JPH10232330A - Semiconductor optical coupling device and assembling method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the number of fixed parts at the end parts of fibers, to form a structure in which assembly at a low cost is possible to achieve, and simultaneously, to improve life reliability in a semiconductor optical coupling device. SOLUTION: The semiconductor optical coupling device is constituted by including a Si substrate 21, an optical integrated circuit 27 disposed on the Si substrate 21, the optical fibers which are disposed within a V groove formed on the surface of the Si substrate 21 toward the outer side from the position of the optical integrated circuit 27 and in which a ferrule 23 is formed at the outer periphery, a Si presser 31 for holding and fixing the ferrule 23 within the V groove of the Si substrate 21 from above the drawing, a case 30 incorporating these Si substrate 21, optical integrated circuit 27, optical fibers with the ferrule 23 and Si presser 31, and a lid 22 of the case 30. At this point, the optical fibers are disposed so as to be optically coupled with the optical integrated circuit 27, and simultaneously, to continuously form the ferrule 23 from the end part of the optical integrated circuit 27 side up to a section which is the outside of the case 30.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor optical coupling device which incorporates optical elements such as an optical integrated circuit, an optical waveguide, an optical multiplexer / demultiplexer, and an optical switch and performs input / output of light via an optical fiber. In particular, by making it suitable for fixing an optical fiber to an optical integrated circuit, an optical waveguide, an optical multiplexer / demultiplexer, or an optical switch, the structure can be easily and inexpensively assembled, or the fiber can be attached and detached by a receptacle structure. And a method for assembling the same.

[0002]

2. Description of the Related Art Conventionally, as a configuration of a semiconductor optical coupling device, for example, the IEICE General Conference 1995, C
184, "Surface-mounted optical module suitable for automatic assembly". In this document, as shown in FIG. 13, the optical fiber 26 is fixed at three places: a Si substrate 21, a ceramic case 30, and a ferrule 23.
That is, the semiconductor element 20 and the optical fiber 26 having one end coupled to the semiconductor element 20 are mounted on the same Si substrate 21 so that the two can be stably optically coupled.
The Si substrate 21 on which both are mounted is hermetically sealed using a lid 22 in a ceramic case 30 in order to maintain the stability of the optical coupling or to protect the semiconductor element. On the other hand, the semiconductor element 20
The other end of the optical fiber 26 is inserted and fixed in the ferrule 23 outside the lid 22 so as to take out the light guided to one end of the optical fiber 26 from the outside and optically couple the light. Butts are joined in the sleeve 24. As described above, the optical fiber is transmitted to the outside by attaching the optical fiber to the module.

Another example is disclosed in Japanese Patent Laid-Open No. 5-27.
As described in Japanese Patent Publication No. 142, the fiber used for the optical module is configured such that the fiber is inserted and fixed in a metal tube and further in a capillary, then incorporated in the module, and light from the LD element is incident on the fiber. .

Another example is disclosed in JP-A-8-13.
As described in Japanese Patent No. 6763, a ferrule for an optical connector has been manufactured by injection molding using a molten thermoplastic resin with good productivity.

[0005]

In the above prior art, as shown in FIG. 13, a light beam emitted from a semiconductor device 20 is condensed by a heated spherical lens and taken into one end of an optical fiber 26. The other end of the optical fiber 26 fixed by the V-groove provided on the Si substrate 21 extends to the outside of the lid 22 and is fixed in the ferrule 23.
The ferrule 23 is fixed to the ceramic case 30. Ferrule 2 fixed to ceramic case 30
Reference numeral 3 denotes a structure in which an end remote from the semiconductor element 20 is inserted into the split sleeve 24 and connected to an external connector 25 inside the split sleeve 24.

In the assembly, first, an optical fiber 26 having a predetermined length is inserted and fixed in the ferrule 23 so that one end face thereof coincides with the end face of the ferrule 23, and then the end face of the ferrule 23 is polished with a curvature. The other end of the optical fiber 26 is joined and fixed along a V groove provided in the Si substrate 21. An optical fiber 26 having a ferrule 23 on one side and an Si substrate 21 on the other side is attached to a ceramic case 30,
Fix it. As described above, the operation of joining the ferrule or the Si substrate to the fiber having an outer diameter of 125 μm and then transporting and fixing it to the case involves careful handling.

In the technique described in Japanese Patent Application Laid-Open No. Hei 5-27142, the end of an optical fiber to be mounted on a module is fixed to a capillary in advance, but the metal tube or capillary used for fixing the end is of high precision. There have been problems such as the need for dimensional processing and high component costs, and the difficulty in automating the assembly work for fixing the fiber to these components.

An object of the present invention is to provide a semiconductor optical coupling device incorporating optical elements such as an optical integrated circuit for inputting and outputting light through an optical fiber, an optical waveguide, an optical multiplexer / demultiplexer, and an optical switch. An object of the present invention is to reduce the number of parts for fixing the end of the fiber, and to easily attach and detach the fiber by a structure or a receptacle structure that can be easily assembled at low cost, and to increase the life reliability after fixing the fiber.

[0009]

In the following description, an optical element is usually an optical semiconductor element (such as an LD) serving as a light source,
Optical waveguide, optical multiplexer / demultiplexer, optical switch, which is an optical transmission medium, means an optical integrated circuit in which they are integrated, and when the optical waveguide, optical multiplexer / demultiplexer, optical switch, and optical integrated circuit are mounted on a substrate , And its substrate.

[0010] The object of the present invention is to provide a coupling system which is emitted from an optical element and condensed on an optical fiber, or a coupling system which is emitted from an optical fiber and condensed on an optical element. This is achieved by solid-forming the ferrule in advance and fixing the ferrule part to a part of the optical element and / or the case. It is preferable that a groove is formed in advance at a portion where a part of the optical element and the ferrule portion of the case are fixed to facilitate positioning. In addition, it is desirable that the range in which the ferrule at the tip of the optical fiber is formed be the entire length of the optical fiber when both ends of the optical fiber are in the same case. By forming the ferrule over the entire length, the work of mounting the optical fiber inside the case, that is, the work of fixing the optical fiber to the components housed in the case or fixing it to the case becomes easy. Also,
When one end of the optical fiber is inside the case and the other end is outside the case, it is preferable to form a ferrule at least from the inside end of the case to a position where the optical fiber comes out of the case. By forming the ferrule up to the case penetrating portion, the work of mounting the optical fiber inside the case becomes easy, and the processing of the optical fiber in the case penetrating portion becomes easy.

That is, a first means of the present invention for achieving the above object comprises an optical element comprising a substrate, an optical fiber provided for optically coupling to an optical input / output end of the optical element, In a semiconductor optical coupling device comprising an optical element and a case accommodating the optical fiber, a plastic resin, a metal powder, a ceramic powder or a solid material thereof is preliminarily molded on the outer periphery of the optical fiber, After positioning the ferrule on the substrate, the solid material with the fiber is fixed to a part of the optical element or the case.

According to a second aspect of the present invention, there is provided an optical element comprising a substrate, an optical fiber provided for optically coupling to an optical input / output end of the optical element, and an optical element. And a case accommodating the optical fiber, wherein the optical fiber extends to the outside of the case. Body, ceramic powder or its solid material is ferrule-molded into a cylindrical or square shape, and after arranging the optical element and the optical fiber so as to optically couple with each other, a part of the optical element or the case The solid material with the fiber is fixed.

According to a third aspect of the present invention, there is provided an optical element including a substrate, an optical fiber provided for optically coupling to a light input / output end of the optical element, and an optical element. And a case accommodating the optical fiber, wherein the optical fiber extends to the outside of the case. Body, ceramic powder or its solid material is ferrule-molded into a cylindrical or square shape, and after arranging the optical element and the optical fiber so as to optically couple with each other, a part of the optical element or the case The solid material with fibers is fixed using an adhesive.

According to a fourth aspect of the present invention, there is provided an optical element comprising a substrate, an optical fiber provided for optically coupling to a light input / output end of the optical element, and an optical element comprising: And a case accommodating an optical fiber, wherein the case is configured by coupling a receptacle, the optical fiber is arranged to extend from the inside of the case to the receptacle, and the optical fiber The outer periphery of the fiber is continuously formed from a plastic resin, a metal powder, a ceramic powder or a solid material thereof into a cylindrical or square ferrule from the inside of the case to the receptacle, and optically couples the optical element and the optical fiber to each other. It is characterized by being arranged and fixed as described above.

According to a fifth aspect of the present invention, there is provided an optical element comprising a substrate, an optical fiber provided for optical coupling to a light input / output end of the optical element, and an optical element comprising: And a case for housing the optical fiber, wherein the optical fiber extends to the outside of the case. That the ferrule is formed of plastic resin, metal powder, ceramic powder or a solid material thereof, and that the ferrule is fixed to a part of the optical element and / or the case. Features.

A sixth means of the present invention for achieving the above object is the fifth means, wherein the ferrule has a cylindrical shape centered on an optical fiber, and the ferrule of the optical element is fixed. A groove for positioning the ferrule is formed in the portion.

According to a seventh aspect of the present invention to achieve the above object, in any one of the first to sixth aspects, the material of the case is any one of ceramic, plastic, and metal. I do.

According to an eighth aspect of the present invention to achieve the above object, in the above seventh aspect, the material of the case is Al ₂ O.
_3. SiC, AlN, transfer mold epoxy, silicon, injection mold polycarbonate, liquid crystal polymer, polyphenylene sulfide, phenol or plastic with filler, Fe, Fe-
29Ni-17Co, mild steel.

A ninth aspect of the present invention for achieving the above object is the above-mentioned one of the first to sixth aspects, wherein the plastic resin solid material at the end of the optical fiber is epoxy, UV epoxy, silicone, phenol, acrylic. , UV acrylic, or a mixture of these resins and fillers.

According to a tenth aspect of the present invention to achieve the above object, in any one of the first to sixth aspects, the metal powder solid material at the end of the optical fiber is a powder of Cu, Fe, W, Mo. Either a solid body or a mixture of these and an organic binder, or a solid body of Al ₂ O ₃ , SiC, AlN powder or a mixture of these and an organic binder It is characterized by.

According to an eleventh aspect of the present invention, there is provided an optical element comprising a substrate, an optical fiber provided for optically coupling to an optical input / output end of the optical element, A method for assembling a semiconductor optical coupling device comprising: a case for accommodating an optical fiber; and a plastic resin, metal powder,
A ferrule is formed into a cylindrical shape or a quadrangular shape with either ceramic powder or its solid material, and after joining the optical element to a predetermined position on the case, the optical fiber is optically coupled to the optical element. As described above, a ferrule of the optical fiber is fixed to a part of the optical element and / or the case.

According to a twelfth aspect of the present invention, there is provided an optical element comprising a substrate, an optical fiber provided for optical coupling to a light input / output end of the optical element, and an optical element comprising: A method for assembling a semiconductor optical coupling device, comprising: a resin resin, a metal powder, a ceramic powder or a solid material thereof on an outer periphery near an end of the optical fiber in advance. A ferrule is formed in a cylindrical or square shape with a ferrule, and the optical fiber with the ferrule is fixed in a groove formed in the optical element so as to optically couple to the optical element. It is characterized in that it is joined and fixed at a predetermined position on the case.

According to a thirteenth aspect of the present invention, there is provided an optical element comprising a substrate, an optical fiber provided for optically coupling to an optical input / output end of the optical element, And a case provided so as to house the optical fiber.In a method of assembling a semiconductor optical coupling device configured by coupling a receptacle to the case, a plastic resin is previously provided on an outer periphery of the optical fiber, Metal powder, ceramic powder or a solid material thereof is ferrule-molded into a cylindrical or square shape, and after joining the optical element to a predetermined position on the case, the ferrule is connected to the receptacle by a connector. The optical fiber is arranged and fixed on the optical element so as to be coupled and optically coupled to the optical element.

According to a fourteenth aspect of the present invention, there is provided an optical element comprising a substrate, an optical fiber provided for optically coupling to an optical input / output end of the optical element, And a case for accommodating an optical fiber, wherein in the method of assembling a semiconductor optical coupling device configured by coupling a receptacle to the case, a plastic resin, metal powder,
A ferrule is formed into a cylindrical shape or a quadrangular shape with either ceramic powder or its solid material, and the optical fiber with the ferrule is fixed to a groove formed in the optical element so as to optically couple to the optical element. Then, the optical element to which the optical fiber is fixed is joined and fixed at a predetermined position on the case, and the optical fiber with a ferrule is connected to the receptacle.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a semiconductor optical coupling device according to the present invention will be described below with reference to FIGS. The illustrated embodiment includes a Si substrate 21, an optical integrated circuit 27 disposed on the Si substrate 21, and a V-groove 21A formed on the surface of the Si substrate 21 from the position of the optical integrated circuit 27 toward the outer side. An optical fiber 26 which is disposed in the V-groove 21A and has a ferrule 23 formed on the outer periphery thereof; and a Si retainer 31 which clamps the ferrule 23 in the V-groove 21A of the Si substrate 21 from above in FIG. The ferrule 23 includes a Si substrate 21, an optical integrated circuit 27, an optical fiber 26 with a ferrule 23, and a ceramic case 30 (not shown) in which a Si holder 31 is provided. The optical fiber 26 is built in the center line. The nylon coating 28 is not provided on a portion of the ferrule 23 near the optical integrated circuit 27. Si substrate 2
1 and the optical integrated circuit 27 arranged thereon are collectively called an optical element.

On the Si substrate 21, a portion where the optical integrated circuit 27 is positioned and fixed is set in advance.
V extending to the outer periphery of the substrate 21 and fixing the optical fiber 26
A groove 21A is formed on the substrate surface. The V-groove is formed by using anisotropic etching of Si. That is, (100)
After performing exposure baking of a photoresist film on the surface of the Si single crystal plate, it is immersed in a KOH etching bath controlled in temperature and etched to form a V groove 21A.

The assembly of the optical integrated circuit 27 on the Si substrate 21 is performed in the following procedure. First, the optical integrated circuit 27 and S
A marker is formed on the upper surface of the i-substrate 21, and the optical integrated circuit 27 is aligned with the Si substrate 21 so that the markers coincide with each other, and bonded and fixed. It is suitable to match the markers by using an image recognition device to recognize the shape of each marker and automatically aligning the markers so that both markers overlap. Markers are formed using a photoresist film, and the number of markers formed on a substrate or a circuit is preferably at least two or more. The center line position of the V-groove 21A is such that when the optical fiber 26 with the ferrule is arranged in the V-groove 21A, the center line of the optical fiber 26 is emitted from the optical integrated circuit 27 fixed on the Si substrate 21. Signal (or optical integrated circuit 2
7 is set to a position that coincides with the center line of the optical signal intake section 7). When the optical integrated circuit 27 is adjusted and fixed as described above, the optical integrated circuit 27 can perform predetermined positioning and fixing with respect to the fiber light incident portion without causing light oscillation by an energizing operation. V groove 21A
Are formed using the same mask, and the optical integrated circuit 27 and a V-groove (hereinafter referred to as a SiV groove) of the Si substrate 21 formed in advance are formed. The arrangement in the X direction and the Z direction with 21A does not shift.

How to fix the optical fiber 26 on the SiV groove 21A will be described with reference to FIG. FIG. 2 shows FIG.
2 is a cross-sectional view in which the center in the X direction is cut along a plane (YZ plane) extending in the Z direction. The optical fiber 26 is covered with the nylon coating 28 and the ferrule 20 from the tip (the end near the optical element) to the portion outside the ceramic case 30 (not shown) (the nylon coating 2).
8 is not provided at the tip portion). Optical integrated circuit 27
Is emitted from the lower end of the element in the lateral direction. The oscillation wavelength is in the 1.3 μm band, and the spread of the oscillation light is 10 to 15 ° in full width at half maximum. The optical fiber 26 is preferably a single mode fiber. The optical fiber 26 has a two-layer structure of a core part (outside diameter of 8 μm) and a clad part (outside diameter of 125 μm) covering the periphery of the core part, and transmits light by confining light in the core part.

The allowable displacement between the optical integrated circuit 27 and the optical fiber 26 is 1 dB.
% Loss), 2-3 μm in the X and Y directions and about 60 μm in the Z direction. The optical integrated circuit 27 emits light horizontally from the lower end. Therefore, in order to provide a structure in which the core of the fiber can be accurately positioned at this position, the SiV
The depth of the groove is determined by adjusting the optical fiber 26 with the ferrule to the V-groove 21.
When fixed to A, the center of the ferrule 23, that is, the center of the optical fiber 26, is set to a value that matches the surface of the Si substrate 21 (the mounting surface of the optical integrated circuit 27), that is, the light emission position of the optical integrated circuit 27. I do. In particular, the position of the end face 32 of the optical fiber 26 on the optical integrated circuit 27 side determines the quality of optical coupling. After the ferrule 23 is installed in the SiV groove 21A,
To keep the ferrule 23 fixed and stable, hold down the Si 3
1 is placed so as to sandwich the ferrule 23 between the Si substrate 21 and the Si retainer 31 is bonded and fixed to the Si substrate 21. At the time of this bonding and fixing, in order to hold the position of the fiber end face 32 at a predetermined position, the Si holder 31 is bonded and fixed while pressing it toward the Si substrate 21.

Next, the configuration of the ferrule 23 will be described. FIG. 3 shows a ferrule structure for fixing the distal end of an optical fiber 26 using a capillary 29 as an example of a conventional optical fiber end fixing structure. The capillary 29 is press-fitted and fixed to the tip of the metal pipe 35, and the optical fiber 26 is inserted therein. The outer diameter of the optical fiber 26 is 12
5 ± 1 μm, and the inner diameter of the capillary 29 is set to 127 ± 1 μm to match this. After the adhesive is applied to the tip of the optical fiber, the optical fiber 26 is inserted to the tip of the capillary 29 and fixed by bonding. A nylon coating 28 having an outer diameter slightly smaller than the inner diameter of the metal pipe 35 is provided on the rear side of the optical fiber 26 (portion not inserted into the capillary 29) so as to protect the optical fiber. The agent flows in and is joined into the metal pipe 25. As described above, in the structure in which the end of the optical fiber is bonded and fixed, the size of the fiber end is accurately controlled by controlling the processing accuracy of the outer diameter and the inner diameter, and furthermore, the reliability is fixed by fixing the inside of the capillary or metal pipe (for example, at -45 to 80 ° C.). Temperature cycle test) Life is long. If the end of the fiber is fixed and the life is short, for example, the tip of the optical fiber may protrude from the end of the capillary 29, or the nylon coating 28 may come out of the metal pipe 35.

FIGS. 4 and 5 show a reference example in which the end of the fiber has a structure different from that of FIG. 3, and FIG. 6 shows a structure used in an embodiment of the present invention. FIG. 4 shows a structure in which the capillary 29 is removed from the structure of FIG. 3 and an adhesive 36 is injected instead of the capillary 29. FIG. 5 shows a structure in which the metal pipe 35 is removed from the structure of FIG. 3, the optical fiber 26 is inserted into the capillary 29, and the capillary 29 is adhered and fixed. FIG. 6 shows that a thin plate capillary 29A and a thin plate metal pipe 35A are provided at the ends instead of the capillary 29, and an adhesive 36 is provided therebetween.
Is cast to form the shape of the ferrule 23. The thickness (length in the axial direction) of the capillary 29A is suitably about 1/3 to 1/5 of the conventional one. In this specific forming method, for example, as shown in FIG. 7, for example, four cylindrical through holes 291 are provided between the mating plates 37,
After inserting the thin plate capillary 29A at one end, the optical fiber 26 with nylon coating is inserted, then the adhesive 36 is injected into the cylindrical through-hole 291 and the thin metal pipe 35A is further attached to cause a curing reaction of the adhesive. Complete the formation.

The method of manufacturing the thin plate capillary 29A may be any of a method of firing alumina with the thin plate size as it is, a method of slicing and cutting a conventional ceramic capillary, and a method of making a thin plate metal by direct machining. In particular, a hole with an inner diameter of 127 μm into which an optical fiber is inserted can be processed with high precision by making it a thin plate. The material is A
l ₂ O ₃ , ZrO ₂ , Fe-29Ni-17Co, Fe-42Ni
Etc. are suitable. As a material of the adhesive 36, epoxy, UV epoxy, silicone, phenol, acrylic, UV acrylic, or a mixture of these resins and a filler is suitable. The coefficient of linear expansion of the resin is 100 to 300
/ 10 ⁶ (/ ° C.) while the optical fiber 26
Has a linear expansion coefficient of 0.5 / 10 ⁶ (/ ° C.). Therefore, when the resin is solidified around the optical fiber as it is, the thermal expansion and contraction of the resin or a change in the environmental temperature causes the thermal expansion of the optical fiber based on the difference in the expansion coefficient. Stress occurs. To avoid this phenomenon, a filler is mixed into the resin. Suitable materials for the filler include SiO ₂ Al ₂ O ₃ and AlN.

In addition to the above, the solid material forming the ferrule may be a metal powder solid material obtained by subjecting Cu, Fe, W, Mo powder or a mixture thereof to an organic binder to a solid treatment. Al ₂ as ceramic powder
O _3, SiC, are suitable those solid processing a mixture of AlN powder or these organic binders. The mixing ratio between the metal powder or ceramic powder and the organic binder is suitably about 10: 5 to 0.5, more preferably in the range of 10: 4 to 2.

[0034]

[Table 1]

The structural components shown in FIGS. 4 to 6 were subjected to a temperature cycle test (−45 to 80 ° C., 1 hour / cycle) in a reliability test, and the results shown in Table 1 were obtained. For example, in the structure of FIG. 4, after 300 cycles, the adhesive 36 may jump out of the metal pipe 35 in some cases. As the adhesive 36 jumps out, the fiber tip is also pulled out, resulting in deterioration of optical coupling. In the structure of FIG.
After the cycle, the fiber end does not protrude from the tip of the capillary 29, but the rear side 24 of the capillary 29
1 part, namely, the capillary 29 and the nylon coating 2
8, there is a case where the optical fiber 26 is broken. Compared to FIGS. 4 and 5, in the structure of FIG. 6, even if a temperature cycle is applied, the optical fiber 26 does not protrude or break, and the nylon coating 28 does not protrude from the metal pipe 35 and is stably fixed. I have.

As described above, according to the structure shown in FIG.
And the workability is improved. Moreover, by providing the end of the capillary 29A, the fiber position in the Y direction (the direction perpendicular to the optical integrated circuit mounting surface of the Si substrate) can be accurately maintained, and the optical coupling with the optical integrated circuit 27 can be stabilized. it can.

The outer diameter of the metal pipe 35 shown in FIG.
Although 5 mm or 2.5 mm is often used, it is necessary to perform etching for a long time in order to etch the SiV groove for holding the ferrule having the outer diameter. The processing time can be reduced by making the shape thin.
The outer diameter of the ferrule is desirably, for example, about 0.3 to 0.5 mm.

Another example of a desirable ferrule structure is shown in FIGS.
As shown in FIG. In the structure shown in FIG. 8, the outer ferrule 261 is formed in advance with a material such as plastic, and the optical fiber 26 with the plastic coating 28 is inserted and fixed therein. Also, the outer ferrule 2
The formation of 61 may be performed by casting as in FIG. Alternatively, there is a method in which the material is sprayed and deposited while rotating in the circumferential direction of the fiber, and the ferrule 261 is formed as a solid material.

In the structure shown in FIG. 9, a small capillary 29 and an optical fiber 26 are first adhered and fixed, and then a thin metal pipe 35A is covered with a plastic coating 2 of the optical fiber 26.
8 to obtain the outer shape of the ferrule 262 by casting. It is desirable that the length of the capillary 29 is 1/2 to 1/4 of the conventional length (4 to 5 mm).

In the structure shown in FIG. 10, after the ferrule 263 is formed in the same manner as in FIG.
90 is attached. The material of the film is Cr, N
i, Mo, or SiO ₂ , Al ₂ O ₃ , AlN, etc. are suitable.

The structures shown in FIGS. 7 to 10 are ferrules which are individually suitable for fixing the fiber, but may be formed as an integral structure by combining two whole structures or parts.

The assembly method of the embodiment shown in FIGS.
Will be described. As described above, the optical integrated circuit 27 is positioned and fixed on the Si substrate 21 using the marker. Au-Sn and Au-Ge solders are suitable as joining materials. The substrate temperature is set to 320 ° C., and nitrogen gas is blown or bonded in a nitrogen gas atmosphere. Next, the SiV groove 2 of the Si substrate 21
An optical fiber with a ferrule is arranged on 1A, and is sandwiched and fixed with an Si retainer 31. The ferrule 23 is provided in a cylindrical shape continuously from the tip of the optical fiber 26 to a portion outside the ceramic case 30 as shown in the figure. Next, the Si substrate 21 with the optical fiber 26
Is mounted on the ceramic case 30. The ceramic case 30 is, for example, a ceramic case 30 in which a metal lead frame 51 is molded in advance and embedded in a resin.
Use Suitable materials for the ceramic case 30 and the lid 22 include epoxy resin, silicone resin, polycarbonate, liquid crystal polymer, polyphenylene sulfide, phenol, or a mixture of these resins and fillers. The external lead pin is DIL
(Dual in-line) The distance between the pins is 2.5 mm with 8 pins. A lead pad 50 is provided in a portion of the ceramic case 30 where the Si substrate 21 is mounted so that heat generated in the optical integrated circuit 27 can be quickly radiated to the outside. The Si substrate 21 is bonded to the pad 50 with an adhesive containing Ag filler having good thermal conductivity. Thereafter, the lead and the optical integrated circuit 27
Is wire-bonded so as to be electrically connected. The lid 22 is joined to the upper side of the ceramic case 30 to shut off the outside.

Further, the Si substrate 21 to which the optical integrated circuit 27 is fixed is mounted and fixed at a predetermined position of the ceramic case 30.
After that, an optical fiber with a ferrule may be arranged in the SiV groove 21A of the Si substrate 21 and sandwiched by the Si retainer 31 to be bonded and fixed.

In the above description, the ferrule 23 has a cylindrical shape. However, the ferrule 23 is not necessarily limited to a cylindrical shape, and may have a polygonal cross section, for example, a rectangular prism. However, in that case, it is desirable that the groove formed in the Si substrate 21 has a cross-sectional shape suitable for the ferrule cross-sectional shape.
When the optical fiber 26 extends inside and outside the ceramic case 30 as in the embodiment shown in FIG. 11, or when the optical fiber 26 extends along the wall surface of the ceramic case 30, It is desirable that grooves are formed in the portion where the 26 passes through the wall surface of the ceramic case 30 and in the wall surface where the optical fiber 26 extends, to facilitate positioning.

Next, referring to FIG. 12, as a second embodiment of the present invention, instead of bonding and fixing an optical fiber with a ferrule directly to a semiconductor optical coupling device, a receptacle type connector to the semiconductor optical coupling device is used. Optical fiber 26A
The structure for attaching and detaching is explained. FIG. 12 shows a structure in which an optical fiber 26A for extracting an optical signal from a semiconductor optical coupling device is detachable. In the semiconductor optical coupling device of the present embodiment, the ceramic case 30 (and the lid 22) in the semiconductor optical coupling device shown in FIG. 11 is extended along the ferrule 23 in the axial direction of the ferrule 23, and the receptacle (hereinafter, referred to as a conversion adapter portion). ) Is formed, and an end of the ferrule 23 is inserted and fixed in a split sleeve 43 provided in the conversion adapter portion, and the split sleeve 4 is fixed.
Connector 50 with ferrule 23A inserted in
It is provided with. The ferrule 23A formed on the outer periphery of the optical fiber 26A has the same diameter as the ferrule 23, and when the connector 50 is connected to the conversion adapter and the ferrule 23A is inserted into the split sleeve 43, the ferrule 23A The optical fibers 26A at the center of the ferrule 23A abut on each other with their axes aligned. The part containing the optical integrated circuit 27 is called an optical element part case, and the entirety including the optical element part case and the conversion adapter part is called a case 42 with an adapter.

In the conversion adapter, the tip of the ferrule 23 coming out of the optical element case and the tip of the ferrule 23A of the connector 50 make PC contact (physical contact), and optical coupling between the optical fiber 26 and the optical fiber 26A is performed. . Both ferrules are held by the split sleeve 43 so as to increase the stability of optical coupling, and the outer diameter of both ferrules is 1.25 ± 0.002 mm. The optical fiber 26 having both ends in the case 42 with the adapter is ferrule-molded over its entire length, fixed to the Si substrate 21, mounted on the split sleeve 43, and further fixed to the Si substrate. The attachment of the case 21 to the case 42 is facilitated.

The ferrule 23A of the connector 50
When the connector 50 is coupled to the conversion adapter, the tip of the ferrule 23A is fixed to the ferrule 2 by the coil spring 33 installed therein.
3 Retreat while compressing the coil spring 33 against the tip,
The structure is such that the coil spring 33 is pressed against the tip of the ferrule 23. The connector 50 is provided with a structure which cannot be released only by the repulsive force of the coil spring 33 once it is connected. The connector 50 is the most commonly used connector.
U connectors are suitable.

According to this embodiment, an optical fiber with a ferrule molded and solidified with a plastic resin, metal powder, ceramic powder or the like is fixed to a case or a part of an optical element. By simply forming the ferrule 23 structure at the tip of the optical fiber in this manner, the outer diameter of the ferrule can be made smaller than before, and the SiV groove can also be made smaller. Further, the thin plate capillary 29A is provided in the ferrule 23 so as to secure the dimensional accuracy of the ferrule outer diameter.
Insert The ferrule 23 fixed to the SiV groove can secure the positional accuracy with the optical integrated circuit 27, and can obtain a stable optical output.

In this embodiment, the semiconductor optical coupling device using the optical integrated circuit has been mainly described.
The same effect can be obtained by applying the present invention to a semiconductor optical coupling device using an optical element such as an optical multiplexer / demultiplexer or an optical switch. Alternatively, an optical fiber with a ferrule can be used as the connector component.

According to the above embodiment, the fiber tip is
Since the ferrule is formed of plastic resin, metal powder, ceramic powder, or the like and is fixed to the case or a part of the optical integrated circuit, there is an effect that the fiber tip can be easily formed at low cost. Further, by inserting a thin plate capillary into the ferrule, the dimensional accuracy of the tip of the ferrule can be secured, and there is an effect that optical coupling with the optical integrated circuit can be performed with high accuracy. Further, the outer diameter of the ferrule can be reduced, and the processing time of the SiV groove can be shortened. By attaching the receptacle to the semiconductor optical coupling device by applying the fiber tip fixing, a fiber attaching / detaching structure using a connector can be provided, and when the semiconductor optical coupling device is automatically assembled, conveyance and handling are facilitated. In addition, since the ferrule is made of a mixture of metal powder, ceramic powder and organic binder, the difference in the expansion coefficient between the optical fiber and the ferrule can be reduced, the thermal stress against temperature change can be reduced, and the ferrule can be used for a long time. Has the effect of obtaining a stable structure. In addition, even if a temperature change occurs in the semiconductor optical coupling device, there is an effect that optical coupling does not deteriorate.

[0051]

According to the present invention, it is possible to easily assemble a semiconductor optical coupling device at a lower cost than before, and it is easy to attach / detach an optical fiber and to improve the life reliability after fixing the optical fiber. improves.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a main part of a first embodiment of the present invention.

FIG. 2 is a sectional view of a plane including an optical fiber axis of the embodiment shown in FIG. 1;

FIG. 3 is a cross-sectional view showing a configuration of a conventional ferrule with a fiber.

FIG. 4 is a sectional view showing a reference example of the configuration of a ferrule with a fiber.

FIG. 5 is a sectional view showing a reference example of the configuration of a ferrule with a fiber.

FIG. 6 is a sectional view showing an example of the configuration of the ferrule of the embodiment shown in FIG. 1;

FIG. 7 is a perspective view showing a procedure for creating the ferrule shown in FIG. 6;

FIG. 8 is a cross-sectional view showing another example of the ferrule of the embodiment shown in FIG.

FIG. 9 is a sectional view showing another example of the ferrule of the embodiment shown in FIG. 1;

FIG. 10 is a sectional view showing another example of the ferrule of the embodiment shown in FIG. 1;

FIG. 11 is an assembled sectional view of the first embodiment of the present invention.

FIG. 12 is an assembled sectional view of a second embodiment of the present invention.

FIG. 13 is an assembled sectional view showing an example of a conventional technique.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 20 Semiconductor element 21 Si board 21A SiV groove 22 Lid 23, 23A Ferrule 24 Split sleeve 25 Optical connector 26 Optical fiber 26A Optical fiber 27 Optical integrated circuit 28 Nylon coating 29 Capillary 29A Thin plate capillary 30 Ceramic case 31 Si press 32 Optical fiber light Integrated circuit side end surface 33 Coil spring 35 Metal pipe 35A Thin metal pipe 36 Adhesive 37 Laminating plate 42 Adapter case 43 Split sleeve 241 Rear end surface of capillary 261 262 263 Ferrule 291 Cylindrical through hole

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shoichi Takahashi 190, Kashiwagi, Komoro-shi, Nagano Prefecture Semiconductor Division, Hitachi, Ltd. (72) Inventor Takeshi Takeshi 1-280, Higashi-Koigabo, Kokubunji-shi, Tokyo Hitachi, Ltd. Central Research Laboratory

Claims (14)

[Claims] 1. An optical element comprising a substrate, an optical fiber provided for optical coupling to an optical input / output end of the optical element, and a case for accommodating the optical element and the optical fiber. In the semiconductor optical coupling device, a ferrule is formed in advance on the outer periphery of the optical fiber with a plastic resin, metal powder, ceramic powder or a solid material thereof, and after positioning the ferrule on the substrate, one of the optical elements is formed. A semiconductor optical coupling device, wherein the solid material with a fiber is fixed to a part or the case. 2. An optical element including a substrate, an optical fiber provided to optically couple to an optical input / output end of the optical element, a case accommodating the optical element and the optical fiber,
In the semiconductor optical coupling device, wherein the optical fiber extends to the outside of the case, the outer periphery near the optical fiber end is a plastic resin, metal powder,
The ferrule is formed into a cylindrical or square shape with ceramic powder or its solid material, and after arranging the optical element and the optical fiber so as to optically couple with each other, a part of the optical element or the case is provided with the fiber. A semiconductor optical coupling device, wherein a solid material is fixed. 3. An optical element including a substrate, an optical fiber provided to optically couple to an optical input / output end of the optical element, a case accommodating the optical element and the optical fiber,
In the semiconductor optical coupling device, wherein the optical fiber extends to the outside of the case, the outer periphery near the optical fiber end is a plastic resin, metal powder,
The ferrule is formed into a cylindrical or square shape with ceramic powder or its solid material, and after arranging the optical element and the optical fiber so as to optically couple with each other, a part of the optical element or the case is provided with the fiber. A semiconductor optical coupling device, wherein a solid material is fixed using an adhesive. 4. An optical element including a substrate, an optical fiber provided for optical coupling to an optical input / output end of the optical element, a case for housing the optical element and the optical fiber,
In the semiconductor optical coupling device, the case is configured by coupling a receptacle, the optical fiber is arranged to extend from the inside of the case to the receptacle, and the outer periphery of the optical fiber is arranged from the inside of the case. Plastic resin, metal powder, ceramic powder or a solid material thereof is ferrule-formed into a cylindrical or square shape continuously over the receptacle, and the optical element and the optical fiber are arranged and fixed so as to optically couple with each other. Semiconductor optical coupling device. 5. An optical element including a substrate, an optical fiber provided for optical coupling to an optical input / output end of the optical element, a case for housing the optical element and the optical fiber,
In the semiconductor optical coupling device, wherein the optical fiber extends to the outside of the case, the outer periphery of the optical fiber is continuously extended from the inside end of the case to the outside of the case, and A semiconductor optical coupling device, wherein a ferrule is formed of resin, metal powder, ceramic powder or a solid material thereof, and the ferrule is fixed to a part of the optical element and / or the case. 6. A semiconductor optical coupling device according to claim 5, wherein said ferrule has a cylindrical shape centered on an optical fiber, and a portion of said optical element to which said ferrule is fixed is provided for positioning a ferrule. A semiconductor optical coupling device, wherein a groove is formed. 7. The semiconductor optical coupling device according to claim 1, wherein a material of the case is any one of ceramic, plastic, and metal. 8. The semiconductor optical coupling device according to claim 7, wherein the material of the case is Al ₂ O ₃ , SiC, AlN, epoxy of transfer mold, silicon, polycarbonate of injection mold, liquid crystal polymer, polyphenylene sulfide, phenol. Alternatively, the semiconductor optical coupling device is any one of a plastic containing a filler, Fe, Fe-29Ni-17Co, and a mild steel material. 9. The semiconductor optical coupling device according to claim 1, wherein the plastic resin solid material at the end of the optical fiber is made of epoxy, UV epoxy, silicone, phenol, acrylic, UV acrylic, or these resins. A semiconductor optical coupling device, which is one of a mixture with a filler. 10. The semiconductor optical coupling device according to claim 1, wherein the metal powder solid material at the end of the optical fiber is made of Cu, Fe, W, or Mo powder or an organic binder. Semiconductor optical coupling characterized in that it is a solid-processed product obtained by mixing a mixture of Al ₂ O ₃ , SiC and AlN, or a solid-processed product of a mixture of these and an organic binder. apparatus. 11. An optical element including a substrate, an optical fiber provided for optically coupling to an optical input / output end of the optical element, and a case for housing the optical element and the optical fiber. In a method of assembling a semiconductor optical coupling device,
A ferrule is formed in a cylindrical or square shape with a plastic resin, a metal powder, a ceramic powder or any of these solid materials in advance on the outer periphery near the end of the optical fiber, and the optical element is mounted on the case. After bonding at a predetermined position, a ferrule of the optical fiber is fixed to a part of the optical element and / or the case so that the optical fiber is optically coupled to the optical element. Assembly method. 12. An optical element comprising a substrate, an optical fiber provided for optically coupling to an optical input / output end of the optical element, and a case for housing the optical element and the optical fiber. In a method of assembling a semiconductor optical coupling device,
A plastic or metal powder, a ceramic powder or a solid material thereof was formed into a cylindrical or square ferrule in advance on the outer periphery near the optical fiber end, and formed on the optical element. A semiconductor optical coupling device, wherein the optical fiber with the ferrule is fixed to the groove so as to optically couple to the optical element, and then the optical element to which the optical fiber is fixed is joined and fixed at a predetermined position on the case. Assembly method. 13. An optical element comprising a substrate, an optical fiber provided for optically coupling to an optical input / output end of the optical element, and a case for housing the optical element and the optical fiber. In the method for assembling a semiconductor optical coupling device in which a receptacle is coupled to the case, a plastic resin is previously provided on an outer periphery of the optical fiber,
Metal powder, ceramic powder or a ferrule molded into a cylindrical or square shape with one of solid materials thereof, and after joining the optical element to a predetermined position on the case, the ferrule is attached to the receptacle. Combine
A method for assembling a semiconductor optical coupling device, wherein the optical fiber is arranged and fixed on the optical element so as to optically couple to the optical element. 14. An optical element comprising a substrate, an optical fiber provided for optically coupling to an optical input / output end of the optical element, and a case for housing the optical element and the optical fiber. In the method for assembling a semiconductor optical coupling device in which a receptacle is coupled to the case, a plastic resin is previously provided on an outer periphery of the optical fiber,
A ferrule is formed into a cylindrical shape or a square shape with one of a metal powder, a ceramic powder or a solid material thereof, and the optical fiber with the ferrule is optically coupled to the optical element in a groove formed in the optical element. Wherein the optical element to which the optical fiber is fixed is bonded and fixed to a predetermined position on the case, and the optical fiber with a ferrule is connected to the receptacle. Method.