JPH10270220A - Variable resistor - Google Patents

Variable resistor

Info

Publication number
JPH10270220A
JPH10270220A JP7701297A JP7701297A JPH10270220A JP H10270220 A JPH10270220 A JP H10270220A JP 7701297 A JP7701297 A JP 7701297A JP 7701297 A JP7701297 A JP 7701297A JP H10270220 A JPH10270220 A JP H10270220A
Authority
JP
Japan
Prior art keywords
substrate
resistor
board
variable resistor
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7701297A
Other languages
Japanese (ja)
Inventor
Jiyunichi Sakukawa
純一 佐久川
Osamu Mitsumura
修 三ツ村
Hirofumi Mori
浩文 毛利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7701297A priority Critical patent/JPH10270220A/en
Publication of JPH10270220A publication Critical patent/JPH10270220A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To restrain a board from increasing in temperature, even if Joule heating is generated in a resistor by a method, wherein the board is formed of composite material composed of resin-molding material and filler of metal compound powder mixed in a specific weight ratio. SOLUTION: A board 21 is equipped with a horseshoe resistor 22 of carbon or the like, provided with a hole 23 located nearly at its center, and integrally formed with a middle terminal 24 and an outer terminal 25 by insert molding. At this point, a base board, formed of polyphenylene sulfide which contains 10 to 90 wt.% of filler of metal compound and glass is used as the board 21. A protrudent part 27 is provided as protruding towards the hollow 23 of the board 21, a through-hole 28 is provided to the protrudent part 27 nearly at the center, a slider 29 which slides on the resistor 22 located on the upside of the board 21 is provided, and a metal driver plate provided with a cutout in parallel with the board 21 is provided.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、主に電子機器の回
路調整用として使用される可変抵抗器に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a variable resistor mainly used for circuit adjustment of electronic equipment.

【0002】[0002]

【従来の技術】従来の可変抵抗器は、特開平7−222
15号公報に開示されたものが知られている。
2. Description of the Related Art A conventional variable resistor is disclosed in JP-A-7-222.
No. 15 is known.

【0003】以下に従来の可変抵抗器について、図面を
参照しながら説明する。図6は従来の可変抵抗器の側断
面面、図7は同要部である基板に中端子および外端子が
インサート成形により一体に形成された状態を示す上面
図である。
A conventional variable resistor will be described below with reference to the drawings. FIG. 6 is a side sectional view of a conventional variable resistor, and FIG. 7 is a top view showing a state in which a middle terminal and an outer terminal are integrally formed by insert molding on a substrate which is the main part.

【0004】図6、図7において、1は上面にカーボン
等からなる馬蹄形状の抵抗体2を有するとともに略中央
に中空孔3を設け、かつ中端子4と外端子5とを一体に
設けた基板である。この基板1は、ポリフェルニンスル
フィド(以下、「PPS」と記す。)60%、ガラス4
0%の混合材料で構成されており、熱伝導率は0.24
W/m・Kである。6は金属製のドライバープレートで
あり、前記基板1の前記中空孔3に向かって突出する突
出部7を有し、この突出部7の略中央に貫通孔8を設け
ている。また、前記ドライバープレート6は前記基板1
の上面の前記抵抗体2と摺動する摺動子9を有しかつ前
記基板1と平行な切欠10を設けている。前記中端子4
は、一端はドライバープレート6の貫通孔8に枢着し電
気的に接続し、他端は基板1の底面から側面に渡って設
けられている。前記外端子5の一端は前記抵抗体2と電
気的に接続するとともに他端は前記基板1の側面から底
面に渡って設けられている。
In FIGS. 6 and 7, reference numeral 1 denotes a horseshoe-shaped resistor 2 made of carbon or the like on the upper surface, a hollow hole 3 provided substantially in the center, and a middle terminal 4 and an outer terminal 5 integrally provided. It is a substrate. This substrate 1 is made of polyfernin sulfide (hereinafter referred to as “PPS”) 60% and glass 4
It is composed of 0% mixed material and has a thermal conductivity of 0.24.
W / m · K. Reference numeral 6 denotes a metal driver plate having a protruding portion 7 protruding toward the hollow hole 3 of the substrate 1, and a through hole 8 provided substantially in the center of the protruding portion 7. The driver plate 6 is mounted on the substrate 1.
A notch 10 is provided which has a slider 9 which slides on the upper surface of the resistor 2 and which is parallel to the substrate 1. The middle terminal 4
Has one end pivotally connected to and electrically connected to the through hole 8 of the driver plate 6 and the other end provided from the bottom surface to the side surface of the substrate 1. One end of the external terminal 5 is electrically connected to the resistor 2 and the other end is provided from the side surface to the bottom surface of the substrate 1.

【0005】以上のように構成した従来の可変抵抗器を
回路基板に装着して使用する状態を図面を参照しながら
説明する。図8は従来の可変抵抗器を回路基板11へ実
装した状態を示す側断面図である。
A state in which the conventional variable resistor configured as described above is mounted on a circuit board and used will be described with reference to the drawings. FIG. 8 is a side sectional view showing a state where a conventional variable resistor is mounted on a circuit board 11.

【0006】ここで、仮に従来の可変抵抗器の外端子5
に0.1Wの負荷(例えば全抵抗値1kΩの抵抗体に1
0Vを印加して10mAを通電する。)を与えると、ジ
ュール熱により抵抗体2の温度が上昇する。基板1の熱
伝導率は0.24W/m・Kであり、図4に示すように
抵抗体2に発生するジュール熱による基板1の温度上昇
は約67℃である。
Here, suppose that the external terminal 5 of the conventional variable resistor is
A load of 0.1 W (for example, 1
A current of 10 mA is applied by applying 0V. ), The temperature of the resistor 2 rises due to Joule heat. The thermal conductivity of the substrate 1 is 0.24 W / m · K, and the temperature rise of the substrate 1 due to Joule heat generated in the resistor 2 is about 67 ° C. as shown in FIG.

【0007】[0007]

【発明が解決しようとする課題】しかしながら、上記従
来の構成においては、基板1の温度上昇が約67℃であ
るので、図5に示すように抵抗体の抵抗値の変化が約−
15%であり、可変抵抗器の特性が劣化してしまうとい
う課題を有していた。
However, in the above-mentioned conventional configuration, since the temperature rise of the substrate 1 is about 67.degree. C., the change in the resistance of the resistor is about-.
15%, which causes a problem that the characteristics of the variable resistor are deteriorated.

【0008】本発明は、上記従来の課題を解決するもの
で、抵抗体にジュール熱が発生しても、基板1の温度の
上昇しにくい可変抵抗器を提供することを目的とするも
のである。
An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a variable resistor in which the temperature of the substrate 1 hardly rises even when Joule heat is generated in the resistor. .

【0009】[0009]

【課題を解決するための手段】上記目的を達成するため
に本発明の可変抵抗器は、基板の材料が樹脂成形材料に
金属化合物からなる粉末の充填剤を10重量%以上90
重量%以下含有する構成としたものである。
In order to achieve the above object, a variable resistor according to the present invention is characterized in that the material of the substrate is a resin molding material containing 10% by weight or more of a powder filler made of a metal compound.
It is configured to contain less than 10% by weight.

【0010】この構成によれば、基板自体の熱伝導率を
高め、抵抗体の温度の上昇しにくい可変抵抗器が得られ
る。
According to this configuration, it is possible to obtain a variable resistor in which the thermal conductivity of the substrate itself is increased and the temperature of the resistor hardly rises.

【0011】[0011]

【発明の実施の形態】本発明の請求項1に記載の発明
は、中端子と外端子とをインサート成形により一体に形
成した基板に設けた馬蹄形状の抵抗体上に、この抵抗体
の中心部を支点として回転可能なドライバープレートの
摺動子を摺動させた可変抵抗器において、前記基板とし
て樹脂成形材料に金属化合物からなる粉末の充填剤を1
0重量%以上90重量%以下含有したものであるので、
通電時の抵抗値変化が小さくなるという作用を有するも
のである。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is characterized in that a center terminal of this resistor is placed on a horseshoe-shaped resistor provided on a substrate on which a middle terminal and an outer terminal are integrally formed by insert molding. In a variable resistor in which a slider of a rotatable driver plate is slid with a part as a fulcrum, a powder filler made of a metal compound is added to a resin molding material as the substrate.
Since it contains 0% by weight or more and 90% by weight or less,
This has the effect of reducing the change in resistance during energization.

【0012】本発明の請求項2に記載の発明は、上面に
馬蹄形状の抵抗体を有するとともに中端子および外端子
をインサート成形により一体に成形され、金属化合物の
充填剤を10重量%以上90重量%以下含有した樹脂成
形材料からなる基板と、前記基板の中空孔に向かって突
出する突出部の略中央に貫通孔を有するとともに前記基
板の上面の抵抗体に摺動する摺動子を有しかつ前記基板
と平行な切欠を設けたドライバープレートとを備えたの
で、通電時の抵抗値変化が小さいという作用を有するも
のである。
The invention according to a second aspect of the present invention has a horseshoe-shaped resistor on the upper surface, and the middle terminal and the outer terminal are integrally formed by insert molding, and the filler of the metal compound is contained in an amount of 10% by weight or more and 90% or more. A substrate made of a resin molding material containing not more than 5% by weight, and a slider having a through hole substantially at the center of a protrusion protruding toward the hollow hole of the substrate and sliding on a resistor on the upper surface of the substrate. And a driver plate provided with a notch parallel to the substrate, so that a change in resistance value during energization is small.

【0013】本発明の請求項3に記載の発明は、請求項
1または2記載の発明において、基板の熱伝導率が0.
3W/m・K以上であるので、通電時の抵抗値変化が小
さいという作用を有するものである。
According to a third aspect of the present invention, in accordance with the first or second aspect, the substrate has a thermal conductivity of 0.1.
Since it is 3 W / m · K or more, it has an effect that a change in resistance value during energization is small.

【0014】本発明の請求項4に記載の発明は、請求項
1または2記載の発明において、基板の充填剤が金属酸
化物、金属窒化物、または金属ホウ化物のいずれかであ
るので、通電時の抵抗値の変化が小さいという作用を有
するものである。
According to a fourth aspect of the present invention, in the first or the second aspect of the present invention, since the filler of the substrate is any one of a metal oxide, a metal nitride, and a metal boride, This has the effect that the change in the resistance value at the time is small.

【0015】(実施の形態)以下、本発明の一実施の形
態における可変抵抗器について図面を参照しながら説明
する。図1は、本発明の一実施の形態における可変抵抗
器の側断面図、図2は同要部である可変抵抗器の基板に
中端子および外端子が一体に成形された状態を示す上面
図である。
(Embodiment) A variable resistor according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view of a variable resistor according to an embodiment of the present invention, and FIG. 2 is a top view showing a state in which a middle terminal and an outer terminal are integrally formed on a substrate of the variable resistor which is the main part. It is.

【0016】図1〜図2において、21は上面にカーボ
ン等からなる馬蹄形状の抵抗体22を有するとともに略
中央に中空孔23を設けた基板であり、中端子24と外
端子25とをインサート成形により一体に成形されてい
る。ここで、基板21は金属化合物の充填剤を10重量
%〜90重量%の範囲で含有したPPSおよびガラスか
らなるベース板を使用してある。26は前記基板21の
前記中空孔23に向かって突出する突出部27を設ける
とともに、この突出部27の略中央に貫通孔28を有
し、かつ前記基板21の上面の前記抵抗体22に摺動す
る摺動子29を有するとともに前記基板21と平行な切
欠30を設けた金属のドライバープレートである。前記
中端子24は、前記基板21の底面から側面に渡って端
子部31を有するとともに前記ドライバープレート26
の前記貫通孔28に枢着し電気的に接続する枢着部32
を設けてある。前記外端子25は前記抵抗体22と一端
で電気的に接続するとともに他端は前記基板21の底面
から側面に渡って設けられた先端部33を有している。
前記中端子24と前記外端子25とは前記基板21と一
体に成形されるとともに前記端子部31、前記先端部3
3が前記基板21の底面部34から露出するとともに前
記基板21の側面部35に沿って上方に折り曲げられて
いる。
In FIG. 1 and FIG. 2, reference numeral 21 denotes a substrate having a horseshoe-shaped resistor 22 made of carbon or the like on the upper surface and having a hollow hole 23 provided substantially in the center, and having a middle terminal 24 and an outer terminal 25 inserted therein. It is integrally formed by molding. Here, as the substrate 21, a base plate made of PPS and glass containing a filler of a metal compound in a range of 10% by weight to 90% by weight is used. Reference numeral 26 designates a protruding portion 27 protruding toward the hollow hole 23 of the substrate 21, has a through hole 28 substantially at the center of the protruding portion 27, and slides on the resistor 22 on the upper surface of the substrate 21. This is a metal driver plate having a moving slider 29 and a cutout 30 parallel to the substrate 21. The middle terminal 24 has a terminal portion 31 extending from the bottom surface to the side surface of the substrate 21 and the driver plate 26.
Pivot portion 32 pivotally connected to and electrically connected to the through hole 28
Is provided. The external terminal 25 is electrically connected to the resistor 22 at one end, and the other end has a tip portion 33 provided from the bottom surface to the side surface of the substrate 21.
The middle terminal 24 and the outer terminal 25 are formed integrally with the substrate 21 and the terminal portion 31 and the tip 3
3 is exposed from the bottom surface portion 34 of the substrate 21 and bent upward along the side surface portion 35 of the substrate 21.

【0017】以上のように構成された本発明の一実施の
形態における可変抵抗器について以下にその組立方法を
図面を参照しながら説明する。
The assembling method of the variable resistor configured as described above according to an embodiment of the present invention will be described below with reference to the drawings.

【0018】予め前記中端子24と前記外端子25の前
記端子部31、前記先端部33が前記底面部34から露
出するように前記基板21と一体に成形されており、前
記基板21の上面に一端を露出させた前記外端子25と
電気的に接続するように前記基板21の上面にカーボン
等からなる前記抵抗体22を馬蹄形状に塗布する。次
に、前記中端子24と前記外端子25の前記端子部3
1、前記先端部33を前記基板21の前記側面部35に
沿って上方に折り曲げる。
The terminal portion 31 and the tip portion 33 of the middle terminal 24 and the outer terminal 25 are formed integrally with the substrate 21 so as to be exposed from the bottom surface portion 34. The resistor 22 made of carbon or the like is applied on the upper surface of the substrate 21 in a horseshoe shape so as to be electrically connected to the external terminal 25 whose one end is exposed. Next, the terminal portions 3 of the middle terminal 24 and the outer terminal 25
1. The tip portion 33 is bent upward along the side surface portion 35 of the substrate 21.

【0019】次に、前記中端子24に設けられた前記枢
着部32を前記ドライバープレート26の前記貫通孔2
8に挿通し、前記枢着部32の先端をかしめることによ
り前記ドライバープレート26を前記基板21上に回転
可能に支持する。このとき、前記ドライバープレート2
6の前記摺動子29は前記基板21の上面の前記抵抗体
22に接触する位置に配されている。
Next, the pivot portion 32 provided on the middle terminal 24 is connected to the through hole 2 of the driver plate 26.
8, the driver plate 26 is rotatably supported on the substrate 21 by caulking the distal end of the pivot portion 32. At this time, the driver plate 2
The slider 29 of No. 6 is disposed on the upper surface of the substrate 21 at a position in contact with the resistor 22.

【0020】以上のように構成、組立られた本発明の一
実施の形態における可変抵抗器は、図3に示すように回
路基板36へ実装され、半田37により接合される。
The variable resistor constructed and assembled as described above according to one embodiment of the present invention is mounted on a circuit board 36 as shown in FIG.

【0021】ここで、上記基板21は金属化合物からな
る粉末の充填剤としては、MgO、Al23等の金属酸
化物、Si34等の金属窒化物、ZrB2、TiB2等の
金属ホウ化物、SiC等の金属炭化物が使用され、PP
Sとガラスファイバーの混合材料に対して(表1)に示
すような配合割合で含有した。
Here, the substrate 21 is made of a metal oxide powder such as MgO or Al 2 O 3 , a metal nitride such as Si 3 N 4, a metal nitride such as ZrB 2 , TiB 2 or the like. Metal boride, metal carbide such as SiC is used, and PP
It was contained in the mixture ratio of S and glass fiber as shown in (Table 1).

【0022】[0022]

【表1】 [Table 1]

【0023】図4は基板の熱伝導率と抵抗体への0.1
W印加時の抵抗体の温度上昇との関係を示す特性図、図
5は抵抗体の温度上昇と抵抗体の抵抗値の減少との関係
を示す図である。
FIG. 4 shows the thermal conductivity of the substrate and the value of 0.1 to the resistor.
FIG. 5 is a characteristic diagram showing the relationship between the temperature rise of the resistor when W is applied, and FIG. 5 is a diagram showing the relationship between the temperature rise of the resistor and a decrease in the resistance value of the resistor.

【0024】ここで、本発明の一実施の形態における可
変抵抗器の基板21が(表1)の資料1の場合、前記外
端子32に0.1Wの負荷(例えば全抵抗値1kΩの抵
抗体に10Vを印加して10mAを通電する。)を与え
ると、前記基板21の充填材料はMgOが10重量%で
あるので、熱伝導率が0.32W/m・Kと高い値であ
り、前記抵抗体22に発生するジュール熱が前記基板2
1から前記中端子24および前記外端子25を介して回
路基板36より放熱する。したがって、図4および(表
1)に示すようにジュール熱により前記抵抗体22の温
度が約58℃上昇する。すなわち、図5に示すように前
記抵抗体22の抵抗値の減少率は約7%となり、抵抗値
変化が小さくなるという作用を有するものである。
Here, when the substrate 21 of the variable resistor according to the embodiment of the present invention is the material 1 shown in Table 1, a load of 0.1 W is applied to the external terminal 32 (for example, a resistor having a total resistance of 1 kΩ). When 10 V is applied to the substrate 21 and a current of 10 mA is applied.), Since the filling material of the substrate 21 is 10% by weight of MgO, the thermal conductivity is as high as 0.32 W / m · K. Joule heat generated in the resistor 22 is
Heat is dissipated from the circuit board 36 from 1 through the middle terminal 24 and the outer terminal 25. Therefore, as shown in FIG. 4 and (Table 1), the temperature of the resistor 22 rises by about 58 ° C. due to Joule heat. That is, as shown in FIG. 5, the reduction rate of the resistance value of the resistor 22 is about 7%, which has an effect of reducing the change in the resistance value.

【0025】なお、本発明の一実施の形態における可変
抵抗器においては、基板21がMgOの金属化合物の充
填剤を10重量%含有したPPSおよびガラスからなる
ベース板としたが、(表1)の資料2,3に示すように
MgOの金属化合物の充填材料を20重量%あるいは4
0重量%としても同様の作用を有するものである。
In the variable resistor according to the embodiment of the present invention, the substrate 21 is a base plate made of PPS and glass containing 10% by weight of a filler of a metal compound of MgO (Table 1). As shown in Documents 2 and 3 of the above, the filling material of the metal compound of MgO is
Even if it is 0% by weight, it has the same effect.

【0026】また、本発明の一実施の形態における可変
抵抗器においては、成形材料への充填材料をMgO等の
金属酸化物としたが、(表1)の資料4〜13に示すよ
うにAl23等の金属酸化物、Si34等の金属窒化
物、ZrB2、TiB2等の金属ホウ化物、あるいはSi
C等の金属炭化物であっても同様の作用を有するもので
ある。
In the variable resistor according to one embodiment of the present invention, the metal oxide such as MgO is used as a filling material for the molding material. Metal oxides such as 2 O 3 , metal nitrides such as Si 3 N 4 , metal borides such as ZrB 2 and TiB 2 , or Si
Even a metal carbide such as C has the same effect.

【0027】但し、充填材料は90重量%を越えて含有
すると、前記基板21の成形性が悪くなり好ましくな
い。また、充填材料は10重量%以下では熱伝導率が小
さく温度上昇分を小さく抑えることができなくなる。
However, if the content of the filler exceeds 90% by weight, the moldability of the substrate 21 deteriorates, which is not preferable. On the other hand, if the filling material is less than 10% by weight, the thermal conductivity is so small that the rise in temperature cannot be kept small.

【0028】[0028]

【発明の効果】以上のように本発明は、金属化合物から
なる充填剤を10重量%以上90重量%以下含有した樹
脂成形材で基板を構成することにより、基板の熱伝導率
が高くなり、抵抗体から発生するジュール熱が基板から
外端子および中端子を通って回路基板に伝わり易く放熱
しやすいので、抵抗体の温度上昇が小さくなり、通電時
の抵抗値変化の小さい特性の向上した可変抵抗器を提供
することができるものである。
As described above, according to the present invention, the thermal conductivity of the substrate is increased by forming the substrate with a resin molding material containing 10% by weight to 90% by weight of a filler made of a metal compound. Joule heat generated from the resistor is easily transmitted from the board to the circuit board through the outer and middle terminals and radiated easily, so the temperature rise of the resistor is reduced and the resistance change during energization is improved. A resistor can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施の形態における可変抵抗器の側
断面図
FIG. 1 is a side sectional view of a variable resistor according to an embodiment of the present invention.

【図2】同要部である可変抵抗器の中端子および外端子
が一体に成形された基板の上面図
FIG. 2 is a top view of a substrate on which a middle terminal and an outer terminal of the variable resistor, which are main parts, are integrally formed.

【図3】同可変抵抗器をプリント基板へ実装した状態を
示す側断面図
FIG. 3 is a side sectional view showing a state where the variable resistor is mounted on a printed circuit board.

【図4】基板の熱伝導率と0.1W印加時の抵抗体の温
度上昇との関係を示す特性図
FIG. 4 is a characteristic diagram showing a relationship between the thermal conductivity of the substrate and the temperature rise of the resistor when 0.1 W is applied.

【図5】抵抗体の温度上昇と抵抗体の抵抗値の減少との
関係を示す特性図
FIG. 5 is a characteristic diagram showing a relationship between a rise in the temperature of the resistor and a decrease in the resistance value of the resistor.

【図6】従来の可変抵抗器の側断面図FIG. 6 is a side sectional view of a conventional variable resistor.

【図7】同要部である従来の可変抵抗器の基板に中端子
および外端子が一体に形成された状態を示す上面図
FIG. 7 is a top view showing a state in which a middle terminal and an outer terminal are integrally formed on a substrate of a conventional variable resistor which is a main part of the same.

【図8】同従来の可変抵抗器をプリント基板に実装した
状態を示す側断面図
FIG. 8 is a side sectional view showing a state where the conventional variable resistor is mounted on a printed circuit board.

【符号の説明】[Explanation of symbols]

21 基板 22 抵抗体 23 中空孔 24 中端子 25 外端子 26 ドライバープレート 27 突出部 28 貫通孔 29 摺動子 30 切欠 31 端子部 32 枢着部 DESCRIPTION OF SYMBOLS 21 Substrate 22 Resistor 23 Hollow hole 24 Middle terminal 25 Outer terminal 26 Driver plate 27 Projecting part 28 Through hole 29 Slider 30 Notch 31 Terminal part 32 Joint part

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 中端子と外端子とを一体に有する基板に
設けた馬蹄形状の抵抗体上に、この抵抗体の中心部を支
点として回転可能なドライバープレートの摺動子を摺動
させた可変抵抗器において、前記基板は樹脂成形材料に
金属化合物からなる粉末の充填剤を10重量%以上90
重量%以下含有したことを特徴とする可変抵抗器。
1. A slider of a driver plate rotatable around a center of the resistor on a horseshoe-shaped resistor provided on a substrate integrally having a middle terminal and an outer terminal. In the variable resistor, the substrate may be formed by adding a filler of a metal compound to a resin molding material in an amount of 10% by weight to 90% by weight.
A variable resistor characterized by containing not more than weight%.
【請求項2】 上面に馬蹄形状の抵抗体を有し、中端子
および外端子が一体に成形されるとともに略中央に中空
孔が設けられた金属化合物の充填剤を10重量%以上9
0重量%以下含有した樹脂成形材料からなる基板と、前
記基板の中空孔に向かって突出する突出部の略中央に貫
通孔を有するとともに前記基板の上面の抵抗体に摺動す
る摺動子を有しかつ前記基板と平行な切欠を設けたドラ
イバープレートとを備えた可変抵抗器。
2. A filler of a metal compound having a horseshoe-shaped resistor on the upper surface, a middle terminal and an outer terminal being integrally formed, and having a hollow hole substantially at the center, is contained in an amount of 10% by weight or more.
A substrate made of a resin molding material containing 0% by weight or less, and a slider having a through hole substantially at the center of a projecting portion projecting toward the hollow hole of the substrate and sliding on a resistor on the upper surface of the substrate. And a driver plate having a notch parallel to the substrate.
【請求項3】 基板は、熱伝導率が0.3W/m・K以
上である請求項1または2記載の可変抵抗器。
3. The variable resistor according to claim 1, wherein the substrate has a thermal conductivity of 0.3 W / m · K or more.
【請求項4】 基板の充填剤は、金属酸化物、金属窒化
物、または金属ホウ化物のいずれかである請求項1また
は2記載の可変抵抗器。
4. The variable resistor according to claim 1, wherein the filler of the substrate is one of a metal oxide, a metal nitride, and a metal boride.
JP7701297A 1997-03-28 1997-03-28 Variable resistor Pending JPH10270220A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7701297A JPH10270220A (en) 1997-03-28 1997-03-28 Variable resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7701297A JPH10270220A (en) 1997-03-28 1997-03-28 Variable resistor

Publications (1)

Publication Number Publication Date
JPH10270220A true JPH10270220A (en) 1998-10-09

Family

ID=13621855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7701297A Pending JPH10270220A (en) 1997-03-28 1997-03-28 Variable resistor

Country Status (1)

Country Link
JP (1) JPH10270220A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6628193B2 (en) 1999-06-30 2003-09-30 Murata Manufacturing Co., Ltd. Variable resistor
JP2006302784A (en) * 2005-04-22 2006-11-02 Murata Mfg Co Ltd Rotary operation type electronic component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6628193B2 (en) 1999-06-30 2003-09-30 Murata Manufacturing Co., Ltd. Variable resistor
JP2006302784A (en) * 2005-04-22 2006-11-02 Murata Mfg Co Ltd Rotary operation type electronic component
JP4617984B2 (en) * 2005-04-22 2011-01-26 株式会社村田製作所 Rotating electronic components

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