JPH10308536A - Led line light source - Google Patents

Led line light source

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Publication number
JPH10308536A
JPH10308536A JP9131750A JP13175097A JPH10308536A JP H10308536 A JPH10308536 A JP H10308536A JP 9131750 A JP9131750 A JP 9131750A JP 13175097 A JP13175097 A JP 13175097A JP H10308536 A JPH10308536 A JP H10308536A
Authority
JP
Japan
Prior art keywords
led
light source
line
line light
surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9131750A
Other languages
Japanese (ja)
Inventor
Hiroaki Kinoshita
Hideaki Matsuda
Shinichi Sano
真一 佐野
浩彰 木下
秀秋 松田
Original Assignee
Mitsubishi Cable Ind Ltd
三菱電線工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Cable Ind Ltd, 三菱電線工業株式会社 filed Critical Mitsubishi Cable Ind Ltd
Priority to JP9131750A priority Critical patent/JPH10308536A/en
Publication of JPH10308536A publication Critical patent/JPH10308536A/en
Application status is Pending legal-status Critical

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

PROBLEM TO BE SOLVED: To provide an LED line light source whose irregularity in an optical output in its long direction can be eliminated as far as possible. SOLUTION: A linear hollow 6 is formed on an aluminum-based board 10 by a drawing and working method or the like. In the hollow 6, its bottom pat 62 is formed to be a flat face, and sidewall faces which are connected to the face are formed to be taper-shaped reflecting faces 63. LED's 21, 22 are arranged on the bottom part 62 to be linear in a row, and the reflecting faces 63 provide cone-shaped reflecting faces to the LED's 21, 22. Since the reflecting faces are formed along both sides of an LED arrangement line, beams of light which are radiated from side faces of the respective LED's can be taken out to the front, and it is possible to restrain an optical output from being dropped just above parts in which the LED's do not exist.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明が属する技術分野】本発明は、ファクシミリやスキャナー用光源等に好適なLEDライン光源に関するものである。 The present invention relates] are those of the preferred LED line light source to a facsimile or scanner light source or the like.

【0002】 [0002]

【従来の技術】一般的にライン光源として、図1に示すようなガラスエポキシ等の配線基板1上に多数のLED 2. Description of the Related Art As a general line light source, a large number of LED on the wiring substrate 1 such as glass epoxy, as shown in FIG. 1
を一列に配列した構造のLEDライン光源が知られている。 Structure LED line light source arranged in a row is known. ここで、ファクシミリやスキャナー用のLEDライン光源にあっては、前記多数のLEDを同種のものとせず、通常発光色の異なる2種類のLED21、22を交互に配置した構造が採用される。 Here, in the LED line light source of facsimile or scanner, the number of LED without the like, structure in which the normal light emission colors of two different LED21,22 alternately is adopted. これら各LEDの上面電極とガラスエポキシ配線基板とは、金線3によりそれぞれ電気的に接続されており、その表面には金線3とL These and the upper electrode and the glass epoxy wiring substrate of each LED, respectively by gold wires 3 are electrically connected, and the gold wire 3 on the surface L
ED21、22の保護を目的とした樹脂4が塗布されている。 Resin 4 is applied for the purpose of protection of ED21,22. さらに、ガラスエポキシ配線基板1の前方には、 Further, in front of a glass epoxy wiring substrate 1,
LEDより放射された光を集光して所定の配光特性を得るためのレンズ5が設けられている。 Lens 5 for obtaining a predetermined light distribution characteristic of light emitted from the LED is focused is provided.

【0003】 [0003]

【発明が解決しようとする課題】ところが上記LEDライン光源において、1種類のLED21のみを点灯させライン光源の光出力の測定した場合、LED21のマウント部直上の領域では光出力が高いものの、点灯させたLED21が直下に存在しない領域では光出力が低くなる傾向が有る。 [SUMMARY OF THE INVENTION However in the LED line light source, one of the case where only the measurement of the light output of the line light source is lit LED 21, although the light output is higher in the region directly above the mount portion of the LED 21, it is lit It was LED21 optical output tends to decrease in the region that does not exist immediately below. 即ち、その光出力分布を測定すると、図2に示すように波状の特性を示してしまうことになる。 That is, when measuring the light output distribution, so that the result shows a wave-like characteristics as shown in FIG.
かかる波状特性を平滑化するにはLED21の配置間隔を狭くすれば良いのであるが、2種のLED21,22 Although the smoothing such undulating characteristic is can it narrow the arrangement intervals of the LED 21, the two LED21,22
を交互配置せねばならない関係上、高密度化には限界がある。 The on relationships which must be interleaved, the density is limited.

【0004】上記のようにLEDの存在する位置としない位置とで光出力の差が顕著であると、ファクシミリやスキャナー用光源として使用した場合に、色ムラの増加や解像度の悪化を引き起こしてしまうという問題がある。 [0004] When the difference in light output between the position not to be present position of the LED as described above is remarkable, when used as a facsimile and a scanner light source, thereby causing an increase or resolution deterioration of color unevenness there is a problem in that. 本発明の目的は、このような光出力ムラを可及的に解消し得るLEDライン光源を提供することにある。 An object of the present invention is to provide a LED line light source capable of eliminating such light output unevenness as much as possible.

【0005】 [0005]

【課題を解決する手段】本発明のLEDライン光源は、 Means for Solving the Problems The LED line light source of the present invention,
配線基板上に複数のLEDが一列のライン状に配置され、このLEDの配置ラインの両側に沿って、各LED A plurality of LED are arranged in a row linearly on the wiring board, along both sides of the arrangement line of the LED, the LED
の側面からの出射光を配線基板前方に反射させる反射面を形成してなる構成である。 A light emitted from the side surface of forming a reflecting surface for reflecting the wiring board frontward comprising configuration.

【0006】また、上記反射面の形成態様として、配線基板にライン状の窪みを設け、その底部に複数のLED Further, as the formation of the above reflective surface, the recess of the line-shaped formed in the wiring board, a plurality of LED at the bottom thereof
が一列のライン状に配置し、前記窪みの側壁面が各LE There are arranged in a row line-shaped, the side wall surfaces of the recesses each LE
Dの側面からの出射光を配線基板前方に反射させる反射面となるよう構成することが好ましい。 It is preferably configured to be a reflective surface for reflecting light emitted from the side surface of the D to the wiring board frontward.

【0007】さらに、配線基板が絶縁金属基板とすること、LEDと反射面部分を樹脂によって封止することも本発明の好ましい構成態様である。 Furthermore, the wiring substrate is an insulating metal substrate, it is preferred construction embodiment of the present invention that the LED and reflecting surface portions are sealed by a resin.

【0008】 [0008]

【作用】前述の従来構造にかかるLEDライン光源では、LED上面からでる光のみが専ら活用されており、 [Action] In the LED line light source according to the aforementioned conventional structure, and only the light exiting from the LED top is exclusively utilized,
これに起因してLEDの存在部分と非存在部分とで極端に光出力の差が発生していたと考えられる。 Believed difference in extreme light output by the part occupied and non-occupied part of the LED due to this has occurred. そこで、L So, L
ED配置ラインの両側に沿って反射面を形成することにより、各LEDの側面より放射される光を前面に取り出すことが可能となり、LEDの存在しない部分直上での光出力の落ち込みを抑制することができる。 By forming a reflective surface along both sides of the ED deployment line, the light emitted from the side surface of each LED can be taken out to the front, to suppress the drop in light output immediately above nonexistent portion of the LED can.

【0009】また、配線基板自体にライン状の窪みを設け、その底部に複数のLEDが一列のライン状に配置し、前記窪みの側壁面を前記の反射面とするよう構成すれば、別途反射面構成部材を準備する必要がなく、部品点数を減少させることができる。 Further, the wiring board itself a recess provided in a line shape, arranged in a plurality of LED is one row linear at the bottom, a side wall surface of the recess if configured to the reflective surface, separately reflected it is not necessary to prepare the surface components, it can be reduced number of parts. この場合、基板として絶縁金属基板を用いれば、前記の窪みを絞り加工等で比較的容易に形成できるため好ましい。 In this case, the use of the insulated metal substrate as the substrate, preferred because it can relatively easily formed by machining or the like squeezing the recess of.

【0010】さらに、LEDと反射面部分を樹脂にて封止することにより、反射機構部分内部において発光光の拡散が起こり、これにより基板前面への取り出し光をさらに平滑化することができる。 Furthermore, by sealing the LED and the reflecting surface portion of a resin, diffusion takes place in the emitted light in the internal reflection mechanism portion, thereby further smoothing the extracted light to the substrate front surface.

【0011】 [0011]

【発明の実施の形態】以下図面に基づいて本発明の実施態様につき説明する。 It will be described embodiments of the present invention based on PREFERRED EMBODIMENTS drawings. 図3は本発明にかかるLEDライン光源の一例を示す斜視図である。 Figure 3 is a perspective view showing an example of a LED line light source according to the present invention. この実施例では、ガラスエポキシ等の配線基板1の表面に、発光波長の異なる2種のLED21、22を交互に一列のライン状に配置し、このLED21、22の配置ラインの両側に沿って反射器6a、6bを付設している。 In this embodiment, the surface of the wiring substrate 1 such as glass epoxy, and the two LED21,22 having different emission wavelengths are alternately arranged in a row linear, along both sides of the arrangement line of the LED21,22 reflection vessel 6a, are attached to 6b. この反射器6a、 The reflector 6a,
6bはテーパ状の反射面61を有し、これらをLED配置ラインを挟んで対向して一対配置することで、各LE 6b has a tapered reflecting surface 61, these are opposed to each other across the LED arrangement line by pair arrangement, each LE
D21,22にコーン状の反射面を提供している。 It provides a conical reflecting surface to D21,22.

【0012】図4は本発明の他の実施例を示し、この実施例では基板としてアルミベース基板等の絶縁金属基板10を用い、絞り加工等の方法により該基板にライン状の窪み6を設けた場合を例示している。 [0012] Figure 4 shows another embodiment of the present invention, an insulating metal substrate 10 of the aluminum base substrate or the like as the substrate in this embodiment, the recess 6 of the linear to the substrate provided by the method of drawing such as It illustrates the case was. 該窪み6は底部62がフラット面とされ、これに連なる側壁面がテーパ状の反射面63とされている。 Depressions viewed 6 the bottom 62 is flat surface, the side wall surface contiguous thereto is tapered reflective surface 63. 前記底部62にはLED The LED on the bottom portion 62
21,22が一列のライン状に配置され、これらLED 21 and 22 are arranged in a row linear, these LED
21,22に対して、対向する前記反射面63がコーン状の反射面を提供している。 Against 21, the reflecting surface 63 which faces is providing a cone-shaped reflecting surface. さらに、窪み60のキャビティがシリコーン樹脂等の封止樹脂Pにより充填され、 Furthermore, the cavity of the recess 60 is filled with a sealing resin P, such as a silicone resin,
LED21,22並びに反射面63部分が封止されている。 LED21,22 and reflecting surface 63 portion is sealed.

【0013】次に、図5を参照しながら、反射機構について詳細に説明する。 [0013] Next, referring to FIG. 5, described in detail reflecting frame. 先ず、多数のLEDの設置面の幅W、即ち窪み6の底部62の横断面方向の幅は、使用するLEDチップ2の大きさW1とすると、0. 05mm First, the width W of the installation surface of the large number of LED, or indentation 6 the width of the cross section direction of the bottom portion 62 of, when the size W1 of the LED chip 2 to be used, 0. 05mm
+W1≦W≦1mm+W1が望ましく、さらに望ましくは、0. 1mm+W1≦W≦0. 5mm+W1である。 + W1 ≦ W ≦ 1mm + W1 is desirable, and more preferably is 0. 1mm + W1 ≦ W ≦ 0. 5mm + W1.
設置面の幅が狭すぎると、LEDチップ2のダイボンディング位置のばらつきによりLEDチップ2が反射面6 If the width of the installation surface is too narrow, the LED chip 2 is reflected surface 6 due to variations in the die-bonding position of the LED chip 2
3と接触してしまい、LEDチップ2にダメージを与えることがある。 3 will come into contact with, which may damage the LED chip 2. また幅が広すぎると、反射機能の効用が減殺されてLEDチップ2からの側面発光光が有効に利用できなくなる傾向が生じてしまう。 Also the width is too wide, tends to side-emitting light can not be effectively used from the LED chip 2 utility of reflecting function is attenuated it occurs.

【0014】反射面63の立ち上がり角度θについては、20°≦θ≦90°が望ましく、さらに望ましくは、30°≦θ≦75°である。 [0014] The rising angle theta of the reflecting surface 63 is desirably 20 ° ≦ θ ≦ 90 °, and more preferably, is 30 ° ≦ θ ≦ 75 °. 反射面の立ち上がり角度θが20°より小さくなると、LEDの側面発光光が有効に利用できなくなる傾向が顕著になり、一方反射面角度が90°を越えると前面に光が取り出せなくなる。 When the rising angle of the reflecting surface θ is smaller than 20 °, it tends to LED side-emitting light can not be effectively used becomes significant, whereas the reflective surface angle will not eject the light on the front exceeds 90 °.

【0015】また、窪み6の深さTについては、LED [0015] Also, the depth T of the recess 6, LED
チップ2の高さをT1とすると、−0. 05mm+T1 When the height of the chip 2, T1, -0. 05mm + T1
≦T≦5mm+T1が望ましく、さらに望ましくは、 ≦ T ≦ 5mm + T1 is desirable, more desirably,
0. 1mm+T1≦T≦1mm+T1である。 0.1 is a 1mm + T1 ≦ T ≦ 1mm + T1. LEDチップ2の高さT1に比べ窪み6の深さTが低くなりすぎると、前記と同様に側面発光光が有効に利用できなくなる。 If the depth T of the recess 6 than the height T1 of the LED chip 2 is too low, the same manner as described above side-emitting light can not be effectively used. 一方、窪み6の深さTがLEDチップ2の高さT1 On the other hand, the depth T of the recess 6 the height of the LED chip 2 T1
より5mm以上高くなると、ワイヤーボンディングの信頼性が悪化する傾向がある。 Becomes higher more 5mm or more, there is a tendency that the reliability of the wire bonding is deteriorated.

【0016】窪み6のキャビティを充填する封止樹脂P The seal fills the cavity of the recesses 6 resin P
の材質については、透明な樹脂であってその樹脂の屈折率nが、n=1. 2以上であることが望ましく、さらに望ましくは、n= 1. 4以上のものである。 For the material, the refractive index n of the resin a transparent resin, n = 1. It is desirably 2 or more, and more preferably, n = 1. is of 4 or more. このような樹脂として、例えばエポキシ樹脂、シリコーン樹脂、ポリカーボネート樹脂、アクリル樹脂等を挙げることができる。 As such a resin, such as epoxy resin, silicone resin, polycarbonate resin, acrylic resin or the like.

【0017】また、反射面63の表面は良反射加工を施すことが好ましく、例えば金、銀、アルミニウム、クロム等の反射率0.2以上の材料でコーティング処理等を施すことが好ましい。 Further, the surface of the reflective surface 63 is preferably subjected to good reflective coating, such as gold, silver, aluminum, be subjected to a coating treatment with reflectivity of 0.2 or more materials such as chromium preferred. なお、本発明のLEDライン光源の用途によっては、封止樹脂P表面と空気との界面での反射を利用することもあるが、この場合は前記のコーティング処理等は特に不要である。 Incidentally, depending on the application of LED line light source of the present invention, there is also possible to utilize the reflection at the interface between the sealing resin P surface and air, coating treatment in this case the are particularly required.

【0018】 [0018]

【実施例】本発明にかかるLEDライン光源として、図4に示した構造のLEDライン光源を作成した。 As LED line light source according to the embodiment of the present invention to prepare a LED line light source having the structure shown in FIG. 配線基板としてアルミベース絶縁配線基板10を用い、反射面63の立ち上がり角度が45°、底部62の幅が0. 6 The aluminum base insulating wiring board 10 used as a wiring board, the rising angle of the reflecting surface 63 is 45 °, the width of the bottom portion 62 is 0.6
mm、窪み6の深さが0.4mmのライン状の窪み6を施した。 mm, the depth of the recess 6 is subjected to a line-shaped depressions 6 of 0.4 mm. この基板10の底部62の上に、DH型AlG On the bottom portion 62 of the substrate 10, DH type AlG
aAs/AlGaAs赤色LED21(チップサイズ0. 32mm角、チップ高さ0. 15mm)とホモ接合型GaAs赤外LED22(チップサイズ0.32mm GaAs / AlGaAs red LED 21 (chip size 0. 32 mm square, chip height 0. 15 mm) and homozygous GaAs infrared LED 22 (chip size 0.32mm
角、チップ高さ0. 23mm)を交互に設置した。 Square, was placed alternately tip height 0. 23 mm). LE LE
D21,22の個数はそれぞれ30個、隣接するLED 30 The number of D21,22 respectively adjacent LED
の配置ピッチは夫々1.5mmとした。 The arrangement pitch was respectively 1.5mm. なお各LED2 It should be noted that each LED2
1,22は、事前に光出力値をチェックし、光出力値のバラツキが相互に±10%以内のものものを使用した。 1, 22 is, in advance to check the light output value, the variation of the light output value was used those within the 10% ± to each other.
さらに、反射面63の表面をソルダーレジストでコーティングし、窪み6のキャビティをシリコーン樹脂Pにより封止してLEDライン光源を作成した。 Further, the surface of the reflective surface 63 coated with a solder resist, the cavity of the recess 6 created the LED line light source is sealed by a silicone resin P.

【0019】 [0019]

【比較例】上記で作成したLEDライン光源との比較のため、図1に示すような、ガラスエポキシ配線基板1上に上記実施例と同じ2種のLED21,22を交互に配置したLEDライン光源を作成した。 [Comparative Examples] For comparison with the LED line light source created above, as shown in FIG. 1, LED line light source arranged alternately same two LED21,22 as in Example on a glass epoxy wiring substrate 1 It was created. LEDの個数はそれぞれ30個、ピッチも1.5mmと同様にし、使用するLEDは、光出力値のバラツキが相互に±10%以内のものものを使用した。 LED 30 pieces each number is the pitch even in the same manner as 1.5 mm, LED used is the variation of the light output value was used as within the 10% ± mutually. なお、各LED21,22及びボンディングワイヤの上には、保護のためシリコーン樹脂をポッティングした。 Note that on each LED21,22 and the bonding wire, and potting a silicone resin for protection.

【0020】上記実施例、比較例で作成したLEDライン光源の光出力ばらつきをそれぞれ測定した。 [0020] The above-described embodiment, the light output variation of the LED line light source produced in Comparative Example were measured. 測定は、 Measurement,
直径1.5mmのスリットを光ファイバの先端に取り付けたフォトセンサーアンプC6386(浜松ホトニクス社製)を用いて行った。 It was performed using a photosensor amplifier C6386 fitted with slits of 1.5mm diameter at the tip of the optical fiber (manufactured by Hamamatsu Photonics KK). 測定位置は、LEDライン光源上10mmの位置とし、1.5mmピッチで順次光出力の測定を行った。 Measuring position is a position on the LED line light source 10 mm, was measured sequentially light output 1.5mm pitch. 測定手順は、先ず赤色発光LED21 Measurement procedure, first, a red light emitting LED21
のみを1つのLED当たり10mAの電流値にて点灯させ、光出力を基板の一端側から他端側まで測定し、その後赤外発光LED22のみを1つのLED当たり10m Only to light at a current value of 10mA per one LED, the light output was measured from one end of the substrate to the other end, then the infrared light emitting LED22 only one LED per 10m
Aの電流値にて点灯して同様に光出力を測定するようにした。 And to measure similarly the optical output lit at a current value of A.

【0021】上記の測定結果として、実施例にかかるL [0021] As the measurement result of the, L according to the embodiment
EDライン光源の測定結果を図6に、比較例にかかるL Figure 6 The measurement results of the ED line light source, L according to the comparative example
EDライン光源の測定結果を図7にそれぞれ示す。 Respectively Figure 7 shows the measurement results of the ED line light source. 図示している通り、比較例品Bでは点灯しているLED直上での光出力は大きいがそれ以外の部分では光出力が小さくなっており、1.5mmピッチにて光出力が大きく変動していることが認められる。 As illustrated, the optical output is large while the other portion just above the LED is lit in Comparative sample B and the optical output becomes smaller, vary the light output is increased at 1.5mm pitch it can be seen that there. これに対し実施例品では、点灯しているLED直上とそれ以外の部分とでの光出力変動がほとんど無くなっていることが認められ、本発明によれば光出力のバラツキの少ないLEDライン光源が提供できることが確認できた。 In contrast Example product, it is recognized that light output variations at the LED directly above and other portions that are lit is almost gone, less LED line light source of variation in optical output according to the present invention it was confirmed that it is possible to provide.

【0022】ちなみに、実施例及び比較例にかかるLE [0022] Incidentally, LE according to Examples and Comparative Examples
Dライン光源につき、有効照明長84mm内での光出力値のばらつきを、 光出力変動=(最大光出力−最小光出力)/(最大光出力+最小光出力) の式で求めたところ、実施例にかかるLEDライン光源における赤色LED21点灯のときの光出力のばらつきは7.7%、赤外LED22のそれのばらつきは4.4 Per D line light source, variations in the optical output value in the effective illumination length 84 mm, light output variation = - was determined by the formula of (maximum light output minimum light output) / (maximum light output + minimum light output), performed 7.7% the variations in the light output when the red LED21 lit in the LED line light source according to the example, that of variations in the infrared LED22 4.4
%であったのに対し、比較例にかかるLEDライン光源では赤色LED21は12.5%、赤外LED22は1 % And was the contrast, red LED21 12.5% ​​in the LED line light source according to a comparative example, infrared LED22 1
2.7%であった。 It was 2.7%.

【0023】上述の実施例ではGaAs、AlGaAs [0023] GaAs in the above-described embodiment, AlGaAs
系の赤色、赤外LEDにつき説明したが、本発明ではこれだけではなくInGaAlP系、GaP系、GaAs Red system, have been explained infrared LED, the present invention InGaAlP system not only this is, GaP-based, GaAs
P系、InGaN系等のLEDであっても勿論適用可能である。 P system, be an LED of InGaN system or the like is of course applicable. 言うまでもなく、2種のLEDを交互配置せず、1種のLEDをライン状に配置する場合であっても本発明は適用できる。 Needless to say, the two LED not interleaved, but the present invention there is provided a case of arranging the one LED in a line can be applied.

【0024】 [0024]

【発明の効果】以上説明した通りの本発明のLEDライン光源によれば、LED配置部直上と非配置部上との光出力変動を非常に低く抑えることが可能となる。 According to the LED line light source of the present invention as has been described in the foregoing, it is possible to suppress very low light output variation of the LED arrangement portion just above the non-arrangement section above. 従って長手方向に極めて光出力の安定したライン状光源を得ることができ、ファクシミリやスキャナー用光源として使用した場合に、色ムラや解像度の悪化を招来することがないという優れた効果を奏する。 Therefore longitudinally can be obtained a stable line light source of extremely light output achieved when used as a light source for a facsimile machine or a scanner, an excellent effect that is not to lead to deterioration of color unevenness and resolution.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】従来のLEDライン光源を示す側面図である。 1 is a side view showing a conventional LED line light source.

【図2】従来のLEDライン光源の光出力分布を示すグラフ図である。 2 is a graph showing the light output distribution of the conventional LED line light source.

【図3】本発明にかかるLEDライン光源の一例を示す斜視図である。 3 is a perspective view showing an example of a LED line light source according to the present invention.

【図4】本発明にかかるLEDライン光源の他の例を示す斜視図である。 It is a perspective view showing another example of the LED line light source according to the present invention; FIG.

【図5】本発明のLEDライン光源における反射機構部の説明図である。 5 is an explanatory diagram of a reflecting frame portion in the LED line light source of the present invention.

【図6】本発明の実施例品の光出力分布を示すグラフ図である。 6 is a graph showing the optical power distribution in the Example Product of the present invention.

【図7】比較例品の光出力分布を示すグラフ図である。 7 is a graph showing the optical power distribution in the comparison example.

【符号の説明】 DESCRIPTION OF SYMBOLS

1,10 配線基板 21,22 LED 6a,6b 反射器 6 窪み 61,63 反射面 62 窪みの底部 P 封止樹脂 1,10 wiring board 21, 22 LED 6a, 6b reflector 6 recesses 61 and 63 reflecting surface 62 recess bottom P sealing resin

Claims (4)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 配線基板上に複数のLEDが一列のライン状に配置され、このLEDの配置ラインの両側に沿って、各LEDの側面からの出射光を配線基板前方に反射させる反射面を形成してなるLEDライン光源。 1. A plurality of LED on the wiring board are arranged in a row linear, along both sides of the arrangement line of the LED, a reflective surface for reflecting the wiring board forward light emitted from the side surface of each LED formed LED line light source comprising.
  2. 【請求項2】 配線基板にライン状の窪みを設け、その底部に複数のLEDが一列のライン状に配置されており、前記窪みの側壁面が各LEDの側面からの出射光を配線基板前方に反射させる反射面とされてなるLEDライン光源。 Wherein provided on the wiring board the recess of the line-shaped, its bottom a plurality of LED in are arranged in a row line-shaped, the wiring board forward outgoing light side wall surfaces of the recess from the side surface of each LED LED line light source formed by a reflection surface for reflecting the.
  3. 【請求項3】 配線基板が、絶縁金属基板である請求項1又は2記載のLEDライン光源。 3. A wiring board, according to claim 1 or 2 LED line light source according an insulated metal substrate.
  4. 【請求項4】 LEDと反射面部分が樹脂によって封止されている請求項1〜3いずれかに記載のLEDライン光源。 4. A LED line light source according to any one of claims 1 to 3 are sealed LED and reflecting surface portion by the resin.
JP9131750A 1997-05-06 1997-05-06 Led line light source Pending JPH10308536A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9131750A JPH10308536A (en) 1997-05-06 1997-05-06 Led line light source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9131750A JPH10308536A (en) 1997-05-06 1997-05-06 Led line light source

Publications (1)

Publication Number Publication Date
JPH10308536A true JPH10308536A (en) 1998-11-17

Family

ID=15065324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9131750A Pending JPH10308536A (en) 1997-05-06 1997-05-06 Led line light source

Country Status (1)

Country Link
JP (1) JPH10308536A (en)

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GB2349537A (en) * 1999-02-23 2000-11-01 Hewlett Packard Co Scanner using a solid state illumination source
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JP2006302803A (en) * 2005-04-25 2006-11-02 Toshiaki Inoue Light emitting diode tube lighting device
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DE102007002403A1 (en) * 2007-01-17 2008-08-21 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Illuminating arrangement for e.g. dome light of vehicle, has light decoupling surface turned away from semiconductor components, and side surfaces running perpendicular or transverse to light outlet surface
JP2011018871A (en) * 2009-07-08 2011-01-27 Paragon Semiconductor Lighting Technology Co Ltd Mounting structure of led having hollow region for positioning heat-conducting adhesive and method for manufacturing the same
JP2012529176A (en) * 2009-06-05 2012-11-15 クリー インコーポレイテッドCree Inc. Solid state light emitting devices
US8807785B2 (en) 2008-05-23 2014-08-19 Ilumisys, Inc. Electric shock resistant L.E.D. based light
US9006990B1 (en) 2000-02-11 2015-04-14 Ilumisys, Inc. Light tube and power supply circuit
US9353939B2 (en) 2008-10-24 2016-05-31 iLumisys, Inc Lighting including integral communication apparatus
US9395075B2 (en) 2010-03-26 2016-07-19 Ilumisys, Inc. LED bulb for incandescent bulb replacement with internal heat dissipating structures
US9398661B2 (en) 2008-10-24 2016-07-19 Ilumisys, Inc. Light and light sensor
US9510400B2 (en) 2014-05-13 2016-11-29 Ilumisys, Inc. User input systems for an LED-based light
US9574717B2 (en) 2014-01-22 2017-02-21 Ilumisys, Inc. LED-based light with addressed LEDs
US9585216B2 (en) 2008-10-24 2017-02-28 Ilumisys, Inc. Integration of LED lighting with building controls
US9807842B2 (en) 2012-07-09 2017-10-31 Ilumisys, Inc. System and method for controlling operation of an LED-based light
US10161568B2 (en) 2015-06-01 2018-12-25 Ilumisys, Inc. LED-based light with canted outer walls
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US6299329B1 (en) 1999-02-23 2001-10-09 Hewlett-Packard Company Illumination source for a scanner having a plurality of solid state lamps and a related method
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US9222626B1 (en) 2000-02-11 2015-12-29 Ilumisys, Inc. Light tube and power supply circuit
US9970601B2 (en) 2000-02-11 2018-05-15 Ilumisys, Inc. Light tube and power supply circuit
US9803806B2 (en) 2000-02-11 2017-10-31 Ilumisys, Inc. Light tube and power supply circuit
US9777893B2 (en) 2000-02-11 2017-10-03 Ilumisys, Inc. Light tube and power supply circuit
US9759392B2 (en) 2000-02-11 2017-09-12 Ilumisys, Inc. Light tube and power supply circuit
US9752736B2 (en) 2000-02-11 2017-09-05 Ilumisys, Inc. Light tube and power supply circuit
US9746139B2 (en) 2000-02-11 2017-08-29 Ilumisys, Inc. Light tube and power supply circuit
US9739428B1 (en) 2000-02-11 2017-08-22 Ilumisys, Inc. Light tube and power supply circuit
US10054270B2 (en) 2000-02-11 2018-08-21 Ilumisys, Inc. Light tube and power supply circuit
US9006990B1 (en) 2000-02-11 2015-04-14 Ilumisys, Inc. Light tube and power supply circuit
US9006993B1 (en) 2000-02-11 2015-04-14 Ilumisys, Inc. Light tube and power supply circuit
US9416923B1 (en) 2000-02-11 2016-08-16 Ilumisys, Inc. Light tube and power supply circuit
EP1280211A3 (en) * 2001-07-25 2006-09-20 Sanyo Electric Co., Ltd. Light emitting device with improved heat dissipation and its manufacturing method
JP2006302803A (en) * 2005-04-25 2006-11-02 Toshiaki Inoue Light emitting diode tube lighting device
JP2007200974A (en) * 2006-01-24 2007-08-09 Sanken Electric Co Ltd Semiconductor light emitting unit, manufacturing method thereof, and linear light source
US8579464B2 (en) 2007-01-17 2013-11-12 Osram Gesellschaft Mit Beschrankter Haftung Illumination arrangement, multiple light module, luminaire and use thereof
US8070315B2 (en) 2007-01-17 2011-12-06 Osram Gesellschaft mit beschränkter Haftung Illumination arrangement, multiple light module, luminaire and use thereof
DE102007002403B4 (en) * 2007-01-17 2016-03-03 Osram Gmbh Lighting arrangement, multiple light module, light and their use
DE102007002403A1 (en) * 2007-01-17 2008-08-21 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Illuminating arrangement for e.g. dome light of vehicle, has light decoupling surface turned away from semiconductor components, and side surfaces running perpendicular or transverse to light outlet surface
US8807785B2 (en) 2008-05-23 2014-08-19 Ilumisys, Inc. Electric shock resistant L.E.D. based light
US9635727B2 (en) 2008-10-24 2017-04-25 Ilumisys, Inc. Light and light sensor
US9398661B2 (en) 2008-10-24 2016-07-19 Ilumisys, Inc. Light and light sensor
US10036549B2 (en) 2008-10-24 2018-07-31 Ilumisys, Inc. Lighting including integral communication apparatus
US10176689B2 (en) 2008-10-24 2019-01-08 Ilumisys, Inc. Integration of led lighting control with emergency notification systems
US10182480B2 (en) 2008-10-24 2019-01-15 Ilumisys, Inc. Light and light sensor
US9353939B2 (en) 2008-10-24 2016-05-31 iLumisys, Inc Lighting including integral communication apparatus
US9585216B2 (en) 2008-10-24 2017-02-28 Ilumisys, Inc. Integration of LED lighting with building controls
US10342086B2 (en) 2008-10-24 2019-07-02 Ilumisys, Inc. Integration of LED lighting with building controls
JP2012529176A (en) * 2009-06-05 2012-11-15 クリー インコーポレイテッドCree Inc. Solid state light emitting devices
JP2011018871A (en) * 2009-07-08 2011-01-27 Paragon Semiconductor Lighting Technology Co Ltd Mounting structure of led having hollow region for positioning heat-conducting adhesive and method for manufacturing the same
US9395075B2 (en) 2010-03-26 2016-07-19 Ilumisys, Inc. LED bulb for incandescent bulb replacement with internal heat dissipating structures
US9807842B2 (en) 2012-07-09 2017-10-31 Ilumisys, Inc. System and method for controlling operation of an LED-based light
US9574717B2 (en) 2014-01-22 2017-02-21 Ilumisys, Inc. LED-based light with addressed LEDs
US10260686B2 (en) 2014-01-22 2019-04-16 Ilumisys, Inc. LED-based light with addressed LEDs
US9510400B2 (en) 2014-05-13 2016-11-29 Ilumisys, Inc. User input systems for an LED-based light
US10161568B2 (en) 2015-06-01 2018-12-25 Ilumisys, Inc. LED-based light with canted outer walls

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