JPH10243423A - Matrix board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To sufficiently prevent crosstalk without causing a large sized scale and reduction in mount density. SOLUTION: A plurality of X patterns in parallel are formed on a front side of a board 11 and a plurality of Y patterns in parallel are formed on a rear side of the board 11. A cross point hole 15 is formed to each cross point between the X patterns 12 and the Y patterns 13, and the patterns are connected or disconnected by inserting/withdrawing a metallic pin to/from each cross point hole 15. Two adjacent X patterns are assigned to one channel in a pair, and each lead pattern 19a connecting to one pattern of the pair in the X patterns 12 is formed on the front side of the board 11, and each lead pattern 19b connecting to the other pattern of the pair is formed on the rear side of the board 11 while they are opposite to each other. Crosstalk is produced in a matrix section 14 and a lead section 21 opposite in phases and cancelled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a matrix board, and more particularly to a matrix board mainly used in a main line distribution connection device for arbitrarily connecting or disconnecting between a subscriber and an exchange.

[0002]

2. Description of the Related Art Main line distribution and connection equipment (MDF: main)
Distributing frame) is a device for arbitrarily connecting or disconnecting between a plurality of subscriber terminals and the exchange, and when a new subscriber contract is established,
In the case of moving or changing the telephone number of the subscriber, or in the case of termination of the subscriber contract, the connection between the subscriber line connected to the subscriber terminal and the exchange line connected to the subscriber circuit of the exchange is switched. , A switch board for connecting or disconnecting. As these lines, two lines A and B are used per subscriber.

For connection or disconnection, the MDF has a matrix board. The matrix board has a plurality of parallel-arranged X-direction wiring patterns to which subscriber-side lines are connected on the surface of a substrate made of an insulating material, and a plurality of switching-side lines to be connected to the back surface of the substrate. And a plurality of input / output connectors having a plurality of metal pins (terminals) are mounted on the edge of the substrate.

As the connectors, there are a subscriber side connector to which a subscriber side line is connected, and an exchange side connector to which an exchange side line is connected. An X direction wiring pattern corresponding to each metal pin of the subscriber side connector and the exchange are provided. The Y-direction wiring patterns corresponding to the respective metal pins of the side connector are connected by a plurality of lead-out wiring patterns arranged and formed in parallel with the surface of the substrate.

The X-direction wiring pattern and the Y-direction wiring pattern are formed in a matrix by being formed so as to be orthogonal to each other, and a difference hole is formed at the intersection.

[0006] By inserting the connection pin into the difference hole, the X-direction wiring pattern is connected to the Y-direction wiring pattern to be connected, and by removing the connection pin, the X-direction wiring pattern is removed.
The Y-direction wiring pattern corresponding to the direction wiring pattern is cut. Insertion and removal of the connection pins are automatically performed by a dedicated robot.

A portion of the substrate where the X-direction wiring patterns and Y-direction wiring patterns are formed in a matrix is called a matrix portion, and a portion of the substrate where the lead-out wiring patterns are formed is called a lead portion.

[0008]

In such a matrix board, miniaturization or high density is required, and it is important to prevent crosstalk between lines. However, when the size between the lines (wiring patterns) on the matrix board is reduced in order to cope with the miniaturization, the occurrence of crosstalk increases, and conversely, between the lines (wiring patterns) on the matrix board to prevent crosstalk. Increasing the size of the device causes a problem that the size of the device increases or the mounting density decreases.

The present invention has been made in view of such a point, and an object of the present invention is to provide a matrix board in which crosstalk is sufficiently prevented without increasing the size or lowering the mounting density. That is.

[0010]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, in the matrix board of the present invention, a pair of parallel first patterns (X-direction wiring patterns) formed on a first layer of a substrate (multi-layer substrate) and the first layer of the substrate are different from each other. A plurality of second patterns (Y-direction wiring patterns) formed on different second layers and intersecting the first pattern, and selectively connecting or disconnecting the first pattern and the second pattern at intersections thereof; Connecting means to
A third pattern (lead wiring pattern) formed on the first layer of the substrate and connected to one of the first patterns
And a fourth pattern (lead-out wiring pattern) formed on the second layer of the substrate so as to be parallel to the third pattern and connected to the other of the first patterns.

According to the present invention, in the matrix section composed of the first and second patterns, the pair of first patterns as the A line and the B line assigned to each line are formed on the same layer (first layer) of the substrate. ), The third and fourth patterns as the A-line and the B-line assigned to each line are formed in different layers (the The three patterns are formed on the first layer, and the fourth pattern is formed on the second layer).

With such a configuration, crosstalk caused by capacitive coupling and inductive coupling between the first pattern assigned to one line and the other first pattern assigned to another line in the matrix section is obtained. For the phase,
Crosstalk generated between the third and fourth patterns assigned to the one line and the other third and fourth patterns assigned to the other line in the drawer occurs in opposite phases and cancel each other. As a result, the occurrence of overall crosstalk can be reduced.

Therefore, the crosstalk can be reduced without increasing the separation distance between the patterns used for each line, and the miniaturization and high-density mounting can be realized.

[0015]

Embodiments of the present invention will be described below in detail with reference to the drawings. [First Embodiment] FIGS. 1 to 4 show a main line distribution and connection device (MDF: main distributing fs).
FIG. 3 is a diagram showing a configuration of a matrix board according to the first embodiment of the present invention used for (r. First, FIG.
FIG.

This matrix board is a switch board for arbitrarily connecting or disconnecting the subscriber line and the exchange line. The line for the subscriber connected to the subscriber terminal and the line on the exchange side connected to the subscriber circuit of the exchange,
One line is constituted by two lines of A line and B line which are physically separated, and connection or disconnection of these lines is performed simultaneously for the two lines.

In FIG. 1, reference numeral 11 denotes a matrix board substrate (multilayer printed wiring board), and the substrate 11 has wiring layers (first and second layers) on both surfaces (front and rear surfaces) of an insulating material (eg, glass epoxy resin). (Second layer).

On a part of the surface of the substrate 11, a plurality of X-direction wiring patterns 12 parallel to each other in the longitudinal direction (X direction) of the substrate are formed. On the other hand, a plurality of Y-direction wiring patterns 13 that are parallel to each other in the substrate short direction (Y direction) and that are orthogonal to the X-direction wiring patterns 12 are formed on the corresponding portion of the back surface of the substrate 11.

The X-direction wiring pattern 12 and the Y-direction wiring pattern 13 are arranged orthogonally to form a matrix (this portion is called a matrix portion).
In this embodiment, two matrix portions 14 are formed on the substrate 11.

The details of the matrix section 14 are shown in FIGS. 2A and 2B. As shown in FIG. 2A, in the X-direction wiring pattern 12, one of a pair of X-direction wiring patterns adjacent to each other is used for an A line, the other is used for a B line, and an A line and a B line are used. Are used to be repeated sequentially. Similarly, the Y-direction wiring pattern 13 is
One of a pair of Y-direction wiring patterns adjacent to each other is used for an A-line, the other is used for a B-line, and a set of the A-line and the B-line is used so as to be sequentially repeated.

A difference hole 15 is formed at the intersection of the X-direction wiring pattern 12 and the Y-direction wiring pattern 13. A land 16 is formed around the difference hole 15, and the land 16 has an X-direction wiring pattern 1.
2 or Y-direction wiring patterns 13 are connected. As shown in FIG. 2B, the land 16 is formed so that a part thereof slightly protrudes inside the difference hole 15.

The connection between the X-direction wiring pattern 12 and the Y-direction wiring pattern 13 is performed by selectively inserting connection pins into the difference holes 15. As shown in FIG. 3A, the connection pin 17 is provided with two metal springs 17.
3A and 3B, one of the metal springs 17a is connected to the difference hole 15 on the A-line side, and the other metal spring 17a is connected to the connection pin 17 as shown in FIGS. Is positioned in the difference hole 15 on the B-line side and inserted.

As a result, the X-direction wiring pattern 12 for each of the A line and the B line is
And the Y-direction wiring pattern 13 are electrically connected. The cutting of the X-direction wiring pattern 12 and the Y-direction wiring pattern 13 is performed by removing the connection pins 17. Insertion or removal of these connection pins 17 is automatically performed by a dedicated robot (not shown).

Referring back to FIG. At the longitudinal end of the board 11, a subscriber side connector 18a to which a subscriber side line connected to a subscriber terminal is connected and an exchange side to which an exchange side line connected to a subscriber circuit of the exchange are connected. Connectors 18b are respectively attached.

In the X-direction wiring pattern 12, the line A (A
Are connected to the subscriber side connector 18a via the lead-out wiring pattern 19a formed on the surface of the substrate 11, and the B lines (B1, B2,...) Are formed on the back surface of the substrate 11. It is electrically connected to the subscriber-side connector 18a via the lead-out wiring pattern 19b.

The Y-direction wiring pattern 13 is electrically connected to the exchange-side connector 18b via a lead-out wiring pattern 20 formed on the back surface of the substrate 11. The portion where these lead wiring patterns 19a, 19b and 20 are formed is referred to as a lead portion 21 to distinguish it from the matrix portion 14.

A part of the lead-out wiring pattern 19a and a corresponding part of the lead-out wiring pattern 19b are formed to be parallel to each other and to face each other with the substrate 11 interposed therebetween (however, in FIG. Are displayed slightly off). The lead-out wiring pattern 19b is formed on the X-direction wiring pattern 12 on the surface of the substrate through a via hole 22 for interlayer connection.
Is conducted.

FIG. 4A is a sectional view taken along the line II of FIG.
Is shown. As mentioned above, one line is 2
A1 line and B line for line 1
The A2 line and the B2 line for one line and the line 2 are formed on the surface of the substrate 11 in this order.

FIG. 4B is a cross-sectional view taken along the line II-II of FIG.
a and 19b are shown. A1 for line 1
The line is formed on the front surface of the substrate 11, and the B1 line for line 1 is formed on the back surface of the substrate 11 so as to face the A1 line. The A2 line for the line 2 is formed on the front surface of the substrate 11, and the B2 line for the line 2 is formed on the back surface of the substrate 11 so as to face the A2 line. That is, A
Line 1 and line A2 are formed adjacent to the surface of the substrate 11,
The B1 line and the B2 line are formed adjacent to the back surface of the substrate.

Hereinafter, the principle of this embodiment will be described. The A1 line and the B1 line for the line 1 and the A2 line and the B2 line for the line 2 are connected to the A1 line and the line for the line 1 on the surface of the substrate 11 as shown in FIG. A2 line for line 2 and B on line 1 for line 1
When the B2 line for one line and the line 2 is arranged (such an arrangement is referred to as conductor arrangement 1), the capacitive coupling ratio and the inductive coupling ratio between the line 1 and the line 2 take positive values. There are many.

On the other hand, A1 line and B1 line for line 1
The line A2 and the line B2 for line 2 are shown in FIG.
As shown in (1), when they are formed and arranged on the same layer (surface) (such an arrangement is called conductor arrangement 2), the capacitive coupling ratio and the inductive coupling ratio between the lines 1 and 2 are negative. Often takes a value.

Therefore, by utilizing this characteristic, the conductor arrangement 1
The crosstalk can be reduced by appropriately combining and conductor arrangement 2. Here, the crosstalk ratio between lines can be represented by the following equation.

Kn = ω (A + B) Kf = ω (AB) A = Cu · Zo · L / 8 B = Mu · Lp / 2 · Zo Cu {C13-C24-C14-C23Mu} -Permeability ln ((d13 × d24) / (d14
× d23)) / 2π, where Kn: near-end crosstalk ratio, Kf: far-end crosstalk ratio, ω: each frequency, A: capacitive coupling, B: inductive coupling, L: parallel section length, Lp: matrix Section, (L) when applied to a simple connection section such as a drawer section, Zo: line termination impedance, Cu: coupling capacity, Mu. : Coupling inductance.

C13 is the coupling capacitance between the A1 and A2 lines, C24 is the coupling capacitance between the B1 and B2 lines, and C14 is the A
C23 is the coupling capacitance between line 1 and line B2, and C23 is the coupling capacitance between line B1 and line A2. d13 is the distance between the A1 line and the A2 line,
d24 is the distance between the B1 line and B2 line, d14 is the A1 line and B
The distance between the two lines, d23, is the distance between the B1 line and the A2 line.

For example, pitch between wiring patterns: 0.4
mm, thickness of wiring pattern: 0.05 mm, width of wiring pattern: 0.2 mm, thickness of substrate: 0.2 mm, material of substrate: FR-4 (glass epoxy), typical simulation values Is shown in FIG. However, Zo: 11
0Ω, wiring pattern length: 1m, frequency f: 160KH
z.

As can be seen from the figure, it is understood that by connecting the conductor arrangement 1 and the conductor arrangement 2 in series, the characteristics of crosstalk are improved on the near end side, and the line length of the conductor arrangement 1 is improved. By appropriately adjusting the ratio of the line lengths of the conductor arrangement 2 and the conductor arrangement 2, the far-end and near-end crosstalk can be made substantially zero.

[Second Embodiment] FIG. 7 shows a second embodiment of the present invention.
FIG. 3 is a partially cutaway perspective view showing a configuration of a main part of the embodiment. In the second embodiment, a part of the configuration of the first embodiment is modified.

In the first embodiment, as shown in FIG. 4B, at the lead-out portion 21 (conductor arrangement 1) on the substrate 11, the line A (line A
The lead-out wiring pattern 19a as (1, A2) and the lead-out wiring pattern 19b as B lines (B1, B2) constituting the lines 1 and 2 are formed so as to face each other with the substrate 11 interposed therebetween.

On the other hand, in the second embodiment, as shown in FIG. 7, the lead wiring pattern 19a as the A1 line and the lead wiring pattern 1 as the B2 line
The lead-out wiring pattern 19a as the A1 line and the lead-out wiring as the A2 line such that the distance between the lead-out wiring pattern 19a as the A2 line and the lead-out wiring pattern 19b as the B1 line is larger than the distance between the lead-out wiring pattern 19a as the A2 line and the lead-out wiring pattern 19b. Pattern 1
9a, a lead-out wiring pattern 19b as a B1 line
And the lead wiring pattern 19b as the B2 line is offset.

That is, at the lead portion 21 (conductor arrangement 1) on the substrate 11, the A line (A
The lead-out wiring pattern 19a as (1, A2) and the lead-out wiring pattern 19b as B lines (B1, B2) constituting the lines 1 and 2 are formed offset in the Y direction with the substrate 11 interposed therebetween. . Although the offset amount is shown in FIG. 7 so that the A2 line and the B1 line face each other with the substrate 11 interposed therebetween, the present invention is not limited to this.

Here, for example, under the same conditions as in FIG. 6, when the offset amount is 0.4 mm, the capacitive coupling ratio is A = 350 (× 10 ⁻¹² ), and the inductive coupling ratio is B = 320 (× 10 ⁻¹² ). As described above, by adjusting the offset amount, the ratio between the capacitive coupling ratio and the inductive coupling ratio can be adjusted.

Therefore, by adjusting the offset amount, the lead-out portion 21 (conductor arrangement 1) has an effect on the capacitive coupling ratio and the inductive coupling ratio of the matrix portion 14 (conductor arrangement 2).
Can adjust the capacitive coupling ratio and the inductive coupling ratio of
In order to reduce the crosstalk by the combination of the conductor arrangement 1 and the conductor arrangement 2, it is possible to adjust the conditions to optimal conditions.

According to the configuration of the second embodiment, for example, as described above, the capacitive coupling ratio and the inductive coupling ratio can be adjusted to be substantially equal. Side crosstalk can be almost eliminated.

[Third Embodiment] FIGS. 8A and 8B are partially cutaway perspective views showing a main part of a third embodiment of the present invention. In the third embodiment,
This is a modification of the configuration of the second embodiment.

In the third embodiment, as shown in FIG. 8B, at the lead-out portion 21 (conductor arrangement 1) on the substrate 11, the A line ( A
Correspondence of the extraction wiring pattern 19b as the B line (B1, B2) constituting the line 1 and the line 2 to a part of the extraction wiring pattern 19a (part on the side of the subscriber connector 18a) as (1, A2). Part of the substrate Y
It is offset to one side (the lower side in FIG. 1) in the direction (the direction in which the Y-direction wiring pattern is formed). This is the same as in the second embodiment.

In addition to this, as shown in FIG. 8B, at the lead-out portion 21 (conductor arrangement 1) on the substrate 11, the A lines (A1, A2) constituting the lines 1 and 2 Other part of the extraction wiring pattern 19a (the matrix part 1)
4), the lines B constituting the lines 1 and 2
The other corresponding portion of the lead-out wiring pattern 19b as the line (B1, B2) is formed offset with respect to the other side (the upper side in FIG. 1) in the Y direction (the forming direction of the Y-direction wiring pattern) across the substrate 11. ing.

By adopting such a configuration, fine adjustment of the ratio of the capacitive coupling ratio and the inductive coupling ratio becomes easier than in the second embodiment. [Fourth Embodiment] FIG. 9 is a perspective view, partially omitted, showing a main part of a fourth embodiment of the present invention. In the fourth embodiment, a part of the configuration of the first embodiment is modified, and crosstalk is reduced by devising the configuration of the subscriber side connector 18a. .

In the first embodiment, the lengths of the lead-out wiring patterns 19a and 19b in the lead-out portion 21 are of a certain length to offset the capacitive coupling ratio and the inductive coupling ratio in the matrix portion 14. In order to secure the length, the size of the substrate 11 must be increased.

Therefore, in the fourth embodiment, FIG.
As shown in the figure, the arrangement of the metal pins 23a and 23b of the subscriber-side connector 18a mounted on the board 11 is
A plurality of metal pins are used in the Y direction and formed in two rows in the X direction.
A line A constituting one line is connected to 3a, and a B line corresponding to the other 23b is connected. That is, the metal pins of the connector are arranged as in conductor arrangement 1 in FIG.

With such a configuration, it is possible to generate crosstalk having a phase opposite to that of the crosstalk in the matrix section 14 by the portions of the metal pins 23a and 23b. It is possible to shorten the length of the wiring patterns 19a, 19b,
The size of the substrate 11 can be reduced.

[Fifth Embodiment] FIG. 10 is a perspective view, partially omitted, showing a main part of a fifth embodiment of the present invention. In the fifth embodiment, a part of the configuration of the fourth embodiment is changed, and a part of the configuration of the subscriber side connector 18a is changed.

A part 24a of the base 24 of the connector 18a is inserted between the metal pins 23a and 23a and 23b and 23b adjacent to each other in the Y direction of the subscriber side connector 18a. (Insulating material) is made of a material having a high dielectric constant.

The material of the base 24 of the connector 18a is, for example, PBT (polybutylene terephthalate: PBT).
Polybutylene ephthalate, ceramic powder composite plastic, or the like can be used.

With such a configuration, between the metal pins 23a and 23b facing each other in the X direction,
Without increasing the capacitive coupling between the lines, the capacitive coupling between the metal pins 23a and 23a and 23b and 23b opposed in the Y direction, that is, the capacitive coupling between the lines can be increased. Of the opposite ends for canceling the far-end and near-end crosstalk of the first embodiment, the length of the metal pins 23a and 23b of the subscriber-side connector 18a can be made shorter than in the fourth embodiment. be able to.

[Sixth Embodiment] FIG. 11 is a perspective view, partially omitted, showing a main part of a sixth embodiment of the present invention. In the sixth embodiment, a part of the configuration of the fourth embodiment is changed, and a part of the configuration of the subscriber-side connector 18a is changed.

In the fourth embodiment, each of the metal pins 23a and 23b of the subscriber-side connector 18a has a square cross-sectional shape. The cross section of the metal pins 25a and 25b adjacent to the side connector 18a in the Y direction was rectangular so that the X direction was larger than the Y direction. That is, the areas of the opposing surfaces of the metal pins 25a and 25a and 25b and 25b opposed in the Y direction are set large.

With such a configuration, the space between the metal pins 25a and 25b facing each other in the X direction,
Without increasing the capacitive coupling between the lines, the capacitive coupling between the metal pins 25a and 25a and 25b and 25b opposed in the Y direction, that is, the capacitive coupling between the lines can be increased. And cross-talk of opposite phases for canceling the far-end and near-end crosstalk can be generated, and the length of the metal pins 25a and 25b of the subscriber-side connector 18a can be made shorter than in the fourth embodiment. be able to.

[Seventh Embodiment] FIG. 12 is a perspective view, partially omitted, showing a main part of a seventh embodiment of the present invention. In the seventh embodiment, a part of the configuration of the first embodiment is modified, and the subscriber circuit and the matrix board are connected by lead wires 26a and 26b without providing the subscriber side connector 18a. The case of a configuration in which direct connection is made is shown.

In the case of such a configuration, the A lines (A1, A2, A3) for the respective lines (lines 1 to 3) are adjacent to each other so that their corresponding portions are substantially parallel, and Line B (B1,
B2, B3) are adjacent to each other so that their corresponding portions are substantially parallel to each other, and the A-ray flux and the B-ray flux are separated from each other.

With such a configuration, the capacitive coupling between the lines can be increased without increasing the capacitive coupling between the A line and the B line.
Since the crosstalk having the opposite phase to the crosstalk in the lead wires 26 and 26b can be generated by the parallel portions of the lead wires 26 and 26b,
a, 19b can be shortened, and the substrate 1
1 can be reduced in size.

[Eighth Embodiment] FIG. 13 is a perspective view, partially omitted, showing a main part of an eighth embodiment of the present invention. In the eighth embodiment, a part of the configuration of the first embodiment is changed, and the subscriber board connector 18a is not provided, and the matrix board is mounted on the motherboard 2.
7 shows a case where the configuration is such that it is directly mounted on the device.

In the case of such a configuration, only the matrix portion 14 (conductor arrangement 2) is arranged on the substrate 11 of the matrix board, and is composed of the lead-out wiring patterns 19a and 19b in the first embodiment. A portion (conductor arrangement 1) corresponding to the drawn portion 21 to be formed can be formed on the motherboard 27.

With this configuration, it is possible to generate crosstalk having a phase opposite to that of the crosstalk in the matrix section 14 by a portion corresponding to the lead-out section 21 formed on the motherboard 27. For,
The size of the substrate 11 of the matrix board can be reduced.

[0064]

Since the present invention is configured as described above, it is possible to provide a matrix board in which crosstalk is sufficiently prevented without increasing the size of the substrate or lowering the mounting density. .

[Brief description of the drawings]

FIG. 1 is a plan view showing an overall configuration of a first embodiment of the present invention.

FIG. 2 is an enlarged plan view (A) and a cross-sectional view (B) of a matrix section according to the first embodiment of the present invention.

FIGS. 3A and 3B are a cross-sectional view and a plan view showing a connection state in a matrix unit according to the first embodiment of the present invention. FIGS.

FIG. 4A is a sectional view taken along the line II of FIG.
It is sectional drawing (B) along the II line.

FIGS. 5A and 5B are diagrams for explaining the principle of the first embodiment of the present invention, wherein FIG. 5A shows a conductor arrangement 1 and FIG.

FIG. 6 is a diagram showing simulation values according to the first embodiment of the present invention.

FIG. 7 is a partially broken perspective view showing a main part configuration of a second embodiment of the present invention.

FIG. 8 is a partially broken perspective view showing a configuration of a main part of a third embodiment of the present invention.

FIG. 9 is a partially omitted perspective view showing a configuration of a main part of a fourth embodiment of the present invention.

FIG. 10 is a partially omitted perspective view showing a configuration of a main part of a fifth embodiment of the present invention.

FIG. 11 is a partially omitted perspective view showing a configuration of a main part of a sixth embodiment of the present invention.

FIG. 12 is a partially omitted perspective view showing a configuration of a main part of a seventh embodiment of the present invention.

FIG. 13 is a partially omitted perspective view showing a configuration of a main part of an eighth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Substrate 12 X direction wiring pattern 13 Y direction wiring pattern 14 Matrix part 15 Difference hole 17 Connection pin 18a Subscriber side connector 19a, 19b Leading wiring pattern 21 Leading part 22 Via hole

Claims (7)

[Claims] 1. A pair of first patterns formed on a first layer of a substrate and being parallel to each other, and a plurality of first patterns formed on a second layer different from the first layer of the substrate and intersecting the first pattern. A second pattern, connecting means for selectively connecting or disconnecting the first pattern and the second pattern at their intersections, formed on the first layer of the substrate, and connected to one of the first patterns. A third pattern connected thereto, and the second pattern of the substrate parallel to the third pattern.
A fourth pattern formed in a layer and connected to the other of the first patterns. 2. A first and a second pattern formed on a surface of a substrate in parallel with each other and used as a pair for one line, and a first pattern and a second pattern on a surface of the substrate in parallel with the first and second patterns. Third and fourth patterns formed in parallel and used in pairs for other lines; and a plurality of fifth patterns formed in parallel with each other on the back surface of the substrate and intersecting the first to fourth patterns. Connecting means for selectively connecting or disconnecting the first to fourth patterns and the fifth pattern at their intersections; and a sixth pattern formed on the surface of the substrate and connected to the first pattern. A seventh pattern formed on the back surface of the substrate so as to be parallel to the sixth pattern and connected to the second pattern; and an eighth pattern formed on the front surface of the substrate and connected to the third pattern. putter And a ninth pattern formed on the back surface of the substrate so as to be parallel to the eighth pattern and connected to the fourth pattern. 3. The matrix board according to claim 2, wherein the sixth pattern and the seventh pattern, and the eighth pattern and the ninth pattern are opposed to each other with the substrate interposed therebetween. A matrix board characterized by the following. 4. The matrix board according to claim 2, wherein a distance between the sixth pattern and the ninth pattern is:
The seventh pattern and the ninth pattern are offset with respect to the sixth pattern and the eighth pattern so as to be larger than a separation dimension between the seventh pattern and the eighth pattern. Matrix board. 5. The matrix board according to claim 2, wherein a distance between a part of the sixth pattern and a corresponding part of the ninth pattern is equal to a part of the seventh pattern and the eighth pattern. With respect to the part of the sixth pattern and the part of the eighth pattern, the part of the seventh pattern and the ninth pattern are larger than a separation dimension from a corresponding part of the seventh pattern. And the distance between the other part of the seventh pattern and the corresponding other part of the eighth pattern is different from the other part of the sixth pattern and the corresponding other part of the ninth pattern. The other part of the seventh pattern and the other part of the ninth pattern are offset with respect to the other part of the sixth pattern and the other part of the eighth pattern so as to be larger than the separation dimension of the sixth pattern. Did Matrix board, characterized. 6. The matrix board according to claim 1, wherein a first pin connected to the sixth pattern, a second pin connected to the seventh pattern, and a third pin connected to the eighth pattern. And a connector having a fourth pin connected to the ninth pattern, wherein the first pin faces the second pin and the third pin, and the fourth pin is the second pin and the third pin. A matrix board, which is arranged at a position corresponding to a vertex of a rectangle so as to face a pin. 7. The matrix board according to claim 6, wherein a dimension of the first pin in a direction from the first pin to the third pin is equal to a dimension of the first pin from the first pin to the second pin. The dimension of the second pin in the direction from the second pin to the fourth pin is set to be larger than the dimension of the second pin in the direction from the second pin to the first pin. The dimension of the third pin in the direction from the third pin to the first pin is larger than the dimension of the third pin in the direction from the third pin to the fourth pin. Setting the size of the fourth pin in the direction from the fourth pin to the second pin larger than the size of the fourth pin in the direction from the fourth pin to the third pin. Features a matrix board.