JPH1026586A - Method and apparatus for observing sample - Google Patents

Method and apparatus for observing sample

Info

Publication number
JPH1026586A
JPH1026586A JP18068896A JP18068896A JPH1026586A JP H1026586 A JPH1026586 A JP H1026586A JP 18068896 A JP18068896 A JP 18068896A JP 18068896 A JP18068896 A JP 18068896A JP H1026586 A JPH1026586 A JP H1026586A
Authority
JP
Japan
Prior art keywords
sample
light
wavelength
cut surface
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18068896A
Other languages
Japanese (ja)
Other versions
JP3623602B2 (en
Inventor
Toshiro Higuchi
俊郎 樋口
Kenichi Kudo
謙一 工藤
Hideo Yokota
秀夫 横田
Yoshichika Fukuda
祥愼 福田
Mitsunori Kokubo
光典 小久保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON BEROO KK
Kanagawa Academy of Science and Technology
Japan Science and Technology Agency
Shibaura Machine Co Ltd
Original Assignee
NIPPON BEROO KK
Kanagawa Academy of Science and Technology
Research Development Corp of Japan
Toshiba Machine Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON BEROO KK, Kanagawa Academy of Science and Technology, Research Development Corp of Japan, Toshiba Machine Co Ltd filed Critical NIPPON BEROO KK
Priority to JP18068896A priority Critical patent/JP3623602B2/en
Publication of JPH1026586A publication Critical patent/JPH1026586A/en
Application granted granted Critical
Publication of JP3623602B2 publication Critical patent/JP3623602B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Sampling And Sample Adjustment (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method capable of observing a sample to observe cut surface and structure of the sample in more details. SOLUTION: Wavelengths of a light emitted to a cut surface of a sample S are selected by first and second light wavelength selectors 2, 4, and imaged by a camera 5 while selecting the wavelength of the light incident on the camera 5 by a third light wavelength selector 6, and hence four image data responsive to the selectors are stored for one sample cut surface. Thus, the cut surface can be observed in more details by utilizing the four data obtained at the respective cut surfaces. A three-dimensional stereoscopic structure of the sample is accurately constructed from these data, and the structure can be accurately observed in detail.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、医療分野における
病理検査,製薬分野における毒性検査,食品分野におけ
る食品検査,農業分野における農作物検査や植物構造解
析,生物分野における生体試料検査等に有用な試料観察
方法及びその装置に関し、特に試料切断面を撮像して得
た画像データに基づいて試料観察を行う試料観察方法及
びその装置に関するものである。
The present invention relates to a sample useful for pathological examination in the medical field, toxicity test in the pharmaceutical field, food inspection in the food field, agricultural crop inspection and plant structure analysis in the agricultural field, biological sample inspection in the biological field, and the like. The present invention relates to an observation method and an apparatus therefor, and more particularly to a sample observation method and an apparatus for observing a sample based on image data obtained by imaging a sample cut surface.

【0002】[0002]

【従来の技術】従来、この種の試料観察には、観察対象
となる試料を切断し、白色光を照射しながら試料切断面
をCCDカメラにより撮像して画像データを記憶し、該
画像データを観察可能なデータに処理してから、試料切
断面や試料構造をモニターに表示する通常観察法が一般
に採用されている。
2. Description of the Related Art Conventionally, in this type of sample observation, a sample to be observed is cut, a sample cut surface is imaged by a CCD camera while irradiating white light, image data is stored, and the image data is stored. A normal observation method of processing a sample cut surface or a sample structure on a monitor after processing the data into observable data is generally adopted.

【0003】また、観察対象となる試料を蛍光染料で予
め染色し、該蛍光染料が励起される特定波長光を試料切
断面に照射することで、試料内部の微細物質や器官や病
原体や癌等を観察する蛍光観察法も知られている。
[0003] Further, a sample to be observed is pre-stained with a fluorescent dye, and light of a specific wavelength at which the fluorescent dye is excited is irradiated on a cut surface of the sample, so that fine substances, organs, pathogens, cancer, etc., inside the sample are observed. There is also known a fluorescence observation method for observing the image.

【0004】[0004]

【発明が解決しようとする課題】しかし、上記従来の観
察方法では、何れも1つの試料切断面に対して1つの画
像データを得ているだけなので、試料切断面毎に得られ
た画像データを如何様に処理しても、試料切断面や試料
構造を今以上詳細に観察することができない。
However, in the conventional observation methods described above, since only one image data is obtained for one sample cut surface, the image data obtained for each sample cut surface is obtained. No matter how the treatment is performed, it is not possible to observe the sample cut surface and the sample structure in more detail than ever.

【0005】本発明は上記事情に鑑みてなされたもの
で、その目的とするところは、試料切断面や試料構造を
より詳細に観察できる試料観察方法と、この方法実施に
好適な試料観察装置を提供することにある。
The present invention has been made in view of the above circumstances. It is an object of the present invention to provide a sample observation method capable of observing a sample cut surface and a sample structure in more detail, and a sample observation apparatus suitable for implementing the method. To provide.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するた
め、本発明に係る試料観察方法は、請求項1に記載のよ
うに、試料切断面を照明しながら撮像手段により撮像し
て画像データを記憶し、該画像データに基づいて試料観
察を行う試料観察方法において、試料切断面に照射され
る光の波長と撮像手段に入射される光の波長の一方を選
択しながら撮像を行うことにより、1つの試料切断面に
対して波長選択数に応じた複数の画像データを記憶す
る、ことをその主たる特徴としている。
According to a first aspect of the present invention, there is provided a method for observing a sample, the method comprising the steps of: In a sample observation method of storing and observing a sample based on the image data, by performing imaging while selecting one of a wavelength of light applied to the sample cut surface and a wavelength of light incident on the imaging unit, The main feature is that a plurality of image data corresponding to the number of selected wavelengths is stored for one sample cut surface.

【0007】また、請求項2に記載のように、試料切断
面を照明しながら撮像手段により撮像して画像データを
記憶し、該画像データに基づいて試料観察を行う試料観
察方法において、試料切断面に照射される光の波長と撮
像手段に入射される光の波長を選択しながら撮像を行う
ことにより、1つの試料切断面に対して波長選択数に応
じた複数の画像データを記憶する、ことをその主たる特
徴としている。
According to a second aspect of the present invention, there is provided a sample observing method in which an image is taken by an image pickup means while illuminating a cut surface of a sample, image data is stored, and the sample is observed based on the image data. By performing imaging while selecting the wavelength of light applied to the surface and the wavelength of light incident on the imaging unit, a plurality of image data corresponding to the number of wavelength selections is stored for one sample cut surface, That is its main feature.

【0008】これらの試料観察方法によれば、試料切断
面に照射される光の波長と撮像手段に入射される光の波
長の少なくとも一方を選択しながら撮像を行い、1つの
試料切断面に対して波長選択数に応じた複数の画像デー
タを記憶することにより、各切断面毎に得た複数の画像
データを利用して切断面観察及び構造観察をより詳細に
実施できる。
According to these sample observation methods, imaging is performed while selecting at least one of the wavelength of light irradiated on the sample cut surface and the wavelength of light incident on the image pickup means, and one sample cut surface is obtained. By storing a plurality of image data corresponding to the number of selected wavelengths, the cut surface observation and the structure observation can be performed in more detail using the plurality of image data obtained for each cut surface.

【0009】一方、本発明に係る試料観察装置は、請求
項6に記載のように、試料切断面を照明する照明手段
と、試料切断面を撮像する撮像手段と、撮像手段で得ら
れた画像データを記憶する記憶手段と、画像データを観
察可能なデータに処理するデータ処理手段とを備えた試
料観察装置において、試料切断面に照射される光の波長
と撮像手段に入射される光の波長の一方を選択する光波
長選択手段と、波長選択毎に撮像手段による撮像を実施
して1つの試料切断面に対して波長選択数に応じた複数
の画像データを記憶させる撮像制御手段とを具備した、
ことをその主たる特徴としている。
According to a sixth aspect of the present invention, there is provided a sample observation apparatus, comprising: an illuminating means for illuminating a sample cut surface; an imaging means for imaging the sample cut surface; and an image obtained by the imaging means. In a sample observation device including a storage unit for storing data and a data processing unit for processing image data into observable data, a wavelength of light irradiated on a sample cut surface and a wavelength of light incident on an imaging unit. Light wavelength selecting means for selecting one of the above, and imaging control means for performing imaging by the imaging means for each wavelength selection and storing a plurality of image data corresponding to the number of wavelength selections for one sample cut surface. did,
That is its main feature.

【0010】また、請求項7に記載のように、試料切断
面を照明する照明手段と、試料切断面を撮像する撮像手
段と、撮像手段で得られた画像データを記憶する記憶手
段と、画像データを観察可能なデータに処理するデータ
処理手段とを備えた試料観察装置において、試料切断面
に照射される光の波長と撮像手段に入射される光の波長
を選択する光波長選択手段と、波長選択毎に撮像手段に
よる撮像を実施して1つの試料切断面に対して波長選択
数に応じた複数の画像データを記憶させる撮像制御手段
とを具備した、ことをその主たる特徴としている。
According to a seventh aspect of the present invention, there is provided an illuminating means for illuminating a cut surface of a sample, an imaging means for imaging the cut surface of the sample, a storage means for storing image data obtained by the imaging means, In a sample observation device including a data processing unit that processes data into observable data, a light wavelength selection unit that selects a wavelength of light irradiated on the sample cut surface and a wavelength of light incident on the imaging unit, The main feature of the present invention is that an imaging control unit is provided for performing imaging by the imaging unit for each wavelength selection and storing a plurality of image data corresponding to the number of selected wavelengths on one sample cut surface.

【0011】これらの試料観察装置によれば、光波長選
択手段によって試料切断面に照射される光の波長と撮像
手段に入射される光の波長の少なくとも一方を選択しな
がら、撮像制御手段によって波長選択毎に撮像手段によ
る撮像を実施して1つの試料切断面に対して波長選択数
に応じた複数の画像データを記憶させることにより、請
求項1及び2に記載した試料観察方法を好適に実施でき
る。
According to these sample observation devices, the image wavelength control means selects at least one of the wavelength of the light irradiated on the sample cut surface and the wavelength of the light incident on the image pickup means, and the image control means selects the wavelength. The sample observation method according to claim 1 or 2, is preferably performed by performing imaging by an imaging unit for each selection and storing a plurality of image data corresponding to the number of selected wavelengths on one sample cut surface. it can.

【0012】[0012]

【発明の実施の形態】図1には本発明を適用した試料観
察装置の概略構成を示してある。図中の1は第1の光
源、2は第1の光波長選択器、3は第2の光源、4は第
2の光波長選択器、5は二次元CCDを内蔵したカメ
ラ、6は第3の光波長選択器、7はハーフミラー(この
ハーフミラーは光の透過波長を制限可能なダイクロイッ
クミラーでもよい)、8は対物レンズ、9は間接照明
器、10は試料載置テーブル、Sは試料、11は撮像制
御部、12は光波長選択制御部、13は主制御部、14
はモニターである。
FIG. 1 shows a schematic configuration of a sample observation apparatus to which the present invention is applied. In the figure, 1 is a first light source, 2 is a first light wavelength selector, 3 is a second light source, 4 is a second light wavelength selector, 5 is a camera with a built-in two-dimensional CCD, and 6 is a second light source. Reference numeral 3 denotes an optical wavelength selector, 7 denotes a half mirror (this half mirror may be a dichroic mirror that can limit the transmission wavelength of light), 8 denotes an objective lens, 9 denotes an indirect illuminator, 10 denotes a sample mounting table, and S denotes A sample, 11 an imaging controller, 12 an optical wavelength selection controller, 13 a main controller, 14
Is a monitor.

【0013】第1の光波長選択器2は、光通過孔を有す
る本体2aと、該本体2aに一部を挿入した状態で回転
自在に軸支された円盤状のフィルタ支持板2bと、フィ
ルタ支持板2bを回転駆動するエンコーダ付きのサーボ
モータ2cとから構成されている。フィルタ支持板2b
には、図2(a)に示すように、円形のフィルタ支持孔
2b1が周方向に45度間隔で計8個形成されており、
これら支持孔2b1には、試料Sの染色に用いられる4
種類の蛍光染料を個別に励起できる波長光(λF1〜λ
F4)を透過可能な4種類の光学フィルタF1〜F4
が、周方向に2組並ぶように装着されている。
The first optical wavelength selector 2 comprises a main body 2a having a light passage hole, a disk-shaped filter support plate 2b rotatably supported with a part inserted in the main body 2a, and a filter. And a servo motor 2c with an encoder that rotationally drives the support plate 2b. Filter support plate 2b
As shown in FIG. 2 (a), a total of eight circular filter support holes 2b1 are formed at intervals of 45 degrees in the circumferential direction.
These support holes 2b1 are provided with 4 holes used for staining the sample S.
Wavelength light (λF1 to λ
F4) Four types of optical filters F1 to F4 that can transmit light
Are mounted so as to be arranged in two sets in the circumferential direction.

【0014】第2の光波長選択器4は、第1の光波長選
択器2と同様に、光通過孔を有する本体4aと、該本体
4aに一部を挿入した状態で回転自在に軸支された円盤
状のフィルタ支持板4bと、フィルタ支持板4bを回転
駆動するエンコーダ付きのサーボモータ4cとから構成
されている。フィルタ支持板4bには、図2(a)に示
すように、円形のフィルタ支持孔4b1が周方向に45
度間隔で計8個形成されており、これら支持孔2b1に
は、第1の光波長選択器2と同じ光学フィルタF1〜F
4が、周方向に2組並ぶように装着されている。
Similarly to the first optical wavelength selector 2, the second optical wavelength selector 4 has a main body 4a having a light passage hole, and a rotatably supported shaft with a part inserted into the main body 4a. And a disk-shaped filter support plate 4b, and a servomotor 4c with an encoder that rotationally drives the filter support plate 4b. As shown in FIG. 2A, a circular filter support hole 4b1 is formed in the filter support plate 4b in the circumferential direction.
The support holes 2b1 have the same optical filters F1 to F1 as the first optical wavelength selector 2.
4 are mounted so as to be arranged in two sets in the circumferential direction.

【0015】第3の光波長選択器6は、第1の光波長選
択器2と同様に、光通過孔を有する本体6aと、該本体
6aに一部を挿入した状態で回転自在に軸支された円盤
状のフィルタ支持板6bと、フィルタ支持板6bを回転
駆動するエンコーダ付きのサーボモータ6cとから構成
されている。フィルタ支持板6bには、図2(b)に示
すように、円形のフィルタ支持孔6b1が周方向に45
度間隔で計8個形成されており、これら支持孔6b1に
は、第1,第2の光波長選択器2,4とは異なる光学フ
ィルタf1〜f4、つまり、試料Sの染色に用いられる
4種類の蛍光染料を励起したときに発せられる光の波長
(λf1〜λf4)を透過可能な4種類の光学フィルタ
f1〜f4が、周方向に2組並ぶように装着されてい
る。
Similarly to the first optical wavelength selector 2, the third optical wavelength selector 6 includes a main body 6a having a light passage hole, and a rotatably supported shaft with a part inserted into the main body 6a. A disk-shaped filter support plate 6b and a servomotor 6c with an encoder for driving the filter support plate 6b to rotate. As shown in FIG. 2B, a circular filter support hole 6b1 is formed in the filter support plate 6b in the circumferential direction.
The support holes 6b1 have optical filters f1 to f4 different from the first and second optical wavelength selectors 2 and 4, that is, four filters 4 to be used for staining the sample S. Four types of optical filters f1 to f4 capable of transmitting the wavelengths (λf1 to λf4) of light emitted when exciting various types of fluorescent dyes are mounted so as to be arranged in two sets in the circumferential direction.

【0016】これら第1,第2,第3の光波長選択器
2,4,6では、サーボモータ2c,4c,6cにより
フィルタ支持板2b,4b,6bを45度角で回転させ
ることによって、光学フィルタF1〜F4またはf1〜
f4の1つを本体2aの光通過孔に一致させることがで
きる。
In these first, second, and third optical wavelength selectors 2, 4, and 6, the filter support plates 2b, 4b, and 6b are rotated by 45 degrees by servo motors 2c, 4c, and 6c. Optical filters F1-F4 or f1-
One of f4 can be matched with the light passage hole of the main body 2a.

【0017】第1の光源1は直接照明用のもので、白色
光を出射する水銀灯等の電球を内部に備えており、内面
光沢管や光ファイバ等の光伝搬路を通じて白色光を第1
の光波長選択器2に入射する。第1の光波長選択器2を
通過した光は同様の光伝搬路を通じてハーフミラー7に
入射される。
The first light source 1 is for direct illumination and includes a light bulb such as a mercury lamp that emits white light therein. The first light source 1 emits white light through a light propagation path such as an inner gloss tube or an optical fiber.
To the optical wavelength selector 2. Light that has passed through the first optical wavelength selector 2 is incident on the half mirror 7 through a similar light propagation path.

【0018】第2の光源3は間接照明用のもので、白色
光を出射する水銀灯等の電球を内部に備えており、内面
光沢管や光ファイバ等の光伝搬路を通じて白色光を第2
の光波長選択器4に入射する。第2の光波長選択器4を
通過した光は同様の光伝搬路を通じて、対物レンズ8の
下端部周囲に配置された間接照明器9に入射される。こ
の間接照明器9は光透過材料からリング状に形成され、
光入射によって全体を同色に発光し、試料Sの切断面を
対物レンズ8の周囲から間接的に照明する。
The second light source 3 is for indirect illumination and includes a light bulb such as a mercury lamp that emits white light therein. The second light source 3 emits white light through a light propagation path such as an inner gloss tube or an optical fiber.
To the optical wavelength selector 4. The light that has passed through the second light wavelength selector 4 is incident on an indirect illuminator 9 disposed around the lower end of the objective lens 8 through a similar light propagation path. The indirect illuminator 9 is formed in a ring shape from a light transmitting material,
The entire surface emits light of the same color by light incidence, and the cut surface of the sample S is indirectly illuminated from around the objective lens 8.

【0019】撮像制御部11は、メモリ及びCPU等を
備えており、主制御部13からの撮像信号を受けてカメ
ラ5による撮像を実施しカメラ5で得られた画像データ
をメモリに記憶すると共に、記憶された画像データに対
し領域分割,輪郭変形処理,特徴抽出,合成等のデータ
処理を施す。
The image pickup control section 11 includes a memory, a CPU, and the like. The image pickup control section 11 receives an image pickup signal from the main control section 13, performs image pickup by the camera 5, stores image data obtained by the camera 5 in the memory, and Then, data processing such as area division, contour deformation processing, feature extraction, and synthesis is performed on the stored image data.

【0020】光波長選択制御部12は、サーボモータ用
の駆動回路等を備えており、主制御部13からの波長切
替信号を受けて各光波長選択器2,4,6によるフィル
タ切り替えを実施する。
The optical wavelength selection control unit 12 includes a drive circuit for a servo motor, and receives a wavelength switching signal from the main control unit 13 to execute filter switching by each of the optical wavelength selectors 2, 4, and 6. I do.

【0021】主制御部13は、メモリ及びCPU等を備
えており、観察制御のプログラムに従って撮像制御部1
1及び光波長選択制御部12に制御信号を送出し、切断
面撮像とフィルタ切り替えを実施する共に、必要な処理
データを撮像制御部11から取り込んで試料Sの切断面
画像や3次元画像をモニター14に表示する。
The main control unit 13 includes a memory, a CPU, and the like, and controls the imaging control unit 1 according to a program for observation control.
1 and a control signal to the optical wavelength selection control unit 12 to perform cut plane imaging and filter switching, and also obtain necessary processing data from the imaging control unit 11 to monitor a cut plane image or a three-dimensional image of the sample S. 14 is displayed.

【0022】試料Sは、医療分野,製薬分野,食品分
野,農業分野,生物分野等から適宜選択されたもので、
異なる波長の光(光学フィルタF1〜F4を透過した波
長光λF1〜λF4)それぞれで励起される4種類の蛍
光染料によって予め染色されている。試料Sとして柔ら
かいもの、例えば生物,植物,食品等を用いる場合に
は、綺麗な切断面を得るためにこれら試料は加熱,酸素
遮断,時間経過等の手法によって染色後に固形化処理さ
れる。
The sample S is appropriately selected from the medical field, pharmaceutical field, food field, agricultural field, biological field, etc.
It is dyed in advance by four kinds of fluorescent dyes which are excited by lights of different wavelengths (wavelength lights λF1 to λF4 transmitted through the optical filters F1 to F4). When a soft material such as an organism, a plant, or a food is used as the sample S, these samples are subjected to a solidification treatment after dyeing by a method such as heating, oxygen cutoff, and passage of time in order to obtain a clean cut surface.

【0023】以下に、上述の試料観察装置で実現される
試料観察方法について図3及び図4を参照して説明す
る。
Hereinafter, a sample observing method realized by the above-described sample observing apparatus will be described with reference to FIGS.

【0024】まず、観察対象となる試料Sを、回転式切
断刃やスライド式切断刃等を用いて図3に示す面Saで
切断し、その切断面Saが対物レンズ8に向き合うよう
にテーブル10に載置する。
First, a sample S to be observed is cut along a surface Sa shown in FIG. 3 using a rotary cutting blade or a slide cutting blade, and the table 10 is cut so that the cut surface Sa faces the objective lens 8. Place on.

【0025】次に、光波長選択制御部12によって各光
波長選択器2,4,6のフィルタ支持板2b,4b,6
bを同時に回転させて、第1,第2の光波長選択器2,
4では、4種類の蛍光染料の1つを励起する波長光λF
1を透過可能な光学フィルタF1を本体2a,4aの光
通過孔に一致させ、一方、第3の光波長選択器6では波
長光λF1を切断面Saに照射したときに励起された波
長光λf1を透過可能な光学フィルタf1を本体6aの
光通過孔に一致させると共に、撮像制御部11によって
カメラ5による撮像を実施する。
Next, the filter support plates 2b, 4b, 6 of the optical wavelength selectors 2, 4, 6 are controlled by the optical wavelength selection controller 12.
b at the same time, the first and second optical wavelength selectors 2,
4, wavelength light λF that excites one of the four types of fluorescent dyes
The optical filter F1 that can transmit the light 1 is matched with the light passing holes of the main bodies 2a and 4a, while the third light wavelength selector 6 emits the wavelength light λf1 excited when the wavelength light λF1 is irradiated on the cut surface Sa. The optical filter f1 capable of transmitting the light is made to coincide with the light passage hole of the main body 6a, and the imaging controller 11 performs imaging by the camera 5.

【0026】これにより、第1の光源1から出射された
白色光のうちλF1の波長光のみが第1の光波長選択器
2の光学フィルタF1を透過して、該波長光λF1がハ
ーフミラー7及び対物レンズ8を通じて試料Sの切断面
Saに照射されると共に、第2の光源3から出射された
白色光のうちλF1の波長光のみが第2の光波長選択器
4の光学フィルタF1を通過し、該波長光λF1が間接
照明器9を通じて試料Sの切断面Saに間接的に照射さ
れ、試料Sの切断面Saは波長光λF1で励起可能な蛍
光染料で染色された部分のみを蛍光発色する。
As a result, of the white light emitted from the first light source 1, only the wavelength light of λF1 passes through the optical filter F1 of the first optical wavelength selector 2, and the wavelength light λF1 is In addition, while being irradiated on the cut surface Sa of the sample S through the objective lens 8, only the wavelength light of λF1 out of the white light emitted from the second light source 3 passes through the optical filter F1 of the second optical wavelength selector 4. Then, the wavelength light λF1 is indirectly applied to the cut surface Sa of the sample S through the indirect illuminator 9, and the cut surface Sa of the sample S emits only a portion stained with a fluorescent dye that can be excited by the wavelength light λF1. I do.

【0027】切断面Saからの反射光、つまり、切断面
Saに照射された波長光λF1とこの波長光λF1で励
起された波長光λf1は、対物レンズ8及びハーフミラ
ー7を通じて第3の光波長選択器6の光学フィルタf1
に導かれ、反射光のうちλf1の波長光のみが光学フィ
ルタf1を透過してカメラ5に導かれる。
The reflected light from the cut surface Sa, that is, the wavelength light λF1 applied to the cut surface Sa and the wavelength light λf1 excited by the wavelength light λF1 are transmitted through the objective lens 8 and the half mirror 7 to the third light wavelength Optical filter f1 of selector 6
And only the wavelength light of λf1 of the reflected light is transmitted through the optical filter f1 and guided to the camera 5.

【0028】つまり、ここでは波長光λF1を切断面S
aに照射し、該波長光λF1で励起された光(波長光λ
f1)をカメラ5に導いて切断面Saを撮像し、この切
断面Saの画像(図4(a)の左端の画像)をメモリに
記憶する。
That is, here, the wavelength light λF1 is
a to the light excited by the wavelength light λF1 (wavelength light λF1).
f1) is guided to the camera 5 to capture an image of the cut surface Sa, and the image of the cut surface Sa (the image at the left end in FIG. 4A) is stored in the memory.

【0029】次に、光波長選択制御部12によって各光
波長選択器2,4,6のフィルタ支持板2b,4b,6
bを同時に回転させて、第1,第2の光波長選択器2,
4では、上記とは別の蛍光染料を励起する波長光λF2
を透過可能な光学フィルタF2を本体2a,4aの光通
過孔に一致させ、一方、第3の光波長選択器6では波長
光λF2を切断面Saに照射したときに励起された波長
光λf2を透過可能な光学フィルタf2を本体6aの光
通過孔に一致させると共に、撮像制御部11によってカ
メラ5による撮像を実施する。
Next, the filter support plates 2b, 4b, 6 of the respective optical wavelength selectors 2, 4, 6 are controlled by the optical wavelength selection controller 12.
b at the same time, the first and second optical wavelength selectors 2,
4, the wavelength light λF2 for exciting another fluorescent dye is used.
An optical filter F2 capable of transmitting light is matched with the light passage holes of the main bodies 2a and 4a, while the third optical wavelength selector 6 converts the wavelength light λf2 excited when the wavelength light λF2 is applied to the cut surface Sa. The transmissible optical filter f2 is made to coincide with the light passage hole of the main body 6a, and the imaging controller 11 performs imaging by the camera 5.

【0030】つまり、ここでは波長光λF2を切断面S
aに照射し、該波長光λF2で励起された光(波長光λ
f2)をカメラ5に導いて切断面Saを撮像し、この切
断面Saの画像(図4(a)の左から2番目の画像)を
メモリに記憶する。
That is, here, the wavelength light λF2 is
a to the light excited by the wavelength light λF2 (wavelength light λF2).
f2) is guided to the camera 5 to capture an image of the cut surface Sa, and the image of the cut surface Sa (the second image from the left in FIG. 4A) is stored in the memory.

【0031】次に、光波長選択制御部12によって各光
波長選択器2,4,6のフィルタ支持板2b,4b,6
bを同時に回転させて、第1,第2の光波長選択器2,
4では、上記とは別の蛍光染料を励起する波長光λF3
を透過可能な光学フィルタF3を本体2a,4aの光通
過孔に一致させ、一方、第3の光波長選択器6では波長
光λF3を切断面Saに照射したときに励起された波長
光λf3を透過可能な光学フィルタf3を本体6aの光
通過孔に一致させると共に、撮像制御部11によってカ
メラ5による撮像を実施する。
Next, the filter support plates 2b, 4b, 6 of the respective optical wavelength selectors 2, 4, 6 are controlled by the optical wavelength selection controller 12.
b at the same time, the first and second optical wavelength selectors 2,
4, the wavelength light λF3 that excites another fluorescent dye
The optical filter F3 that can transmit the wavelength light λf3 is made to coincide with the light passing holes of the main bodies 2a and 4a, while the third light wavelength selector 6 converts the wavelength light λf3 excited when the wavelength light λF3 is applied to the cut surface Sa. The transmissible optical filter f3 is made to coincide with the light passage hole of the main body 6a, and the imaging by the camera 5 is performed by the imaging controller 11.

【0032】つまり、ここでは波長光λF3を切断面S
aに照射し、該波長光λF3で励起された光(波長光λ
f3)をカメラ5に導いて切断面Saを撮像し、この切
断面Saの画像(図4(a)の右から2番目の画像)を
メモリに記憶する。
That is, here, the wavelength light λF3 is
a to the light excited by the wavelength light λF3 (wavelength light λF3).
f3) is guided to the camera 5 to capture an image of the cut surface Sa, and the image of the cut surface Sa (the second image from the right in FIG. 4A) is stored in the memory.

【0033】次に、光波長選択制御部12によって各光
波長選択器2,4,6のフィルタ支持板2b,4b,6
bを同時に回転させて、第1,第2の光波長選択器2,
4では、上記とは別の蛍光染料を励起する波長光λF4
を透過可能な光学フィルタF4を本体2a,4aの光通
過孔に一致させ、一方、第3の光波長選択器6では、波
長光λF4を切断面Saに照射したときに励起された波
長光λf4を透過可能な光学フィルタf4を本体6aの
光通過孔に一致させると共に、撮像制御部11によって
カメラ5による撮像を実施する。
Next, the filter support plates 2b, 4b, 6 of the optical wavelength selectors 2, 4, 6 are controlled by the optical wavelength selection controller 12.
b at the same time, the first and second optical wavelength selectors 2,
4, the wavelength light λF4 for exciting another fluorescent dye is used.
The optical filter F4 capable of transmitting the light is matched with the light passing holes of the main bodies 2a and 4a, while the third light wavelength selector 6 emits the wavelength light λf4 excited when the wavelength light λF4 is irradiated on the cut surface Sa. The optical filter f4 capable of transmitting the light through the optical filter f4 is made to coincide with the light passage hole of the main body 6a, and the imaging controller 11 performs imaging by the camera 5.

【0034】つまり、ここでは波長光λF4を切断面S
aに照射し、該波長光λF4で励起された光(波長光λ
f4)をカメラ5に導いて切断面Saを撮像し、この切
断面Saの画像(図4(a)の右から2番目の画像)を
メモリに記憶する。
That is, here, the wavelength light λF4 is
a, and the light excited by the wavelength light λF4 (wavelength light λ
f4) is guided to the camera 5 to capture an image of the cut surface Sa, and the image of the cut surface Sa (the second image from the right in FIG. 4A) is stored in the memory.

【0035】これ以後も、上記と同様に、試料Sを図3
に示す面Sb,Sc,Sdで順次切断し、各切断面S
b,Sc,Sdに対し4種類の波長光λF1〜λF4を
照射しながら、各波長光λF1〜λF4で励起された光
(波長光λf1〜λf4)をカメラ5に導いて切断面S
b,Sc,Sdを撮像し、図4(b)(c)(d)に示
す切断面Sb,Sc,Sdの画像をメモリに記憶する。
Thereafter, as in the above, the sample S
Are sequentially cut at the planes Sb, Sc, and Sd shown in FIG.
While irradiating b, Sc, and Sd with four types of wavelength lights λF1 to λF4, the light (wavelength lights λf1 to λf4) excited by the respective wavelength lights λF1 to λF4 is guided to the camera 5, and the cut surface S
b, Sc, and Sd are imaged, and the images of the cut surfaces Sb, Sc, and Sd shown in FIGS. 4B, 4C, and 4D are stored in the memory.

【0036】切断面Sa〜Sd毎に得られた4つの画像
データは、撮像制御部11により領域分割,輪郭変形処
理,特徴抽出,合成等のデータ処理を施される。これら
処理データは必要に応じて主制御部13に取り込まれ、
各切断面画像や3次元画像等がモニター14に表示され
る。
The four image data obtained for each of the cut surfaces Sa to Sd are subjected to data processing such as area division, contour deformation processing, feature extraction, and synthesis by the imaging control unit 11. These processing data are taken into the main control unit 13 as needed,
Each cut plane image, three-dimensional image, and the like are displayed on the monitor 14.

【0037】このように、上述の試料観察方法及びその
装置によれば、各切断面Sa〜Sd毎に得た4つの画像
データを利用して切断面観察をより詳細に行えると共
に、これら画像データから試料の3次元立体構造を高精
度で構築してその構造観察を詳細且つ正確に実施でき
る。
As described above, according to the sample observation method and the apparatus described above, the cut surface can be observed in more detail by using the four image data obtained for each of the cut surfaces Sa to Sd. Thus, the three-dimensional structure of the sample can be constructed with high precision, and the structure can be observed in detail and accurately.

【0038】また、各切断面Sa〜Sd毎に蛍光発色状
態が異なる4つの画像データを得ているので、蛍光観察
による切断面観察と構造観察を高感度で実施でき、試料
内部の微細物質や器官や病原体や癌等を観察する場合に
極めて有用である。
Further, since four pieces of image data having different fluorescent coloring states are obtained for each of the cut surfaces Sa to Sd, the cut surface observation and the structure observation by the fluorescence observation can be performed with high sensitivity, and the fine substance and the fine substance inside the sample can be observed. This is extremely useful when observing organs, pathogens, cancer, and the like.

【0039】さらに、試料切断面を直接光と間接光によ
って照明して撮像を行うので、照明陰やムラを原因とし
たノイズを排除して観察に適した画像データを取り込む
ことができる。
Further, since the image is taken by illuminating the sample cut surface with the direct light and the indirect light, it is possible to eliminate noise caused by shadows and unevenness of the illumination and to acquire image data suitable for observation.

【0040】尚、図1乃至図4に示した実施形態では、
各光波長選択器としてフィルタ支持板を回転させること
で光学フィルタの切り替えを行うものを例示したが、図
5または図6に示す光波長選択器を代わりに使用するこ
ともできる。
In the embodiment shown in FIGS. 1 to 4,
Although each of the optical wavelength selectors switches the optical filters by rotating the filter support plate, the optical wavelength selector shown in FIG. 5 or 6 can be used instead.

【0041】図5に示した光波長選択器21は、本体2
1aと、光分岐器21bと、光合流器21cと、4種類
の光学フィルタF1〜F4(f1〜f4)と、各光学フ
ィルタF1〜F4(f1〜f4)の光入射面に設けられ
た開閉自在なシャッター21dと、計8個のミラー21
eとから構成されている。シャッター21は図示省略の
動力源、例えばモータやソレノイド等による開閉を可能
としており、2分割またはスライドによる開閉によって
光学フィルタF1〜F4(f1〜f4)への光入射を選
択的に制御する。
The optical wavelength selector 21 shown in FIG.
1a, an optical splitter 21b, an optical combiner 21c, four types of optical filters F1 to F4 (f1 to f4), and an opening and closing provided on a light incident surface of each of the optical filters F1 to F4 (f1 to f4). Flexible shutter 21d and 8 mirrors 21 in total
e. The shutter 21 can be opened and closed by a power source (not shown), for example, a motor, a solenoid, or the like, and selectively controls light incidence on the optical filters F1 to F4 (f1 to f4) by opening and closing by two or sliding.

【0042】この光波長選択器21では、光源から光分
岐器21bの端部に入射された光を該光分岐器21bで
4方向に分岐して、各分岐光をミラー21eを介して各
シャッター21dに導くことができ、使用する光学フィ
ルタに合わせてシャッター21dを選択的に開放してお
けば、所定の光学フィルタのみに光を入射して、該光学
フィルタを透過した特定波長の光をミラー21eを介し
て光合流器21cに導いてその端部から出射することが
できる。
In the optical wavelength selector 21, the light incident on the end of the optical splitter 21b from the light source is split in four directions by the optical splitter 21b, and each split light is transmitted to each shutter via the mirror 21e. If the shutter 21d is selectively opened in accordance with an optical filter to be used, light is incident only on a predetermined optical filter, and light having a specific wavelength transmitted through the optical filter is mirrored. The light can be guided to the optical combiner 21c through the end 21e and emitted from the end.

【0043】図6に示した光波長選択器22は、本体2
2aと、ポリゴンミラー22bと、計9個のミラーと、
4種類の光学フィルタF1〜F4(f1〜f4)と、光
合流器22dとから構成されている。ポリゴンミラー2
2bは図示省略の動力源、例えばモータ等による角度変
位を可能としており、自らの角度変位によって光学フィ
ルタF1〜F4(f1〜f4)への光入射を選択的に制
御する。
The optical wavelength selector 22 shown in FIG.
2a, a polygon mirror 22b, a total of nine mirrors,
It is composed of four types of optical filters F1 to F4 (f1 to f4) and an optical combiner 22d. Polygon mirror 2
2b enables angular displacement by a power source (not shown) such as a motor, and selectively controls light incidence on the optical filters F1 to F4 (f1 to f4) by its own angular displacement.

【0044】この光波長選択器22では、光源からポリ
ゴンミラー22bに入射された光を該ポリゴンミラー2
2bで反射し、該反射光をミラー22cを介して光学フ
ィルタF1〜F4のうちの1つに導くことができ、使用
する光学フィルタに合わせてポリゴンミラー22bの反
射角度を変化させておけば、所定の光学フィルタのみに
光を入射して、該光学フィルタを透過した特定波長の光
をミラー22cを介して光合流器22dに導いてその端
部から出射することができる。また、ポリゴンミラー2
2bの反射光を直接光合流器22dに導くことで、波長
非選択の白色光をその端部から出射することもできる。
In the optical wavelength selector 22, the light incident on the polygon mirror 22b from the light source is
2b, the reflected light can be guided to one of the optical filters F1 to F4 via the mirror 22c. If the reflection angle of the polygon mirror 22b is changed according to the optical filter to be used, Light can be incident only on a predetermined optical filter, and light of a specific wavelength transmitted through the optical filter can be guided to the optical combiner 22d via the mirror 22c and emitted from the end. Also, polygon mirror 2
By directing the reflected light of 2b directly to the optical combiner 22d, it is possible to emit wavelength-nonselective white light from its end.

【0045】図1に示した各光波長選択器2,4,6で
も、光学フィルタが装着されない箇所をフィルタ支持板
に残しておけば、波長非選択の白色光を試料切断面に照
射することができる。また、図5に示した光波長選択器
21でも、光学フィルタがない場所に設けたシャッター
に分岐光の1つを導けるようにしておけば、波長非選択
の白色光を試料切断面に照射することができる。
In each of the optical wavelength selectors 2, 4, and 6 shown in FIG. 1, if a portion where the optical filter is not mounted is left on the filter support plate, white light with non-selective wavelength can be irradiated on the cut surface of the sample. Can be. Also, in the optical wavelength selector 21 shown in FIG. 5, if one of the branched lights can be guided to a shutter provided in a place where there is no optical filter, white light of non-selective wavelength is irradiated on the sample cut surface. be able to.

【0046】このように、光源から出射された白色光を
直接試料切断面に照射できる機能を光波長選択器に付加
しておけば、白色光を試料切断面に照射したときの画像
を各切断面毎に得ることが可能であり、蛍光観察と白色
光による通常観察とを可能として切断面観察をより一層
詳細に行えると共に、白色光による画像を蛍光発色の画
像とを合成して3次元立体構造を構築することにより試
料構造の観察をより詳細且つ正確に実施できる。
As described above, if the function of directly irradiating the sample cut surface with the white light emitted from the light source is added to the optical wavelength selector, an image obtained when the white light is irradiated on the sample cut surface can be cut. It can be obtained for each surface, enabling fluorescence observation and normal observation using white light to enable more detailed cut surface observation, and combining a white light image with a fluorescent color image to create a three-dimensional image. By constructing the structure, the observation of the sample structure can be performed in more detail and accurately.

【0047】また、図1乃至図4に示した実施形態で
は、試料観察装置とは異なる位置で別途切断した試料を
テーブルに載置するようにしたものを例示したが、図7
に示す切断装置を図1の装置に組み合わせて使用すれ
ば、単一の装置にて試料の切断と切断面の撮像を連続し
て行うことができる。
Further, in the embodiment shown in FIGS. 1 to 4, an example in which a sample separately cut at a position different from that of the sample observation device is placed on the table is illustrated.
When the cutting device shown in FIG. 1 is used in combination with the device shown in FIG. 1, the cutting of the sample and the imaging of the cut surface can be continuously performed by a single device.

【0048】同図に示した切断装置31は、ベースフレ
ーム32と、切断刃33を備えた切断刃取付円盤34
と、切断刃取付円盤回転用のモータ35と、試料Sが載
置されるテーブル36と、テーブル36を上下動可能に
支持する一対のガイドロッド37と、テーブル昇降用の
モータ38と、モータ回転を直線動力に変換してテーブ
ル36に伝達するボールネジ39とから構成されてい
る。切断刃取付円盤36は大小2つの環状リングの間に
切断刃33を備えており、自らの回転によって試料Sを
切断刃33によって切断することができる。
The cutting device 31 shown in FIG. 6 includes a base frame 32 and a cutting blade mounting disk 34 having a cutting blade 33.
A motor 35 for rotating a cutting blade mounting disk, a table 36 on which the sample S is placed, a pair of guide rods 37 for supporting the table 36 in a vertically movable manner, a motor 38 for moving the table up and down, and a motor rotation. Is converted into linear power and transmitted to the table 36 by a ball screw 39. The cutting blade mounting disk 36 has a cutting blade 33 between two large and small annular rings, and can cut the sample S by the cutting blade 33 by its own rotation.

【0049】この切断装置31では、モータ38を作動
させてテーブル36を上昇させ、試料Sの上端を切断刃
33よりも所定量突出させた状態で、モータ35を作動
させて切断刃取付円盤34を1回転させることで、試料
Sの突出分を切断刃33により切断して切断面を切断刃
取付円盤36のリング間から露出させることができる。
つまり、テーブル36が図1に示した試料観察装置の対
物レンズ4の真下に位置するように同装置を配置すれ
ば、観察対象となる試料Sを必要量送り込んで切断し、
その切断面をカメラ5により撮像することができる。
In the cutting device 31, the motor 38 is operated to raise the table 36, and the motor 35 is operated with the upper end of the sample S protruding beyond the cutting blade 33 by a predetermined amount. Is rotated once, the protruding portion of the sample S is cut by the cutting blade 33, and the cut surface can be exposed from between the rings of the cutting blade mounting disk 36.
That is, if the apparatus is arranged so that the table 36 is located directly below the objective lens 4 of the sample observation apparatus shown in FIG. 1, the required amount of the sample S to be observed is fed and cut,
The cut surface can be imaged by the camera 5.

【0050】さらに、図1乃至図4に示した実施形態で
は、試料切断面に照射される光の波長を第1,第2の光
波長選択器2,4で選択し、カメラ5に入射される光の
波長を第3の光波長選択器6で選択するようにしたもの
を例示したが、第1,第2の光波長選択器2,4を排除
した装置構成、つまり、白色光を試料切断面に照射しカ
メラ5に入射される光の波長を第3の光波長選択器6で
選択しながら撮像を行うようにしても図4と近似の画像
を各切断面毎に得ることが可能である。また、第3の光
波長選択器6を排除した装置構成、つまり、試料切断面
に照射される光の波長を第1,第2の光波長選択器2,
4で選択しながら試料切断面からの反射光をカメラ5に
入射して撮像を行うようにしても図4と近似の画像を各
切断面毎に得ることが可能である。特に後者の場合で
は、ハーフミラーとしてダイクロイックミラーを用いれ
ば、該ダイクロイックミラーによってカメラ5に入射さ
れる光の波長を選択波長に合わせて制限することもでき
る。
Further, in the embodiment shown in FIGS. 1 to 4, the wavelength of the light to be irradiated on the cut surface of the sample is selected by the first and second light wavelength selectors 2 and 4, and is incident on the camera 5. In this example, the third light wavelength selector 6 is used to select the wavelength of the light to be output. It is possible to obtain an image similar to that of FIG. 4 for each section even if the image is taken while selecting the wavelength of the light irradiated to the section and incident on the camera 5 by the third optical wavelength selector 6. It is. Further, the device configuration excluding the third optical wavelength selector 6, that is, the wavelength of the light applied to the sample cut surface is changed to the first and second optical wavelength selectors 2,
It is also possible to obtain an image similar to that of FIG. 4 for each cut surface by making the reflected light from the cut surface of the sample incident on the camera 5 and taking an image while selecting in step 4. In particular, in the latter case, if a dichroic mirror is used as the half mirror, the wavelength of light incident on the camera 5 by the dichroic mirror can be limited in accordance with the selected wavelength.

【0051】さらにまた、図1乃至図4に示した実施形
態では、第1の光源1からの光と第2の光源3からの光
を用いて試料切断面を照明するようにしたものを例示し
たが、第1の光源1を除外した装置構成、つまり、第2
の光源3からの光で試料切断面を間接的に照明するだけ
でも所期の画像をカメラ5に取り込むことができる。こ
の場合の間接照明は図1に示したリング状の照明器に限
らず、複数個の平板状照明器で試料切断面を斜め上方か
ら照明するものであってもよい。
Further, the embodiment shown in FIGS. 1 to 4 exemplifies an embodiment in which the light from the first light source 1 and the light from the second light source 3 are used to illuminate the sample cut surface. However, the device configuration excluding the first light source 1, that is, the second
By simply indirectly illuminating the sample cut surface with the light from the light source 3, the desired image can be captured by the camera 5. The indirect illumination in this case is not limited to the ring-shaped illuminator shown in FIG. 1, and a plurality of flat illuminators may be used to illuminate the sample cut surface obliquely from above.

【0052】さらにまた、図1乃至図4に示した実施形
態では、試料の切断と該切断面の撮像を順次繰り返すよ
うにしたものを例示したが、切断面撮像は必ずしも試料
切断の度に実施する必要はなく、全ての切断面のうち必
要な切断面のみに対して撮像を実施してその画像データ
を記憶するようにしてもよい。
Further, in the embodiment shown in FIGS. 1 to 4, the cutting of the sample and the imaging of the cut surface are sequentially repeated, but the imaging of the cut surface is not necessarily performed every time the sample is cut. It is not necessary to perform the imaging, and the image data may be stored only for the necessary cutting plane out of all the cutting planes.

【0053】[0053]

【発明の効果】以上詳述したように、本発明に係る試料
観察方法及びその装置によれば、各切断面毎に得た複数
の画像データを利用して切断面観察をより詳細に行える
と共に、これら画像データから試料の3次元立体構造を
高精度で構築してその構造観察を詳細且つ正確に実施で
きる。
As described above in detail, according to the sample observation method and apparatus according to the present invention, it is possible to observe a cut surface in more detail by using a plurality of image data obtained for each cut surface. The three-dimensional structure of the sample can be constructed with high precision from these image data, and the structure can be observed in detail and accurately.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明を適用した試料観察装置の概略構成を示
す図
FIG. 1 is a diagram showing a schematic configuration of a sample observation device to which the present invention is applied.

【図2】フィルタ支持板の上面図FIG. 2 is a top view of a filter support plate.

【図3】試料の斜視図FIG. 3 is a perspective view of a sample.

【図4】切断面毎の画像を示す図FIG. 4 is a diagram showing an image for each cut surface.

【図5】光波長選択器の他の構造例を示す図FIG. 5 is a diagram showing another example of the structure of the optical wavelength selector.

【図6】光波長選択器の他の構造例を示す図FIG. 6 is a diagram showing another example of the structure of the optical wavelength selector.

【図7】切断装置の概略構成を示す図FIG. 7 is a diagram showing a schematic configuration of a cutting device.

【符号の説明】[Explanation of symbols]

1…カメラ、2…第1の光波長選択器、2b…フィルタ
支持板、F1〜F4…光学フィルタ、3…ハーフミラ
ー、4…対物レンズ、5…第1の光源、6…第2の光波
長選択器、6b…フィルタ支持板、7…第2の光源、8
…第3の光波長選択器、8b…フィルタ支持板、9…間
接照明器、10…テーブル、S…試料、11…撮像制御
部、12…光波長選択制御部、13…主制御部、14…
モニター、Sa,Sb,Sc,Sd…試料切断面。
DESCRIPTION OF SYMBOLS 1 ... Camera, 2 ... 1st light wavelength selector, 2b ... Filter support plate, F1-F4 ... Optical filter, 3 ... Half mirror, 4 ... Objective lens, 5 ... 1st light source, 6 ... 2nd light Wavelength selector, 6b: filter support plate, 7: second light source, 8
... Third light wavelength selector, 8b. Filter support plate, 9 indirect illuminator, 10 table, S. sample, 11 imaging control unit, 12 light wavelength selection control unit, 13 main control unit, 14 …
Monitor, Sa, Sb, Sc, Sd: Sample cut surface.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 樋口 俊郎 神奈川県横浜市都筑区荏田東3−4−26 (72)発明者 工藤 謙一 東京都豊島区巣鴨5−15−16 (72)発明者 横田 秀夫 神奈川県川崎市多摩区菅2−15−5 キャ ピタル稲田堤206 (72)発明者 福田 祥愼 神奈川県川崎市高津区新作3−8−3 (72)発明者 小久保 光典 静岡県沼津市大岡2068−3 東芝機械株式 会社沼津事業所内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshiro Higuchi 3-4-26, Edahigashi, Tsuzuki-ku, Yokohama, Kanagawa Prefecture (72) Inventor Kenichi Kudo 5-15-16, Sugamo, Toshima-ku, Tokyo (72) Inventor Yokota Hideo 206 Inada Tsutsumi, 2-15-5 Suga, Tama-ku, Kawasaki City, Kanagawa Prefecture (72) Inventor Shoshin Fukuda 3-8-3, Shinsaku, Takatsu-ku, Kawasaki City, Kanagawa Prefecture (72) Inventor Mitsunori Kokubo Ooka, Numazu-shi, Shizuoka Prefecture 2068-3 Toshiba Machine Co., Ltd. Numazu Office

Claims (11)

【特許請求の範囲】[Claims] 【請求項1】 試料切断面を照明しながら撮像手段によ
り撮像して画像データを記憶し、該画像データに基づい
て試料観察を行う試料観察方法において、 試料切断面に照射される光の波長と撮像手段に入射され
る光の波長の一方を選択しながら撮像を行うことによ
り、1つの試料切断面に対して波長選択数に応じた複数
の画像データを記憶する、 ことを特徴とする試料観察方法。
1. A method for observing a sample based on the image data by capturing an image with an imaging unit while illuminating the sample cut surface, and observing a sample based on the image data. Specimen observation characterized by storing a plurality of image data corresponding to the number of selected wavelengths for one sample cut surface by performing imaging while selecting one of the wavelengths of light incident on the imaging means. Method.
【請求項2】 試料切断面を照明しながら撮像手段によ
り撮像して画像データを記憶し、該画像データに基づい
て試料観察を行う試料観察方法において、 試料切断面に照射される光の波長と撮像手段に入射され
る光の波長を選択しながら撮像を行うことにより、1つ
の試料切断面に対して波長選択数に応じた複数の画像デ
ータを記憶する、 ことを特徴とする試料観察方法。
2. A sample observing method in which an image is taken by an image pickup means while illuminating a sample cut surface, image data is stored, and a sample is observed based on the image data. A sample observing method, characterized in that a plurality of image data corresponding to the number of selected wavelengths is stored for one sample cut surface by performing imaging while selecting the wavelength of light incident on the imaging means.
【請求項3】 光の波長選択が、光学フィルタを用いて
行われる、 ことを特徴とする請求項1または2記載の試料観察方
法。
3. The sample observation method according to claim 1, wherein the wavelength of the light is selected using an optical filter.
【請求項4】 試料を、異なる波長の光で励起される複
数の蛍光染料によって予め染色した、 ことを特徴とする請求項1乃至3の何れか1項記載の試
料観察方法。
4. The sample observation method according to claim 1, wherein the sample is pre-stained with a plurality of fluorescent dyes excited by light of different wavelengths.
【請求項5】 1つの試料切断面で得られる画像データ
が、白色光により撮像された画像データを含む、 ことを特徴とする請求項1乃至4の何れか1項記載の試
料観察方法。
5. The sample observation method according to claim 1, wherein the image data obtained on one cut surface of the sample includes image data captured by white light.
【請求項6】 試料切断面を照明する照明手段と、試料
切断面を撮像する撮像手段と、撮像手段で得られた画像
データを記憶する記憶手段と、画像データを観察可能な
データに処理するデータ処理手段とを備えた試料観察装
置において、 試料切断面に照射される光の波長と撮像手段に入射され
る光の波長の一方を選択する光波長選択手段と、 波長選択毎に撮像手段による撮像を実施して1つの試料
切断面に対して波長選択数に応じた複数の画像データを
記憶させる撮像制御手段とを具備した、 ことを特徴とする試料観察装置。
6. An illuminating means for illuminating a sample cut surface, an imaging means for imaging the sample cut surface, a storage means for storing image data obtained by the imaging means, and processing the image data into observable data. A sample observing apparatus having data processing means, wherein: a light wavelength selecting means for selecting one of a wavelength of light irradiated on the sample cut surface and a wavelength of light incident on the imaging means; and A sample observation device, comprising: imaging control means for performing imaging and storing a plurality of image data corresponding to the number of wavelengths selected for one sample cut surface.
【請求項7】 試料切断面を照明する照明手段と、試料
切断面を撮像する撮像手段と、撮像手段で得られた画像
データを記憶する記憶手段と、画像データを観察可能な
データに処理するデータ処理手段とを備えた試料観察装
置において、 試料切断面に照射される光の波長と撮像手段に入射され
る光の波長を選択する光波長選択手段と、 波長選択毎に撮像手段による撮像を実施して1つの試料
切断面に対して波長選択数に応じた複数の画像データを
記憶させる撮像制御手段とを具備した、 ことを特徴とする試料観察装置。
7. An illuminating means for illuminating a sample cut surface, an imaging means for imaging the sample cut surface, a storage means for storing image data obtained by the imaging means, and processing the image data into observable data. A sample observing apparatus including a data processing unit, a light wavelength selecting unit for selecting a wavelength of light irradiated on the sample cut surface and a wavelength of light incident on the imaging unit, and imaging by the imaging unit for each wavelength selection. A sample observation device, comprising: an imaging control unit that stores a plurality of image data according to the number of wavelengths selected for one sample cut surface.
【請求項8】 光波長選択手段が、複数の光学フィルタ
を支持するフィルタ支持板と、該フィルタ支持板を変動
させることで使用する光学フィルタの切り替えを行う動
力源とから成る、 ことを特徴とする請求項6または7記載の試料観察装
置。
8. The optical wavelength selecting means comprises: a filter support plate for supporting a plurality of optical filters; and a power source for switching an optical filter to be used by changing the filter support plate. The sample observation device according to claim 6 or 7, wherein
【請求項9】 光波長選択手段が、複数の光学フィルタ
と、各光学フィルタの一面に設けられた開閉可能なシャ
ッターと、各シャッターを選択的に開放することで使用
する光学フィルタの切り替えを行う動力源とから成る、 ことを特徴とする請求項6または7記載の試料観察装
置。
9. An optical wavelength selection unit switches between a plurality of optical filters, an openable / closable shutter provided on one surface of each optical filter, and an optical filter to be used by selectively opening each shutter. The sample observation device according to claim 6, comprising a power source.
【請求項10】 光波長選択手段が、複数の光学フィル
タと、各光学フィルタへの光入射を選択的に行う可変ミ
ラーと、可変ミラーの反射角度を変化させることで使用
する光学フィルタの切り替えを行う動力源とから成る、 ことを特徴とする請求項6または7記載の試料観察装
置。
10. An optical wavelength selecting means for switching between a plurality of optical filters, a variable mirror for selectively inputting light to each optical filter, and an optical filter to be used by changing a reflection angle of the variable mirror. The sample observation device according to claim 6, comprising a power source for performing the operation.
【請求項11】 光波長選択手段が、白色光を通過させ
る機能を有する、 ことを特徴とする請求項6乃至10の何れか1項記載の
試料観察装置。
11. The sample observation device according to claim 6, wherein the light wavelength selection means has a function of passing white light.
JP18068896A 1996-07-10 1996-07-10 Sample observation method and apparatus Expired - Lifetime JP3623602B2 (en)

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Application Number Priority Date Filing Date Title
JP18068896A JP3623602B2 (en) 1996-07-10 1996-07-10 Sample observation method and apparatus

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JPH1026586A true JPH1026586A (en) 1998-01-27
JP3623602B2 JP3623602B2 (en) 2005-02-23

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7280680B2 (en) 2002-03-04 2007-10-09 Riken Method and apparatus for observing three-dimensional localizations of in vivo expressed genes as well as method and apparatus for observing minute three-dimensional localizations of in vivo expressed genes
WO2010109811A1 (en) * 2009-03-27 2010-09-30 ソニー株式会社 Observation device
JP2010243597A (en) * 2009-04-01 2010-10-28 Sony Corp Device and method for presenting biological image, program, and biological image presentation system
JP2012132890A (en) * 2010-12-22 2012-07-12 Samsung Electro-Mechanics Co Ltd Mobile type component sampling analyzer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7280680B2 (en) 2002-03-04 2007-10-09 Riken Method and apparatus for observing three-dimensional localizations of in vivo expressed genes as well as method and apparatus for observing minute three-dimensional localizations of in vivo expressed genes
WO2010109811A1 (en) * 2009-03-27 2010-09-30 ソニー株式会社 Observation device
JP2010230495A (en) * 2009-03-27 2010-10-14 Sony Corp Observation device
CN102362168A (en) * 2009-03-27 2012-02-22 索尼公司 Observation device
JP2010243597A (en) * 2009-04-01 2010-10-28 Sony Corp Device and method for presenting biological image, program, and biological image presentation system
JP2012132890A (en) * 2010-12-22 2012-07-12 Samsung Electro-Mechanics Co Ltd Mobile type component sampling analyzer

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