JPH10295071A - Water-cooled high-voltage semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a water-cooled high-voltage semiconductor device in which leaking water can be introduced quickly and securely to a detector without spattering, and furthermore, water leaking from the neighborhood of a header tank also can be collected and detected. SOLUTION: A plurality of thyristor modules 3, in which thyristor devices 1 and accessorial circuits are incorporated, are stacked vertically with insulating supporting members 4 therebetween. The thyristor devices 1 are connected to water-cooled resistors 19 with internal pipings 17 and 18, through which cooling water is circulated. Header tanks 37a and 37b which supply and drain the cooling water are provided outside the respective thyristor modules 3. An external water supply/drain apparatus is connected to the header tanks 37a and 37b through external pipings 8. A water leakage detector 31 provided on the ground, external leaking water sinks 39 provided beneath the header tanks 37a and 37b and leaking water introducing means 32 and 35, which are provided between the external water sinks 39 and the water leakage detector 31 and introduce the leaking water collected in the external leaking water sinks to the water leakage detector 31 are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a water-cooled high-voltage semiconductor device applied to direct current transmission, interconnection of different frequencies, and stabilization of an electric power system. The present invention relates to the detection of water leakage of a water-cooled high-voltage semiconductor device using pure water, which is excellent in the above.

[0002]

2. Description of the Related Art In recent years, water-cooled high-voltage semiconductor devices used for direct current power transmission and the like have tended to increase in voltage and capacity, and have been used for cooling semiconductor elements, resistors, anode reactors and the like, which are main components thereof. A water cooling system using pure water is being adopted. This is because the water-cooled system is much better than the conventional oil or wind-based cooling system, which can reduce the size and capacity of the water-cooled high-voltage semiconductor device and reduce overall system loss. Becomes possible.

On the other hand, while realizing a high-voltage, large-capacity water-cooled high-voltage semiconductor device, there is a demand for a small-sized and space-saving semiconductor device. A multi-layered system is employed.
In such a water-cooled high-voltage semiconductor device, it is important to ensure the reliability of the electrical connection and the connection of the cooling circuit. Loose electrical connections or leakage from the cooling circuit connections will overheat the electrical circuit components or connections, causing a fire or series arc, and in the worst case, a fire and a long time before recovery. This can lead to costly and serious accidents. Therefore, it is necessary to reduce the number of electrical connection points and the number of connection points of the cooling circuit as much as possible, and to immediately detect water leakage generated from the connection point of the cooling circuit.

FIG. 22 is a front view showing an example of a conventional water-cooled high-voltage semiconductor device. In the figure, a plurality of thyristor modules 3 accommodating thyristor elements (not shown) and their peripheral electric circuit components are arranged in a horizontal plane while being electrically insulated from each other, and a plurality of thyristor modules 3 are arranged. The insulating support members 4 made of an insulating material such as FRP or insulators are stacked in multiple layers in the vertical direction while ensuring electrical insulation. In addition, the water-cooled high-voltage semiconductor device thus stacked in multiple stages is:
Reinforcing frames 5 are arranged every several steps to improve rigidity in consideration of improvement of seismic performance and convenience of unit transportation. Then, it is erected on an insulating stand 7 having a predetermined electric insulation performance, and is installed so as to have a predetermined electric insulation performance with respect to the ground.

One long cylindrical header tank 37a, 37b is provided for each thyristor module 3 between opposing sides between thyristor modules 3 adjacent in the horizontal direction. Header tank 37
a, 37 b are arranged in parallel to one side of the thyristor module 3. Cooling water of pure water is stored inside the header tanks 37a and 37b. The header tanks 37a and 37b are connected to internal piping in the thyristor module 3 by piping 37c.

On the other hand, a header tank 37e is also provided on the reinforcing frame 5. And each header tank 37a, 37
The b and 37e are connected to an external water supply and drainage device (not shown) disposed on the ground by a Teflon pipe 8 which is an external pipe, respectively, and supplied with cooling water.

FIG. 23 is an electric circuit diagram in the conventional thyristor module 3. In the figure, a plurality of thyristor elements 1 are connected in series, and a saturable anode reactor 9 is connected to both ends. Each thyristor element 1 is connected with a DC voltage dividing resistor 10 for equalizing the voltage sharing of the thyristor element 1, and further includes a snubber resistor 11 for suppressing electric stress applied to the thyristor element 1. A snubber circuit 13 including a snubber capacitor 12 is connected. The DC voltage dividing resistor 10 and the snubber resistor 11 are water-cooled resistors that are cooled by flowing cooling water therein.

FIG. 24 shows, for example, Japanese Patent Application Laid-Open No. 61-548.
No. 76, the conventional thyristor module 3
FIG. In the figure, behind the thyristor module 3 (upper side in FIG. 24), long cylindrical header tanks 37a and 37b are arranged in parallel and adjacent to one side of the thyristor module 3. The header tanks 37a and 37b are connected to internal piping in the thyristor module 3 by piping 37c, respectively. The cooling water in the header tank 37a is supplied into the thyristor module 3 through a pipe 37c, and after cooling the thyristor element in the thyristor module 3 and its peripheral electric circuit components, returns to the header tank 37b.

In the thyristor module 3, first, a plurality of thyristor elements 1 and a plurality of cooling fins 1 are provided.
4 and the thyristor stack 1 are connected alternately.
5 are formed. The thyristor stack 15 is arranged on the front side (the lower side in FIG. 24) of the thyristor module 3. The cooling fin 14 cools the thyristor element 1 through cooling water. Each cooling fin 14 is connected to each other by a Teflon pipe 16 having high insulation performance, and two cooling fins 14 arranged at both ends are connected to a cooling water supply pipe 17 and a cooling water drain pipe 18 which are internal pipes. Each is connected by a tube 16. Each cooling fin 14
The cooling water is supplied from a cooling water supply pipe 17, and the cooling water is drained to a cooling water drain pipe 18 to circulate the cooling water inside.

A DC voltage dividing resistor 10 and a snubber resistor 1
A plurality of the water-cooled resistors 19 composed of 1 are connected to form a water-cooled resistor row 48. Each water-cooled resistor 19 is connected to each other by a Teflon pipe 20 having high insulation performance, and both ends are connected to a cooling water supply pipe 17 and a cooling water drain pipe 18 by a Teflon pipe 16, respectively. Each resistor is supplied with cooling water from a cooling water supply pipe 17, drains the cooling water to a cooling water drain pipe 18, and circulates internal cooling water. The water-cooled resistor row 48 is arranged substantially at the center of the thyristor module 3.

Further, a plurality of snubber capacitors 12
Are arranged in a row to form a snubber capacitor row 21. One water-cooled supersaturated anode reactor 9 is disposed at each end of the snubber capacitor row 21. The two supersaturated anode reactors 9 are connected to each other by a Teflon pipe 16 having high insulation performance, and both are connected to a cooling water supply pipe 17 and a cooling water drain pipe 18. The two supersaturated anode reactors 9 are supplied with cooling water from a cooling water supply pipe 17, discharge the cooling water to a cooling water drain pipe 18, and circulate the cooling water inside. The snubber capacitor row 21 and the supersaturated anode reactor 9 are:
It is arranged behind the thyristor module 3 (upper side in FIG. 24). An orifice or the like is inserted into each water passage through which the cooling water is circulated through the thyristor stack 15, the water cooling resistor row 48, and the supersaturated anode reactor 9, so that a predetermined flow rate is supplied to each cooling component. .

Thyristor stack 15, water-cooled resistor array 4
8, the snubber capacitor row 21 and the supersaturated anode reactor 9 are connected to each other using an insulating structure material such as an insulating plate, and are secured to the thyristor module 3 with a required insulating distance from the bottom plate 23.

In the water-cooled high-voltage semiconductor device having such a configuration, if water leaks from any one of the cooling circuits in the thyristor module 3, parts overheating occurs due to a decrease in the amount of cooling water. In addition, the insulation performance of the insulating member is reduced due to the water leakage. In the worst case, a fire occurs, leading to a large accident.

FIG. 25 is a conceptual diagram of a conventional water leak detecting device for a water-cooled high-voltage semiconductor device described in Japanese Patent Publication No. 2-18020. In the figure, a bottom plate 23 of the thyristor module 3 is provided with a water leakage collecting part 22 formed in a concave shape for collecting the internal water leakage. In the water leakage collecting part 22, the cooling fin 14, the water cooling resistor row 48, the supersaturated anode reactor 9, the cooling water supply pipe 17, the cooling water drain pipe 18, or the Teflon pipes 16 and 20 housed in the thyristor module 3 are provided. Leaks are collected.

Reference numeral 24 denotes an optical signal generator for generating an optical signal used for water leakage detection, which is connected to the thyristor element 1 and driven by a current flowing through the DC voltage dividing resistor 10 or the snubber circuit 13. Reference numeral 26 denotes a water leakage detecting unit provided in the water collecting unit 22. Reference numeral 27 denotes an optical signal receiving unit installed on the outside ground. The optical signal generator 24, the water leak detector 26, and the optical signal receiver 27 are connected to each other by an optical fiber 25.

The optical signal generated by the optical signal generator 24 is
The light passes through the water leak detector 26 and reaches the optical signal receiver 27. The water leak detector 26 changes this optical signal when a water leak exists. The optical signal receiving section 27 detects a change in the optical signal to detect water leakage. The optical fiber 25 needs to have the same insulation performance as an insulating material such as FRP, in addition to transmitting an optical signal.

Next, the operation will be described. Cooling water is sent from an external water supply / drainage device disposed on the ground to the thyristor module 3 via a Teflon pipe and a header tank (not shown). Then, a required amount of cooling water is supplied to each cooling water passage in the thyristor module 3. If water leaks in the thyristor module 3, the water leaks along the bottom plate 23 and is collected in the water leak collecting part 22. At this time, a water leak is detected by a water leak detecting unit 26 provided in the water leak collecting unit 22, and the detection signal is transmitted to an optical signal receiving unit 27 by an optical fiber 25. The optical signal receiving unit 27 reports the occurrence of water leakage to the outside. Then, a predetermined treatment is performed correspondingly.

FIG. 26 is a conceptual diagram showing another example of a conventional water-cooled high-voltage semiconductor device. In the figure, reference numeral 29 denotes a water leakage outlet for perforating the bottom plate 23 of the thyristor module 3 to discharge water generated in the thyristor module 3 to a lower stage. Reference numeral 30 denotes a funnel for collecting water leakage generated in the upper thyristor module 3 and further guiding the water leakage downstairs. Outlet 30a of funnel 30
Is disposed at the center of the water leakage outlet 29 with a predetermined gap from the water leakage outlet 29. Reference numeral 31 denotes a water leak detection device installed on the ground.

Next, the operation will be described. The water leak generated in the thyristor module 3 is transmitted from the bottom plate 23 of the thyristor module 3 and drops from the water leak outlet 29. The leaked water is received by the funnel 30 of the thyristor module 3 downstairs. The water leak received by the funnel 30 is dripped from the water leak outlet 29 to the thyristor module 3 further downstairs, and this is repeated. And finally, it is detected by the water leakage detecting device 31 provided on the ground. The water leak detection device 31 reports that the water leak has occurred to the outside, and a predetermined measure is taken in response thereto.

FIG. 27 is an enlarged view of a portion D in FIG. In the figure, header tanks 37a, 37b
Are connected to the Teflon tube 8 extending in the vertical direction by cap nuts 38, respectively. And the header tank 37
Water leakage from the a and 37b mainly occurs from the connection between the Teflon tube 8 and the cap nut 38.

[0021]

Since the conventional water leakage detecting device for a water-cooled high voltage semiconductor device is constructed as described above, in the prior art shown in FIG. The optical fiber 25 for transmitting to the signal receiving unit 27 has to be installed. And the optical fiber 25
Are required to have insulation performance equivalent to that of an insulating material such as FRP or the like, which is expensive and causes an increase in cost of the apparatus. In addition, there is a problem that the reliability of the system is reduced because the number of parts increases.

Further, in the conventional example shown in FIG. 26, since the water leak is guided to the ground by using the funnel 30 provided on the thyristor module 3 and the reinforcing frame 5, when the funnel drops from the funnel 30 to the funnel 30 downstairs, the water leak occurs. However, there is a problem that water leaks to other parts of the apparatus, and the water does not reach the ground and the water leak cannot be detected. Furthermore, since the bottom plate 23 of the thyristor module 3 is flat, there is a problem that it takes time for the water leakage to reach the water leakage outlet 29.

Further, as shown in FIG. 27, in the header tanks 37a and 37b provided adjacent to the thyristor module 3, water leakage also occurs from the cap nut 38 used for connection with the Teflon pipe 8. For this leak, no leak can be detected. Further, there is a problem that water leakage from the header tanks 37a and 37b reaches other parts of the apparatus.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is possible to quickly and surely lead a detection device without using expensive components such as an optical fiber and without scattering water leakage. It is another object of the present invention to provide a water-cooled high-voltage semiconductor device capable of collecting and detecting water leakage from the vicinity of a header tank outside a thyristor module.

[0025]

According to a first aspect of the present invention, there is provided a water-cooled high-voltage semiconductor device in which a plurality of thyristor modules accommodating a plurality of thyristor elements and their attached circuits are vertically arranged on the ground via insulating support members. Water cooling parts such as thyristor elements in each thyristor module and water cooling resistors in an attached circuit are connected by internal piping for circulating cooling water, and cooling for cooling the thyristor elements and water cooling resistors through the internal piping. In a water-cooled high-voltage semiconductor device in which a header tank for supplying and discharging water is disposed horizontally outward of each thyristor module, and an external water supply and drainage device is connected to the header tank via an external pipe, the header tank is provided on the ground. Water leak detection device, and each of the header tanks are installed below each to collect water leakage from the header tank. And external leakage receiving, provided between an external leak receiving and leak detection apparatus, and a leakage induction means induce leakage that is collecting the received external leak water leakage detector.

In the water-cooled high-voltage semiconductor device according to the second aspect, the thyristor stack in which a plurality of thyristor elements and cooling fins are alternately arranged and connected, and the thyristor stack in which a plurality of water-cooled resistors are connected are arranged in a column direction. Thyristor modules each containing a row of water-cooled resistor arrays arranged in parallel with each other as opposed to each other are stacked vertically on an earth via an insulating support member, and the cooling fins and the water-cooled resistor are externally mounted. In the water-cooled high-voltage semiconductor device that circulates cooling water supplied from the thyristor stack and the water-cooled resistor row, the pipe is run in parallel and connected to the thyristor stack and the water-cooled resistor row via joints, respectively. It has a plurality of branch pipes, an internal pipe for circulating cooling water, a water leak detection device provided on the ground, and a An internal water leakage receiver for collecting water leakage from a hand, and a water leakage guiding means provided between the internal water leakage receiver and the water leakage detection device for guiding the water collected in the internal water leakage receiver to the water leakage detection device are provided. .

According to a third aspect of the present invention, there is provided a water-cooled high-voltage semiconductor device, wherein a plurality of thyristor elements and cooling fins are alternately arranged and connected, and a plurality of water-cooled resistors are connected and the thyristor stack is arranged in a column direction. Thyristor modules containing water cooling resistor rows arranged side by side with each other as parallel are stacked vertically on the ground via insulating support members, and cooling fins and water cooling resistors are cooled. A header tank is connected by an internal pipe for circulating water, and a header tank for supplying and discharging cooling water for cooling the thyristor element and the water-cooled resistor through the internal pipe is disposed outside each thyristor module in the horizontal direction. Is connected to the header tank via external piping, the internal piping is thyristor A plurality of branch pipes that are piped in parallel between the stack and the water-cooled resistor row, and are connected to the thyristor stack and the water-cooled resistor row via joints, respectively, and a water leakage detection device provided on the ground. , An internal leak receiver disposed below the joint to collect water leakage from the joint, an external leak receiver disposed below the header tank to collect water leakage from the header tank, an internal leak receiver and water leakage There is provided a water leakage guiding means provided between the detection devices and between the external water leakage receiver and the water leakage detection device, and guiding the water collected by the internal water leakage receiver and the external water leakage receiver to the water leakage detection device.

In the water-cooled high-voltage semiconductor device according to the fourth aspect, each of the external leakage receivers has a water leakage drain port at an end thereof, and the external water leakage receptacle is inclined so that water leaks toward the water leakage drain port. The leak guiding means is provided at the leak drain.

In the water-cooled high-voltage semiconductor device according to the fifth aspect, each thyristor module has a water leakage drain at an end thereof, and the internal water leakage receiver is disposed so as to be inclined so that water leaks toward the water leakage drain. The leakage guidance means is provided at the leakage drainage port.

In the water-cooled high-voltage semiconductor device according to the sixth aspect, each thyristor module has a water leakage drain at an end thereof, and the internal water leakage receiver and the external water leakage receiver allow the water to flow toward the water leakage drain. The leak guiding means is disposed at an angle, and is provided at the leak drain.

In the water-cooled high-voltage semiconductor device according to the present invention, each of the external leak receivers has a leak outlet at an end thereof, and the internal leak receiver and the external leak receiver allow the leak water to flow toward the leak drain port. The water leakage guiding means is provided at the water leakage drain port.

[0032] In the water-cooled high-voltage semiconductor device according to claim 8, each of the water leakage drains is provided on the same vertical line, and the water leakage inducing means is provided on the same vertical line as each of the water leakage drains.
There are a plurality of funnels for sequentially guiding water discharged from the upper water leakage drainage port to the lower water leakage drainage port, and each funnel is provided with a rectifying device.

In the water-cooled high-voltage semiconductor device according to the ninth aspect, the water leakage inducing means is connected to each water leakage discharge port by a water leakage drain pipe branch and is disposed along the thyristor module stacking direction. is there.

In the water-cooled high-voltage semiconductor device according to the tenth aspect, the surface of the internal water leakage receiver is made uneven.

In the water-cooled high-voltage semiconductor device according to the eleventh aspect, the header tank is connected to the external piping with a cap nut, and each cap nut is covered with a water leakage prevention cap for preventing water from scattering.

In the water-cooled high-voltage semiconductor device according to the twelfth aspect, the header tank is connected to the external piping with a cap nut, and the cap nut is covered with a water leakage preventing wall for preventing water from scattering.

[0037]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. FIG. 1 is a schematic view of a water-cooled high-voltage semiconductor device according to the present invention. FIG. 2 is a plan view of the thyristor module, and FIG. 3 is a cross-sectional view of the thyristor module. FIG. 4 is an enlarged view of a portion A in FIG. FIG. 5 is an enlarged view of a connection portion between the header tank and the Teflon tube. FIG. 6 is a system diagram showing an outline of a cooling water channel.

In FIGS. 1 to 3, a thyristor module 3 containing a thyristor element 1 and a peripheral electric circuit component is electrically connected to a thyristor element 3 by an insulating support member (not shown) made of an insulating material such as FRP or insulator, as in the conventional example. The layers are stacked in multiple layers in the up-down direction while the insulation is secured.
In consideration of the improvement of seismic performance and the convenience of unit transportation, reinforcing frames 5 are further arranged at every several stages of the thyristor module 3 to increase rigidity.

Inside the thyristor module 3, a plurality of thyristor elements 1 are alternately arranged and connected to a plurality of cooling fins 14 to form a thyristor stack 15. The cooling fin 14 cools the thyristor element 1 by passing cooling water through it. Thyristor stack 1
5 is disposed on the front side (the lower side in FIG. 2) of the thyristor module 3 as in the conventional case. In addition, a plurality of water-cooled resistors 19 including a DC voltage dividing resistor 10 and a snubber resistor 11 are connected to form a water-cooled resistor array 48. The water-cooled resistor row 48 is arranged substantially at the center of the thyristor module 3 as in the related art. Furthermore, a plurality of snubber capacitors 12 are arranged in a row to form a snubber capacitor row 21. Water-cooled supersaturated anode reactors 9 are arranged on both sides of the snubber capacitor row 21. Snubber capacitor row 21
The supersaturated anode reactor 9 is arranged behind the thyristor module 3 (upper side in FIG. 2). The thyristor stack 15, the water-cooled resistor row 48, the snubber capacitor row 21, and the supersaturated anode reactor 9 are connected by using an insulating structure material such as an insulating plate, and furthermore, a required insulation distance on the tray-like bottom plate 23 of the thyristor module 3 is required. Secured and secured.

Outside the one side of the thyristor module 3, a long cylindrical header tank 37 is provided as in the conventional case.
a, 37 b are arranged in parallel with the side of the thyristor module 3. Cooling water of pure water is stored inside the header tanks 37a and 37b. The header tanks 37a and 37b are connected to internal piping in the thyristor module 3 by piping 37c. The cooling water in the header tank 37a is supplied into the thyristor module 3 through a pipe 37c, and after cooling the thyristor element in the thyristor module 3 and its peripheral electric circuit components, returns to the header tank 37b.

As shown in FIG. 2, the header tank 37
A pipe 37c extending from one end surface of the thyristor module 3 extends along the side wall of the thyristor module 3, and is a cooling water supply pipe as an internal pipe near the front of the thyristor module 3 with the side wall of the thyristor module 3 as a boundary. 17 is connected. Then, inside the thyristor module 3, the cooling water supply pipe 17 advances along the inner wall from the connection with the pipe 37 c to the rear of the thyristor module 3, and then at a position close to the inner wall. One branch extends along the inner wall as it is and is connected to the supersaturated anode reactor 9 on one side, and the other extends in parallel from the branch position between the row of the water-cooled resistor row 48 and the row of the thyristor stack 15 in both rows. And near the inner wall on the opposite side,
The thyristor module 3 is bent in the rear direction, extends along the inner wall as it is, and is connected to the supersaturated anode reactor 9 on the other side.

On the other hand, the cooling water drain pipe 18 which is an internal pipe
Are arranged substantially line-symmetrically with the cooling water supply pipe 17.
That is, the cooling water drainage pipes 18 are respectively drawn out of the two supersaturated anode reactors 9 toward the front of the thyristor module 3, and finally, after the two are combined into one, the cooling water drainage pipe 18 is separated from the side wall of the thyristor module 3. Is connected to the pipe 37c extending from the header tank 37b, but is connected to the supersaturated anode reactor 9 on the opposite side of the connection between the two cooling water drain pipes 18 and the inner pipe 37c. The cooling water drain pipe 18 passes between the water cooling resistor row 48 and the thyristor stack 15 in parallel with both rows and traverses the thyristor module 3 from end to end.

Then, the above-described cooling water supply pipe 1 passing between the row of the water cooling resistor rows 48 and the row of the thyristor stacks 15
From 7, a large number of branch pipes, Teflon pipes 16 a, branch and extend, and are connected to the cooling fins 14, respectively. Also, from the above-mentioned cooling water drain pipe 18 passing between the row of the water-cooling resistor rows 48 and the row of the thyristor stacks 15,
Teflon pipes 16a, which are a large number of branch pipes, branch and extend, and are connected to a plurality of water-cooled resistors 19, respectively. Further, each of the water-cooling resistors 19 and the cooling fins 14 are connected one-to-one by a Teflon tube 16a.

The cooling water supply pipe 1 traversing in parallel between the rows of the water cooling resistor rows 48 and the rows of the thyristor stacks 15 in parallel with both rows.
Below the pipe 7 and the cooling water drain pipe 18, a rectangular basin-shaped internal leak receiver 34 is provided. The bottom of the internal leak receiver 34 is formed in a wavy or uneven shape. The internal leak receiver 34 is attached so as to be inclined so that the thyristor stack 15 side is lowered.

On the other hand, the bottom plate 23 of the thyristor module 3
Is provided with a water leakage discharge port 29 as in the prior art. A drain pipe 34 a extends from the front end of the inclined side of the internal leak receiver 34 on the lower side, and is connected to the leak outlet 29. The drain pipe 34a is connected to the leak outlet 2
It is arranged so that the 9 side becomes lower. Leakage outlet 29
A funnel 32, which is a water leakage guidance means, is disposed above. The outlet 32a at the tip of the funnel 32 is covered with a wire mesh 33 which is a rectifying device formed in a hemispherical shape. The funnel 32 is arranged such that the leading outlet 32a is located at the center of the leak outlet 29, and the outlet 32a is located at the leak outlet 2
9 so as to leave a predetermined gap.

A funnel 35 having substantially the same shape as the funnel 32 is also provided on the reinforcing frame 5. A hemispherically-shaped wire net 33 as a rectifying device is also attached to the outlet 35a at the tip of the funnel 35. The funnel 35 is further provided with a wire mesh 36 which is a rectifying device formed in a slightly smaller conical or hemispherical shape inside the upper conical portion. The funnel 32 provided on each thyristor module 3 and the funnel 35 provided on the reinforcing frame 5 are arranged so as to be located on the same vertical line.

Further, below the header tanks 37a and 37b and below the header tank 37e, a rectangular tray-shaped external leak receiver 39 is provided. External leak receiver 3
A drain pipe 39 a also extends from 9 and is connected to the water leakage discharge port 29. The drain pipe 39a is disposed so that the leak outlet 29 side is lower. The external leak receiver 39 and the drain pipe 39 a are inclined toward the leak outlet 29. In general, the case potentials of the plurality of connected snubber capacitors 12 are different from each other. However, if a potential difference is generated between the case potential of the snubber capacitor 12 and the drain pipe 39a passing in the vicinity thereof, the electric field becomes severe, and harmful partial discharge occurs. Therefore, it is desirable that the case potential of the snubber capacitor 12 and the potential of the drain pipe 39a be the same. Therefore, the drain pipe 39a is extended from the central portion of the external leak receiver 39 so that the case potential of the snubber condenser 12 and the drain pipe 39a have the same potential, and traverses substantially the central portion of the thyristor module 3 so that the water outlet 29 Extending to

As shown in FIG. 4, the cooling water supply pipe 17
A large number of Teflon tubes 16a branching from and extending from the cooling fins 14 are connected to the cooling fins 14 by cooling fin joints 14a. The Teflon pipe 16a extending from the cooling water drain pipe 18 is connected to the water cooling resistor 19 by a water cooling resistor joint 19a which is a joint. Further, a Teflon tube 16a connecting the cooling fin 14 and the water cooling resistor 19 is provided.
Are connected by a cooling fin joint 14a, which is a joint, and a water-cooled resistor joint 19a. The internal water leakage receiver 34 provided below the cooling water supply pipe 17 and the cooling water drain pipe 18 is
The range in which the plurality of cooling fin joints 14a and the water-cooled resistor joints 19a are provided is calculated from the range projected vertically downward.
It has an area widened by a predetermined width. That is, the width is large enough to capture the water leaking from the cooling fin joint 14a and the water-cooled resistor joint 19a.

As shown in FIG. 5, each header tank 3
7a and 37b are connected to a Teflon pipe 8 as an external pipe by a cap nut 38. On the head of the cap nut 38,
Water leakage prevention cap 3 that reduces electric field and prevents water leakage
8a is mounted. The water leakage prevention cap 38a has a substantially hemispherical shape, and has a hole at the center thereof through which the Teflon tube 8 penetrates. The water leakage prevention cap 38a penetrates the Teflon tube 8 and covers the connection portion of the cap nut 38 like a cap. The water leakage prevention cap 38a is made of a metal and is divided into two parts. The cap 38a is covered from both sides so as to sandwich the cap nut 38, and is attached by screwing or welding.

FIG. 6 is a system diagram showing an outline of a cooling water channel. As shown in the figure, each header tank 37a, 3
Reference numeral 7b is connected to an external water supply and drainage device (not shown) provided on the ground by a Teflon pipe 8 as an external pipe. Each of the header tanks 37a and 37b needs to be supplied with cooling water for reducing a predetermined amount of heat. For example, since the cooling water supplied to the upper header tank 37a passes through the lower header tank 37a, the flow rate needs to be increased accordingly. For this reason, the number of Teflon tubes 8 connected to the header tanks 37a and 37b increases as one goes down.

FIG. 7 is a diagram showing the details of the wire net 33 provided on the funnel 32. As shown in FIG.
A wire mesh 33 which is a rectifier is provided at the discharge port 32a at the two ends. The wire net 33 is made of a metal net or a porous plastic or ceramic material, is formed in a spherical or conical shape, and is attached so as to cover the outlet 32a. The wire mesh 33 attached to the outlet of the funnel 35 is similar.

Next, the operation will be described. The cooling water is supplied from an external water supply and drainage device (not shown) installed on the ground to the header tank 37a provided for each thyristor module 3 via the Teflon pipe 8. The cooling water supplied to the header tank 37a cools each electronic component in the thyristor module 3 and returns to the header tank 37b. At this time, water leakage often leaks from the connection between the cooling fin joint 14a and the water-cooled resistor joint 19a in the thyristor module 3. Furthermore, it leaks from the connection between the cap nut 38 outside the thyristor module 3 and the Teflon tube 8.

Cooling fin joint 14a and water-cooled resistor joint 1
The water leaking from 9a is captured by the internal water leak receiver 34, flows quickly along the slope, is guided to the drain pipe 34a, and falls from the water leak outlet 29. In addition, the water leaking from the cap nut 38 is captured by the external water leak receiver 39, guided by the drain pipe 39 a, and then falls from the water leak outlet 29. The water leaked from the water leak outlet 29 is guided to the funnel 32 and the funnel 35, and eventually reaches the water leak detection device 31 provided on the ground.

In the water-cooled high-voltage semiconductor device configured as described above, the cooling water supply pipe 17 and the cooling water drain pipe 18
Is arranged between the rows of the water-cooled resistor rows 48 and the rows of the thyristor stacks 15 so as to be parallel to the respective rows, and the Teflon tubes 16 extending from the parallel portions.
a, the cooling fin 14, and the water-cooled resistor 19 are connected by a cooling fin joint 14a and a water-cooled resistor joint 19a. That is, the cooling fin joint 14a and the water-cooled resistor joint 19a are arranged so as to be within a small range as much as possible. And below the area, there is an internal leak receiver 3
4 are provided. Therefore, the internal leak receiver 34 is
It can be small and can efficiently capture leaks.

The inner leak receiver 34 and the outer leak receiver 39 are inclined in the direction of discharging the leak water. Therefore, the water leakage is caused on the internal water leakage receiver 34 or the external water leakage receiver 3
9 and moves to the water leakage discharge port 29 in a short time without staying on it. Further, since the bottom surface of the internal water leakage receiver 34 is formed in a corrugated shape or a concave / convex shape toward the water leakage drainage port, the water leakage does not accumulate further.

Further, an external leakage receiver 39 is provided below the thyristor module 3 below the header tanks 37a and 37b. Therefore, water leakage from the header tanks 37a and 37b can also be captured. In particular, a water leakage prevention cap 38a is provided on the head of the cap nut 38 where water leakage occurs, which both reduces the electric field and prevents water leakage. Therefore, the cap nut 38
From the connection between the Teflon tube 8 and the Teflon pipe 8 is once trapped inside the water leakage prevention cap 38a and then slowly falls from the gap. Water is collected at 39.

Further, the outlets 3 of the funnels 32, 35
Since the wire mesh 33 is attached to 2a and 35a, when water leaks from the funnels 32 and 35, the water does not scatter. Furthermore, since the wire mesh 36 is provided inside the upper conical portion of the funnel 35, when water leaks from above, it does not splash and splash.

Embodiment 2 FIG. 8 is a schematic diagram showing another example of the water-cooled high-voltage semiconductor device of the present invention. FIG. 9 is a plan view of the thyristor module, and FIG. 10 is a cross-sectional view of the thyristor module. Each header tank 37a, 37
A rectangular tray-shaped external leak receiver 39 is provided below b in the same manner as in the first embodiment. A water leakage outlet 39b is formed at an end of the external water leakage receiver 39. The external leak receiver 39 is disposed to be inclined toward the leak outlet 39b.

A funnel 32, which is a means for inducing water leakage, is provided above the water leakage outlet 39b. The outlet 32a at the tip of the funnel 32 is covered with a wire mesh 33 which is a rectifying device formed in a hemispherical shape. The funnel 32 is positioned such that the outlet 32a at the tip is located at the center of the water outlet 39b.
Further, the discharge port 32a is disposed so as to open a predetermined gap from the water leakage discharge port 39b. The funnel 35 provided on the reinforcing frame 5 is disposed so as to be located directly below the funnel 32 correspondingly.

The cooling water supply pipe 1 traversing between the rows of the water-cooling resistor rows 48 and the rows of the thyristor stacks 15 in parallel to both rows.
Below the cooling water drain pipe 7 and the cooling water drain pipe 18, a rectangular tray-shaped internal leak receiver 41 is provided. The bottom of the internal leak receiver 41 is formed in a wavy or uneven shape. Contrary to the first embodiment, the internal water leakage receiver 41 is attached so as to be inclined such that the side of the water cooling resistor row 48 is lowered. A drain pipe 41a is provided to be inclined from the rear end of the inner leak receiver 41 on the lower side, and the outer leak receiver 3 is provided.
9 are connected to the leak water outlet 39b. Other configurations are the same as those of the first embodiment.

Next, the operation will be described. Cooling fin joint 14
a and the water leaking from the water-cooled resistor joint 19a are captured by the internal water leak receiver 41, flow along the slope, and drain pipe 41
The water is guided to a and collected in the external leak receiver 39. Water leaked from the header tanks 37a and 37b is captured by the external water leak receiver 39. The water leak collected in the external water leak receiver 39 falls from the water leak outlet 39b, is guided to the funnel 32 and the funnel 35, and eventually reaches a water leak detection device provided on the ground.

In the water-cooled high-voltage semiconductor device configured as described above, the funnel 32 serving as the water leakage inducing means is disposed outside the thyristor module 3. Therefore, when water is dropped from the funnel 32 to the lower funnel 32, and when the water is dropped from the funnel 32 to the funnel 35,
Even if water leaks, the electric components in the thyristor module 3 will not be wet.

Embodiment 3 FIG. 11 is a schematic diagram showing another example of the water-cooled high-voltage semiconductor device of the present invention. In the present embodiment, a rectangular tray-shaped external leak receiver 39 is disposed below each of the header tanks 37a and 37b, as in the second embodiment. On the side of the external leak receiver 39, a leak drainage pipe 44, which is a leak guiding means extending along the stacking direction of the thyristor modules 3, is provided. And a water outlet 39b of the external water receiver 39.
Are connected to the water leakage drainage pipe 44 at the water leakage drainage pipe branch 44a. On the other hand, a water leakage detection device (not shown) is provided on the ground at the lower end of the water leakage drainage pipe 44.

The water leakage drainage pipe 44 is made of, for example, Teflon having a required insulating performance or an insulating pipe having a high water-repellent inner surface. A filter 45 made of, for example, a nonwoven fabric or a mesh is attached to a connection portion between the water leakage discharge port 39b and the water leakage drain pipe branch 44a in order to prevent mixing of conductive foreign matter and prevent the inner surface of the water leakage drain pipe 44 from being stained. ing. Other configurations are the same as those of the second embodiment.

In the water-cooled high-voltage semiconductor device configured as described above, a water leakage drainage pipe 44 extending in the stacking direction of the thyristor modules 3 is provided. The water reaches the water leak detection device provided on the ground through the water leak drain pipe 44. Therefore, the water leak that has entered the water leak drain pipe 44 reaches the water leak detection device without being scattered thereafter. As a result, no other electrical components are wetted.

Embodiment 4 FIG. 12 is a schematic diagram showing another example of the water-cooled high-voltage semiconductor device of the present invention. FIG.
13 is an enlarged view of a portion B in FIG. In the present embodiment, the cap nuts 38 disposed above the header tanks 37a and 37b are disposed horizontally so that the conventional cap nuts 38 are disposed vertically. . Further, the cap nut 38 connected to the upper side is disposed so as to be located on a vertical extension of the cap nut 38 connected to the lower side. That is, the two cap nuts 38 are arranged on the same vertical line. Also, the two cap nuts 38
It is arranged so as to be as close as possible. To place the upper cap nut 38 in such a position, the pipe connecting the header tanks 37a, 37b and the upper cap nut 38 is elongated and bent outwardly at a right angle.

On the side of the two cap nuts 38, 38 opposite to the thyristor module 3, a water receiver 51, which is a water leakage prevention wall made of metal, is attached so as to penetrate the Teflon tube 8. . The water receiver 51 is an external water receiver 39.
It is arranged above. Water leaking down the water receiver 51 is received by the external water receiver 39. The upper part of the water receiver 51 is bent toward the thyristor module 3, and the tip is bent downward so as to cover the cap nut 38.

FIG. 14 is a view of the water receiver 51 as viewed from the direction of arrow C in FIG. FIG. 15 is a perspective view of the water receiver 51. As shown in FIG. 14 and FIG.
It is composed of two members divided into right and left by a vertical dividing line. In the division, two Teflon tubes 8, 8
A notch for penetrating through is formed. The two members thus formed are attached so as to sandwich the Teflon tubes 8 from the left and right. Other configurations are the same as those of the first embodiment.

With such a configuration, water leakage scattered from the cap nut 38 is prevented by the water receiver 51 and does not scatter outside. Then, the water that has fallen on the water receiver 51 is collected in the external water receiver 39. Then, after being guided by the drain pipe 39a, it falls from the water leakage discharge port 29. The water leaked from the water leak outlet 29 is guided to the funnel 32 and the funnel 35, and eventually reaches the water leak detection device 31 provided on the ground.

In the water-cooled high-voltage semiconductor device thus configured, water leaking from the cap nut 38 to the outside is blocked by the water receiver 51 and collected in the external water receiver 39. The cap nut 38 disposed above the header tanks 37a and 37b is connected to the thyristor module 3
Since the water is moved away from the thyristor module 3, the water scattered toward the thyristor module 3 hardly falls on the electric components. Further, since the two cap nuts 38 are arranged on the same vertical line, the water receiver 51 covering the two cap nuts 38 can be made small. Further, since the water receiver 51 is made of metal, it has an effect of reducing the electric field.

Embodiment 5 FIG. 16 and 17 are side views of a funnel and a rectifier showing another example of the water-cooled high-voltage semiconductor device of the present invention. FIG. 18 is a perspective view of the example of FIG. In the funnel 32 shown in FIG. 16, a rectifying device, which is a rectifying device and is formed by laminating a plurality of nets 46 made of metal or an insulator, is attached so as to close the water leakage drain port 29. .

In the water-cooled high-voltage semiconductor device having such a configuration, the speed is reduced by the net 46 when water is dropped from above. Then, it does not violently collide with the edge of the water leakage drainage port 29 and does not rebound and scatter.

In the funnel 32 shown in FIGS. 17 and 18, the tip of the drain pipe 39a connected to the water leakage outlet 29 in the first embodiment is connected to the water leakage outlet 29 and the funnel 3
2 and a drain pipe 39a
A net 47 made of a metal or an insulator, which is a rectifying device, is attached to the tip of the device. In addition, the net 47 may be attached to the tip of the drain pipe 41a extending from the internal leak receiver 41.

In the water-cooled high-voltage semiconductor device having such a configuration, the net 47 eliminates the influence of the surface tension and the initial velocity direction by the rectifying function when the water dripping from the funnel 32 is drained from the funnel. Can fall vertically.

Embodiment 6 FIG. 19 to 21 are sectional views of a funnel showing another example of the water-cooled high-voltage semiconductor device of the present invention. In the funnels 32 and 35 shown in FIG. 19, for example, hemispherical or conical projections (projections) are irregularly provided on the conical inner surface of the upper part of the funnel. A wire mesh 33 similar to that of the first embodiment is attached to the tip.

In the funnels 32 and 35 shown in FIG. 20, for example, hemispherical or conical dents (recesses) are irregularly provided on the conical inner surface of the upper part of the funnel.
A wire mesh 33 similar to that of the first embodiment is attached to the tip.

In the funnels 32 and 35 shown in FIG. 21, for example, a texture pattern is randomly engraved on a conical inner surface of the upper part of the funnel. A wire mesh 33 similar to that of the first embodiment is attached to the tip.

In the water-cooled high-voltage semiconductor device having such a configuration, when the water leaks into contact with the funnel, the water is miniaturized and the reaction force is suppressed, so that the scattering of the water leak is prevented.

[0079]

According to the first aspect of the present invention, in the water-cooled high-voltage semiconductor device, a plurality of thyristor modules accommodating a plurality of thyristor elements and their attached circuits are vertically stacked on the ground via an insulating support member. The thyristor elements in each thyristor module and the water-cooling components such as the water-cooling resistor in the attached circuit are connected by internal piping for circulating cooling water, and supply and discharge cooling water for cooling the thyristor element and the water-cooling resistor through the internal piping. In a water-cooled high-voltage semiconductor device in which a header tank to be disposed is disposed outside each thyristor module in the horizontal direction, and an external water supply / drainage device is connected to the header tank via an external pipe,
A leak detection device provided on the ground, an external leak receiver disposed below each of the header tanks to collect water leaked from the header tank, and provided between the external leak receiver and the leak detector. And a water leakage inducing means for guiding the water collected in the external water leakage receiver to the water leakage detecting device.
Therefore, water leakage from the header tank provided outside the thyristor module can also be captured.

In the water-cooled high-voltage semiconductor device according to the second aspect, the thyristor stack in which a plurality of thyristor elements and cooling fins are alternately arranged and connected, and the thyristor stack in which a plurality of water-cooled resistors are connected are arranged in a column direction. Thyristor modules each containing a row of water-cooled resistor arrays arranged in parallel with each other as opposed to each other are stacked vertically on an earth via an insulating support member, and the cooling fins and the water-cooled resistor are externally mounted. In the water-cooled high-voltage semiconductor device that circulates cooling water supplied from the thyristor stack and the water-cooled resistor row, the pipe is run in parallel and connected to the thyristor stack and the water-cooled resistor row via joints, respectively. It has a plurality of branch pipes, an internal pipe for circulating cooling water, a water leak detection device provided on the ground, and a An internal water leakage receiver for collecting water leakage from a hand, and a water leakage guiding means provided between the internal water leakage receiver and the water leakage detection device for guiding the water collected in the internal water leakage receiver to the water leakage detection device are provided. . Therefore, the joint in which water leakage easily occurs is arranged so as to be within a small range as much as possible. As a result, water leakage can be efficiently captured. Further, the internal leak receiver can be small.

In the water-cooled high-voltage semiconductor device according to the third aspect, a thyristor stack in which a plurality of thyristor elements and cooling fins are alternately arranged and connected, and a thyristor stack in which a plurality of water-cooled resistors are connected are arranged in a column direction. Thyristor modules containing water cooling resistor rows arranged side by side with each other as parallel are stacked vertically on the ground via insulating support members, and cooling fins and water cooling resistors are cooled. A header tank is connected by an internal pipe for circulating water, and a header tank for supplying and discharging cooling water for cooling the thyristor element and the water-cooled resistor through the internal pipe is disposed outside each thyristor module in the horizontal direction. Is connected to the header tank via external piping, the internal piping is thyristor A plurality of branch pipes that are piped in parallel between the stack and the water-cooled resistor row, and are connected to the thyristor stack and the water-cooled resistor row via joints, respectively, and a water leakage detection device provided on the ground. , An internal leak receiver disposed below the joint to collect water leakage from the joint, an external leak receiver disposed below the header tank to collect water leakage from the header tank, an internal leak receiver and water leakage There is provided a water leakage guiding means provided between the detection devices and between the external water leakage receiver and the water leakage detection device, and guiding the water collected by the internal water leakage receiver and the external water leakage receiver to the water leakage detection device. Therefore, water leakage from a header tank provided outside the thyristor module can be captured, and water leakage from a joint in the thyristor module where water leakage easily occurs can be captured at the same time. that time,
The joints are arranged to be as small as possible. As a result, water leakage can be efficiently captured. Further, the internal leak receiver can be small.

In the water-cooled high-voltage semiconductor device according to the fourth aspect, each of the external leakage receivers has a leakage drainage port at an end thereof, and the external leakage receptacles are inclined so that water flows toward the leakage drainage port. The leak guiding means is provided at the leak drain. For this reason, the water leakage moves to the water leakage discharge port in a short time without staying on the external water leakage receiver. As a result, water leakage can be detected quickly and reliably.

In the water-cooled high-voltage semiconductor device according to the fifth aspect, each thyristor module has a water leakage drainage port at an end, and the internal water leakage receiver is disposed so as to be inclined so that water leaks toward the water leakage drainage port. The leakage guidance means is provided at the leakage drainage port. For this reason, the water leakage moves to the water leakage outlet in a short time without staying on the internal water leakage receiver. As a result, water leakage can be detected quickly and reliably.

In the water-cooled high-voltage semiconductor device according to the sixth aspect, each thyristor module has a water leakage drain at an end thereof, and the internal water leakage receiver and the external water leakage receiver allow the water to flow toward the water leakage drain. The leak guiding means is disposed at an angle, and is provided at the leak drain. Therefore, the water leak moves to the water leak outlet in a short time without staying on the internal water leak receiver and the external water leak receiver. As a result, water leakage can be detected quickly and reliably.

In the water-cooled high-voltage semiconductor device according to the present invention, each of the external leakage receivers has a water leakage drain port at an end, and the internal water leakage receptacle and the external water leakage receptacle allow the water leakage to flow toward the water leakage drain port. The water leakage guiding means is provided at the water leakage drain port. Therefore, the leak does not stay on the internal leak receiver and the external leak receiver,
Move to leak outlet in a short time. As a result, water leakage can be detected quickly and reliably.

[0086] In the water-cooled high-voltage semiconductor device according to the eighth aspect, each of the water leakage drains is provided on the same vertical line, and the water leakage inducing means is provided on the same vertical line as each of the water leakage drains.
There are a plurality of funnels for sequentially guiding water discharged from the upper water leakage drainage port to the lower water leakage drainage port, and each funnel is provided with a rectifying device. Therefore, when water is dropped from the funnel, the water does not scatter.
As a result, it is possible to ensure that the water leak reaches the water leak detection device and does not wet other electric components.

In the water-cooled high-voltage semiconductor device according to the ninth aspect, the water leakage inducing means is connected to each water leakage discharge port by a water leakage drain pipe branch, and is disposed along the direction in which the thyristor modules are stacked. is there. Therefore, the leaked water that has entered the leaked water drain pipe surely reaches the leak detecting device without being scattered thereafter. As a result, no other electrical components are wetted.

In the water-cooled high-voltage semiconductor device according to the tenth aspect, the surface of the internal water leakage receiver is made uneven.
Therefore, the leak does not stay on the internal leak receiver,
Move to leak outlet in a short time. Then, water leakage can be detected quickly and reliably.

In the water-cooled high-voltage semiconductor device according to the eleventh aspect, the header tank is connected to the external piping by a cap nut, and each cap nut is covered with a water leakage prevention cap for preventing scattering of water leakage. Therefore, water leakage from the cap nut is once captured inside the water leakage prevention cap, and then slowly falls from the gap. Therefore, even if the water leak is strong, the water is reliably collected without scattering.

In the water-cooled high-voltage semiconductor device according to the twelfth aspect, the header tank is connected to the external piping with a cap nut, and the cap nut is covered with a water leakage prevention wall for preventing water from scattering. For this reason, water leaking from the cap nut scattered vigorously outward is blocked by the water leakage prevention wall. As a result, water leaking from the cap nut can be reliably collected.

[Brief description of the drawings]

FIG. 1 is a schematic view of a water-cooled high-voltage semiconductor device according to the present invention.

FIG. 2 is a plan view of a thyristor module.

FIG. 3 is a sectional view of a thyristor module.

FIG. 4 is an enlarged view of a portion A in FIG. 3;

FIG. 5 is an enlarged view of a connection portion between a header tank and a Teflon tube.

FIG. 6 is a system diagram showing an outline of a cooling water channel.

FIG. 7 is a diagram showing details of a wire net provided on the funnel 32;

FIG. 8 is a schematic view showing another example of the water-cooled high-voltage semiconductor device of the present invention.

FIG. 9 is a plan view of a thyristor module,

FIG. 10 is a sectional view of a thyristor module.

FIG. 11 is a schematic view showing another example of the water-cooled high-voltage semiconductor device of the present invention.

FIG. 12 is a schematic view showing another example of the water-cooled high-voltage semiconductor device of the present invention.

FIG. 13 is an enlarged view of a portion B in FIG.

14 is a view of the water receiver 51 viewed from the direction of arrow C in FIG.

15 is a perspective view of a water receiver 51. FIG.

FIG. 16 is a side view of a funnel and a rectifier showing another example of the water-cooled high-voltage semiconductor device of the present invention.

FIG. 17 is a side view of a funnel and a rectifier showing another example of the water-cooled high-voltage semiconductor device of the present invention.

FIG. 18 is a perspective view of the example of FIG.

FIG. 19 is a sectional view of a funnel showing another example of the water-cooled high-voltage semiconductor device of the present invention.

FIG. 20 is a sectional view of a funnel showing another example of the water-cooled high-voltage semiconductor device of the present invention.

FIG. 21 is a sectional view of a funnel showing another example of the water-cooled high-voltage semiconductor device of the present invention.

FIG. 22 is a front view showing an example of a conventional water-cooled high-voltage semiconductor device.

FIG. 23 is an electric circuit diagram in a conventional thyristor module 3.

FIG. 24 is a layout diagram in a conventional thyristor module 3.

FIG. 25 is a conceptual diagram of a conventional water leakage detection device for a water-cooled high-voltage semiconductor device.

FIG. 26 is a conceptual diagram showing another example of a conventional water-cooled high-voltage semiconductor device.

FIG. 27 is an enlarged view of a portion D in FIG. 26;

[Explanation of symbols]

1 Thyristor element, 3 Thyristor module, 4
Insulation support member, 8 Teflon pipe (external piping), 14 cooling fins, 14a cooling fin joint (joint), 15 thyristor stack, 16a Teflon pipe (branch pipe),
17 cooling water supply pipe (internal pipe), 18 cooling water drain pipe (internal pipe), 19 water-cooled resistor, 19a water-cooled resistor joint (joint), 29, 39b leak outlet, 31 leak detector, 32, 35 funnel (Leakage induction means), 33
Wire mesh (rectifier), 36 Wire mesh (rectifier), 37
a, 37b, 37e header tank, 38 cap nut,
38a Water leakage prevention cap, 39 External water leakage receiver, 41
Internal leak catcher, 44 leak drainage pipe (leakage inducing means),
44a Leakage distribution pipe branch, 46 nets (rectifier), 47 nets (rectifier), 48 water-cooled resistor row, 51 water receiver (water leakage prevention wall).

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yuichi Shoji 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Corporation

Claims (12)

[Claims] 1. A thyristor module accommodating a plurality of thyristor elements and an associated circuit are stacked vertically on an earth via an insulating support member, and a thyristor element and an associated circuit in each of the thyristor modules are provided. A water cooling component such as a water cooling resistor is connected by an internal pipe for circulating cooling water, and a header tank for supplying and discharging cooling water for cooling the thyristor element and the water cooling resistor through the internal pipe is provided in a horizontal direction of each thyristor module. A water-cooled high-voltage semiconductor device, which is disposed outward in each direction and an external water supply / drainage device is connected to the header tank via an external pipe, comprises: a water leakage detection device provided on the ground; An external leakage receiver disposed below each of the external leakage receivers for collecting water leakage from the header tank; A water-cooling type high-voltage semiconductor device comprising: a water leakage inducing means provided between the water leakage detection device and the water leakage detection device for guiding water collected in the external water leakage receiver to the water leakage detection device. 2. A thyristor stack in which a plurality of thyristor elements and cooling fins are alternately arranged and connected to each other, and a plurality of water-cooled resistors are connected and arranged in parallel with each other with the thyristor stack in a column direction parallel to each other. A plurality of thyristor modules accommodating a row of water-cooling resistors are vertically stacked on the ground via insulating support members, and the cooling fins and the water-cooling resistors circulate cooling water supplied from the outside. In the water-cooled high-voltage semiconductor device to be provided, a plurality of branch pipes that are piped in parallel between the thyristor stack and the water-cooled resistor row and that are connected to the thyristor stack and the water-cooled resistor row via joints, respectively. An internal pipe for circulating the cooling water; a water leak detection device provided on the ground; and a water leak detector provided below the joint and leaking from the joint. An internal leak receiver that collects water; and a water leakage guide unit that is provided between the internal leak receiver and the water leak detector and guides water collected by the internal leak receiver to the water leak detector. A water-cooled high-voltage semiconductor device, characterized in that: 3. A thyristor stack in which a plurality of thyristor elements and cooling fins are alternately arranged and connected, and a plurality of water-cooling resistors are connected and arranged in parallel with each other with the thyristor stack in a row direction parallel to each other. A thyristor module containing a row of water-cooled resistors is stacked on the ground in a vertical direction via an insulating support member, and the cooling fins and the water-cooled resistors are connected by an internal pipe for circulating cooling water. Header tanks for supplying and discharging cooling water for cooling the thyristor element and the water-cooled resistor through the internal piping are respectively disposed outside the thyristor modules in the horizontal direction, and an external water supply and drainage device is provided for the header tank. In a water-cooled high-voltage semiconductor device connected via an external pipe, the internal pipe is connected to the thyristor stack and the water-cooled high-voltage semiconductor device. A plurality of branch pipes that are connected in parallel between the arrester row and are connected to the thyristor stack and the water-cooled resistor row via joints, respectively, and further, a water leakage detection device provided on the ground, An internal water leakage receiver disposed below the joint for collecting water leakage from the joint; an external water leakage receiver disposed below the header tank for collecting water leakage from the header tank; Water leakage provided between the water leak receiver and the water leak detector and between the external water leak receiver and the water leak detector to guide the water collected by the internal water leak receiver and the external water leak receiver to the water leak detector. A water-cooled high-voltage semiconductor device comprising an inducing means. 4. Each of the external leakage receivers has a water leakage drain at an end thereof, and the external water leakage receiver is disposed so as to be inclined so that water flows toward the water leakage drain. The water-cooled high-voltage semiconductor device according to claim 1, wherein the water-cooled high-voltage semiconductor device is provided at the water leakage drain port. 5. Each of the thyristor modules has a water leakage drain at an end thereof, and the internal water leakage receiver is disposed so as to be inclined so that water leaks toward the water leakage drain, and the water leakage guiding means is provided. And a drainage outlet provided at the water leakage drainage port.
A water-cooled high-voltage semiconductor device according to claim 1. 6. Each of the thyristor modules has a water leakage drain at an end thereof, and the internal water leakage receiver and the external water leakage receptacle are disposed so as to be inclined so that water flows toward the water leakage drain. 4. The water-cooled high-voltage semiconductor device according to claim 3, wherein said water leakage inducing means is provided at said water leakage outlet. 7. Each of the external leak receivers has a water leak drain at an end thereof, and the internal leak receiver and the external leak receiver are provided with:
4. The water-cooled high-voltage semiconductor device according to claim 3, wherein the water leakage guiding means is provided at the water leakage drain port so as to be inclined so that the water flows toward the water leakage drain port. 8. Each of the water leakage drains is provided on the same vertical line, and the water leakage inducing means is provided on the same vertical line as each of the water leakage drains, and discharges water discharged from an upper water leakage drain, The water-cooled high-voltage semiconductor according to any one of claims 4 to 7, wherein a plurality of funnels are sequentially guided to a leakage drainage port on a lower side, and each of the funnels is provided with a rectifier. apparatus. 9. The water leakage drainage pipe connected to each of the water leakage drainage ports by a water leakage drainage pipe and arranged along the stacking direction of the thyristor modules. 8. The water-cooled high-voltage semiconductor device according to any one of 4 to 7. 10. The water-cooled high-voltage semiconductor device according to claim 2, wherein the surface of the internal water leakage receiver has an uneven shape. 11. The header tank is connected to the external piping by a cap nut, and each cap nut is covered with a water leakage prevention cap for preventing water leakage from scattering. 11. The water-cooled high-voltage semiconductor device according to any one of 10. 12. The header tank is connected to the external pipe by a cap nut, and the cap nut is covered with a water leakage prevention wall for preventing water leakage from scattering.
Or a water-cooled high-voltage semiconductor device according to any one of 3 to 11.