JPH10247379A - Semiconductor memory card system - Google Patents
Semiconductor memory card systemInfo
- Publication number
- JPH10247379A JPH10247379A JP9048754A JP4875497A JPH10247379A JP H10247379 A JPH10247379 A JP H10247379A JP 9048754 A JP9048754 A JP 9048754A JP 4875497 A JP4875497 A JP 4875497A JP H10247379 A JPH10247379 A JP H10247379A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor memory
- memory card
- power supply
- voltage
- ground terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、システム本体の電
源供給側コネクタと半導体メモリカード側コネクタとを
相互に接続し、システム本体側の電源電圧を半導体メモ
リカードに供給する半導体メモリカードシステムに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor memory card system in which a power supply side connector of a system main body and a semiconductor memory card side connector are interconnected, and a power supply voltage of the system main body is supplied to the semiconductor memory card.
【0002】[0002]
【従来の技術】図2はこの種の半導体メモリカードシス
テムの電源コネクタ部の概略構成図であり、システム本
体の電源供給側コネクタ1と半導体メモリ側コネクタ2
とが相互に接続される。このうち、電源供給側コネクタ
1はプラグタイプでなり、電源端子3P及び接地端子4
Pを有し、半導体メモリ側コネクタ2はジャックタイプ
でなり、電源端子3J及び接地端子4Jを有している。
そして、半導体メモリカードをシステム本体に挿入した
場合、電源端子3Jは電源端子3Pに、接地端子4Jは
接地端子4Pにそれぞれ接続される。電源供給側コネク
タ1を有するシステム本体では、接地端子4Pが接地さ
れ、この接地端子4Pと電源端子3Pとの間に直流の電
源装置11が接続されている。しかして、両コネクタの
接続により半導体メモリカードはその動作電圧を得るこ
とができる。2. Description of the Related Art FIG. 2 is a schematic diagram showing the configuration of a power supply connector of a semiconductor memory card system of this type.
Are connected to each other. The power supply side connector 1 is of a plug type, and includes a power terminal 3P and a ground terminal 4P.
P, the semiconductor memory side connector 2 is a jack type, and has a power terminal 3J and a ground terminal 4J.
When the semiconductor memory card is inserted into the system body, the power terminal 3J is connected to the power terminal 3P, and the ground terminal 4J is connected to the ground terminal 4P. In the system main body having the power supply connector 1, the ground terminal 4P is grounded, and the DC power supply 11 is connected between the ground terminal 4P and the power terminal 3P. Thus, the operation voltage of the semiconductor memory card can be obtained by connecting both connectors.
【0003】[0003]
【発明が解決しようとする課題】最近の半導体メモリカ
ードの電源電圧は、半導体装置自体の低電圧化に伴って
低い電圧を採用するようになり、現時点では5.0Vと
3.3Vをそれぞれ動作電圧とする2種類の半導体メモ
リカードが存在し、この電源電圧の違いに応じてシステ
ム本体側の供給電圧を変更していた。Recently, the power supply voltage of a semiconductor memory card has become lower as the voltage of the semiconductor device itself becomes lower. At present, the power supply voltage is 5.0 V and 3.3 V, respectively. There are two types of semiconductor memory cards used as voltages, and the supply voltage on the system body side is changed according to the difference in the power supply voltage.
【0004】しかして、従来の半導体メモリカードシス
テムでは、半導体メモリカードに不適当な電圧が印加さ
れることを防ぐため、その動作電圧に応じて形状の異な
る電源供給側コネクタ1及び半導体メモリ側コネクタ2
を使用していた。このため、電源電圧の違いによって形
状の異なる複数種類のコネクタを使用しなければなら
ず、これが生産性の低下を招くことから互換性に対する
要求も強かった。However, in the conventional semiconductor memory card system, in order to prevent improper voltage from being applied to the semiconductor memory card, the power supply side connector 1 and the semiconductor memory side connector having different shapes according to the operating voltage. 2
Was used. For this reason, it is necessary to use a plurality of types of connectors having different shapes depending on a difference in power supply voltage, and this leads to a decrease in productivity.
【0005】本発明は上記の事情を考慮してなされたも
ので、半導体メモリカードの電源電圧が複数種類存在す
る場合でも容易に対応でき、かつ、電源供給側コネクタ
に互換性を持たせることのできる半導体メモリカードシ
ステムを提供することを目的とする。The present invention has been made in consideration of the above circumstances, and can easily cope with a case where there are a plurality of types of power supply voltages of a semiconductor memory card, and provide a power supply side connector with compatibility. It is an object of the present invention to provide a semiconductor memory card system capable of performing the above.
【0006】[0006]
【課題を解決するための手段】本発明に係る請求項1に
記載の半導体メモリカードシステムは、システム本体の
電源供給側コネクタと半導体メモリカード側コネクタと
を相互に接続し、システム本体側の電源電圧を半導体メ
モリカードに供給するに当たり、電源供給側コネクタ及
び半導体メモリカード側コネクタに、相互に接離可能に
設けられ、一組の端子を接地端子とする3組以上の端子
と、システム本体に設けられ、接地端子を共通接地端子
とし、この共通接地端子以外の互いに異なる端子に値の
違った電圧を印加する電源装置とを備え、半導体メモリ
カードは接地端子を基準として所定の電圧に対応する端
子を選択して動作電圧を得るようにしたので、半導体メ
モリカードの電源電圧が複数種類存在する場合でも容易
に対応でき、かつ、互換性を持たせることができる。According to a first aspect of the present invention, there is provided a semiconductor memory card system, wherein a power supply side connector of a system main body and a semiconductor memory card side connector are connected to each other, and a power supply of a system main body side is provided. In supplying a voltage to the semiconductor memory card, the power supply connector and the semiconductor memory card connector are provided so as to be able to be connected to and separated from each other, and three or more sets of terminals having one set of terminals as ground terminals; A power supply device for applying different voltages to different terminals other than the common ground terminal, the semiconductor memory card corresponding to a predetermined voltage with respect to the ground terminal. Since the operating voltage is obtained by selecting the terminal, even when there are plural kinds of power supply voltages of the semiconductor memory card, it can easily cope with the case, and It can be made compatible.
【0007】本発明に係る請求項2に記載の半導体メモ
リカードシステムは、システム本体に設けられる電源装
置は、共通接地端子から見て2種類の電圧を共通接地端
子以外の互いに異なる端子に印加するようにしたので、
半導体装置自体の低電圧化に伴う最近の状況に合致した
低コストのものが提供できる。According to a second aspect of the present invention, in the semiconductor memory card system, the power supply device provided in the system body applies two types of voltages to different terminals other than the common ground terminal when viewed from the common ground terminal. So,
It is possible to provide a low-cost device that matches the recent situation associated with the reduction in the voltage of the semiconductor device itself.
【0008】本発明に係る請求項3に記載の半導体メモ
リカードシステムは、電源供給側コネクタはプラグタイ
プであり、半導体メモリカード側コネクタはジャックタ
イプであるので、半導体メモリカードに対する携帯時の
安全性が確保される。In the semiconductor memory card system according to the third aspect of the present invention, the power supply side connector is a plug type and the semiconductor memory card side connector is a jack type. Is secured.
【0009】[0009]
【発明の実施の形態】以下、本発明を好適な実施形態に
基づいて詳細に説明する。図1は本発明の一実施形態の
概略構成図であり、図中、従来の半導体メモリカードシ
ステムを示す図2と同一の要素には同一の符号を付して
その説明を省略する。この実施形態では、(a)に示す
システム本体の電源供給側コネクタ1に、(b)に示す
ように、動作電圧が5.0Vの半導体メモリカードの半
導体メモリ側コネクタ2Aを接続したり、(c)に示す
ように、動作電圧が3.3Vの半導体メモリカードの半
導体メモリ側コネクタ2Bを接続したりするものであ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on preferred embodiments. FIG. 1 is a schematic configuration diagram of one embodiment of the present invention. In the drawing, the same elements as those of FIG. 2 showing a conventional semiconductor memory card system are denoted by the same reference numerals, and description thereof will be omitted. In this embodiment, as shown in (b), a semiconductor memory-side connector 2A of a semiconductor memory card having an operating voltage of 5.0 V is connected to the power supply-side connector 1 of the system body shown in (a), or ( As shown in (c), the operation voltage is to connect the semiconductor memory side connector 2B of the semiconductor memory card of 3.3V.
【0010】ここで、(a)に示す電源供給側コネクタ
1はプラグタイプであり、接地端子4P、電源端子5P
及び電源端子6Pを備え、このうち、接地端子4Pが接
地され、さらに、接地端子4P及び電源端子5P間に、
出力電圧が5.0Vの電源装置11が接続され、接地端
子4P及び電源端子6P間に、出力電圧が3.3Vの電
源装置12が接続されている。しかして、接地端子4P
は電源装置11,12に対する共通接地端子となってい
る。The power supply connector 1 shown in FIG. 1A is of a plug type, and includes a ground terminal 4P, a power terminal 5P.
And a power terminal 6P, of which the ground terminal 4P is grounded, and between the ground terminal 4P and the power terminal 5P,
A power supply device 11 having an output voltage of 5.0 V is connected, and a power supply device 12 having an output voltage of 3.3 V is connected between the ground terminal 4P and the power supply terminal 6P. Therefore, the ground terminal 4P
Is a common ground terminal for the power supplies 11 and 12.
【0011】一方、(b)に示す半導体メモリ側コネク
タ2Aは、ジャックタイプであり、接地端子4J、電源
端子5J及び電源端子6Jを備え、このうち、接地端子
4Jと電源端子5Jの間の電圧を動作電圧とするように
図示省略の後続の回路が接続され、電源端子6Jは未接
続の状態、すなわち、遊びの状態になっている。On the other hand, the semiconductor memory-side connector 2A shown in FIG. 1B is a jack type and includes a ground terminal 4J, a power terminal 5J and a power terminal 6J, of which a voltage between the ground terminal 4J and the power terminal 5J is provided. Is set to the operating voltage, and a subsequent circuit (not shown) is connected, and the power supply terminal 6J is in an unconnected state, that is, in an idle state.
【0012】さらに、(c)に示す半導体メモリ側コネ
クタ2Bも、ジャックタイプであり、接地端子4J、電
源端子5J及び電源端子6Pを備え、このうち、接地端
子4Jと電源端子6Jの間の電圧を動作電圧とするよう
に図示省略の後続の回路が接続され、電源端子5Jは未
接続の状態、すなわち、遊びの状態になっている。Further, the semiconductor memory side connector 2B shown in (c) is also of a jack type and includes a ground terminal 4J, a power terminal 5J and a power terminal 6P, and among these, the voltage between the ground terminal 4J and the power terminal 6J. Is set to the operating voltage, and the subsequent circuit (not shown) is connected, and the power supply terminal 5J is in an unconnected state, that is, in a play state.
【0013】しかして、電源供給側コネクタ1に半導体
メモリ側コネクタ2Aを接続すれば、この半導体メモリ
側コネクタ2Aに接続された回路は電源装置11から供
給される5.0Vの電圧によって動作し、電源供給側コ
ネクタ1に半導体メモリ側コネクタ2Bを接続すれば、
この半導体メモリ側コネクタ2Bに接続された回路は電
源装置12から供給される3.3Vの電圧によって動作
することになる。When the semiconductor memory side connector 2A is connected to the power supply side connector 1, the circuit connected to the semiconductor memory side connector 2A operates by the 5.0V voltage supplied from the power supply device 11, If the semiconductor memory side connector 2B is connected to the power supply side connector 1,
The circuit connected to the semiconductor memory side connector 2B operates by the voltage of 3.3V supplied from the power supply device 12.
【0014】かくして、上記実施形態によれば、動作電
圧が5.0Vの半導体メモリカード2Aと、動作電圧が
3.3Vのメモリカード2Bとで、それぞれ接地端子4
Jを基準としてそれ自体の動作電圧に対応する電源端子
5J又は電源端子6Jを選択して動作電圧を得るように
したので、半導体メモリカードの電源電圧が2種類存在
する場合でも容易に対応でき、かつ、互換性を持たせる
ことができる。Thus, according to the above embodiment, the semiconductor memory card 2A having an operating voltage of 5.0V and the memory card 2B having an operating voltage of 3.3V have the ground terminals 4 respectively.
Since the power supply terminal 5J or the power supply terminal 6J corresponding to its own operation voltage is selected based on J to obtain the operation voltage, even when there are two types of power supply voltages of the semiconductor memory card, it is possible to easily cope with the case. In addition, compatibility can be provided.
【0015】また、電源供給側コネクタがプラグタイプ
で、半導体メモリカード側コネクタがジャックタイプで
あるので、半導体メモリカードに対する携帯時の安全性
が確保される。Further, since the power supply side connector is a plug type and the semiconductor memory card side connector is a jack type, the safety of the semiconductor memory card at the time of carrying is ensured.
【0016】なお、上記実施形態では、動作電圧が2種
類の半導体メモリカードを対象とする場合の構成を示し
たが、一般的に、動作電圧の異なる複数種類の半導体メ
モリカードを対象とする場合には、電源供給側コネクタ
及び半導体メモリカードカード側コネクタとして、少な
くとも一組の端子を接地端子とする3組以上の端子を有
するものを用い、システム本体にはこの接地端子を共通
接地端子とし、これ以外の互いに異なる端子に値の違っ
た電圧を印加する電源装置を設け、各半導体メモリカー
ドは接地端子を基準として所定の電圧に対応する端子を
選択して動作電圧を得るようにすれば、上述したと同様
な作用を行わせることができる。In the above-described embodiment, the configuration in which the operation voltage is applied to two types of semiconductor memory cards has been described. For the power supply side connector and the semiconductor memory card card side connector, a connector having at least three sets of terminals having at least one set of terminals as ground terminals is used, and this ground terminal is used as a common ground terminal in the system body. If a power supply device for applying different voltages to other different terminals is provided, and each semiconductor memory card selects a terminal corresponding to a predetermined voltage with reference to a ground terminal to obtain an operating voltage, The same operation as described above can be performed.
【0017】[0017]
【発明の効果】以上の説明によって明らかなように、本
発明に係る請求項1に記載の半導体メモリカードシステ
ムによれば、相互に接離するコネクタとして、一組の端
子を接地端子とする3組以上の端子を有するものを用
い、システム本体には接地端子を共通接地端子とし、こ
の共通接地端子以外の互いに異なる端子に値の違った電
圧を印加する電源装置を設ける一方、半導体メモリカー
ドは接地端子を基準としてそれ自体の動作電圧に対応す
る端子を選択して動作電圧を得るようにしたので、半導
体メモリカードの電源電圧が複数種類存在する場合でも
容易に対応でき、かつ、互換性を持たせることができ
る。As is apparent from the above description, according to the semiconductor memory card system according to the first aspect of the present invention, a pair of terminals which are mutually connected and separated from each other are grounded. The system body has a ground terminal as a common ground terminal, and a power supply device for applying different voltages to different terminals other than the common ground terminal is provided on the system body, while the semiconductor memory card is provided with The terminal corresponding to its own operating voltage is selected based on the ground terminal to obtain the operating voltage, so that even when there are plural types of power supply voltages of the semiconductor memory card, it is possible to easily cope with it and to improve compatibility. You can have.
【0018】本発明に係る請求項2に記載の半導体メモ
リカードシステムによれば、システム本体に2種類の電
圧を互いに異なる端子に印加するようにしたので、半導
体装置自体の低電圧化に伴う最近の状況に合致した低コ
ストのものが提供できる効果もある。According to the semiconductor memory card system of the second aspect of the present invention, two kinds of voltages are applied to different terminals of the system main body. There is also an effect that a low-cost product that matches the situation described above can be provided.
【0019】本発明に係る請求項3に記載の半導体メモ
リカードシステムによれば、電源供給側コネクタはプラ
グタイプであり、半導体メモリカード側コネクタはジャ
ックタイプであるので、半導体メモリカードに対する携
帯時の安全性が確保される効果も得られる。According to the third aspect of the present invention, the power supply side connector is a plug type and the semiconductor memory card side connector is a jack type. The effect of ensuring safety is also obtained.
【図1】本発明の一実施形態の概略構成図。FIG. 1 is a schematic configuration diagram of an embodiment of the present invention.
【図2】従来の半導体メモリカードシステムの電源コネ
クタ部の概略構成図。FIG. 2 is a schematic configuration diagram of a power supply connector of a conventional semiconductor memory card system.
1 電源供給側コネクタ 2A,2B 半導体メモリ側コネクタ 4P,4J 接地端子 5P,6P,5J,6J 電源端子 1 Power supply side connector 2A, 2B Semiconductor memory side connector 4P, 4J Ground terminal 5P, 6P, 5J, 6J Power supply terminal
Claims (3)
体メモリカード側コネクタとを相互に接続し、システム
本体側の電源電圧を半導体メモリカードに供給する半導
体メモリカードシステムにおいて、前記電源供給側コネ
クタ及び半導体メモリカード側コネクタに相互に接離可
能に設けられ、一組の端子を接地端子とする3組以上の
端子と、前記システム本体に設けられ、前記接地端子を
共通接地端子とし、この共通接地端子以外の互いに異な
る端子に値の違った電圧を印加する電源装置とを備え、
前記半導体メモリカードは前記接地端子を基準として所
定の電圧に対応する端子を選択して動作電圧を得ること
を特徴とする半導体メモリカードシステム。In a semiconductor memory card system for connecting a power supply connector of a system body and a connector of a semiconductor memory card to each other and supplying a power supply voltage of the system body to the semiconductor memory card, the power supply connector and the semiconductor memory card are connected to each other. Three or more sets of terminals provided on the semiconductor memory card side connector so as to be able to be connected to and separated from each other, one set of terminals being a grounding terminal, and provided on the system body, the grounding terminal being a common grounding terminal; A power supply for applying different voltages to different terminals other than the terminals,
The semiconductor memory card system according to claim 1, wherein a terminal corresponding to a predetermined voltage is selected based on the ground terminal to obtain an operating voltage.
は、前記共通接地端子から見て2種類の電圧を前記共通
接地端子以外の互いに異なる端子に印加することを特徴
とする請求項1に記載の半導体メモリカードシステム。2. The power supply device provided in the system body applies two types of voltages to different terminals other than the common ground terminal as viewed from the common ground terminal. Semiconductor memory card system.
あり、前記半導体メモリカード側コネクタはジャックタ
イプである請求項1又は2に記載の半導体メモリカード
システム。3. The semiconductor memory card system according to claim 1, wherein said power supply side connector is a plug type, and said semiconductor memory card side connector is a jack type.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9048754A JPH10247379A (en) | 1997-03-04 | 1997-03-04 | Semiconductor memory card system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9048754A JPH10247379A (en) | 1997-03-04 | 1997-03-04 | Semiconductor memory card system |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10247379A true JPH10247379A (en) | 1998-09-14 |
Family
ID=12812079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9048754A Pending JPH10247379A (en) | 1997-03-04 | 1997-03-04 | Semiconductor memory card system |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH10247379A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005078648A (en) * | 2003-09-02 | 2005-03-24 | Samsung Electronics Co Ltd | System including attachable/detachable storage device and control method therefor |
-
1997
- 1997-03-04 JP JP9048754A patent/JPH10247379A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005078648A (en) * | 2003-09-02 | 2005-03-24 | Samsung Electronics Co Ltd | System including attachable/detachable storage device and control method therefor |
JP4707352B2 (en) * | 2003-09-02 | 2011-06-22 | 三星電子株式会社 | System including removable storage device and control method thereof |
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