JPH10242644A - Green sheet printed with conductor circuit, and its manufacture, and multilayer wiring ceramic board using this - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to peel a conductor circuit pattern off a base material and to bond this pattern accurately to a ceramic green sheet at the same time, by using a thermoexfoliative adhesive sheet for base material for transfer where a conductor circuit pattern is manufactured. SOLUTION: A thermoexfoliative adhesive layer is made on a base material, and a metallic conductor circuit pattern is made on the side of the thermoexfoliative adhesive layer. A ceramic green sheet is welded by heating to the metallic conductor circuit pattern, with its tip of the projection positioned to connect with the circuit pattern, and the conductor pattern is transferred, and then, the green sheet printed with the conductor circuit is peeled off the thermoexfoliative adhesive layer on the base material. Wired green sheets units fitted obtained this way are laid on top of one another in such a way as to match one another, and are pressure-welded by heating and are sintered. Hereby, a multilayer ceramic board which is of high strength and excellent in electric property can be manufactured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high performance multilayer wiring ceramic substrate having a low-resistance conductor circuit in which a conductor wiring for mounting a semiconductor chip to form a functional module is provided.

[0002]

2. Description of the Related Art The multilayer technology of ceramics is a technology for multilayer wiring ceramic substrates and the like which are indispensable for miniaturization and high performance of electronic ceramic devices such as multilayer ceramic capacitors and piezoelectric elements, and high-density mounting of semiconductor elements and the like. Is raised.

[0003] Conventional multilayer ceramic substrates have utilized sintered metal patterns on individual layers interconnected by sintered conductors in via holes that penetrate the layers at selected locations. In these conductor pattern production methods, 1) a conductor paste is printed by a screen printing method on a ceramic green sheet having a conductor in a via hole penetrating the layered body to form a film. The conductor pattern obtained by these methods is sintered. 2) attaching a metal conductor pattern to each of the plurality of backing sheets, transferring each pattern to individual unquenched ceramic green sheets, and superimposing the green sheets so that they are aligned with each other;
Multilayer ceramics used for mounting and interconnecting electronic devices by limiting the shrinkage of the superimposed ceramic in the X and Y directions so that the superimposed green sheets are sintered at a temperature below the melting point of the metal conductor It is known that a substrate is manufactured (JP-A-63-9959).
No. 6).

In order to achieve high density, high performance and high reliability of a multilayer ceramic substrate, it is necessary to form fine patterns of conductor wiring, to reduce the resistance of the conductor wiring and to provide reliable individual interconnections. . However, 1) In the case of a multilayer wiring ceramic substrate formed using a conventional conductive paste or photosensitive conductive paste, the specific resistance is 3.0 to 4.0 μΩ · cm, which is larger than that of bulk copper 1.7 μΩ · cm, and the resistance is low. Can not be achieved. Also, in the conductor formation by screen printing, the width 60
Only a wiring pattern of μm or more can be obtained, and it is difficult to pattern extremely fine wiring. Even if done, the cost of the screen is high. It is difficult to make the wiring finer than about 60 to 100 μm. On the other hand, 2) a metal conductor pattern is applied to each of the backing sheets (polyethylene terephthalate, polyimide, etc.) coated with a plurality of release materials (for example, polyvinyl butyral, alpha-methyl styrene, polyisobutylene, or polymethyl methacrylate). Since they are directly attached to the release material, it is difficult to transfer their respective patterns uniformly to individual unquenched ceramic green sheets. This is because the adhesiveness between the release material and the metal conductor varies. Further, since the green sheet surface and the stud surface of the metal conductor pattern are the same surface, the reliability between the layered connections is not sufficient.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks. In other words, in order to enable high-density wiring, low resistance, and high reliability, by using a heat-peelable adhesive sheet for the transfer substrate on which the conductive circuit pattern has been formed, transfer to the ceramic green sheet can be performed with good yield. By providing a pad-shaped conductor protruding from a via hole at a selected position, the connection reliability between layers was improved. At the same time, it is positioned so as to be connected to the pad-shaped conductor and metal conductor pattern of the ceramic green sheet, heat-pressed to transfer the conductor pattern, and the obtained green sheets with conductor circuits are overlapped so as to match each other. By applying heat and pressure, limiting the shrinkage of the superposed ceramics in the X and Y directions, and sintering while applying a load in the Z (thickness) direction, it is a high-strength, highly reliable multilayer with excellent electrical characteristics. Provided is a wiring ceramic substrate.

[0006]

Means for Solving the Problems As a result of intensive studies, the present inventor has formed a step of forming a heat-peelable adhesive layer on a substrate and forming a metal conductor circuit pattern on the heat-peelable adhesive layer surface side. Providing a pad-shaped conductor portion made of a conductor paste or a metal conductor alloy having a melting point of 10 ° C. to 100 ° C. lower than the conductor circuit pattern in the via hole for interlayer connection, and connecting the tip of the protrusion of the ceramic green sheet to the metal conductor circuit pattern. Transferring the conductive pattern by heating and pressing to transfer the conductive pattern and peeling the conductive sheet from the heat-peelable adhesive layer on the base material to the green sheet with conductive circuit, so that the obtained green sheet units with wiring are aligned with each other. X and Y of superimposed ceramics
It has been found that a multilayer ceramic substrate having high strength and excellent electrical characteristics can be manufactured by limiting shrinkage in the direction and sintering while applying a load in the Z (thickness) direction.

Hereinafter, the present invention will be described in detail.

A heat-peelable adhesive sheet (separator /
Thermal release adhesive / base material (polyethylene terephthalate) /
(Adhesive / separator) and a copper foil on the side of the heat-peelable adhesive. Next, a copper foil is patterned by a photosensitive dry film. Thus, the substrate for conductor circuit transfer is manufactured.

On the other hand, a green sheet to which a conductor pattern is transferred from the transfer substrate is formed by a conventional method by the following method. For example, a ceramic slurry composed of 100 parts by weight of a ceramic powder having an average particle diameter of 20 μm or less, a dispersing aid, and an organic solvent (or an aqueous solvent) is mixed with a ball mill by a ball mill.
The mixture is wet-mixed for up to 5 hours, and then 2 to 30 parts by weight of an organic binder, a plasticizer, or a plasticizer-containing organic binder is added, and the wet-mixing is further performed for at least 5 hours to produce a ceramic slurry. After defoaming, dewatering and removing the solvent, a green sheet is formed by a doctor flade method or the like at a casting temperature from room temperature to 120 ° C. The production method is not particularly limited.

The obtained green sheet having a thickness of 0.05 to 2 mm is sized to a predetermined size, for example, 10 to 200 mm × 1.
The substrate is cut into 0 to 200 mm squares, and via holes are punched in necessary layers at predetermined positions. Cu (melting point 1083.4 ° C.), copper-silver alloy (melting point 10
A conductor paste or a copper alloy ball mainly containing a conductor such as 83.4 to 961.9 ° C. and Au (melting point 1064 ° C.) is embedded. In this way, a conductor-filled green sheet is manufactured.

Next, after aligning the conductive circuit transfer substrate and the conductive-filled green sheet with a predetermined temperature and pressure, the conductive circuit pattern is transferred to the green sheet. The foaming agent contained therein is fired, and the heat-peelable adhesive and the conductor circuit pattern are peeled off, whereby a green sheet with a conductor circuit is manufactured.

Next, several to several tens of green sheets with a conductor circuit are laminated, and the temperature is 80 to 150 ° C. and the pressure is 0.98M.
Pa~29.4MPa (10~300kgf / cm ²⁾
Hot press bonding. The obtained laminate is cut into a predetermined shape and size. This is fired while applying a restraining force in the plane direction, that is, while applying a load in the thickness direction. Although the firing temperature varies depending on the type of the conductor, the multilayer wiring ceramic substrate is manufactured by firing in air or in a non-reducing atmosphere.

Examples of the base material of the heat-peelable adhesive film used for manufacturing the multilayer wiring ceramic substrate of the present invention include styrene-butadiene-styrene block copolymer (SBS) and styrene-isoprene-styrene block copolymer ( SIS), styrene, ethylene butylene,
Rubber-based heat-peelable adhesive film based on synthetic rubber such as styrene block copolymer (SEBS), rubber-based heat-peelable adhesive film based on natural rubber or synthetic rubber, methyl, ethyl, propyl, butyl, Acrylic acid esters such as acrylic acid or methacrylic acid having an alkyl group having 20 or less carbon atoms such as ethylhexyl, isooctyl, isononyl, isodecyl, dodecyl, lauryl, tridecyl, pentadecyl, hexadecyl, heptadecyl, octadecyl, nonadecyl, and eicosyl groups; , Acrylic acid, methacrylic acid, itaconic acid, hydroxyethyl acrylate, hydroxypropyl acrylate,
Acrylic ester-based heat peeling containing hydroxyethyl methacrylate, hydroxypropyl methacrylate, N-methylolacrylamide, acrylonitrile, glycidyl acrylate, glycidyl methacrylate, vinyl acetate, styrene, isobutylene, isoprene, butadiene, vinyl ether, and the like as components Adhesive film and the like.

Examples of the tackifying resin include rosin and derivatives thereof, polyterpenes, petroleum resins and hydrogenated products thereof, cyclopentadiene petroleum resins, styrene petroleum resins, and cumarone indene resins. Can be The amount of the tackifier resin is 40 per 100 parts by weight of the base resin.
~ 200 parts by weight is suitable.

Examples of the foaming agent for thermal stripping include water, ammonium carbonate, ammonium bicarbonate, ammonium nitrite, sodium borohydride, azides and the like as inorganic foaming agents. Examples of organic propellants include fluorinated alkanes such as trichloromonofluoromethane and dichloromonofluoromethane, azo compounds such as azobisisobutyronitrile, azodicarbonamide, and barium azodicarboxylate, and paratoluene. Sulfonyl hydrazide, diphenyl sulfone-3,
Hydrazine compounds such as 3'-disulfonyl hydrazide, 4.4'-oxybis (benzenesulfonyl hydrazide) and allyl bis (sulfonyl hydrazide);
Semicarbazide compounds such as toluylenesulfonyl semicarbazide and 4,4'-oxybis (benzenesulfonyl semicarbazide), 5-morpholyl-1,2,2
Triazole compounds such as 3,4-thiatriazole, N, N-dinitropentamethylenetetramine,
N-nitroso-based compounds such as N-dimethyl-N, N'-dinitrosoterephthalamide are exemplified.

The amount of the foaming agent is determined by expanding the adhesive layer (firing).
It may be appropriately determined according to the degree of the reduction or the degree of the decrease in the adhesive strength. Generally, 5 to 40 parts by weight, preferably 10 to 30 parts by weight, is blended with respect to 100 parts by weight of the base polymer. A foaming agent that expands or foams at a temperature higher than the bonding temperature of the adhesive film is used.

The heat-expandable microparticles obtained by microencapsulating the foaming agent are used from the viewpoint of facilitating uniform mixing of the base polymer and the like. Specifically, for example, it is commercially available as Matsumoto Micro Fair (trade name, Matsumoto Yushi Seiyaku).

The average particle size of the ceramic powder used in the present invention is 20.0 μm or less, preferably 10 μm or less, more preferably 5 μm or less. Ceramic powder, for example,
_{Al 2 O 3, SiO 2,} 3Al 2 O 3 · SiO 2, PbO, A
l ₂ O ₃ .MgO, B ₂ O ₃ , CaO, BaO, ZrO ₂ ,
It is selected from one or more of ZnO, Na ₂ O, P ₂ O ₅ , K ₂ O, Li ₂ O and the like. More specifically, alumina (Al ₂ O ₃ ), anorthite (Anorthit)
e, CaO.AlO.2SiO ₂ ), mullite (Mul
lite, 3Al ₂ O ₃ .2SiO ₂ ), cordierite (Cordierite, 2MgO.2Al ₂ O ₃ .5S)
iO ₂ ), Spodumene, Li ₂
O · Al least one ceramic powder of the _{2 O 3 · SiO 2),} SiO 2 -B 2 O 3 -Na 2 O -based, SiO ₂ -
B ₂ O ₃ -K ₂ O _{based, SiO 2 -B 2 O 3 -Li} 2 O system, Si
Among borosilicate glasses such as O ₂ —B ₂ O ₃ —ZnO,
It is selected from one or more glass ceramic powders. Further, it is preferable that these glass ceramics are non-crystalline or crystalline glass ceramics which can be fired at a temperature lower than the melting point of copper, and that they have a high transverse rupture strength. Further, components which do not easily produce cristobalite after sintering are preferable. As the ceramic fine particles, spherical or pulverized particles are used. When fine through-hole processing is required, the average particle size of the ceramic powder for green sheets is generally 10 μm or less, preferably 5 μm or less.

The ceramic raw material used in the present invention comprises:
A high dielectric material such as BaTiO ₃ , a resistor material, and the like are also included, and are not particularly limited.

The organic binder used in the present invention includes, for example, polyvinyl butyral, polymethacrylate, polyisobutylene, poly (α-methylstyrene) and the like. These organic binders are used after being dissolved in a mixed solvent composed of an alcohol solvent such as butyl alcohol and an acetone solvent.

Among these, polymethacrylate is prepared by subjecting a polyethylene oxide resin as a polymerization dispersant to suspension polymerization in the presence of a vinyl monomer such as methacrylate ester monomer and a polymerization initiator, and obtaining an average particle size. An aqueous organic binder obtained by dispersing a polymer having a diameter of 5 μm or less in an aqueous system can also be used.

A slurry of a ceramic precursor composition comprising a ceramic precursor composition comprising 100 parts by weight of ceramic powder, 5 to 30 parts by weight of an organic binder for forming a ceramic, and if necessary, a dispersant and a plasticizer is used. A green sheet is obtained by coating the surface of the base material in a thin film form, the sheet is fixed to a jig, drilling is performed, and the conductor circuit pattern is transferred onto the green sheet filled with conductors. The multilayer ceramic substrate is obtained by laminating and adhering to several tens of layers from the layers and sintering under predetermined conditions (a binder removing step, and then a step of reducing residual carbon), and the above object is achieved. .

The ceramic powder is not particularly limited, but when it is formed into a green sheet that requires fine wiring and fine holes for high density, the average particle size of the ceramic powder is 20.0 μm. The following fine powder is desirable.

[0024]

Embodiments of the present invention will be described below.

(Examples 1 to 6) (Preparation of Green Sheet with Conductor Circuit) The adhesive side of a 200 mm square heat-peelable sheet was placed on the substrate, and the heat-peelable adhesive side was made of 12,18 μm copper. The foils were each laminated. Laminate photosensitive dry film on the copper foil surface,
Exposure, development, rinsing and drying of the photosensitive dry film so as to obtain a predetermined conductive circuit pattern, and
Etching was performed at ~ 50 ° C with a 37% ferric chloride etching solution so that the wiring widths became 50, 40, and 30 µm, respectively. Thus, a substrate for transferring a conductive circuit pattern was prepared.

Next, as a powder for a glass ceramic green sheet, borosilicate glass (SiO ₂ 8
_{4%, B 2 O 3 9} , K 2 O 4%, Al 2 O 3 3%) 5
100 parts by weight of a ceramic powder having a component of 0 wt% and 50 wt% of mullite and having an average particle diameter of 5 μm or less, 150 parts by weight of a solvent of butyl alcohol and isobutyl methyl ketone, 8 parts by weight of polybutyl methacrylate, and a plasticizer are added to alumina. The mixture was kneaded for 24 hours in a ball mill using a lining container and alumina balls. After preparing a slurry as a ceramic precursor composition in this manner, the slurry was defoamed under reduced pressure. Further, the viscosity of the slurry mixture was adjusted to 1000 to 5000 cP by concentration under reduced pressure, applied to a polyester film using a doctor blade type casting device, and dried at 100 ° C. to produce a green sheet. Using a punching die for green sheet, 200
It was cut into a square of 200 mm x 200 mm, and a hole for a guide was provided.
Thereafter, the green sheet was fixed using the guide holes, and a bias hole was punched at a predetermined position by a punch method. A copper paste consisting of 100 parts by weight of copper powder, 2 parts by weight of ethyl cellulose, and 10 parts by weight of 2,2,4-trimethylpentanediol monoisobutyrate has a conductor protruding in a pad-like shape in a bias hole of a green sheet. Was filled as follows. Heat (120 ° C.) crimping (pressure: pressure) by positioning so that the projecting pad of the conductor in the bias loop hole and a part of the conductor circuit pattern are connected.
100 kgf / cm ² ). During this thermocompression bonding, the copper circuit pattern is peeled off from the heat-peelable adhesive and adheres to the green sheet to produce a green sheet with a conductor circuit.

(Manufacture of Multilayer Wiring Ceramic Substrate) A green sheet with a conductor circuit is aligned with a hole for a guide to obtain a green sheet.
Zero sheets were laminated and subjected to hot press bonding at 130 ° C. and a pressure of 120 kgf / cm ² . The obtained laminate was cut into a required shape to obtain a 150 mm × 150 mm square green sheet laminate, and a binder was removed at 850 ° C. for 12 hours in a baking furnace of a mixed atmosphere of nitrogen and steam, followed by 9 hours.
It baked at 50-1000 degreeC for 2 hours. This gives 120
A multilayer wiring ceramic substrate having a size of 150 mm square and a thickness of 7 mm was manufactured.

(Evaluation) The wiring width,
The wiring thickness (substrate cross section measurement), transfer status, specific resistance (four-terminal method measurement), and disconnection occurrence rate (presence or absence of conduction) were measured. Table 1 shows the results.

(Comparative Example 1) The glass-ceramic green sheet produced in Example 1 was applied to a punch die for 200 hours.
It was cut into a square of 200 mm x 200 mm, and a hole for a guide was provided.
Thereafter, the green sheet was fixed using the guide holes, and a bias hole was punched at a predetermined position by a punch method. A copper paste comprising 100 parts by weight of copper powder, 2 parts by weight of ethyl cellulose, and 10 parts by weight of 2,2,4-trimethylpentanediol monoisobutyrate was filled in a bias through hole of a green sheet. next,
A circuit pattern was formed on the surface of the green sheet by a screen printing method using a copper paste. Forty green sheets on which a conductor circuit having a wiring width of 50 μm and a wiring thickness of 25 μm are formed are stacked in a state of aligning the positions of the holes for the guides, and subjected to hot press bonding at 130 ° C. and a pressure of 120 kgf / cm ^2. Done. The obtained laminate was cut into a required shape to obtain a green sheet laminate of 150 mm × 150 mm square, and the green sheet laminate was fired in a baking furnace of a mixed atmosphere of nitrogen and steam.
The binder was removed at 0 ° C. for 12 hours.
It was baked at 1000 ° C. for 2 hours. This gives 120 × 12
A 0 mm square, 7 mm thick multilayer wiring ceramic substrate was manufactured. With respect to the substrate after sintering, the wiring width, the wiring thickness (substrate cross-sectional measurement), the transfer status, the specific resistance (four-terminal method measurement), and the disconnection occurrence rate (presence or absence of conduction) were measured. Table 1 shows the results.

[0030]

[Table 1]

Comparative Example 2 (Preparation of Green Sheet with Conductor Circuit) A 10 wt% polyvinyl butyral solution was coated on a polyethylene terephthalate base material, and a 18 μm-thick copper foil was laminated. Laminate a photosensitive dry film on a copper foil surface, expose, develop, rinse, and dry the photosensitive dry film so as to obtain a predetermined conductor circuit pattern. Etching was performed with a ferric etching solution so that the wiring width became 40 μm. Thus, a substrate for transferring a conductive circuit pattern was prepared.

Next, as a powder for a glass ceramic green sheet, borosilicate glass (SiO ₂ 8
_{4%, B 2 O 3 9} , K 2 O 4%, Al 2 O 3 3%) 5
100 parts by weight of a ceramic powder having a component of 0 wt% and 50 wt% of mullite and having an average particle diameter of 5 μm or less, 150 parts by weight of a solvent of butyl alcohol and isobutyl methyl ketone, 8 parts by weight of polybutyl methacrylate, and a plasticizer are added to alumina. The mixture was kneaded for 24 hours in a ball mill using a lining container and alumina balls. After preparing a slurry as a ceramic precursor composition in this manner, the slurry was defoamed under reduced pressure. Further, the viscosity of the slurry mixture was adjusted to 1000 to 5000 cP by concentration under reduced pressure, applied to a polyester film using a doctor blade type casting device, and dried at 100 ° C. to produce a green sheet. Using a punching die for green sheet, 200
It was cut into a square of 200 mm x 200 mm, and a hole for a guide was provided.
Thereafter, the green sheet was fixed using the guide holes, and a bias hole was punched at a predetermined position by a punch method. A copper paste comprising 100 parts by weight of copper powder, 2 parts by weight of ethyl cellulose, and 10 parts by weight of 2,2,4-trimethylpentanediol monoisobutyrate was filled in a bias through hole of a green sheet. Heating (120 ° C.) and pressure bonding (pressure: 100 kgf / cm ² ) are performed by aligning the conductor in the bias loop hole with a part of the conductor circuit pattern. During this thermocompression bonding, the copper circuit pattern is peeled off from the heat-peelable adhesive and adheres to the green sheet to produce a green sheet with a conductor circuit.

(Manufacture of Multilayer Wiring Ceramic Substrate) A green sheet with a conductor circuit was aligned with a hole for guide 4
Zero sheets were laminated and subjected to hot press compression at 130 ° C. and a pressure of 120 kgf / cm ² . The obtained laminate was cut into a required shape to obtain a 150 mm × 150 mm square green sheet laminate, and a binder was removed at 850 ° C. for 12 hours in a baking furnace of a mixed atmosphere of nitrogen and steam, followed by 9 hours.
It baked at 50-1000 degreeC for 2 hours. This gives 120
A multilayer wiring ceramic substrate having a size of 150 mm square and a thickness of 7 mm was manufactured.

With respect to the substrate after sintering, the wiring width, the wiring thickness (substrate cross-sectional measurement), the transfer state, the specific resistance (measured by the four-terminal method), and the disconnection occurrence rate (presence or absence of conduction) were measured. Table 1 shows the results.

[0035]

According to the present invention, that is, by using a heat-peelable adhesive sheet for a transfer substrate on which a conductor circuit pattern has been produced, the conductor circuit pattern is peeled off from the substrate by heat, and at the same time, a ceramic green sheet can be accurately formed. Since they are bonded, they can be transferred with good yield. By providing a pad-shaped conductor protruding from the via hole at a selected position, the connection reliability between layers is greatly improved. In addition, the obtained green sheets with conductive circuits are superimposed on each other so as to be aligned with each other, and heated and pressed to limit shrinkage of the superimposed ceramics in the X and Y directions and sinter while applying a load in the Z (thickness) direction. Therefore, there is no sintering shrinkage in the X and Y directions, and no displacement of the connection position of the semiconductor element to the substrate and no displacement of the internal wiring are recognized.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a manufacturing process of a multilayer wiring ceramic substrate according to an embodiment of the present invention.

FIG. 2 is a layer configuration of a multilayer wiring ceramic substrate according to an embodiment of the present invention and a sectional view thereof.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Sintered glass ceramic, 2 ... Copper internal wiring conductor, 3 ... Multilayer wiring glass ceramic substrate, 4 ... I / O pin, 5 ... Solder, 6 ... Semiconductor element.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masahide Okamoto 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside of Hitachi, Ltd. Hitachi, Ltd. Production Technology Research Laboratories (72) Inventor Hideaki Tanaka 292, Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Hitachi, Ltd. General Computer Division, Manufacturing Corporation (72) Inventor Kunihiro Yagi 1st Horiyamashita, Hadano-shi, Kanagawa Hitachi, Ltd.General-purpose Computer Division, Hitachi Ltd. (72) Inventor Fumiko Kobayashi 1st Horiyamashita, Hadano-shi, Kanagawa Hitachi Computer Division

Claims (4)

[Claims] A step of forming a heat-peelable adhesive layer on a substrate and forming a conductive circuit pattern on the heat-peelable adhesive layer side;
Providing a protruding pad portion of a conductive paste or metal conductor having a melting point of 10 ° C. to 100 ° C. lower than the conductor circuit pattern in the via hole for interlayer connection, so that the protruding tip end of the glass ceramic green sheet is connected to the metal conductor pattern; 2. A method for producing a green sheet with a conductor circuit, comprising: a step of heat-pressing and positioning the substrate; and a step of peeling the heat-peelable adhesive layer from the green sheet to which the conductor circuit pattern has been transferred. 2. A method for transferring a metal conductor circuit pattern to a green sheet, comprising: forming a heat-peelable adhesive layer on a base material; and pressing the metal conductor layer on a side of the heat-peelable adhesive layer with a rotating roll. Furthermore, a step of forming a photosensitive resin layer for pattern formation on the metal conductor layer and patterning the metal conductor layer, and providing a via hole for interlayer connection in a green sheet made of glass ceramic powder and a thermally decomposable organic binder, The via hole has a melting point of 10
A step of providing a protruding pad portion of a conductor paste or a metal conductor at a temperature lower than 100 ° C. to 100 ° C., and a step of positioning the protruding portion so as to be connected to the metal conductor circuit pattern portion and performing thermocompression bonding. Of manufacturing a green sheet with a conductive circuit. 3. A multi-layer wiring ceramic substrate for transferring a metal conductor circuit pattern to a green sheet, wherein a heat-peelable adhesive layer is formed on a base material, and a metal conductor circuit pattern portion formed on the heat-peelable adhesive layer surface side. A green sheet with a conductor circuit is manufactured by aligning and heating and crimping the ceramic green sheet so as to be connected to a connection projection formed by embedding a conductive paste or a metal conductor in a via hole for interlayer connection of a ceramic green sheet. A multilayer wiring ceramic substrate characterized in that a green sheet with a conductor circuit is aligned with each other and heated and pressed to form a laminate, which is heated and sintered while applying a restraining force in a surface direction. 4. A multi-layer wiring ceramic substrate for transferring a metal conductor pattern to a green sheet, wherein a heat-peelable adhesive layer is formed on a substrate, and a metal conductor circuit pattern is formed on the heat-peelable adhesive layer side. A green sheet with a conductor circuit is positioned by heating and pressing under pressure so as to be connected to a connection projection formed by embedding a conductive paste or a metal conductor in a via hole for interlayer connection of a green sheet made of ceramic powder and a thermally decomposable organic binder. A multilayer wiring ceramic substrate, wherein a sheet is manufactured, a plurality of green sheets with conductive circuits are aligned with each other, and heat-pressed to form a laminate, which is heated and sintered while applying a restraining force in a surface direction. Manufacturing method.