JPH1022433A - Iron-chromium alloy lead frame material having excellent anticorrosive property and manufacture thereof - Google Patents
Iron-chromium alloy lead frame material having excellent anticorrosive property and manufacture thereofInfo
- Publication number
- JPH1022433A JPH1022433A JP19519096A JP19519096A JPH1022433A JP H1022433 A JPH1022433 A JP H1022433A JP 19519096 A JP19519096 A JP 19519096A JP 19519096 A JP19519096 A JP 19519096A JP H1022433 A JPH1022433 A JP H1022433A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- lead frame
- frame material
- less
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、耐食性に優れたF
eーCr合金系リードフレーム材およびその製造方法に
関する。[0001] The present invention relates to an anticorrosive F
The present invention relates to an e-Cr alloy-based lead frame material and a method for manufacturing the same.
【0002】[0002]
【従来の技術】従来、リードフレーム材として、主とし
てNi:30〜55%からなるFeーNi系合金のリー
ドフレーム材およびCu合金系のリードフレーム材が用
いられていた。これらのリードフレーム材のうちのFe
ーNi合金系のリードフレーム材は、熱膨張率がSiチ
ップの熱膨張率に近く、めっき性およびはんだ濡れ性が
よく、、強度が高いことなどの優れた点もあるが、熱伝
導性が低いために熱放散性が劣っており、またコストが
高いなどの欠点があった。また、Cu合金系のリードフ
レーム材は、熱伝導性が高いために熱放散性がよく、ま
た加工性などの優れた点もあるが、強度が低いなどの欠
点があった。2. Description of the Related Art Heretofore, as a lead frame material, a lead frame material of an Fe-Ni based alloy mainly composed of 30 to 55% of Ni and a lead frame material of a Cu alloy have been used. Fe of these lead frame materials
-Ni alloy-based lead frame materials have the following advantages: thermal expansion coefficient is close to that of Si chip, good plating and solder wettability, high strength, etc. Low heat dissipation is inferior because of its low cost, and there are drawbacks such as high cost. Further, the Cu alloy-based lead frame material has a good heat dissipation property due to its high thermal conductivity and also has excellent points such as workability, but has disadvantages such as low strength.
【0003】また、FeーNi系合金のリードフレーム
材より耐食性が優れ、コストが低く、またCu合金系の
リードフレーム材より、強度が高いFeーCr系合金の
リードフレーム材、すなわちC:0.03%以下、S
i:0.5%以下、Mn:0.5%以下、P:0.02
%以下、S:0.02%以下、Cr:5〜10%、残部
FeからなるFeーCr合金系のリードフレーム材も知
られている。Further, a lead frame material of Fe—Cr alloy, which is superior in corrosion resistance and lower in cost than a lead frame material of Fe—Ni alloy and has higher strength than a lead frame material of Cu alloy, ie, C: 0 .03% or less, S
i: 0.5% or less, Mn: 0.5% or less, P: 0.02
%, S: 0.02% or less, Cr: 5 to 10%, and a Fe-Cr alloy-based lead frame material composed of the balance Fe is also known.
【0004】しかし、このFeーCr系合金のリードフ
レーム材は、表面にCr酸化物を生成するためにめっき
性が劣っており、また熱伝導性が低いためにCu合金に
比較して熱放散性が劣っているという欠点があった。ま
た、リードフレーム材には、はんだ付け性をよくするた
めにPbはんだをめっきしているが、環境上の問題から
Pbをなくすことが要求されおり、最近ではPdをめっ
きすることが検討されている。しかし、FeーCr合金
系のリードフレーム材にPdをめっきすると、局部電池
の関係から、めっき前のものに比較して耐食性が劣化し
てしまうという欠点が判明した。[0004] However, this Fe-Cr alloy lead frame material is inferior in plating property due to formation of Cr oxide on the surface, and has low heat conductivity, so that heat dissipation is lower than that of Cu alloy. There was a drawback that the properties were inferior. In addition, Pb solder is plated on the lead frame material in order to improve the solderability, but it is required to eliminate Pb due to environmental problems. Recently, plating of Pd has been studied. I have. However, when Pd was plated on the Fe-Cr alloy lead frame material, it was found that the corrosion resistance was deteriorated as compared with that before plating, due to the local battery.
【0005】[0005]
【発明が解決しようとする課題】本発明は、耐食性の優
れたたPdめっきFeーCr合金系リードフレーム材お
よびその製造方法を提供することである。SUMMARY OF THE INVENTION An object of the present invention is to provide a Pd-plated Fe-Cr alloy-based lead frame material having excellent corrosion resistance and a method for producing the same.
【0006】[0006]
【課題を解決するための手段】上記目的を達成するた
め、本発明の耐食性に優れたFeーCr合金系リードフ
レーム材は、FeーCr合金系のリードフレーム材の片
面または両面にCu或いはCu合金を被覆し、更にこの
表面にPdめっき層を設けたものとしたことである。In order to achieve the above-mentioned object, the present invention provides an Fe--Cr alloy lead frame material having excellent corrosion resistance, which comprises Cu or Cu on one or both sides of an Fe--Cr alloy lead frame material. That is, an alloy was coated, and a Pd plating layer was further provided on this surface.
【0007】また、上記目的を達成するため、本発明の
耐食性に優れたFeーCr合金系リードフレーム材は、
FeーCr合金系のリードフレーム材の片面または両面
に被覆したCu或いはCu合金とこの上にめっきしたP
dを加熱して相互に拡散させた拡散層を設けたものとし
たことである。Further, in order to achieve the above object, the Fe—Cr alloy-based lead frame material of the present invention, which has excellent corrosion resistance,
Cu or Cu alloy coated on one or both sides of Fe-Cr alloy lead frame material and P plated on it
This is to provide a diffusion layer in which d is heated and diffused mutually.
【0008】さらに、上記目的を達成するため、本発明
のFeーCr合金系リードフレーム材の製造方法は、F
eーCr合金系のリードフレーム材の表面にCu或いは
Cu合金を被覆し、更にこの表面にPdめっき層を設
け、400〜800℃の不活性ガス中で拡散加熱処理を
行ったことである。Further, in order to achieve the above object, a method for producing an Fe—Cr alloy-based lead frame material according to the present invention comprises:
That is, Cu or a Cu alloy is coated on the surface of an e-Cr alloy-based lead frame material, a Pd plating layer is further provided on the surface, and diffusion heating is performed in an inert gas at 400 to 800 ° C.
【0009】次に、本発明を更に詳細に説明すると、本
発明のFeーCr合金系リードフレーム材のFeーCr
合金は、C:0.03%以下、Si:0.5%以下、M
n:0.5%以下、P:0.02%以下、S:0.02
%以下、Cr:5〜13%、残部Feからなる合金が適
当である。また、本発明のFeーCr合金系の表面に被
覆するCu合金は、Ni:2〜3%、Si:0.4〜
0.6%、残部Cuからなる合金、Zn:0.6〜0.
8%、Si:0.8〜1.0%、残部Cuからなる合金
などである。Next, the present invention will be described in more detail. The Fe—Cr alloy-based lead frame material of the present invention
Alloy: C: 0.03% or less, Si: 0.5% or less, M
n: 0.5% or less, P: 0.02% or less, S: 0.02
% Or less, Cr: 5 to 13%, and the balance of Fe is suitable. Further, the Cu alloy covering the surface of the Fe—Cr alloy system of the present invention has Ni: 2 to 3% and Si: 0.4 to
0.6%, alloy consisting of the balance Cu, Zn: 0.6-0.
8%, Si: 0.8 to 1.0%, and the balance Cu.
【0010】本発明のリードフレーム材のCu或いはC
u合金を被覆する方法は、電解めっきの他に、真空蒸
着、溶射、圧延圧接法などでもよい。また、本発明のリ
ードフレーム材のPdめっきは、電解めっきの他に、化
学めっき、真空蒸着などによって行うことができる。[0010] The lead frame material of the present invention Cu or C
The method for coating the u alloy may be vacuum deposition, thermal spraying, rolling welding, or the like, in addition to electrolytic plating. Further, Pd plating of the lead frame material of the present invention can be performed by chemical plating, vacuum deposition, or the like, in addition to electrolytic plating.
【0011】本発明のリードフレーム材の厚さは、0.
05〜0.25mm、Cuの占める割合は板厚の比で6
0%以下、Pdのめっき厚さ3μm以下が好ましい。C
uの占める割合が板厚の比で60%を超えると強度が低
下するからである。また、本発明の拡散加熱処理の温度
を400〜800℃に限定したのは、400℃より低い
と拡散が十分行われないからであり、また800℃より
高いと結晶粒が粗大化するからである。[0011] The thickness of the lead frame material of the present invention is 0.1 mm.
05 to 0.25 mm, the proportion of Cu is 6
0% or less, and a Pd plating thickness of 3 μm or less are preferable. C
This is because if the ratio of u exceeds 60% in the thickness ratio, the strength decreases. The reason why the temperature of the diffusion heat treatment of the present invention is limited to 400 to 800 ° C. is that if the temperature is lower than 400 ° C., diffusion is not sufficiently performed, and if the temperature is higher than 800 ° C., crystal grains become coarse. is there.
【0012】[0012]
【作用】本発明のリードフレーム材は、FeーCr合金
系のリードフレーム材の片面または両面にCu或いはC
u合金を被覆したので、熱伝導性が高くなり、まためっ
き性がよくなり、さらにPdをめっきしたときの自然電
位の差が緩和され、局部電池の発生が僅かになり、耐食
性が劣化すること殆どない。さらに、本発明のリードフ
レーム材は、FeーCr合金系のリードフレーム材の片
面または両面にCu或いはCu合金を被覆し、更にこの
表面にPdめっき層を設けた後、拡散加熱処理をしてい
るので、相互に拡散層が生じて自然電位の差が更に緩和
され、局部電池の発生がなくなり、耐食性が劣化するこ
とがない。The lead frame material of the present invention is made of a Fe—Cr alloy lead frame material having Cu or C on one or both sides.
Coating with u alloy increases thermal conductivity, improves plating properties, reduces the difference in spontaneous potential when Pd is plated, reduces the occurrence of local batteries, and degrades corrosion resistance. Almost no. Further, the lead frame material of the present invention is obtained by coating one or both surfaces of a Fe-Cr alloy-based lead frame material with Cu or a Cu alloy, further providing a Pd plating layer on this surface, and then performing a diffusion heating treatment. As a result, a diffusion layer is formed mutually, and the difference in the natural potential is further alleviated, and no local battery is generated, so that the corrosion resistance does not deteriorate.
【0013】[0013]
【発明の実施の形態】本発明の実施例を説明するが、こ
れらによって本発明が限定されるものではない。Feー
Cr系合金としてC:0.018%、Si:0.23
%、Mn:0.48%、P:0.002%、S:0.0
08%、Cr:7.1%、残部Feからなる合金を溶解
し、熱間鍛造、熱間圧延、冷間圧延、連続光輝焼鈍を行
い、板厚0.15mmの板にした。その後、この板の両
表面に厚さ0.03mmのCuの板を冷間圧延圧接によ
りクラッドにし、全体の厚さを0.15mmにした。さ
らに、この上に下記電気めっき浴およびめっき条件でP
dを0.3μmめっきした。こうして製造したリードフ
レーム材を表1でPd/Cu/Fe−7Crとして表し
た。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described, but the present invention is not limited by these embodiments. C: 0.018%, Si: 0.23 as Fe-Cr alloy
%, Mn: 0.48%, P: 0.002%, S: 0.0
An alloy comprising 08%, Cr: 7.1% and the balance Fe was melted and subjected to hot forging, hot rolling, cold rolling, and continuous bright annealing to obtain a 0.15 mm thick plate. Thereafter, a Cu plate having a thickness of 0.03 mm was formed on both surfaces of the plate by cold rolling and pressure welding to form a clad, thereby reducing the total thickness to 0.15 mm. Furthermore, P is applied on this with the following electroplating bath and plating conditions.
d was plated by 0.3 μm. The lead frame material manufactured in this manner is shown in Table 1 as Pd / Cu / Fe-7Cr.
【0014】 パラジウム(Pd(NH3)2(NO2)2として) 13g/l スルファミン酸アンモニウム 100g/l pH(アンモンニア水で) 8.0 温度 27℃ 電流密度 0.6A/dm2 陽極 白金被覆陽極 時間 1分Palladium (as Pd (NH 3 ) 2 (NO 2 ) 2 ) 13 g / l Ammonium sulfamate 100 g / l pH (in ammonia water) 8.0 Temperature 27 ° C. Current density 0.6 A / dm 2 Anode Platinum coated Anode time 1 minute
【0015】また、このPd/Cu/Fe−7CrをA
r雰囲気中において600℃で2分間加熱(拡散加熱処
理)したものを表1でhPd/Cu/Fe−7Crとし
て表した。表1のFe−7%Crは、表1のPd/Cu
/Fe−7CrのCuおよびPdをめっきする前のもの
で、本発明の比較材である。また、表1のFe−42%
Niは従来多く使われているリードフレーム材で、本発
明の比較材である。The Pd / Cu / Fe-7Cr is converted to A
Heated at 600 ° C. for 2 minutes (diffusion heat treatment) in an r atmosphere is shown in Table 1 as hPd / Cu / Fe-7Cr. Fe-7% Cr in Table 1 is the same as Pd / Cu in Table 1.
/ Before plating with Cu and Pd of Fe-7Cr, it is a comparative material of the present invention. Further, Fe-42% in Table 1 was used.
Ni is a lead frame material that has been widely used in the past, and is a comparative material of the present invention.
【0016】これらのリードフレーム材の引張強度、伸
び、電気伝導度および錆発生率は、表1のとおりであ
る。この表の電気伝導度は、C(炭素)を100とした
ときの比率である。また、錆発生率は、JIS Z 2371 塩
水噴霧試験方法によって試験した後、発生した錆を画像
処理にて面積を求め、試験材表面中の面積率で表したも
のである。Table 1 shows the tensile strength, elongation, electrical conductivity, and rust generation rate of these lead frame materials. The electric conductivity in this table is a ratio when C (carbon) is set to 100. Further, the rust occurrence rate is obtained by testing the rust in accordance with JIS Z 2371 salt water spray test method, obtaining the area of the rust generated by image processing, and expressing the area ratio on the surface of the test material.
【0017】[0017]
【表1】 [Table 1]
【0018】本発明のPd/Cu/Fe−7Cr材は、
比較材のFe−42%Niと比較すると引張強さおよび
伸びはほぼ同程度であるが、電気伝導度が大幅に高く、
錆発生率もかり低くなっていることが分かる。また、本
発明の拡散加熱処理したhPd/Cu/Fe−7Cr材
は、比較材のFe−42%Niと比較すると引張強さは
やや低くなっているが、電気伝導度が大幅に高く、錆発
生率も大幅に低下し、伸びも大幅に高くなっていること
が分かる。The Pd / Cu / Fe-7Cr material of the present invention comprises:
Although the tensile strength and the elongation are almost the same as compared with the comparative material Fe-42% Ni, the electric conductivity is significantly higher,
It can be seen that the rust generation rate is also low. The hPd / Cu / Fe-7Cr material subjected to the diffusion heating treatment of the present invention has a slightly lower tensile strength than the comparative material Fe-42% Ni, but has a significantly higher electric conductivity and a higher rust resistance. It can be seen that the incidence rate has been greatly reduced and the elongation has been greatly increased.
【0019】上記実施例では、Cuを被覆する方法とし
て、圧延圧接法を用いたが、電解めっきなど他の方法を
採用しても同様な結果が得られる。また、Pdを電気め
っきしたが、真空蒸着など他の方法でめっきすることが
できる。また、上記実施例では、Cuを被覆している
が、Cu合金を被覆してCuを被覆したものと同様にリ
ードフレーム材を製造することができる。In the above embodiment, the rolling pressure welding method was used as the method of coating Cu, but similar results can be obtained by employing other methods such as electrolytic plating. Although Pd is electroplated, it can be plated by another method such as vacuum evaporation. Further, in the above embodiment, Cu is coated. However, a lead frame material can be manufactured in the same manner as a Cu alloy coated with a Cu alloy.
【0020】[0020]
【発明の効果】本発明は、上記構成にしたので、本発明
のリードフレーム材は、熱伝導性が高くなるために熱放
散性がよくなり、まためっき性がよくなる。さらに、本
発明のリードフレーム材は、自然電位の差が緩和され、
局部電池の発生が僅かになり、耐食性が劣化すること殆
どないという優れた効果を奏する。As described above, according to the present invention, the lead frame material of the present invention has a high thermal conductivity and thus has a good heat dissipation and a good plating property. Furthermore, in the lead frame material of the present invention, the difference in the natural potential is reduced,
An excellent effect is obtained in that the generation of local batteries is slight and the corrosion resistance is hardly degraded.
Claims (3)
表面にCu或いはCu合金を被覆し、更にこの表面にP
dめっき層を設けたことを特徴とする耐食性に優れたF
eーCr合金系リードフレーム材。1. A surface of an Fe—Cr alloy-based lead frame material is coated with Cu or a Cu alloy.
F excellent in corrosion resistance characterized by providing a d plating layer
e-Cr alloy lead frame material.
表面に被覆したCu或いはCu合金とこの上にめっきし
たPdを加熱して相互に拡散させた拡散層を設けたこと
を特徴とする耐食性に優れたFeーCr合金系リードフ
レーム材。2. Corrosion resistance characterized in that a Cu or Cu alloy coated on the surface of an Fe—Cr alloy lead frame material and a diffusion layer formed by heating and diffusing Pd plated thereon are provided. Excellent Fe-Cr alloy lead frame material.
表面にCu或いはCu合金を被覆し、更にこの表面にP
dめっき層を設け、400〜800℃の不活性ガス中で
拡散加熱処理を行ったことを特徴と耐食性に優れたFe
ーCr合金系リードフレーム材の製造方法。3. The surface of an Fe—Cr alloy-based lead frame material is coated with Cu or a Cu alloy.
a d-plated layer, and a diffusion heat treatment in an inert gas at 400 to 800 ° C.
-Manufacturing method of Cr alloy lead frame material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19519096A JPH1022433A (en) | 1996-07-08 | 1996-07-08 | Iron-chromium alloy lead frame material having excellent anticorrosive property and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19519096A JPH1022433A (en) | 1996-07-08 | 1996-07-08 | Iron-chromium alloy lead frame material having excellent anticorrosive property and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1022433A true JPH1022433A (en) | 1998-01-23 |
Family
ID=16336957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19519096A Pending JPH1022433A (en) | 1996-07-08 | 1996-07-08 | Iron-chromium alloy lead frame material having excellent anticorrosive property and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1022433A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1030355A1 (en) * | 1998-09-10 | 2000-08-23 | Mitsubishi Denki Kabushiki Kaisha | Press contact semiconductor device |
US7268021B2 (en) * | 2004-04-16 | 2007-09-11 | Samsung Techwin Co., Ltd. | Lead frame and method of manufacturing the same |
-
1996
- 1996-07-08 JP JP19519096A patent/JPH1022433A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1030355A1 (en) * | 1998-09-10 | 2000-08-23 | Mitsubishi Denki Kabushiki Kaisha | Press contact semiconductor device |
EP1030355A4 (en) * | 1998-09-10 | 2006-02-01 | Mitsubishi Electric Corp | Press contact semiconductor device |
US7268021B2 (en) * | 2004-04-16 | 2007-09-11 | Samsung Techwin Co., Ltd. | Lead frame and method of manufacturing the same |
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