JPH10256796A - Electronic component fixing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To decrease the mounting height of an electronic component by providing a positioning member at the end part of the electronic component, inserting the electronic component into an opening made through a board and then positioning the electronic device on the rear side of the board. SOLUTION: An electronic device 3 is inserted into an opening 2 made through a board 1 and secured so as to clamp a fixing hole 5 from the lower surface of the board 1 by means of supporting members 6, provided on the opposite sides of the terminal block 4 of the electronic device 3, thus positioning the electronic device 3 with respect to the board 1. The supporting members 6 are formed asymmetrically with respect to the terminal block 4, such that one supporting member 6 is located on the left side of the central part of the board 1, while the other is located on the right side thereof when they are arranged in the central part of the board 1. The electronic device 3 is supported on the board 1 with a uniform force. According to the arrangement, space can be saved at the part of an electronic apparatus for fixing a control section.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art A large number of electronic components such as capacitors, resistors, coils, and transformers are used in consumer or industrial electronic equipment. These electronic components include a substrate 1 having an opening 2 for inserting electronic components as shown in FIG.
Attached to.

FIG. 5 is a front view when the electronic component 3 is mounted on the substrate 1 as shown in FIG. 4, and FIG. 6 is a perspective view. The electronic component is inserted into the opening 2 formed in the substrate 1,
A support member 6 and a lead wire 7 are drawn out from the side surface of the electronic component 3 and are joined to the substrate 1. Lead wire 7 is substrate 1
Above is connected to an external conductor by solder or the like. A large number of lead wires 7 are drawn out at both ends of the electronic component 3,
Positioning means is required because it is necessary to accurately position the corresponding external conductor provided on the side. Further, when the weight of the electronic component cannot be supported only by the fixing force by soldering between the lead wire 7 and the external conductor provided on the substrate, a support means for the electronic component is required.

[0005] For this reason, in the examples of FIGS. 5 and 6, a positioning and supporting member (hereinafter simply referred to as a supporting member) for positioning the electronic component 3 on the substrate 1 and for supporting the weight of the electronic component 3. ) 6 are provided. The installation position of the support member 6 is arbitrarily selected at both ends of the electronic component in a symmetrical position or in a left-right asymmetrical position in consideration of a connection point between the lead wire 7 and the external conductor. In particular, when the electronic component 3 is a transformer, the weight of the component becomes heavy due to the coil, core, insulating material, etc. In order to attach such a heavy electronic component to the board, a steel wire having high mechanical strength is used. It is used as a support member 6.

[0005]

In such a structure for mounting an electronic component on a substrate, the electronic component is positioned and fixed on the substrate by the support member, so that the height T of the foot of the support member is reduced. This necessitates a small space above the substrate, which increases the mounting dimension of the control portion of the electronic device, and poses a problem in saving space.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and aims to reduce the height of an electronic component mounted on a substrate from the substrate to save space in a control portion mounting portion of an electronic device. With the goal.

[0007]

In order to achieve the above object, in the present invention, a positioning member is provided at an end of an electronic component, and the electronic component is inserted into an opening formed in a substrate. The positioning is performed on the back side of the substrate.

In addition, the positioning and fixing of the electronic component on the back side of the substrate are performed by a positioning member.

Further, a steel wire is used as a positioning member, and the steel wire is welded on the back surface of the substrate to position and fix the electronic component to the substrate.

With the above structure, in the present invention, the height of the electronic component from the substrate is reduced, so that the space above the substrate can be saved, and the space for the control part mounting portion of the electronic device can be saved.

Further, even when the electronic component is heavy and the electronic component cannot be supported on the substrate only by the fixing force of the soldering of the lead wire and the external conductor, the supporting member is separately provided by a positioning member. And can support the weight of electronic components.

Further, the positioning and fixing of the electronic component to the substrate can be easily performed by welding without forming a mounting hole in the substrate.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. 1 is a front view, FIG. 2 is a rear view, and FIG. 3 is a perspective view. In FIG. 1, 1 is a substrate, 2 is an opening formed in the substrate, 3 is an electronic component, 4 is a terminal block, 5 is a mounting hole, and 6 is a supporting member such as a steel wire. Electronic components 3
Are inserted through the opening 2 of the substrate 1, and the supporting members 6 provided on both sides of the terminal block of the electronic component are fixed so as to sandwich the mounting hole 5 from the lower surface of the substrate 1, and the electronic component 3 is fixed to the substrate. Position. It also functions to support the weight of the electronic component.

In this example, the mounting hole 5 formed in the substrate 1 is sandwiched from both sides by using a steel wire or the like as the supporting member 6, but the supporting member 6 is connected to the substrate 1 without forming the mounting hole 5 in the substrate 1. 1 may be fixed to the back surface by welding such as soldering. In this case, since the mounting hole 5 is not formed, the work of positioning and fixing the electronic component 3 is simplified. Note that various positioning and fixing means can be adopted as long as the electronic component 3 can be fixed to the back surface of the substrate 1.

FIG. 2 is a rear view of the substrate when the electronic component 3 is mounted on the substrate. Lead wires 7 drawn from the terminal block are welded to the rear surface of the substrate by solder 8 and connected to external conductors. .

FIG. 3 is a perspective view of the entire structure when the electronic component 3 is mounted on the substrate 1 as viewed from the back side of the substrate. In the example of the drawing, the lead wires 7 are provided on both sides of the terminal block, and the support member 6 is arranged at the center. However, if the electronic component 3 can be supported on the substrate with a uniform force, one of the support members is used. The support member may be formed at an asymmetrical position of the terminal block, such that 6 is disposed on the left side with respect to the central portion and the other support member 6 is disposed on the right side with respect to the central portion.

Although the supporting member 6 is provided separately from the lead wire 7 in this example, when the electronic component 3 is light in weight, a part of the lead wire 7 is inserted into the mounting hole 5 and inserted. The positioning of the electronic component may be performed by the lead wire 7. In this case, since all the lead wires 7 including those to be inserted into the mounting holes are fixed to the substrate by soldering to external conductors, the weight of the electronic component can be supported by such fixing means. .

In this example, the support member 6 is the electronic component 3
However, the electronic component 3 may be directly taken out of the side surface without providing the terminal block 4. In this case, costs can be saved because the terminal block can be omitted.

In the illustrated example, the electronic component 3 is supported by the supporting member 6 in the longitudinal direction of the substrate 1.
It may be configured to support in the width direction of the substrate 1. The mounting position of the support member can be arbitrarily selected according to the form of mounting the electronic component 3 on the substrate 1.

Further, in the illustrated example, the support members 6 are provided at both ends of the electronic component, but the support members may be provided only on one side of the electronic component to perform positioning and support of the electronic component.

[0021]

As described above, in the electronic component mounting apparatus of the present invention, the positioning member is provided at the end of the electronic component, and the electronic component is inserted into the opening formed in the substrate and positioned on the back side of the substrate. Therefore, the height of the electronic components arranged on the substrate from the substrate can be reduced, and the space for the control part mounting portion of the electronic device can be reduced.

Also, when the electronic component is heavy and cannot be supported on the substrate only by the fixing force by soldering the lead wire and the external conductor provided on the substrate, the electronic component is separately supported by the positioning member. The weight of the electronic component can be supported without providing a member.

Further, the positioning and fixing of the electronic component with respect to the substrate can be easily performed without forming a mounting hole in the substrate.

[Brief description of the drawings]

FIG. 1 is a front view showing a configuration of a preferred embodiment of an electronic component mounting device according to the present invention.

FIG. 2 is a rear view of FIG.

FIG. 3 is a perspective view seen from the back side of FIG. 1;

FIG. 4 is a perspective view of a substrate.

FIG. 5 is a front view of a conventional example.

FIG. 6 is a perspective view of a conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 board 2 opening 3 electronic component 4 terminal block 5 mounting hole 6 support member 7 lead wire 8 solder

Claims (3)

[Claims] 1. A positioning member is provided at an end of an electronic component, and the electronic component is inserted into an opening formed in a substrate.
An electronic component mounting device, wherein positioning is performed on the back side of a substrate. 2. An electronic component mounting device, wherein an electronic component is positioned and fixed on the back side of a substrate by a positioning member. 3. A steel wire is used as a positioning member,
The electronic component mounting apparatus according to claim 1, wherein the electronic component is positioned and fixed to the substrate by welding a steel wire on a back surface of the substrate.