEDs 21 and 22 having different emission wavelengths are alternately arranged in a line on the surface of a wiring board 1 made of glass epoxy or the like, and reflected along both sides of the arrangement line of the LEDs 21 and 22. Containers 6a and 6b are additionally provided. This reflector 6a,
6b has a tapered reflecting surface 61, and these are arranged in a pair facing each other with the LED arrangement line interposed therebetween.
D21 and D22 are provided with a cone-shaped reflecting surface.
【0012】図4は本発明の他の実施例を示し、この実
施例では基板としてアルミベース基板等の絶縁金属基板
10を用い、絞り加工等の方法により該基板にライン状
の窪み6を設けた場合を例示している。該窪み6は底部
62がフラット面とされ、これに連なる側壁面がテーパ
状の反射面63とされている。前記底部62にはLED
21,22が一列のライン状に配置され、これらLED
21,22に対して、対向する前記反射面63がコーン
状の反射面を提供している。さらに、窪み60のキャビ
ティがシリコーン樹脂等の封止樹脂Pにより充填され、
LED21,22並びに反射面63部分が封止されてい
る。FIG. 4 shows another embodiment of the present invention. In this embodiment, an insulated metal substrate 10 such as an aluminum base substrate is used as a substrate, and a linear recess 6 is formed in the substrate by a method such as drawing. This is illustrated by way of example. The recess 6 has a flat bottom surface 62 and a side wall surface connected to the flat surface 63 is a tapered reflecting surface 63. The bottom 62 has an LED
21 and 22 are arranged in a line, and these LEDs
The opposing reflecting surface 63 provides a cone-shaped reflecting surface with respect to 21 and 22. Further, the cavity of the depression 60 is filled with a sealing resin P such as a silicone resin,
The LEDs 21 and 22 and the reflection surface 63 are sealed.
【0013】次に、図5を参照しながら、反射機構につ
いて詳細に説明する。先ず、多数のLEDの設置面の幅
W、即ち窪み6の底部62の横断面方向の幅は、使用す
るLEDチップ2の大きさW1とすると、0. 05mm
+W1≦W≦1mm+W1が望ましく、さらに望ましく
は、0. 1mm+W1≦W≦0. 5mm+W1である。
設置面の幅が狭すぎると、LEDチップ2のダイボンデ
ィング位置のばらつきによりLEDチップ2が反射面6
3と接触してしまい、LEDチップ2にダメージを与え
ることがある。また幅が広すぎると、反射機能の効用が
減殺されてLEDチップ2からの側面発光光が有効に利
用できなくなる傾向が生じてしまう。Next, the reflection mechanism will be described in detail with reference to FIG. First, the width W of the installation surface of a large number of LEDs, that is, the width in the cross-sectional direction of the bottom 62 of the recess 6 is 0.05 mm, assuming that the size W1 of the LED chip 2 to be used.
+ W1 ≦ W ≦ 1 mm + W1 is preferable, and more preferably, 0.1 mm + W1 ≦ W ≦ 0.5 mm + W1.
If the width of the installation surface is too narrow, the LED chip 2 will not be able to reflect the reflection surface 6 due to the variation in the die bonding position of the LED chip 2.
3 and may damage the LED chip 2. On the other hand, if the width is too wide, the utility of the reflection function is reduced, and the side emission light from the LED chip 2 tends to be unable to be used effectively.
【0014】反射面63の立ち上がり角度θについて
は、20°≦θ≦90°が望ましく、さらに望ましく
は、30°≦θ≦75°である。反射面の立ち上がり角
度θが20°より小さくなると、LEDの側面発光光が
有効に利用できなくなる傾向が顕著になり、一方反射面
角度が90°を越えると前面に光が取り出せなくなる。The rising angle θ of the reflecting surface 63 is preferably 20 ° ≦ θ ≦ 90 °, and more preferably 30 ° ≦ θ ≦ 75 °. If the rising angle θ of the reflecting surface is smaller than 20 °, the tendency that the side emission light of the LED cannot be used effectively becomes conspicuous, while if the reflecting surface angle exceeds 90 °, light cannot be extracted to the front surface.
【0015】また、窪み6の深さTについては、LED
チップ2の高さをT1とすると、−0. 05mm+T1
≦T≦5mm+T1が望ましく、さらに望ましくは、
0. 1mm+T1≦T≦1mm+T1である。LEDチ
ップ2の高さT1に比べ窪み6の深さTが低くなりすぎ
ると、前記と同様に側面発光光が有効に利用できなくな
る。一方、窪み6の深さTがLEDチップ2の高さT1
より5mm以上高くなると、ワイヤーボンディングの信
頼性が悪化する傾向がある。The depth T of the recess 6 is determined by using an LED.
Assuming that the height of the chip 2 is T1, −0.05 mm + T1
≦ T ≦ 5 mm + T1 is desirable, and more desirably,
0.1 mm + T1 ≦ T ≦ 1 mm + T1. If the depth T of the depression 6 is too low compared to the height T1 of the LED chip 2, the side emission light cannot be used effectively as described above. On the other hand, the depth T of the depression 6 is equal to the height T1 of the LED chip 2.
If the height is 5 mm or more, the reliability of wire bonding tends to deteriorate.
【0016】窪み6のキャビティを充填する封止樹脂P
の材質については、透明な樹脂であってその樹脂の屈折
率nが、n=1. 2以上であることが望ましく、さらに
望ましくは、n= 1. 4以上のものである。このような
樹脂として、例えばエポキシ樹脂、シリコーン樹脂、ポ
リカーボネート樹脂、アクリル樹脂等を挙げることがで
きる。The sealing resin P filling the cavity of the depression 6
Is a transparent resin, and the refractive index n of the resin is desirably n = 1.2 or more, and more desirably, n = 1.4 or more. Examples of such a resin include an epoxy resin, a silicone resin, a polycarbonate resin, and an acrylic resin.
【0017】また、反射面63の表面は良反射加工を施
すことが好ましく、例えば金、銀、アルミニウム、クロ
ム等の反射率0.2以上の材料でコーティング処理等を
施すことが好ましい。なお、本発明のLEDライン光源
の用途によっては、封止樹脂P表面と空気との界面での
反射を利用することもあるが、この場合は前記のコーテ
ィング処理等は特に不要である。The surface of the reflection surface 63 is preferably subjected to good reflection processing, and is preferably subjected to a coating treatment or the like with a material having a reflectance of 0.2 or more, such as gold, silver, aluminum, and chromium. Depending on the use of the LED line light source of the present invention, reflection at the interface between the surface of the sealing resin P and air may be used, but in this case, the above-described coating treatment is not particularly required.
【0018】[0018]
【実施例】本発明にかかるLEDライン光源として、図
4に示した構造のLEDライン光源を作成した。配線基
板としてアルミベース絶縁配線基板10を用い、反射面
63の立ち上がり角度が45°、底部62の幅が0. 6
mm、窪み6の深さが0.4mmのライン状の窪み6を
施した。この基板10の底部62の上に、DH型AlG
aAs/AlGaAs赤色LED21(チップサイズ
0. 32mm角、チップ高さ0. 15mm)とホモ接合
型GaAs赤外LED22(チップサイズ0.32mm
角、チップ高さ0. 23mm)を交互に設置した。LE
D21,22の個数はそれぞれ30個、隣接するLED
の配置ピッチは夫々1.5mmとした。なお各LED2
1,22は、事前に光出力値をチェックし、光出力値の
バラツキが相互に±10%以内のものものを使用した。
さらに、反射面63の表面をソルダーレジストでコーテ
ィングし、窪み6のキャビティをシリコーン樹脂Pによ
り封止してLEDライン光源を作成した。EXAMPLE An LED line light source having the structure shown in FIG. 4 was prepared as an LED line light source according to the present invention. The aluminum-based insulating wiring board 10 is used as the wiring board, the rising angle of the reflection surface 63 is 45 °, and the width of the bottom 62 is 0.6.
A linear depression 6 having a depth of 0.4 mm and a depth of 0.4 mm was formed. On the bottom 62 of the substrate 10, a DH type AlG
aAs / AlGaAs red LED 21 (chip size 0.32 mm square, chip height 0.15 mm) and homojunction GaAs infrared LED 22 (chip size 0.32 mm)
Corners and a chip height of 0.23 mm) were alternately provided. LE
The number of D21 and D22 is 30 each, and the adjacent LED
Were set to 1.5 mm. Each LED2
In Examples 1 and 22, the light output values were checked in advance, and those whose light output values varied within ± 10% of each other were used.
Further, the surface of the reflection surface 63 was coated with a solder resist, and the cavity of the depression 6 was sealed with the silicone resin P to prepare an LED line light source.
【0019】[0019]
【比較例】上記で作成したLEDライン光源との比較の
ため、図1に示すような、ガラスエポキシ配線基板1上
に上記実施例と同じ2種のLED21,22を交互に配
置したLEDライン光源を作成した。LEDの個数はそ
れぞれ30個、ピッチも1.5mmと同様にし、使用す
るLEDは、光出力値のバラツキが相互に±10%以内
のものものを使用した。なお、各LED21,22及び
ボンディングワイヤの上には、保護のためシリコーン樹
脂をポッティングした。COMPARATIVE EXAMPLE For comparison with the LED line light source prepared above, as shown in FIG. 1, an LED line light source in which the same two types of LEDs 21 and 22 as in the above embodiment are alternately arranged on a glass epoxy wiring board 1. It was created. The number of LEDs was 30 and the pitch was 1.5 mm, and the LEDs used had a variation in light output value within ± 10% of each other. Note that a silicone resin was potted on each of the LEDs 21 and 22 and the bonding wires for protection.
【0020】上記実施例、比較例で作成したLEDライ
ン光源の光出力ばらつきをそれぞれ測定した。測定は、
直径1.5mmのスリットを光ファイバの先端に取り付
けたフォトセンサーアンプC6386(浜松ホトニクス
社製)を用いて行った。測定位置は、LEDライン光源
上10mmの位置とし、1.5mmピッチで順次光出力
の測定を行った。測定手順は、先ず赤色発光LED21
のみを1つのLED当たり10mAの電流値にて点灯さ
せ、光出力を基板の一端側から他端側まで測定し、その
後赤外発光LED22のみを1つのLED当たり10m
Aの電流値にて点灯して同様に光出力を測定するように
した。Light output variations of the LED line light sources prepared in the above Examples and Comparative Examples were measured. The measurement is
The measurement was performed using a photosensor amplifier C6386 (manufactured by Hamamatsu Photonics) having a slit having a diameter of 1.5 mm attached to the tip of the optical fiber. The measurement position was 10 mm above the LED line light source, and the light output was measured sequentially at 1.5 mm pitch. The measurement procedure is as follows.
Only at a current value of 10 mA per LED, and the light output is measured from one end of the substrate to the other end.
The lamp was turned on at the current value of A, and the light output was measured in the same manner.
【0021】上記の測定結果として、実施例にかかるL
EDライン光源の測定結果を図6に、比較例にかかるL
EDライン光源の測定結果を図7にそれぞれ示す。図示
している通り、比較例品Bでは点灯しているLED直上
での光出力は大きいがそれ以外の部分では光出力が小さ
くなっており、1.5mmピッチにて光出力が大きく変
動していることが認められる。これに対し実施例品で
は、点灯しているLED直上とそれ以外の部分とでの光
出力変動がほとんど無くなっていることが認められ、本
発明によれば光出力のバラツキの少ないLEDライン光
源が提供できることが確認できた。As a result of the above measurement, L
FIG. 6 shows the measurement results of the ED line light source, and L according to the comparative example.
FIG. 7 shows the measurement results of the ED line light source. As shown in the figure, in the comparative example product B, the light output immediately above the lit LED is large, but the light output is small in other portions, and the light output fluctuates greatly at a 1.5 mm pitch. Is admitted. On the other hand, in the example product, it is recognized that there is almost no change in the light output between immediately above the lit LED and the other portions, and according to the present invention, an LED line light source with less variation in the light output is provided. It was confirmed that it could be provided.
【0022】ちなみに、実施例及び比較例にかかるLE
Dライン光源につき、有効照明長84mm内での光出力
値のばらつきを、 光出力変動=(最大光出力−最小光出力)/(最大光出
力+最小光出力) の式で求めたところ、実施例にかかるLEDライン光源
における赤色LED21点灯のときの光出力のばらつき
は7.7%、赤外LED22のそれのばらつきは4.4
%であったのに対し、比較例にかかるLEDライン光源
では赤色LED21は12.5%、赤外LED22は1
2.7%であった。By the way, LEs according to the examples and comparative examples
For the D-line light source, the variation of the light output value within the effective illumination length of 84 mm was obtained by the formula: light output fluctuation = (maximum light output−minimum light output) / (maximum light output + minimum light output). The variation of the light output when the red LED 21 is turned on in the LED line light source according to the example is 7.7%, and the variation of the infrared LED 22 is 4.4.
%, The red LED 21 and the infrared LED 22 of the LED line light source according to the comparative example are 12.5% and 12.5%, respectively.
2.7%.
【0023】上述の実施例ではGaAs、AlGaAs
系の赤色、赤外LEDにつき説明したが、本発明ではこ
れだけではなくInGaAlP系、GaP系、GaAs
P系、InGaN系等のLEDであっても勿論適用可能
である。言うまでもなく、2種のLEDを交互配置せ
ず、1種のLEDをライン状に配置する場合であっても
本発明は適用できる。In the above embodiment, GaAs, AlGaAs
In the present invention, not only this but also InGaAlP-based, GaP-based, GaAs
It is needless to say that a P-based or InGaN-based LED can be used. Needless to say, the present invention can be applied to a case where two kinds of LEDs are not alternately arranged but one kind of LED is arranged in a line.
【0024】[0024]
【発明の効果】以上説明した通りの本発明のLEDライ
ン光源によれば、LED配置部直上と非配置部上との光
出力変動を非常に低く抑えることが可能となる。従って
長手方向に極めて光出力の安定したライン状光源を得る
ことができ、ファクシミリやスキャナー用光源として使
用した場合に、色ムラや解像度の悪化を招来することが
ないという優れた効果を奏する。As described above, according to the LED line light source of the present invention, it is possible to suppress the fluctuation of the light output between the portion where the LED is disposed and the portion where the LED is not disposed very low. Therefore, it is possible to obtain a linear light source having extremely stable light output in the longitudinal direction, and when used as a light source for facsimile or scanner, an excellent effect that color nonuniformity and deterioration of resolution are not caused.
【図1】従来のLEDライン光源を示す側面図である。FIG. 1 is a side view showing a conventional LED line light source.
【図2】従来のLEDライン光源の光出力分布を示すグ
ラフ図である。FIG. 2 is a graph showing a light output distribution of a conventional LED line light source.
【図3】本発明にかかるLEDライン光源の一例を示す
斜視図である。FIG. 3 is a perspective view showing an example of an LED line light source according to the present invention.
【図4】本発明にかかるLEDライン光源の他の例を示
す斜視図である。FIG. 4 is a perspective view showing another example of the LED line light source according to the present invention.
【図5】本発明のLEDライン光源における反射機構部
の説明図である。FIG. 5 is an explanatory diagram of a reflection mechanism in the LED line light source of the present invention.
【図6】本発明の実施例品の光出力分布を示すグラフ図
である。FIG. 6 is a graph showing a light output distribution of an example product of the present invention.
【図7】比較例品の光出力分布を示すグラフ図である。FIG. 7 is a graph showing the light output distribution of a comparative example product.
1,10 配線基板 21,22 LED 6a,6b 反射器 6 窪み 61,63 反射面 62 窪みの底部 P 封止樹脂 1,10 Wiring board 21,22 LED 6a, 6b Reflector 6 Depression 61,63 Reflection surface 62 Bottom of depression P Sealing resin
Claims (4)
ン状に配置され、このLEDの配置ラインの両側に沿っ
て、各LEDの側面からの出射光を配線基板前方に反射
させる反射面を形成してなるLEDライン光源。1. A plurality of LEDs are arranged in a line on a wiring board. A reflecting surface for reflecting light emitted from the side surface of each LED toward the front of the wiring board is provided along both sides of the arrangement line of the LEDs. An LED line light source formed.
底部に複数のLEDが一列のライン状に配置されてお
り、前記窪みの側壁面が各LEDの側面からの出射光を
配線基板前方に反射させる反射面とされてなるLEDラ
イン光源。2. A line-shaped depression is provided in a wiring substrate, and a plurality of LEDs are arranged in a line at the bottom of the depression, and a side wall surface of the depression transmits light emitted from a side surface of each LED to the front of the wiring substrate. An LED line light source having a reflection surface for reflecting light.
1又は2記載のLEDライン光源。3. The LED line light source according to claim 1, wherein the wiring substrate is an insulated metal substrate.
されている請求項1〜3いずれかに記載のLEDライン
光源。4. The LED line light source according to claim 1, wherein the LED and the reflection surface are sealed with a resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9131750A JPH10308536A (en) | 1997-05-06 | 1997-05-06 | Led line light source |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9131750A JPH10308536A (en) | 1997-05-06 | 1997-05-06 | Led line light source |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10308536A true JPH10308536A (en) | 1998-11-17 |
Family
ID=15065324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9131750A Pending JPH10308536A (en) | 1997-05-06 | 1997-05-06 | Led line light source |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH10308536A (en) |
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