JPH10239564A - Optical module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the assembly time of an optical module, by forming a guide part for positioning an optical fiber, on a semiconductor substrate with an optical element grown, and mounting the optical fiber on this guide part. SOLUTION: A groove 5 is formed on a substrate 3 of the laser 1 by etching or the like so that an optical fiber 4 is adjusted to each semiconductor laser 1 in the state of a wafer with a plurality of semiconductor laser 1 grown. Position adjustment between a light emitting part 2 of the laser 1 and the optical fiber 4 can be made by fixing the optical fiber 4 along the groove 5. This position adjustment of a mask pattern for forming the groove 5 is equivalent to position adjustment of the optical fiber 4 to a plurality of laser 1 in the wafer 6 collectively. There is, thereby, no need to make position adjustment between the light emitting part 2 of the laser 1 and the optical fiber 4 every optical module using an infrared camera, and an inexpensive optical module can be easily obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical module used for an optical communication system.

[0002]

2. Description of the Related Art FIG. 11 shows an optical module shown in the 1993 Spring Meeting of the Institute of Electronics, Information and Communication Engineers, C-279, "Study of optical integrated structure using silicon bonding technology". In the figure, 1 is a semiconductor laser for converting an electric signal to an optical signal, 4 is an optical fiber which is a transmission path of the optical signal, 11 is a silicon substrate on which the semiconductor laser 1 and the optical fiber 4 are mounted, and 13 is a positioner for the optical fiber 4 The V-groove portion 30 formed on the silicon substrate 11
A marker 31 is formed on the silicon substrate 11 for positioning the semiconductor laser 1, and a marker 31 is formed on the semiconductor laser 1 for positioning the semiconductor laser 1.

[0003] The semiconductor laser 1 converts an input electric signal into an optical signal and outputs it. The output optical signal is coupled to the optical fiber 4 which is a transmission line of the optical communication system and transmitted. Generally, the semiconductor laser 1 and the silicon substrate 11 are provided with a V-groove portion 13 for positioning the marker 30, the marker 31, and the optical fiber 4 such that the light emitting portion of the semiconductor laser 1 and the core of the optical fiber 4 are aligned. Therefore, the marker 30 and the marker 31 are observed using an infrared camera, the semiconductor laser 1 is adjusted in position so that the two match, and the semiconductor laser 1 is mounted on the silicon substrate 11. By fixing, optical coupling between the semiconductor laser 1 and the optical fiber 4 is established, and an optical module can be manufactured.

[0004]

Since the conventional optical module is configured as shown in FIG. 11, the individual optical modules are formed on the marker 30 formed on the silicon substrate 11 and the semiconductor laser 1 respectively. The position of the semiconductor laser 1 has to be adjusted using an infrared camera so that the marker 31 is fitted, which takes time for assembling and is an obstacle to cost reduction.

Further, in the conventional optical module, since the incident surface of the optical fiber 4 is flat and orthogonal to the light emitted from the semiconductor laser 1, the reflected light returned from the incident surface of the optical fiber 4 is And the characteristics are degraded.

Further, when a downward force is applied to the optical fiber 4, the optical fiber 4 directly hits the edge formed on the end face of the silicon substrate 11 of the V-groove portion 13, so that the optical fiber 4 is easily scratched. There is a problem that the optical fiber 4 is easily broken.

Further, since the beam diameter of the semiconductor laser 1 is different from the beam diameter of the optical fiber 4, there is a problem that the light coupling efficiency is low.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and there is no need to adjust the position of an optical element and an optical fiber for each individual optical module, and the assembly time can be reduced. An optical module that can obtain a compact optical module, reduce the influence of reflected return light, prevent disconnection of the optical fiber, and increase the coupling efficiency of light between the optical element and the optical fiber. The purpose is to get.

[0009]

According to a first aspect of the present invention, there is provided an optical module, comprising: a semiconductor substrate on which an optical element is grown; a guide portion formed on the semiconductor substrate for positioning an optical fiber; An optical fiber mounted on the guide portion and optically coupled to the optical element.

In the optical module according to the present invention, a groove for mounting the optical fiber is formed as the guide.

An optical module according to a third aspect of the present invention is such that the optical fiber portion mounted on the guide portion has a reduced diameter.

According to a fourth aspect of the present invention, in the optical module, the tip of the optical fiber portion mounted on the guide portion is
It is a sphere.

In the optical module according to a fifth aspect of the present invention, the wafer on which the optical elements have been grown is cut into grooves by etching.
A guide portion formed by cleaving the optical element along the groove is provided.

According to a sixth aspect of the present invention, there is provided an optical module, comprising: a substrate; an optical element guide formed on the substrate for positioning the optical element; an optical element mounted on the optical element guide; An optical fiber guide portion formed on the substrate for positioning the optical fiber, and an optical fiber mounted on the optical fiber guide portion and optically coupled to the optical element; and The optical fiber guide section is formed so that the position of the light emitting section or the light receiving section of the optical element and the position of the light input / output section of the optical fiber are aligned.

According to a seventh aspect of the present invention, in the optical module, the substrate is a silicon substrate.

An optical module according to an eighth aspect of the present invention includes an optical element guide portion having a concave portion formed on the substrate, and the optical element is formed on a mounting surface of the optical element on the substrate side. It has a convex portion, and the convex portion and the concave portion are mounted together.

An optical module according to a ninth aspect of the present invention includes an optical element guide having a convex portion formed on the substrate, wherein the optical element is formed on a mounting surface of the optical element on the substrate side. And the concave portion and the convex portion are mounted together.

An optical module according to a tenth aspect of the present invention is:
The semiconductor device includes a protective coat for protecting the optical fiber, and the substrate has a step portion on which the protective coat is placed.

An optical module according to the invention of claim 11 is:
One end of the substrate is processed obliquely to a mounting surface of the optical fiber.

An optical module according to a twelfth aspect of the present invention is:
The tip of the optical fiber portion mounted on the optical fiber guide portion is made spherical.

An optical module according to a thirteenth aspect of the present invention comprises:
A substrate, a semiconductor laser mounting part formed on the substrate for positioning and mounting the semiconductor laser, a semiconductor laser mounted on the semiconductor laser mounting part and converting an input electric signal into an optical signal, and positioning the lens. A lens guide portion formed on the substrate, a lens mounted on the lens guide portion for condensing an optical signal from the semiconductor laser, and an optical isolator formed on the substrate for insertion. An optical isolator guide portion, an optical isolator mounted on the optical isolator guide portion and transmitting light collected by the lens, and an optical fiber guide portion formed on the substrate to position an optical fiber, An optical fiber mounted on the optical fiber guide and receiving light transmitted from the optical isolator. The light shields return light from the optical fiber, and the semiconductor laser mounting section, the lens guide section, the optical isolator guide section, and the optical fiber guide section include a light emitting section of the semiconductor laser and an optical fiber. It is formed so that the position of the incident part matches.

An optical module according to claim 14 is:
A garnet substrate, a semiconductor laser mounting portion formed on the garnet substrate for positioning and mounting the semiconductor laser, a semiconductor laser mounted on the semiconductor laser mounting portion for converting an input electric signal into an optical signal, and a Faraday effect. An optical waveguide section for rotating and outputting the polarization of an optical signal from the semiconductor laser, an optical fiber guide section formed on the garnet substrate for positioning an optical fiber, and the optical fiber guide An optical fiber that is mounted on the portion and receives light emitted from the optical waveguide portion. The semiconductor laser mounting portion, the optical waveguide portion, and the optical fiber guide portion include a light emitting portion of the semiconductor laser, It is formed so that the positions of the light input / output part of the wave path part and the light input part of the optical fiber match.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. FIG. 1 is a configuration diagram illustrating a configuration of the optical module according to the first embodiment. In the figure, 1 is a semiconductor laser for converting an electric signal into an optical signal, 2 is a light emitting portion of the semiconductor laser 1, 3 is a substrate of the semiconductor laser 1, 4 is an optical fiber which is a transmission path of an optical signal, and 5 is an optical fiber 4. The semiconductor laser 1 is mounted on the
A groove 6 formed in the substrate 3 is a wafer on which a plurality of semiconductor lasers 1 are grown.

Next, the operation will be described. The semiconductor laser 1 converts an input electric signal into an optical signal and outputs it. The output optical signal is coupled to the optical fiber 4 which is a transmission line of the optical communication system and transmitted. The semiconductor laser 1 includes:
Since there is a groove 5 formed for mounting the optical fiber 4 and positioning the light emitting unit 2 of the semiconductor laser 1, by fixing the optical fiber 4 along the groove 5, the light emitting unit 2 of the semiconductor laser 1 can be easily formed. And the optical fiber 4 can be optically coupled.

When manufacturing the optical module shown in FIG. 1, a plurality of semiconductor lasers 1 are grown on a wafer by etching or the like so that the optical fibers 4 are fitted to the individual semiconductor lasers 1. The groove 5 is formed in the substrate 3 of the semiconductor laser 1. By fixing the optical fiber 4 along the groove 5, the position between the light emitting section 2 of the semiconductor laser 1 and the optical fiber 4 can be adjusted.

As described above, according to this embodiment,
Adjusting the position of the mask pattern for forming the groove 5 is equivalent to adjusting the positions of the plurality of semiconductor lasers 1 in the wafer 6 collectively with the position of the optical fiber 4. Therefore, it is not necessary to adjust the position of the light emitting section 2 of the semiconductor laser 1 and the optical fiber 4 for each individual optical module, and an inexpensive optical module can be easily obtained.

Although this embodiment has been described using a semiconductor laser as a light emitting element as an optical element, a photodiode (light receiving element) having a waveguide structure similar to that of the semiconductor laser is also described. It goes without saying that the present invention is applicable.

Embodiment 2 FIG. 2 is a cross-sectional view illustrating a configuration of the optical module according to the second embodiment. In the figure,
Reference numerals 1 to 5 are the same as those in the first embodiment shown in FIG. 1, and reference numeral 7 is a tip portion of the optical fiber 4 having a reduced diameter and a spherical shape.

Next, the operation will be described. The semiconductor laser 1 converts an input electric signal into an optical signal and outputs it. The output optical signal is coupled to the optical fiber 4 which is a transmission line of the optical communication system and transmitted. The semiconductor laser 1 includes:
Since there is a groove 5 formed in the substrate 3 for mounting the optical fiber 4 and positioning it with the light emitting portion 2 of the semiconductor laser 1, the groove 5
By fixing the optical fiber 4 along the optical fiber 4, the light-emitting portion 2 of the semiconductor laser 1 and the optical fiber 4 can be easily optically coupled.

Here, since the distal end portion 7 of the optical fiber 4 fixed to the groove 5 has a small diameter, the depth of the groove 5 formed by etching or the like may be small, or it may be spherical. Therefore, the tip portion 7 has a lens effect, the light coupling efficiency between the light emitting portion 2 of the semiconductor laser 1 and the optical fiber 4 can be increased, and the reflected return light from the incident surface of the optical fiber 4 can be reduced. Can be smaller.

As described above, according to this embodiment,
The groove 5 for mounting the optical fiber 4 can be easily formed by reducing the diameter of the distal end of the optical fiber 4, and the optical module having a high coupling efficiency and a small reflected return light by forming a spherical surface. Can be obtained.

In this embodiment, a semiconductor laser which is a light emitting element has been described as an optical element. However, a photodiode (light receiving element) having a waveguide structure similar to that of a semiconductor laser may also be used. It goes without saying that the present invention is applicable.

Embodiment 3 FIGS. 3A and 3B are diagrams showing a configuration of the optical module according to the third embodiment. FIG. 3A is a plan view of the optical module, and FIG. In the figure, 1, 2 and 4 are the same as those in the first embodiment shown in FIG. 1, 8 is a core which is a light incident portion of the optical fiber 4, and 9 is a semiconductor laser for positioning the optical fiber 4. The guide portion 10 formed on the substrate 1 is a substrate on which the semiconductor laser 1 and the optical fiber 4 are mounted.

Next, the operation will be described. The semiconductor laser 1 converts an input electric signal into an optical signal and outputs it. The output optical signal is coupled to the optical fiber 4 which is a transmission line of the optical communication system and transmitted. The semiconductor laser 1 includes:
Since there is a guide portion 9 formed for positioning the optical fiber 4 with the light emitting portion 2 of the semiconductor laser 1, if the height of the light emitting portion 2 of the semiconductor laser 1 and the core 8 of the optical fiber 4 are the same. By fixing the optical fiber 4 along the guide section 9, the light emitting section 2 of the semiconductor laser 1 can be easily formed.
And the optical fiber 4 can be optically coupled.

Such a guide section 9 is used for the semiconductor laser 1.
Can be obtained by forming a groove by etching on the wafer on which the semiconductor laser 1 has been grown, and cleaving the semiconductor laser 1 along the groove. In order to make the height of the light emitting portion 2 of the semiconductor laser 1 and the core 8 of the optical fiber 4 the same, the wafer is polished so that the height from the substrate 10 is the same, or This is possible by providing a step so that the mounting surface of the ten optical fibers 4 is lower than the mounting surface of the semiconductor laser 1.

As described above, according to this embodiment,
The position adjustment between the light emitting portion 2 and the optical fiber 4 of the semiconductor laser 1 is performed by the guide portion 9 formed by etching in the state of the wafer and the thickness of the wafer or the step of the substrate 10, and the semiconductor laser 1 in the wafer is collectively adjusted. Optical fiber 4
This is equivalent to adjusting the position of the optical module, and it is not necessary to adjust the position of each optical module, and an inexpensive optical module can be easily obtained.

In this embodiment, a semiconductor laser as a light emitting element has been described as an optical element. However, a photodiode (light receiving element) having a waveguide structure similar to that of a semiconductor laser is also described. It goes without saying that the present invention is applicable.

Embodiment 4 FIG. FIGS. 4A and 4B are diagrams showing a configuration of an optical module according to the fourth embodiment. FIG. 4A is a left side view of the optical module, and FIG. 4B is a plan view. In the figure, 1 and 4 are the same as those in the first embodiment shown in FIG. 1, 11 is a silicon substrate on which the semiconductor laser 1 and the optical fiber 4 are mounted, and 12 is a silicon substrate 11
A guide portion 13 is formed on the silicon substrate 11 for positioning the optical fiber 4. A guide portion 13 is formed on the silicon substrate 11 for positioning the optical fiber 4.

Next, the operation will be described. The semiconductor laser 1 converts an input electric signal into an optical signal and outputs it. The output optical signal is coupled to the optical fiber 4 which is a transmission line of the optical communication system and transmitted. On a silicon substrate 11 on which the semiconductor laser 1 and the optical fiber 4 are mounted, a guide portion 12 for positioning the semiconductor laser 1 and a V-groove portion 13 for positioning the optical fiber 4 are formed. The guide section 12 positions the semiconductor laser 1 so that the side face of the semiconductor laser 1 is abutted, and the V-groove section 13 holds the optical fiber 4 when the optical fiber 4 is placed.
Are formed so as to be aligned with the light emitting portion of the semiconductor laser 1. Therefore, if the semiconductor laser 1 is cleaved from the wafer accurately by etching or the like, the guide portion 12
The semiconductor laser 1 and the optical fiber 4 can be easily coupled by fixing the optical fiber 4 to the V-groove 13 by mounting the semiconductor laser 1 against the semiconductor laser 1. The guide portion 12 and the V-groove portion 1 to the silicon substrate 11
The formation of 3 can be performed with high precision by etching.

As described above, according to this embodiment,
Since the position adjustment between the semiconductor laser 1 and the optical fiber 4 is performed by the guide portion 12 and the V-groove portion 13 formed on the silicon substrate 11, the position adjustment becomes unnecessary, and
An inexpensive optical module can be obtained.

In this embodiment, a semiconductor laser which is a light emitting element has been described as an optical element. However, a photodiode (light receiving element) having a waveguide structure similar to that of a semiconductor laser is also described. It goes without saying that the present invention is applicable.

Embodiment 5 FIG. FIGS. 5A and 5B are diagrams showing a configuration of an optical module according to the fifth embodiment. FIG. 5A is a plan view of the optical module, and FIG. In the figure, 1 and 4 are the same as those in the first embodiment shown in FIG. 1, 11 and 13 are the same as those in the fourth embodiment shown in FIG. Recesses formed on the silicon substrate 11 to perform
Reference numeral 15 denotes a protrusion formed on the surface of the semiconductor laser 1 mounted on the silicon substrate 11.

Next, the operation will be described. The semiconductor laser 1 converts an input electric signal into an optical signal and outputs it. The output optical signal is coupled to the optical fiber 4 which is a transmission line of the optical communication system and transmitted. On the silicon substrate 11 on which the semiconductor laser 1 and the optical fiber 4 are mounted, a concave portion 14 for positioning the semiconductor laser 1 and a V-groove 13 for positioning the optical fiber 4 are provided.
And the core of the optical fiber 4 are aligned with each other.
Since the convex portion 15 is formed on the mounting surface of the semiconductor laser 1, the concave portion 14 of the silicon substrate 11 and the convex portion 15 of the mounting surface of the semiconductor laser 1 are combined to mount the semiconductor laser 1, and By fixing to the groove 13, easily,
Optical coupling between the semiconductor laser 1 and the optical fiber 4 is established. The formation of the concave portions 14 and the V-groove portions 13 on the silicon substrate 11 and the formation of the convex portions 15 on the semiconductor laser 1 can be performed with high precision by etching.

As described above, according to this embodiment,
Since the position adjustment between the semiconductor laser 1 and the optical fiber 4 is performed by the concave portion 14 and the V-groove portion 13 formed on the silicon substrate 11 and the convex portion 15 formed on the semiconductor laser 1, the position adjustment becomes unnecessary. An inexpensive optical module can be easily obtained.

In this embodiment, a semiconductor laser as a light emitting element has been described as an optical element. However, it goes without saying that the present invention can be applied to a photodiode (light receiving element). Furthermore, although a description has been given of the case where a concave portion is provided on a silicon substrate and a convex portion is provided on a semiconductor laser, the present invention is also applicable to a case where a convex portion is provided on a silicon substrate and a concave portion is provided on a semiconductor laser. Needless to say.

Embodiment 6 FIG. FIGS. 6A and 6B are diagrams showing a configuration of an optical module according to the sixth embodiment. FIG. 6A is a plan view of the optical module, and FIG. 6B is a cross-sectional view. In the figure, 1 and 4 are the same as those in the first embodiment shown in FIG. 1, 11 and 13 are the same as those in the fourth embodiment shown in FIG. A mounting portion 17 for mounting is provided so as to cover the optical fiber 4 and protect the optical fiber 4. A step 18 is formed on the silicon substrate 11 to fix the protective coat 17. Is an adhesive for fixing the protective coat 17 to the step 18.

Next, the operation will be described. The semiconductor laser 1 converts an input electric signal into an optical signal and outputs it. The output optical signal is coupled to the optical fiber 4 which is a transmission line of the optical communication system and transmitted. Here, the optical fiber 4
Is provided on the end of the silicon substrate 11 on which the optical fiber 4 is mounted, and an adhesive 19
Since the protective coat 17 is fixed to the step 18 by the above method,
Since the optical fiber 4 does not directly hit the edge of the end of the silicon substrate 11, it is difficult for the optical fiber 4 to be scratched and disconnection can be prevented.

As described above, according to this embodiment,
By providing the protective coat 17 for protecting the optical fiber 4 and the step 18 for fixing the protective coat 17, a highly reliable optical module can be obtained.

The mounting of the semiconductor laser 1 on the mounting section 16 may be performed by any of the methods of the fourth and fifth embodiments. In this embodiment, a semiconductor laser which is a light emitting element has been described as an optical element. However, it goes without saying that the present invention can be applied to a photodiode (light receiving element).

Embodiment 7 FIG. FIGS. 7A and 7B are diagrams showing a configuration of an optical module according to a seventh embodiment. FIG. 7A is a plan view of the optical module, and FIG. 7B is a cross-sectional view. In the figure, 1 and 4 are the same as those in the first embodiment shown in FIG. 1, 11 and 13 are the same as those in the fourth embodiment shown in FIG. 4, and 16 and 19 are the same as those in FIG. This is the same as the sixth embodiment shown, and reference numeral 20 denotes a surface obtained by processing the end of the silicon substrate 11 obliquely with respect to the mounting surface of the optical fiber 4.

Next, the operation will be described. The semiconductor laser 1 converts an input electric signal into an optical signal and outputs it. The output optical signal is coupled to the optical fiber 4 which is a transmission line of the optical communication system and transmitted. Here, since the end of the silicon substrate 11 was processed obliquely with respect to the mounting surface of the optical fiber 4 to form the surface 20, the angle of the edge formed by the V-groove portion 13 and the surface 20 hitting the optical fiber 4 was set at a right angle. Becomes large (obtuse angle), so that scratches due to the edge hardly enter the optical fiber 4 and disconnection can be prevented. Further, when the optical fiber 4 is bonded and fixed to the V-groove portion 13, the space between the optical fiber 4 and the surface 20 becomes a pool of the adhesive 19,
The fixing strength of the optical fiber 4 is increased, and the workability of module production is improved because the adhesive 19 is prevented from flowing to unnecessary places.

As described above, according to this embodiment,
By processing the end of the silicon substrate 11 obliquely with respect to the mounting surface of the optical fiber 4, a highly reliable optical module can be obtained.

The mounting of the semiconductor laser 1 on the mounting section 16 may be performed by any of the methods of the fourth and fifth embodiments. In this embodiment, a semiconductor laser which is a light emitting element has been described as an optical element. However, it goes without saying that the present invention can be applied to a photodiode (light receiving element).

Embodiment 8 FIG. FIGS. 8A and 8B are diagrams showing a configuration of an optical module according to the eighth embodiment. FIG. 8A is a plan view of the optical module, and FIG. 8B is a cross-sectional view. In the figure, 1 and 4 are the same as those in the first embodiment shown in FIG. 1, 11 and 13 are the same as those in the fourth embodiment shown in FIG. 4, and 16 is the one shown in FIG. 21 is a lens for condensing an output optical signal from the semiconductor laser 1 on the optical fiber 4, 22 is a V-groove formed on the silicon substrate 11 for positioning the lens 21 23, an optical isolator for preventing return light from the optical fiber 4 from returning to the semiconductor laser 1, a groove 24 for inserting and mounting the optical isolator 23 on the silicon substrate 11, and a magnetic field 25 for the optical isolator 23. Is a magnet for applying a voltage.

Next, the operation will be described. The semiconductor laser 1 converts an input electric signal into an optical signal and outputs it. The output optical signal is condensed by the lens 21, passes through the optical isolator 23, is coupled to the optical fiber 4 which is a transmission line of the optical communication system, and is transmitted. Since the reflected return light from the optical fiber 4 is shielded by the optical isolator 23, it is not coupled to the semiconductor laser 1, and the characteristic deterioration due to the return light is small.

On the silicon substrate 11, a mounting portion 16 for positioning and mounting the semiconductor laser 1, a V-groove portion 22 for positioning the lens 21, a groove 24 for inserting the optical isolator 23,
And V-groove portion 13 for positioning optical fiber 4
Are formed so that light emitted from the semiconductor laser 1 is incident on the optical fiber 4.
The semiconductor laser 1 is mounted on the
By fixing the optical fiber 4 in the V-groove portion 13 and inserting the optical isolator 23 in the groove 24,
Optical coupling between the semiconductor laser 1 and the optical fiber 4 is established. In addition, since the dependence of the optical coupling characteristic on the position of the lens 21 and the optical fiber 4 in the groove direction is small, these V-groove portions 2
The adjustment to the 2 and V groove portions 13 can be made non-adjustable. Further, the formation of the V-groove portion 22 and the V-groove portion 13 on the silicon substrate 11 can be performed with high precision by etching.

As described above, according to this embodiment,
Optical coupling between the semiconductor laser 1 and the optical fiber 4 is performed by the mounting portion 16, the V-groove portion 22, and the V-groove portion 13 formed on the silicon substrate 11, so that the position adjustment of the lens 21 and the optical fiber 4 becomes unnecessary. It is possible to easily and inexpensively obtain an optical module in which characteristic deterioration due to return light is small.

The mounting of the semiconductor laser 1 on the mounting section 16 may be performed by any of the methods of the fourth and fifth embodiments.

Embodiment 9 9A and 9B are diagrams showing a configuration of an optical module according to the ninth embodiment. FIG. 9A is a plan view of the optical module, and FIG. 9B is a cross-sectional view. In the figure, 1 and 4 are the same as those of the first embodiment shown in FIG. 1, 13 is the same as that of the fourth embodiment shown in FIG. 4, and 16 is the same as that of the first embodiment shown in FIG. 25 is the same as that of the eighth embodiment shown in FIG. 8, 26 is a garnet substrate such as a GGG (Gadolinium Gallium Garnet) on which the semiconductor laser 1 and the optical fiber 4 are mounted; 27 is an optical waveguide having a Faraday effect formed on the garnet substrate 26, and 28 is a polarizer that absorbs or reflects unnecessary polarized waves.

Next, the operation will be described. The semiconductor laser 1 converts an input electric signal into an optical signal and outputs it. The output optical signal is coupled to the optical waveguide 27 having the Faraday effect formed on the garnet substrate 26, and is emitted from the optical waveguide 27 after receiving a 45 ° rotation of the polarization. After passing through the polarizer 28 whose polarization direction has been adjusted so that the exit polarization passes almost without loss, it is coupled to the optical fiber 4 which is the transmission path of the optical communication system and transmitted. After unnecessary polarization is removed by the polarizer 28 from the reflected return light from the optical fiber 4, the polarization is again rotated by 45 ° in the same direction by the optical waveguide 27, and is orthogonal to the oscillation polarization of the semiconductor laser 1. The polarized light is coupled to the semiconductor laser 1. Semiconductor laser 1
Has a characteristic that it is hardly affected by the return light of the polarization orthogonal to the oscillation polarization, so that the characteristic deterioration due to the return light is small. As described above, the magnet 25, the optical waveguide 27 having the Faraday effect, and the polarizer 28 constitute an optical isolator.

Here, on the garnet substrate 26, the mounting portion 16 for positioning and mounting the semiconductor laser 1, the optical waveguide 27 having the Faraday effect, and the V-groove portion 13 for positioning the optical fiber 4 are provided with the light emission of the semiconductor laser 1. Department,
The semiconductor laser 1 is mounted on the mounting portion 16 and the V-groove portion 13 is formed since the light input / output portion of the optical waveguide 27 and the light input portion of the optical fiber 4 are formed so as to match each other.
By fixing the optical fiber 4 to the optical fiber 4, optical coupling between the semiconductor laser 1 and the optical waveguide 27 and between the optical waveguide 27 and the optical fiber 4 can be easily achieved.

As described above, according to this embodiment,
The optical coupling between the semiconductor laser 1 and the optical waveguide 27, and between the optical waveguide 27 and the optical fiber 4 is performed by the semiconductor laser mounting section 16, the optical waveguide 27, and the V-groove section 13 formed on the garnet substrate 26. Despite having the function, an optical module such as a lens is not required, and an optical module that is easily, inexpensively, and has little characteristic deterioration due to return light can be obtained.

The mounting of the semiconductor laser 1 on the mounting section 16 may be performed by any of the methods of the fourth and fifth embodiments. Further, as the polarizer, a fiber-type polarizer having the function of a polarizer in the optical fiber itself may be used.

Embodiment 10 FIG. FIG. 10 shows Embodiment 1
FIG. 2A is a diagram showing a configuration of an optical module, and FIG. 2A is a plan view of the optical module, and FIG. In the figure, 1 and 4 are the same as those in the first embodiment shown in FIG. 1, 11 and 13 are the same as those in the fourth embodiment shown in FIG. 4, and 19 is the one shown in FIG. Embodiment 20 is the same as Embodiment 6, 20 is the same as Embodiment 7 shown in FIG. 7, and 29 is such that the reflection from the end face is small and the end face has a lens effect. This is the tip of the optical fiber 4 that has been subjected to spherical processing.

Next, the operation will be described. The semiconductor laser 1 converts an input electric signal into an optical signal and outputs it. The output optical signal is coupled to the optical fiber 4 which is a transmission line of the optical communication system and transmitted. Here, the optical fiber 4
Since the tip portion 29 is spherically processed, it has a lens effect, can increase the coupling efficiency of light between the semiconductor laser 1 and the optical fiber 4, and reflects light from the incident surface of the optical fiber 4. Return light can be reduced. As described above, by subjecting the distal end portion of the optical fiber 4 to spherical processing, it is possible to obtain an optical module having high coupling efficiency and little influence of reflection.

In this embodiment, a semiconductor laser which is a light emitting element has been described as an optical element. However, it goes without saying that the present invention can be applied to a photodiode (light receiving element).

[0067]

According to the first aspect of the present invention, a guide portion for positioning an optical fiber is formed on a semiconductor substrate on which an optical element has been grown, and the optical fiber is mounted on this guide portion. Since the position adjustment between the optical element and the optical fiber can be performed, it is not necessary to adjust the position between the optical element and the optical fiber for each individual optical module, which has the effect of shortening the assembly time of the optical module.

According to the second aspect of the present invention, a groove is formed as a guide for positioning the optical fiber, and the optical fiber is placed in the groove, whereby the position between the optical element and the optical fiber can be adjusted. This eliminates the need to adjust the position of the optical element and the optical fiber for each individual optical module, which has the effect of shortening the assembly time of the optical module.

According to the third aspect of the present invention, since the diameter of the optical fiber portion mounted on the guide portion is reduced, the depth of the guide portion may be small, so that the guide portion is easily formed by etching or the like. There are effects that can be done.

According to the fourth aspect of the present invention, the tip of the optical fiber portion mounted on the guide portion is made spherical,
Since the tip has a lens effect, the light coupling efficiency between the optical element and the optical fiber can be increased, and the reflected return light can be reduced.

According to the fifth aspect of the present invention, when the optical element is cut out, the wafer on which the optical element has been grown is etched so that a groove for positioning the optical fiber is formed. By cleaving the optical element to form the guide portion, optical coupling between the optical element and the optical fiber can be achieved without any adjustment, which has the effect of shortening the assembly time of the optical module.

According to the sixth aspect of the present invention, an optical element guide for positioning an optical element and an optical fiber guide for positioning an optical fiber are provided on a substrate by a light emitting or light receiving section of the optical element and an optical fiber. The optical input and output sections are aligned so that the optical element is mounted on the optical element guide section, and the optical fiber is mounted on the optical fiber guide section. Since the coupling can be achieved, there is an effect that the assembling time of the optical module can be reduced.

According to the seventh aspect of the invention, since the substrate is a silicon substrate, the optical element guide and the optical fiber guide can be formed with high precision by etching.

According to the eighth aspect of the present invention, a concave portion for positioning the optical element is formed on the substrate, a convex portion is formed on the mounting surface of the optical element on the substrate side, and the convex portion and the concave portion on the substrate are formed. By mounting them together, optical coupling between the optical element and the optical fiber can be achieved without adjustment, so that there is an effect that the assembly time of the optical module can be reduced.

According to the ninth aspect of the present invention, a convex portion for positioning the optical element is formed on the substrate, a concave portion is formed on the mounting surface of the optical device on the substrate side, and the concave portion and the convex portion on the substrate are formed. By mounting them together, optical coupling between the optical element and the optical fiber can be achieved without adjustment, so that there is an effect that the assembly time of the optical module can be reduced.

According to the tenth aspect of the present invention, since the protective coat for protecting the optical fiber is placed on the step provided on the substrate, the optical fiber does not directly hit the edge of the end of the substrate. Has the effect of preventing scratches and disconnection.

According to the eleventh aspect of the present invention, since one end of the substrate is formed obliquely with respect to the mounting surface of the optical fiber, the angle of the edge of the end of the substrate becomes larger than a right angle. This makes it difficult for the flaws caused by the edge to enter the optical fiber, and has the effect of preventing disconnection.

According to the twelfth aspect of the present invention, the tip of the optical fiber portion mounted on the optical fiber guide is made spherical, so that the tip has a lens effect. This has the effect of increasing the coupling efficiency and reducing the reflected return light.

According to the thirteenth aspect of the present invention, the semiconductor laser mounting section, the lens guide section, the optical isolator guide section, and the optical fiber guide section are formed on the substrate by the light emitting section of the semiconductor laser and the light incidence of the optical fiber. The parts are aligned so that the semiconductor laser is mounted on the semiconductor laser mounting part, the lens is mounted on the lens guide part, the optical fiber is mounted on the optical fiber guide part, and the optical isolator is inserted into the optical isolator guide part. By doing so, optical coupling between the optical element and the optical fiber can be achieved without any adjustment, which has the effect of reducing the time required for assembling the optical module. Further, it is possible to obtain an optical module in which characteristic deterioration due to return light is small.

According to the fourteenth aspect of the present invention, the semiconductor laser mounting section, the optical waveguide section, and the optical fiber guide section are provided on the garnet substrate by the light emitting section of the semiconductor laser, the light input / output section of the optical waveguide section, and the light guide. The optical coupling between the optical element and the optical fiber is adjusted without adjustment by forming the optical input part of the fiber so that the position matches, mounting the semiconductor laser on the semiconductor laser mounting part, and mounting the optical fiber on the optical fiber guide part. Therefore, there is an effect that the assembling time of the optical module can be reduced. Further, it is possible to obtain an optical module in which characteristic deterioration due to return light is small.

[Brief description of the drawings]

FIG. 1 is a configuration diagram illustrating a configuration of an optical module according to a first embodiment.

FIG. 2 is a cross-sectional view illustrating a configuration of an optical module according to a second embodiment.

FIG. 3 is a diagram illustrating a configuration of an optical module according to a third embodiment.

FIG. 4 is a diagram illustrating a configuration of an optical module according to a fourth embodiment.

FIG. 5 is a diagram showing a configuration of an optical module according to a fifth embodiment.

FIG. 6 is a diagram illustrating a configuration of an optical module according to a sixth embodiment.

FIG. 7 is a diagram showing a configuration of an optical module according to a seventh embodiment.

FIG. 8 is a diagram illustrating a configuration of an optical module according to an eighth embodiment.

FIG. 9 is a diagram showing a configuration of an optical module according to a ninth embodiment.

FIG. 10 is a diagram illustrating a configuration of an optical module according to a tenth embodiment.

FIG. 11 is a diagram showing a configuration of a conventional optical module.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 semiconductor laser, 2 light emitting section, 3 substrate, 4 optical fiber, 5 groove, 6 wafer, 7 tip of optical fiber 4, 8 core of optical fiber 4, 9 guide, 10 substrate, 11 silicon substrate, 12 guide , 13 V groove portion, 14 concave portion, 15 convex portion, 16 mounting portion, 17 protective coat, 18 step portion, 19 adhesive, 20 surfaces, 2
1 lens, 22 V groove, 23 optical isolator, 2
4 grooves, 25 magnets, 26 garnet substrate, 27 optical waveguide, 28 polarizer, 29 tip.

Claims (14)

[Claims] 1. A semiconductor substrate on which an optical element is grown, a guide portion formed on the semiconductor substrate for positioning an optical fiber, mounted on the guide portion, and optically coupled to the optical element. An optical module comprising: an optical fiber. 2. The optical module according to claim 1, wherein the guide section is a groove on which the optical fiber is placed. 3. The optical module according to claim 1, wherein said optical fiber portion mounted on said guide portion has a reduced diameter. 4. The optical module according to claim 1, wherein a tip of said optical fiber portion mounted on said guide portion is spherical. 5. The device according to claim 1, wherein the guide portion is formed by cutting a groove in the wafer on which the optical element has been grown by etching, and cleaving the optical element along the groove. Optical module. 6. A substrate, an optical element guide formed on the substrate for positioning an optical element, an optical element mounted on the optical element guide, and the substrate for positioning an optical fiber. An optical fiber guide portion formed on the optical fiber guide portion, and an optical fiber mounted on the optical fiber guide portion and optically coupled to the optical element. An optical module, wherein a light emitting portion or a light receiving portion of the element and a light input / output portion of the optical fiber are aligned. 7. The optical module according to claim 6, wherein said substrate is a silicon substrate. 8. The optical element guide part has a concave part formed on the substrate, and the optical element has a convex part formed on a mounting surface of the optical element on the substrate side. 7. The optical module according to claim 6, wherein the projection and the recess are mounted together. 9. The optical element guide part has a convex part formed on the substrate, and the optical element has a concave part formed on a mounting surface of the optical element on the substrate side. The optical module according to claim 6, wherein the concave portion and the convex portion are mounted together. 10. The optical module according to claim 6, further comprising a protective coat for protecting the optical fiber, wherein the substrate has a step portion on which the protective coat is placed. 11. The optical module according to claim 6, wherein one end of the substrate is processed obliquely to a mounting surface of the optical fiber. 12. The optical module according to claim 6, wherein a tip of the optical fiber portion mounted on the optical fiber guide is spherical. 13. A substrate, a semiconductor laser mounting part formed on the substrate for positioning and mounting the semiconductor laser, and a semiconductor laser mounted on the semiconductor laser mounting part and converting an input electric signal into an optical signal. A lens guide portion formed on the substrate for positioning a lens; a lens mounted on the lens guide portion for condensing an optical signal from the semiconductor laser; and a substrate for inserting an optical isolator. An optical isolator guide formed on the optical isolator guide, an optical isolator mounted on the optical isolator guide and transmitting light collected by the lens, and a light formed on the substrate for positioning an optical fiber. A fiber guide portion, and an optical fiber mounted on the optical fiber guide portion and receiving the transmitted light from the optical isolator. The optical isolator blocks return light from the optical fiber, and the semiconductor laser mounting section, the lens guide section, the optical isolator guide section, and the optical fiber guide section include a light emitting section of the semiconductor laser, An optical module, wherein an optical fiber is formed so that a position of a light incident portion of the optical fiber is matched. 14. A garnet substrate, a semiconductor laser mounting portion formed on the garnet substrate for positioning and mounting a semiconductor laser, and a semiconductor mounted on the semiconductor laser mounting portion for converting an input electric signal into an optical signal. A laser, an optical waveguide portion having a Faraday effect, and rotating and emitting the polarization of an optical signal from the semiconductor laser; and an optical fiber guide portion formed on the garnet substrate for positioning an optical fiber. An optical fiber mounted on the optical fiber guide portion and receiving light emitted from the optical waveguide portion, wherein the semiconductor laser mounting portion, the optical waveguide portion, and the optical fiber guide portion are provided by the semiconductor laser. The light emitting section, the light input / output section of the optical waveguide section, and the light input section of the optical fiber are formed so as to be aligned with each other. Optical module.