JPH10268145A - Two-dimensional optical fiber array device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device having the high density and high accuracy of the two-dimensional array of optical fibers. SOLUTION: This two-dimensional optical fiber array device has optical fibers 1 led and fixed through a stack body 2 formed out of a plurality of ceramic plates 2a to 2o having a plurality of preliminarily formed elaborate holes. stacked on top of each other. In order to manufacture the array device, a plurality of filament materials (metallic wires) having the same diameter as the optical fibers 1, or a diameter different from the diameter thereof are inserted in the holes of the first ceramic plate 2a, and led through other ceramic plates (2b, 2c...2o) in sequence, using the filament materials as a guide. Then, the ceramic plates are aligned with one another in terms of the positions of the holes and stacked, thereby being fixed. Thereafter, the filament materials as the guide are pulled out and the optical fibers 1 are led and fixed through the ceramic plate stack body 2. Finally, the edges of the optical fibers 1 and the ceramic stack body 2 are polished and aligned.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD OF THE INVENTION

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a two-dimensional optical fiber array device and a method of manufacturing the same, and more particularly, to a parallel optical transmission in the field of optical communication, wherein an outgoing light end face of an optical fiber or an incident light. The present invention relates to a two-dimensional optical fiber array device in which end faces are two-dimensionally arranged vertically and horizontally and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, this type of two-dimensional optical fiber array device in which optical fiber end faces are arranged in a matrix has a device as shown in FIGS. In order to obtain the two-dimensional optical fiber array device shown in FIG.
A substrate Sj made of a material such as i) and having a predetermined thickness Tj is provided with a "V" -shaped cross section and a predetermined pitch P
A plurality (m) of grooves Gi parallel to each other with x are formed in the lateral direction. Next, the optical fiber 1 is inserted into these V-shaped grooves Gi.
Are inserted and juxtaposed, and a one-dimensional optical fiber array Rj is once manufactured. The plurality of (n) one-dimensional arrays R ₁ , R ₂ ,..., R _n thus manufactured are joined together and sequentially stacked in the vertical direction, so that the optical fibers 1 are arranged in a matrix (m). A two-dimensional optical fiber array arranged in (row n column) is manufactured.

In the two-dimensional optical fiber array device shown in FIG. 1 manufactured as described above, the V-shaped groove Gi can be accurately formed on each substrate Sj at the first stage of forming the V-shaped groove Rj. Therefore, the desired size and accuracy can be obtained without any problem for the lateral groove pitch Px.

In general, it is desired that two-dimensional optical fiber array devices have optical fibers arranged as densely as possible. At present, for example, those in which optical fibers are arranged vertically and horizontally at a pitch of 250 μm are widely used. It is used.
However, in the thickness Tj of the substrate Sj, which is a factor that determines the vertical pitch Py of the two-dimensional optical fiber array in FIG. 1, a one-dimensional structure in which the V-shaped groove Gi is formed on the substrate Sj and the optical fibers 1 are juxtaposed. In order to manufacture the fiber array Rj, a certain size of, for example, about 500 μm is required from the viewpoint of workability and accuracy. Therefore, it is difficult to stack the substrates Sj to obtain a shorter vertical interval that matches such a desired pitch.

The vertical pitch Py of the two-dimensional optical fiber array device shown in FIG.
_1, R _2, ..., since R _n are stacked, can not be obtained in principle sufficiently good accuracy. That is, although the bonding between the substrates Sj is performed by bonding only by contacting the super-cleaning surface without using an adhesive, there is not much problem with the accuracy deterioration, but rather, the bonding of each substrate Sj is performed. The accuracy of the thickness Tj is a bigger problem. Then, even if the accuracy of the thickness Tj of each substrate Sj is increased, it is difficult to obtain a desired accuracy in the vertical pitch Py because it necessarily involves a cumulative error.

In the two-dimensional optical fiber array device shown in FIG. 2, a single optical fiber 1 is inserted through a ferrule Fij to produce a single array element Eij having a single-core optical fiber. Then, the plurality of array elements R ₁₁ , R ₂₁ ,..., R _m1 ; R ₁₂ , R
_{22, ..., R m2; ...} ; R 1n, R 2n, ..., R mn is by being juxtaposed vertically and horizontally within the frame FR, 2-dimensional array of optical fibers 1 are arranged in a matrix is configured .

In the two-dimensional optical fiber array device of FIG. 2 configured as described above, each array element Eij is
The outer diameter φij of each ferrule Fij itself has a tolerance. Therefore, when these array elements Eij are stacked in contact with each other, the respective tolerances are also accumulated. As the number of juxtaposed cores of the optical fiber 1 increases, it becomes very difficult to obtain good pitch accuracy. come.

[0008]

SUMMARY OF THE INVENTION Accordingly, it is a primary object of the present invention to provide a two-dimensional optical fiber array device which realizes a high-density arrangement of optical fibers with high accuracy.

[0009]

SUMMARY OF THE INVENTION According to the present invention, a plurality of ceramic plates having a plurality of holes are stacked with their holes aligned, and a plurality of through holes are formed by these holes. This problem is solved by a two-dimensional optical fiber array device including a ceramic plate laminate and an optical fiber fixed to the ceramic plate laminate and inserted into the through hole.

[0010] According to the present invention, there is provided a method of preparing at least two ceramic plates having a plurality of holes formed two-dimensionally at a predetermined pitch. A step of inserting a plurality of linear bodies having the same diameter or a different diameter from the optical fiber into the holes, inserting the linear bodies into corresponding holes of another ceramics plate, and inserting a plurality of ceramics plates into the holes. A step of assembling a ceramics plate laminated body in which a plurality of through holes are formed by sequentially laminating the ceramics plate in a state where the holes are aligned, and the holes of the ceramics plate are communicated with each other. Removing the body, inserting the optical fiber into the through hole, and fixing the optical fiber and the ceramic plate laminate, and polishing and aligning the end faces of the optical fiber and the ceramic plate laminate. It is solved by a method for manufacturing a fiber array apparatus.

According to the present invention, as described above, the position of the through-hole of the ceramics plate laminate into which the optical fiber is inserted is:
Each of a plurality of ceramic plates serving as constituent elements of the ceramic plate laminate is strictly defined by a plurality of holes formed in advance with extremely high precision, so that the precision of the arrangement pitch of the optical fibers is greatly improved. be able to.

Further, according to the present invention, a method of laminating a plurality of ceramic plates in which a plurality of holes are formed with high precision in advance in the through-hole direction so that these holes communicate with each other correspondingly. Therefore, the two-dimensional optical fiber array device can be assembled accurately and easily.

Other features and advantages of the present invention can be more clearly understood from the following description made with reference to the accompanying drawings, in which:
It is not limited at all by these descriptions, but only by the provisions of the claims.

[0014]

FIG. 3 is a schematic front perspective view of a two-dimensional optical fiber array device according to an embodiment of the present invention. The optical fiber 1 is inserted into a hole that penetrates the ceramic plate laminate 2 and is fixed in the ceramic plate laminate 2. This ceramic plate laminated body 2 is formed by laminating at least two ceramic plates 2a, 2b, 2c,..., 2n, 2o each having a plurality of two-dimensionally extending holes formed therein in the direction in which the through holes pass. Is done. Therefore, the optical fiber 1 is inserted into the through hole formed by connecting these holes by this lamination.

Each of the ceramic plates 2a, 2b,...
Typically, it is made of a ferrule material such as zirconia which is often used as a ferrule at present, but materials such as alumina, SiC, beryllia resin, and forsterite can also be used. In FIG. 4, the structure of the ceramic plates 2a, 2b,.
a. As can be seen from these figures, these ceramic plates 2a, 2b,..., 2o have a thickness to which drilling with a laser or the like can be applied, for example, a plate thickness Dz of about 0.1 to 1 mm. , A plurality of holes (Hij) are formed.

The holes (Hij) are typically formed at a predetermined pitch Px, Py in the horizontal and vertical directions by a high-precision and high-efficiency laser processing method such as an excimer laser. Are formed with extremely high precision so as to be separated from each other. The inner diameter of these holes (Hij) corresponds to the diameter of the processing laser.
μm (+0.5 to 2 μm). In order to form such a hole, a laser processing method of YAG, glass (a type of YAG), CO ₂ , ruby, semiconductor, or the like can be used, if necessary, in addition to the excimer laser.
Ruby and semiconductor laser processing methods are somewhat inferior in power.

These ceramic plates 2a, 2b,..., 2o in which a plurality of holes (Hij) are formed with high precision as described above.
Are laminated so that the total lamination thickness D becomes a thickness necessary for fixing the optical fiber 1. Therefore, these ceramics plates 2a, 2b,
, 2o are formed with high precision through holes in which the corresponding holes communicate with each other, and the optical fiber 1 is inserted into these through holes and fixed to the ceramic plate laminate 2 by an appropriate fixing means.

In order to fix the optical fiber 1 to the ceramics laminate 2, the hole diameter of a predetermined ceramics plate is made very slightly larger, for example, by using the first and final ceramics plates 2.
The holes a, 2o are previously set in the other ceramics plates 2b, 2c,
..., the inner diameter is formed to be slightly larger than the 2n hole, and a method of fixing the optical fiber 1 with an adhesive or the like only at the large diameter portion is adopted. Thus, it is preferable that the optical fiber 1 is fixed to a predetermined ceramic plate. Of course, other suitable fixing methods may be used.

FIGS. 5 and 6 show steps of implementing one method for producing such a two-dimensional optical fiber array device. One method for fabricating a two-dimensional optical fiber array device will be described with reference to FIGS.

First, as described above, at least two ceramic plates 2a, 2b, 2c made of a material such as zirconia, alumina, SiC, beryllia resin, forsterite and having a thickness of, for example, about 0.1 to 1 mm. ,
, 2n, 2o are prepared. These ceramic boards 2
a, 2b,..., 2o have a disk shape or a wafer shape in FIG. 4 (in this figure, the ceramics plate 2a is representatively shown), but are not limited to such shapes. Any shape such as an ellipse or a rectangle (square or rectangle) can be used as needed.

These prepared ceramic plates 2a, 2a
Each of b,..., 2o is drilled from one surface by an excimer laser as described above. Alternatively, high-precision and high-efficiency laser processing (for example, laser processing of YAG, glass, CO ₂ , ruby, semiconductor, or the like described above) that can replace the excimer processing is performed. By such high-precision laser processing, FIG.
As shown in the figure, 125μ
A hole (Hij) having an inner diameter of about m (+0.5 to 2 μm)
It is formed with high precision at predetermined pitches Px and Py in the horizontal and vertical directions.

In this way, ceramic plates 2a, 2b,..., 2o in which a plurality of holes (Hij) are finely formed are obtained. Next, the first ceramics plate 2a is taken out of these ceramics plates, and as shown in FIG. 5A, a plurality of linear members 3 are inserted into a plurality of holes formed in the ceramics plate 2a. Is inserted. These linear bodies 3 have an outer diameter equal to the optical fiber 1 to be finally inserted, and a length sufficiently larger than the thickness D required to fix the optical fiber 1, and have a predetermined rigidity and 5 out of a plurality of holes (Hij) formed in advance, preferably made of a material such as metal having strength.
And if necessary, more than four (for example, all) holes are inserted.

Then, another ceramics plate 2b is taken out, and a plurality of linear members 3 penetrating the first ceramics plate 2a are inserted into a plurality of holes corresponding to the ceramics plate 2b. The ceramic plate 2b is laminated with the linear members 3 serving as guides in a state where the holes are aligned with the first ceramic plate 2a. Still another ceramic plate 2c is taken out, and similarly, both ceramic plates 2a,
Using the plurality of linear bodies 3 penetrating through 2b as guides,
Both ceramic plates 2 on which the ceramic plates 2c are laminated
The work of further laminating on a and 2b is performed.

This laminating operation is repeated until the thickness D becomes sufficient to fix the optical fiber 1, and at least two ceramic plates 2a, 2b, 2
.., 2n, 2o are laminated with the hole positions aligned, and the ceramics plate laminate 2 is assembled.

These ceramic plates 2a, 2
, 2o are ceramic plates 2b, 2c,.
Each time they are successively stacked, they are fixed to each other in such a way that the surfaces are directly joined or bonded via an adhesive, so that they are fixed one after another. Can be. However, instead of such a sequential fixing method, after all the ceramic plates 2a, 2b,..., 2o are laminated to a predetermined thickness D, these ceramic plates are collectively pressurized or heated and joined / fixed. You can also.

When the ceramic plate laminate 2 is assembled in this manner, the laminated ceramic plates 2b, 2c,.
The linear body 3 used as a guide for 2o is pulled out of the ceramic plate laminate 2. Thereafter, as shown in FIG. 6, a plurality of through-holes are formed in the ceramics plate laminate 2 from which the linear members 3 have been drawn out by mutually communicating the holes of the ceramics plates 2a, 2b,. Therefore, the optical fiber 1 is inserted into these through holes, and is fixed to the ceramic plate laminate 2.

To fix the optical fiber 1 to the ceramic plate laminate 2, any method can be adopted as necessary. For example, as described above, the first and final ceramic plates 2a and 2o can be fixed. The holes are made in advance with the other ceramics plates 2b, 2
The optical fiber 1 is formed so as to have a slightly larger inner diameter than the holes c,..., 2n, and by fixing the optical fiber 1 with an adhesive or the like at the large diameter portion. It can be fixed to a predetermined ceramic plate.

After the optical fiber 1 is fixed to the ceramic plate laminate 2, the end face of the ceramic plate laminate 2 and the end face of the optical fiber 1 are polished by a well-known method, and the end face shapes are made uniform. .

The above-described method is merely one method for realizing the two-dimensional optical fiber array device of the present invention, and can be variously modified without departing from the spirit. . For example, each ceramic plate 2
The plate thicknesses Dz and materials of a, 2b,..., 2o do not need to be equal to each other, and can be changed as necessary.

As shown in FIG. 7, a ceramic in which at least two holes Ha, Hb, Hc, Hd of the same diameter or different diameters are opened outside the matrix of holes Hij where the optical fibers 1 are usually arranged. The plates 2a, 2b, ..., 2o can also be used. In this case, a through-hole formed by the hole Hij in the matrix is formed with a linear body 3 having the same diameter or a different diameter as the optical fiber 1 such as a metal wire inserted into the through-hole formed by the holes Ha to Hd. After the optical fiber 1 is inserted through the optical fiber 1 and the optical fiber is inserted and fixed, the linear body 3 is pulled out, thereby facilitating the operation.

[0031]

As described above, according to the present invention, a plurality of holes are formed in advance in each of a plurality of ceramic plates with extremely high accuracy, and the ceramic plates are laminated on each other. Since the optical fiber is inserted into the through hole formed by communicating the hole with the body, it is possible to provide a two-dimensional optical fiber array device in which the arrangement pitch of the optical fibers is set with high precision and high density.

According to the present invention, the holes are communicated with each other in correspondence with each other by a method of simply stacking a plurality of ceramics plates as they are in a direction in which the holes penetrate using a linear body such as a metal wire as a guide. Since the through holes of the fibers are formed with high precision, a two-dimensional optical fiber array device with good precision can be easily assembled.

[Brief description of the drawings]

FIG. 1 is a front view schematically showing a two-dimensional optical fiber array device according to the related art.

FIG. 2 is a front view schematically showing another two-dimensional optical fiber array device according to the prior art.

FIG. 3 is a front perspective view schematically showing a two-dimensional optical fiber array device according to an embodiment of the present invention.

FIG. 4 is a diagram showing an example of a ceramics plate used in the two-dimensional optical fiber array device of the present invention.

FIG. 5 is a diagram schematically showing a first half of a method of manufacturing a two-dimensional optical fiber array device according to one embodiment of the present invention.

FIG. 6 is a view schematically showing a latter half of a method of manufacturing a two-dimensional optical fiber array device according to one embodiment of the present invention.

FIG. 7 is a diagram schematically illustrating an example of a modified two-dimensional optical fiber array device manufacturing method according to the present invention.

[Explanation of symbols]

Sj A substrate having a thickness Tj, Gj a plurality of (m) grooves formed at a horizontal pitch Py, a Rj a plurality (n) one-dimensional array, a Px vertical pitch, an Eij array element, and a Fij outer diameter φij. , FR frame, holes formed in the Hij matrix, holes formed outside the Ha-Hd matrix, 1 optical fiber, 2 ceramic plate laminate having a total laminate thickness D, 2a, 2b, 2c,. 2n, 2o Ceramics plate having a plate thickness Dz, 3 Linear body (metal wire).

Claims (8)

[Claims] 1. A plurality of ceramic plates (2a, 2b, 2c,..., 2n, 2o) having a plurality of holes (Hij) are stacked with their hole positions aligned, and a plurality of through holes are formed by these holes. A two-dimensional optical fiber, comprising: a ceramic plate laminate (2) on which is formed; and an optical fiber (1) fixed to the ceramic plate laminate (2) and inserted through the through hole. Array device. 2. The two-dimensional optical fiber array device according to claim 1, wherein the plurality of holes in the ceramic plate (Hij) are formed by excimer laser. 3. A plurality of holes (Hij) having a predetermined pitch (Px,
Py), a step of preparing at least two ceramic plates (2a, 2b, 2c,..., 2n, 2o) formed two-dimensionally, a plurality of holes formed in the first ceramic plate (2a). (Hij or Ha-Hd) through which a plurality of linear bodies (3) having the same diameter or different diameters as the optical fiber (1) are inserted, and the linear bodies (3) are inserted into another ceramic plate (2b). , 2c,
. 2o), and a plurality of ceramic plates (2a, 2b,..., 2o) are sequentially laminated with their holes aligned, and the holes of these ceramic plates communicate with each other. Assembling a ceramic plate laminate (2) having a plurality of through-holes formed therein, extracting the linear body (3) from the ceramic plate laminate (2), and removing the optical fiber (1). A step of inserting the optical fiber into the through-hole and fixing it to the ceramic plate laminate (2); and a step of polishing and aligning end faces of the optical fiber (1) and the ceramic plate laminate (2). A method for manufacturing a two-dimensional optical fiber array device. 4. The ceramic plate (2a, 2b,..., 2)
4. The method for manufacturing a two-dimensional optical fiber array device according to claim 3, wherein the plurality of holes (Hij) of (o) are formed by an excimer laser. 5. In the step of assembling the ceramic plate laminate (2), another ceramic plate (2b, 2c,
The method for manufacturing a two-dimensional optical fiber array device according to claim 3, wherein ..., 2o) are sequentially bonded and fixed as they are stacked. 6. In the step of assembling the ceramic plate laminate (2), all the ceramic plates (2a, 2b,.
5. The method for manufacturing a two-dimensional optical fiber array device according to claim 3, wherein after o) is stacked and fixed together. 7. The method for manufacturing a two-dimensional optical fiber array device according to claim 3, wherein said linear body (3) is a metal wire. 8. In the step of fixing the optical fibers (1) to the ceramics plate laminate (2), these optical fibers (1) are connected to a first ceramics plate (2a) and a ceramics laminated last. 8. The device according to claim 3, wherein the adhesive is fixed only to the plate (2 o). 9.
A method for manufacturing a two-dimensional optical fiber array device.