JPH10242179A - Manufacture of semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the work efficiency on the occasion of injecting resin, by injecting the resin at an ordinary temperature without warming a semiconductor package and the resin, and filling up between the semiconductor chip and a wiring board with resin by primary baking after that. SOLUTION: When a semiconductor package are manufactured by filling up between a semiconductor chip 1 flip-chip-mounted and a wiring board 3 with a resin 7, on the occasion of filling with the resin 7, the resin 7 is injected at a normal temperature without warming semiconductor packages 1-3 and the resin 7. After that, between the semiconductor chip 1 and the wiring board 3 is filled up with the resin 7 by primary baking being preparatory baking for making the resin 7 and the members 1-3 get to fit. For example, the needle 5 of a resin injecting syringe 4 is thrusted into the gap between the LSI ship 1 of an LSI package and the wiring board 3 downwards from the vertical upside, and the resin 7 is injected. Next, they are all put into a baking furnace 10 together with a product case 9 at the time of injection with the bottom surface of the LSI package horizontal, and resin 7 filling and primary baking are performed simultaneously.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package manufacturing method for manufacturing a semiconductor package in which a semiconductor chip is flip-chip mounted, and more particularly to a semiconductor in which a connection reinforcing resin is injected into an LSI package in which an LSI chip is flip-chip mounted. The present invention relates to a technology effective when applied to a package manufacturing method.

[0002]

2. Description of the Related Art In a conventional semiconductor package manufacturing method,
A semiconductor chip is mounted on the surface of the wiring board via bump electrodes.

[0003] When a semiconductor chip is flip-chip mounted on a wiring board as described above, stress is generated in a bump connecting the semiconductor chip and the wiring board due to a difference in thermal expansion coefficient between the semiconductor chip and the wiring board.

Therefore, in order to prevent the life of the bump connection from being shortened by the stress, a technique of filling the gap between the semiconductor chip and the wiring board with a resin to reinforce the bump has been put to practical use (underfill technique).

[0005] Further, as described above, after filling the gap between the semiconductor chip and the wiring board with resin to reinforce the bumps,
It is also practiced to fix a heat radiator to a semiconductor chip to enhance the heat radiation effect of the semiconductor device.

For example, a package in which a semiconductor chip is mounted on one surface of a wiring substrate with a bump electrode interposed, and a resin is filled in a gap region between one surface of the wiring substrate and a main surface of the semiconductor chip. A mounting method for improving the heat radiation effect of a semiconductor device having a structure is described in Japanese Patent Application No. 8-124156 previously filed by the present applicant.

[0007] The outline is that a semiconductor chip is mounted on one surface of a wiring substrate with a first bump electrode interposed therebetween, and resin is filled in a gap region between one surface of the wiring substrate and a main surface of the semiconductor chip. A flat plate having a filled package structure, and further having a plane size larger than the plane size of the semiconductor chip on its back surface facing the main surface of the semiconductor chip, and made of aluminum nitride material A step of preparing a semiconductor device in which a member is disposed, and a fixing region on one surface of the flat plate member facing the back surface of the semiconductor chip is fixed to the back surface of the semiconductor chip via a brazing material; A step of fixing the heat radiation fin member with a flexible layer interposed on the back surface facing one surface, and a step of mounting the semiconductor device with a second bump electrode interposed on one surface of the mounting substrate It is as it has.

As described above, in the underfill technique of filling the gap between the semiconductor chip and the wiring board with a resin to reinforce the bump, conventionally, in order to increase the filling rate of the resin, a semiconductor package and a syringe for resin injection are used. The resin is injected by lowering the viscosity of the resin by warming the needle.

FIG. 5 is a view showing an example of filling a resin into an underfill type LSI package in a conventional semiconductor package manufacturing method. In FIG. 5, 1 is an LSI chip,
2 is a solder bump, 3 is a wiring board, 4 is a syringe, 5 is a needle, 6 is a temperature controller, 7 is resin, and 8 is a heater.

As shown in FIG. 5, in filling a resin into an underfill type LSI package according to a conventional method of manufacturing a semiconductor package, a syringe 4 is provided near a side of an LSI chip 1 mounted on a wiring board 3 by solder bumps 2. The applied resin 7 is applied, and the applied resin 7 penetrates between the LSI chip 1 and the wiring board 3 by capillary action, and
The gap between the I chip 1 and the wiring board 3 is filled.

At this time, in the conventional method of manufacturing a semiconductor package, the syringe 4 has to be filled in order to increase the filling speed of the resin 7.
Warming the resin 7 with the temperature controller 6 attached to the needle 5 of
The entire LSI package is heated by the heater 8.

This is based on the fact that the viscosity of the resin 7 to be charged tends to decrease when the temperature is increased. When the viscosity is decreased, the filling speed is increased, and the efficiency of filling the resin 7 is improved.

In the conventional method for manufacturing a semiconductor package, when the resin 7 is injected into the LSI package by automatic resin injection or the like, the LSI package after the injection is moved by the size of the LSI package, and then the un-injected LSI package is moved.
Although the resin is injected into the SI package, the LSI package is moved horizontally on the heater 8 in order to inject the resin while heating the LSI package on the heater 8.

In the conventional semiconductor package manufacturing method, an LSI in which a heat radiator is fixed to the LSI chip 1 is provided.
If the package is to be filled with the resin 7, the heat dissipating body hinders the filling of the resin 7.

Therefore, in the above-described conventional semiconductor package manufacturing method, the radiator is fixed after the resin 7 is filled. In this case, the filled resin 7 is not damaged (no high temperature is applied). An anchoring method has been implemented.

Further, in the conventional method of manufacturing a semiconductor package, in order to improve the wettability between the LSI chip 1, the solder bumps 2, the wiring board 3 and the resin 7, a preliminary bake for accommodating the resin 7 and each member is performed. After the first baking is performed, the gap between the LSI chip 1 and the wiring board 3 is filled with the resin 7, and then the second baking is performed to cure the resin 7 by a baking furnace for curing the resin. Is performed at a lower temperature than the secondary bake.

[0017]

The present inventor has found the following problems as a result of studying the above prior art.

That is, in the conventional method of manufacturing a semiconductor package, when resin is injected into the semiconductor package by automatic resin injection or the like, the semiconductor package must be moved by a size corresponding to the size of the semiconductor package from the semiconductor package after the injection to the semiconductor package not injected. However, since the semiconductor package is injected while being heated, the semiconductor package is placed horizontally and the semiconductor package tends to become larger.
There has been a problem that the number of semiconductor packages that can be transported at one time is limited.

Further, in the conventional semiconductor package manufacturing method, when the semiconductor package in which the heat radiator is fixed to the semiconductor chip is placed horizontally and the resin is to be filled,
Since it is difficult to position the syringe when inserting the needle tip into the narrow gap between the radiator and the wiring board of the semiconductor package, the radiator is fixed after filling with resin.
The fixing method has a problem that it is limited to a fixing method that does not damage the resin (does not apply a high temperature).

The viscosity of the resin filled by the conventional semiconductor package manufacturing method tends to decrease when the temperature is increased. Therefore, the viscosity is decreased by heating the resin, and the filling speed is increased. While using, while the viscosity decreases, the curing reaction speed of the resin increases,
Unused resin in the syringe also cures (degrades) quickly,
There is a problem that the usable time of the resin is shortened.

For example, when an epoxy resin is used as the resin to be filled in the semiconductor package manufacturing method, the epoxy group is opened with an organic acid, and then another epoxy group is opened. The polymerization causes a three-dimensional structure and the resin hardens during baking. However, even at room temperature, these reactions progress little by little, especially in a state where the resin is heated by a heater at the time of pouring, even if the baking temperature (for example, 150 ° C.) The reaction proceeds even at temperatures not reached.

An object of the present invention is to provide a technique capable of improving work efficiency when injecting a resin.

Another object of the present invention is to provide a technology capable of realizing a semiconductor package having good heat radiation efficiency.

Another object of the present invention is to provide a technique capable of preventing deterioration of a resin due to heating.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0026]

SUMMARY OF THE INVENTION Among the inventions disclosed by the present application, the outline of a representative one will be briefly described.
It is as follows.

(1) In a semiconductor package manufacturing method in which a resin is filled between a flip-chip mounted semiconductor chip and a wiring board, a semiconductor package in which a semiconductor chip is flip-chip mounted is set in a vertical direction, and the semiconductor chip and the wiring are connected. The resin is injected by inserting a needle for injecting the resin into the gap with the substrate from vertically upward and downward.

In the method of manufacturing a semiconductor package, a semiconductor package on which a semiconductor chip is flip-chip mounted is set up vertically, and a needle of a syringe for resin injection is inserted into a gap between the semiconductor chip and the wiring board vertically downward from above. And inject resin.

The injected resin penetrates between the semiconductor chip and the wiring board by capillary action and fills a gap between the semiconductor chip and the wiring board.

When the injection of the resin into the specific semiconductor package is completed, the injection position is moved from the injected semiconductor package to the uninjected semiconductor package,
A resin is injected into an uninjected semiconductor package.

In the method of manufacturing a semiconductor package, the semiconductor package is moved in a state where the semiconductor package is set upright, so that the movement of the next semiconductor package from the semiconductor package in which injection has been completed is minimized, and the semiconductor package to be transported at one time is provided. By increasing the number of packages as compared with the related art, it is possible to improve the work efficiency of injecting the resin into the gap between the semiconductor chip and the wiring board (increase the number of products handled).

As described above, according to the method of manufacturing a semiconductor package, the semiconductor package in which the semiconductor chip is flip-chip mounted is vertically set and the resin is injected, so that the work efficiency at the time of injecting the resin is improved. Is possible.

(2) In the method of manufacturing a semiconductor package described in (1), a radiator is fixed to the semiconductor chip before the resin is injected.

In the method of manufacturing a semiconductor package, a radiator is first fixed to a semiconductor chip of a semiconductor package in which a semiconductor chip is flip-chip mounted before resin injection.

Next, after the semiconductor package having the radiator fixed to the semiconductor chip is erected vertically, a needle of a syringe for resin injection is vertically inserted into a gap between the semiconductor chip to which the radiator is fixed and the wiring board. Put the resin downward and inject the resin.

The injected resin penetrates between the semiconductor chip and the wiring board by capillary action and fills a gap between the semiconductor chip and the wiring board.

When the injection of the resin into the specific semiconductor package is completed, the injection position is moved from the injected semiconductor package to the uninjected semiconductor package.
A resin is injected into an uninjected semiconductor package.

In the above-described conventional semiconductor package manufacturing method, the resin is injected from the vertical direction after the semiconductor package to which the heat radiator is fixed is set in the vertical direction, so that the tip of the resin injection syringe is connected to the heat radiator and the semiconductor package. Positioning when inserting into a narrow gap with the wiring board is facilitated.

In the semiconductor package manufacturing method, since the heat radiator is fixed before filling the resin, the fixing method does not need to be limited to a fixing method that does not damage the resin.
For example, even when a fixing method using solder is used, it is possible to prevent the resin from deteriorating due to heat history at the time of fixing.

When the heat radiator is fixed by soldering as described above, heat can be efficiently transmitted from the semiconductor chip to the heat radiator, and a semiconductor package having high heat radiation efficiency can be realized.

As described above, according to the semiconductor package manufacturing method, the resin is filled after the heat radiator is fixed, so that a semiconductor package having good heat radiation efficiency can be realized.

(3) In the method of manufacturing a semiconductor package described in the above (1) or (2), when the resin is injected, the semiconductor package and the resin are injected at room temperature without warming. After that, the resin is filled between the semiconductor chip and the wiring board by a primary bake which is a preliminary bake for accommodating the resin and the member.

In the method of manufacturing a semiconductor package, as a method of increasing the resin injection efficiency and not deteriorating the resin, the resin is potted between the semiconductor chip and the wiring board at room temperature, and then the first bake (the resin and the member) are performed. The resin is filled during preliminary baking to acclimatize the resin.

After filling the resin between the semiconductor chip and the wiring board in the first bake, the resin filled between the semiconductor chip and the wiring board is cured by the second bake.

In the method of manufacturing a semiconductor package, since the resin is not heated when the resin is injected between the semiconductor chip and the wiring board, it is possible to prevent the deterioration of the resin due to heating, and to prevent the deterioration of the resin. Material costs can be reduced.

In the method of manufacturing a semiconductor package, a heating device such as a temperature controller for heating the resin at the tip of the syringe or a heater for heating the semiconductor package is not required, and the capital investment can be reduced.

Further, in the method of manufacturing a semiconductor package, since the resin is simultaneously filled during the primary baking, the working efficiency is high.

As described above, according to the method of manufacturing a semiconductor package, the resin is not heated when the resin is injected between the semiconductor chip and the wiring board, so that deterioration of the resin due to heating can be prevented. It is.

[0049]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following, a method of manufacturing a semiconductor package according to the present invention will be described.
An embodiment of a method of manufacturing a semiconductor package in which a connection reinforcing resin is injected into a package will be described.

FIG. 1 is a view showing an example of filling a LSI package with a resin in the semiconductor package manufacturing method of the present embodiment. In FIG. 1, reference numeral 9 denotes a product case.

As shown in FIG. 1, in the method of manufacturing a semiconductor package according to the present embodiment, in filling an LSI package with resin,
The LSI package in which the LSI chip 1 is flip-chip mounted is set up vertically, and the resin 7 is injected from above vertically.

In the semiconductor package manufacturing method of this embodiment, first, an LSI package in which the LSI chip 1 is flip-chip mounted on the wiring board 3 is set in the product case 9 in a direction in which the bottom surface of the LSI package is vertical.

The needle 5 of the syringe 4 for resin injection is inserted into the gap between the LSI chip 1 of the LSI package and the wiring board 3 from above vertically to fill the space between the LSI chip 1 and the wiring board 3. A required amount of the resin 7 is injected.

At this time, the resin 7 injected into the LSI package remains at room temperature, and the injected resin 7 penetrates between the LSI chip 1 and the wiring substrate 3 by capillary action, and It is filled in the gap with the substrate 3.

When the injection of the resin 7 into the specific LSI package is completed, the injection position is moved from the injected LSI package to the uninjected LSI package, and the injection of the resin 7 into the uninjected LSI package is started. Do.

When the injection of the resin 7 into all the LSI packages in the product case 9 is completed, the LS
The I-package is placed in a baking furnace for primary baking with the bottom surface of the LSI package horizontal, with or without the product case 9 at the time of pouring.

FIG. 2 is a diagram showing an example of a step of performing a primary bake in the method of manufacturing a semiconductor package according to the present embodiment.
In FIG. 2, reference numeral 10 denotes a baking furnace.

As shown in FIG. 2, in the step of performing the first bake of the semiconductor package manufacturing method of the present embodiment, the LSI package in which the resin 7 has been injected is placed on the bottom of the LSI package together with the product case 9 at the time of injection. And then put in a baking furnace 10 for performing primary baking.

In the baking furnace 10 containing the LSI package into which the resin 7 has been injected, the filling of the resin 7 and the primary baking are performed simultaneously, and after the completion of the primary baking, the secondary baking is performed to cure the resin 7.

As described above, in the method of manufacturing a semiconductor package according to the present embodiment, the LSI package is moved while standing in the vertical direction, so that the movement of the next LSI package from the injected LSI package is minimized. Also,
By increasing the number of LSI packages to be transported at one time, it is possible to improve the work efficiency of filling the resin 7 into the gap between the LSI chip 1 and the wiring board 3 (increase the number of products handled).

FIG. 3 is a diagram showing an example of resin filling in the LSI package to which the heat radiator is fixed in the semiconductor package manufacturing method of the present embodiment. In FIG. 3, reference numeral 11 denotes an LSI chip fixing material, and reference numeral 12 denotes a radiator.

As shown in FIG. 3, in the method of manufacturing a semiconductor package according to the present embodiment, when filling the LSI package with the heat sink fixed thereto, the LSI package in which the LSI chip 1 is flip-chip mounted and the heat sink 12 is fixed is mounted vertically. The resin 7 is injected vertically upward.

In the semiconductor package manufacturing method of this embodiment, first, the LSI chip 1 is mounted on the wiring board 3 by flip-chip mounting.
The radiator 12 is fixed by the chip fixing material 11.

Next, the LSI package to which the heat radiator 12 is fixed is set in the product case 9 in a direction in which the bottom surface of the LSI package is vertical.

The needle 5 of the syringe 4 for resin injection is inserted into the gap between the LSI chip 1 of the LSI package and the wiring board 3 vertically downward from above to fill the space between the LSI chip 1 and the wiring board 3. A required amount of the resin 7 is injected.

At this time, the resin 7 injected into the LSI package is kept at room temperature, and the injected resin 7 penetrates between the LSI chip 1 and the wiring substrate 3 by capillary action, and It is filled in the gap with the substrate 3.

When the injection of the resin 7 into the specific LSI package is completed, the injection position is moved from the injected LSI package to the uninjected LSI package, and the injection of the resin 7 into the uninjected LSI package is started. Do.

When the injection of the resin 7 into all the LSI packages in the product case 9 is completed, the LS
The I-package is placed in a baking furnace 10 for primary baking with the bottom of the LSI package horizontal with the product case 9 taken out of the product case 9 together with or taken out of the product case 9.

FIG. 4 is a view showing an example of a step of performing the first bake of the LSI package with the heat radiator fixed thereto in the semiconductor package manufacturing method of the present embodiment.

As shown in FIG. 4, one of the LSI packages to which the heat radiator is fixed in the semiconductor package manufacturing method of the present embodiment.
In the step of performing the next baking, the LS after the injection of the resin 7 is completed.
A baking furnace 10 for performing primary baking of the I package with the bottom of the LSI package horizontal together with the product case 9 at the time of injection.
Put in.

In the baking furnace 10 containing the LSI package into which the resin 7 has been injected, the filling of the resin 7 and the primary baking are performed simultaneously, and after the completion of the primary baking, the secondary baking is performed to cure the resin 7.

As described above, in the method of manufacturing a semiconductor package according to the present embodiment, the radiator 12 is fixed before filling with the resin. Therefore, the fixing method need not be limited to a fixing method that does not damage the resin 7. Even when solder is used as the LSI chip fixing material 11, the deterioration of the resin 7 due to heat history at the time of fixing can be prevented.

Further, when the radiator 12 is fixed by the solder as the LSI chip fixing material 11 as described above, heat can be efficiently transmitted from the LSI chip 1 to the radiator 12, so that the LSI having good heat radiation efficiency can be obtained. Package can be realized.

In the resin application in the conventional semiconductor package manufacturing method, the LSI package is leveled, and the required amount of resin 7 is potted while the syringe 4 is moved along one side of the LSI chip 1.

At this time, the next L is transferred from one LSI package.
For example, it takes about 5 seconds to move to the SI package, and the potting is performed at a pressure of, for example, 4.00 kgf / cm ² for 20 to 30 seconds.

In this potting, it is necessary to adjust the speed for moving the syringe so that the resin 7 can be applied to one side of the LSI chip 1 in about 20 to 30 seconds.

This is because if the resin 7 is stored in one place, a large film of the resin 7 remains and the area where components cannot be mounted increases.

At the time of potting in the conventional semiconductor package manufacturing method, the whole product is heated to, for example, about 80 ° C. by the heater 8 so that the resin 7 is quickly filled.

On the other hand, in the semiconductor package manufacturing method according to the present embodiment, the space between the LSI packages is reduced by placing the LSI packages in the vertical direction, and the movement from the LSI package to the LSI package can be completed in about 2 seconds, for example.

Further, at the time of potting, since the work can be performed while the syringe 4 is fixed at one place, speed adjustment for moving the syringe is unnecessary.

The potting is performed at room temperature without using the temperature controller 6, and the filling of the resin 7 is performed at the time of the first baking without using the heater 8. This allows
The deterioration of the resin 7 due to the heat of the temperature controller 6 and the heater 8 being transmitted to the syringe 4 can be prevented.

As described above, according to the method of manufacturing a semiconductor package of the present embodiment, the semiconductor package on which the semiconductor chip is flip-chip mounted is vertically set and the resin is injected. Can be improved.

Further, according to the semiconductor package manufacturing method of the present embodiment, the resin is filled after the heat radiator is fixed, so that a semiconductor package having good heat radiation efficiency can be realized.

According to the semiconductor package manufacturing method of the present embodiment, the resin is not heated when the resin is injected between the semiconductor chip and the wiring board, so that the deterioration of the resin due to heating can be prevented. It is.

Although the present invention has been specifically described based on the above embodiment, the present invention is not limited to the above embodiment, and it is needless to say that various modifications can be made without departing from the gist of the present invention. It is.

[0086]

The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows.

(1) Since the resin is filled after the radiator is fixed, a semiconductor package with good heat radiation efficiency can be realized.

(2) Since the resin is not heated when the resin is injected between the semiconductor chip and the wiring board, it is possible to prevent deterioration of the resin due to heating.

(3) Since the semiconductor package on which the semiconductor chip is flip-chip mounted is vertically set and the resin is injected, the work efficiency at the time of injecting the resin can be improved.

[Brief description of the drawings]

FIG. 1 shows an LS of a semiconductor package manufacturing method according to an embodiment;
It is a figure showing an example of resin filling to an I package.

FIG. 2 is a diagram illustrating an example of a step of performing a primary bake in the semiconductor package manufacturing method according to the embodiment.

FIG. 3 is a diagram showing an example of resin filling in a heat sink fixed LSI package in the semiconductor package manufacturing method of the present embodiment.

FIG. 4 is a diagram illustrating an example of a step of performing a primary bake of the LSI package with the heat radiator fixed thereto in the semiconductor package manufacturing method according to the embodiment.

FIG. 5 is a diagram showing an example of filling a resin into an underfill LSI package in a conventional semiconductor package manufacturing method.

[Explanation of symbols]

1. LSI chip, 2. Solder bump, 3. Wiring board,
4: Syringe, 5: Needle, 6: Temperature controller, 7: Resin, 8
... heater, 9 ... product case, 10 ... bake oven, 11 ...
LSI chip fixing material, 12: heat radiator.

Claims (3)

[Claims] 1. A method of manufacturing a semiconductor package in which a resin is filled between a semiconductor chip on which flip-chip mounting has been performed and a wiring board, wherein the semiconductor package and the resin are injected at room temperature without warming the resin. A method of manufacturing a semiconductor package, comprising: filling a resin between a semiconductor chip and a wiring board by a primary bake, which is a preliminary bake for accommodating a resin and a member after injecting the resin. 2. The method of manufacturing a semiconductor package according to claim 1, wherein a radiator is fixed to the semiconductor chip before resin is injected into the semiconductor package. 3. The method of manufacturing a semiconductor package according to claim 1, wherein when filling the semiconductor package with a resin, the semiconductor package is set upright and a needle for injecting the resin into a gap between the semiconductor chip and the wiring board. A semiconductor package manufacturing method, wherein a resin is injected while vertically downward from above vertically.