JPH1022058A - Heating panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the corrosion of a heating source pipe, and to provide a heating panel with a good temperature distribution, by providing a heating source pipe in which the outer peripheral surface of the other side pipe member is contacted closely to the inner circumferential surface of one side pipe member, opposing to the main surface of a heating plate where a substance to be heated is loaded. SOLUTION: A substance to be heated loaded on the main surface 1a of a heating plate 1 is heated through heating source pipes 3 provided opposing to the main surface 1a. In such a heating panel, the above heating source pipe 3 is composed of the first pipe member 3a, and the second pipe member 3b whose outer peripheral surface is adhered closely to the inner circumferential surface of the first pipe member 3a. Each heating source pipe 3 is preferably jointed to the inner surface of one line of groove provided on one side at the opposite side of the main surface of the heating plate 1. The first pipe member 3a is preferable to form of a material same as the heating plate 1, such as the aluminum, for example. On the other hand, the second pipe member 3b is favorably formed of a stainless steel or the like with the hardness higher than the first pipe member 3a, and has a corrosion-proof property to the pure water flowing through the pipe member, and furthermore, its top 10 is projected to prevent the fluid invasion between both members.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hot plate for heating an object to be heated, and more particularly to a hot plate used in a heat treatment process for manufacturing a semiconductor or a liquid crystal display.

[0002]

2. Description of the Related Art As a prior art of a hot plate, for example, a plate used in a manufacturing process of a liquid crystal display is known. 2. Description of the Related Art In recent years, a liquid crystal display device (LCD: Liquid Crystal Disp.
aY) has attracted attention, but the LCD currently on the market is a simple matrix driven STN (Supe).
r Twisted Transistor), TFT
MIM (MetaL InsuaitoR)
Metal) method. Among these, the TFT system in which a transistor is embedded in each pixel occupies 60% of the entire liquid crystal panel.

[0003] This TFT type display is composed of a very thin film except for the glass substrate, spacers and liquid crystal which are structural materials. In particular, the structure of a TFT portion serving as a switch for opening and closing a pixel is a combination of metal, silicon, and an insulating film often found in a semiconductor integrated circuit. As in the case of semiconductors, these are formed by a manufacturing process by repetition of lithography by forming a thin film, exposing, and etching. At this time, a temperature rise or fall of about 200 ° C. is required, and a hot plate is used for heating and cooling.

An example of how a hot plate is used will be described with reference to a pre-bake process shown in FIG.

An apparatus for manufacturing a liquid crystal display has a size of 5
The exterior structure is made of a rectangular parallelepiped box 171 of about 2 × 2 m ³ . A plurality of partition plates are provided inside the box 171 to provide a plurality of small rooms 172a, 172b, 172c,
172d are provided. Small rooms 172a, 172
b, 172c, 172d, below the hot platen 173a, 1
73b, 173c and 173d are installed one by one.

The windows 174a, 17a are provided on both sides of the box 171.
4b is formed. In one window 174a, a liquid crystal glass substrate 180 being processed is placed in each of the small rooms 172a, 172b, 172c, 172d. As an example, four small rooms 172a, 172b, 172 provided with hot plates 173a, 173b, 173c, 173d temperature-controlled to 110 ° C., 140 ° C., 160 ° C., 110 ° C., respectively.
c, 172d, and is transmitted to the other window 174b. Such a planar in-line heating method is a pre-bake step.

Although a flat in-line type has been described as an example, a single-wafer type liquid crystal glass substrate may be stacked in a plurality of stages or incorporated together as a coating device. Further, it is also incorporated in semiconductor manufacturing apparatuses such as a diffusion apparatus for forming a film and a heat treatment, a CVD apparatus, and a heat treatment apparatus.

As such a conventional hot platen for a liquid crystal display manufacturing apparatus or a semiconductor manufacturing apparatus, a liquid crystal display or a semiconductor is brought into contact with or in close proximity to a surface in contact with a liquid crystal or a semiconductor. Alternatively, there is a flat plate (top plate) on which one surface for drying and heat-treating a semiconductor is flat and no impurity is exposed on one surface, and a heat source for heating the top plate is combined. These hot plates are described in the specification of Japanese Patent Application No. 8-116788 filed earlier by the applicant.

The hot platen shown in FIG. 6 shows a prior art which is configured to be used as a hot platen for a liquid crystal display manufacturing device or a hot platen for a semiconductor manufacturing device.

In this hot plate, a single groove 201 is formed on the back surface of the top plate 200.
1 is configured to flow hot water or cooling water and use it for heating or cooling. A sealing plate 2 is provided on the back surface of the top plate 200 to seal the groove 201 in a watertight manner.
03 is provided. In addition, a packing groove 208 for fitting a sealing packing member (not shown) in the same direction as the groove 201 of the top plate 200 is formed on the back surface of the top plate 200. The top plate 200 and the sealing plate 203 are fitted together with a sealing packing member in a packing groove 208 and are integrally fixed by screws 204. An inflow pipe 206 for flowing the liquid into the groove 201 and an outflow pipe 207 for flowing the liquid from the groove 201 are connected to the sealing plate 203.

[0011]

However, the hot plate having the configuration of the prior art shown in FIG. 5 has a problem that the structure for sealing the groove 201 in a watertight manner becomes complicated.

Further, the hot plate having the configuration of the conventional example has a groove 2
Since industrial pure water is used as cooling water flowing between the first plate 01 and the sealing plate 203 in order to avoid attack of dissolved metals on the metal, the cooling water remains on the inner surface of the groove 201 of the top plate 200. There is a problem that corrosion occurs due to attack of a metal material or elution of metal ions from a metal. In particular, when the top plate 200 is made of a soft metal material such as aluminum, corrosion also occurs due to residual metal powder due to cutting of the groove 201.

Furthermore, the groove 20 of the top plate 200
In the case where the pipe is fixed to the top plate 200 instead of 1, the top plate 200 and the pipe 200
If aluminum is used as the material, the same corrosion may be caused by the top plate 200 and the industrial pure water flowing through the pipe 200, and there is a danger of water leakage due to long-term use.

Therefore, an object of the present invention is to use a pipe fixed to a top plate and prevent corrosion of the pipe so that the temperature distribution can be improved over a long period of time, and a liquid crystal or semiconductor can be mounted on the top plate. An object of the present invention is to provide a hot plate in which the temperature distortion of the main surface of the hot plate when placed is improved.

[0015]

According to the present invention, there is provided a hot plate having a main surface on which an object to be heated is placed and heated, and a heat source pipe provided on the hot plate 1 so as to face the main surface. In the hot platen, the heat source pipe has a first pipe member and a second pipe member whose outer peripheral surface is in close contact with the inner peripheral surface of the first pipe member. A hot plate is obtained.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a hot plate according to the present invention will be described below with reference to FIGS. 1 and 2
, A hot plate (hereinafter, referred to as a face plate) 1 having a main surface 1a on which an object to be heated such as a liquid crystal glass substrate is placed and which heats the object to be heated, and a hot plate facing the main surface 1a And a heat source pipe 3 provided on the face plate 1 to perform the heat treatment.

The face plate 1 is provided with a groove 5 for mounting the heat source pipe 3 on one surface 1b opposite to the main surface 1a. The outer peripheral surface of the heat source pipe 3 is joined to the inner wall of the groove 5. A part of the outer peripheral surface of the heat source pipe 3 is exposed on the opening side of the groove 5. Groove 5
The heat source pipe 3 can be attached to the groove 5 by a known means such as press-fitting the heat source pipe 3 into the groove 5 with a press machine or the like and caulking the opening edge of the groove 5.

In the hot plate of this embodiment, about 240 to
A groove 5 is provided in a loop on one surface 1b of the face plate 1 having a disk shape of 340 mm, and a heat source pipe 3 is inserted into the groove 5 to fix an edge portion of the groove 5 by caulking (or a screw or the like). . At this time, both ends of the heat source pipe 3 are bent on one surface 1b opposite to the main surface 1a,
The heat source pipe 3 is formed in a substantially upright state, and one end of the heat source pipe 3 serves as a liquid inflow portion for heating or cooling, and the other end serves as a liquid outflow portion.

The heat source pipe 3 includes a first pipe member 3a
And a second pipe member 3b provided inside the first pipe member 3a. On the inner peripheral surface of the first pipe member 3a, the second pipe member 3b including the first pipe member 3a is pushed into the pushing groove 5 without tightly processing the second pipe member 3b, and the whole is swaged. Thus, the outer peripheral surface of the second pipe member 3b is in close contact with the first pipe member 3a.

The second pipe member 3b is connected to the second pipe member 3b.
Is made of a material having corrosion resistance to a fluid such as industrial pure water flowing through the pipe member 3b and having a higher hardness than the first pipe member 3a. The face plate 1 and the first pipe member 3a are made of the same metal material so that the surface treatment of the face plate 1 can be freely set. Second pipe member 3
b is made of a metal material different from that of the face plate 1 and the first pipe member 3a.

The first pipe member 3a is made of, for example, an aluminum material, and the second pipe member 3b is made of a material such as stainless steel.
By forming b with high hardness, for example, it has corrosion resistance and high hardness with respect to pure water flowing through the second pipe member 3b. Also, the second pipe member 3b
Is protruded from the end of the first pipe member 3a, and is made of a material having high hardness so as to obtain sufficient mechanical strength when connected to the inlet pipe or the outlet pipe.

Further, the end 10 of the heat source pipe 3 is
Is formed in a stepped shape by projecting the first pipe member 3b from the first pipe member 3a, and the first and second pipe members 3b are connected to the above-described introduction pipe or lead-out pipe by connecting the end of the second pipe member 3b. 2 pipe members 3a, 3b
Can be prevented from occurring due to the permeation of the fluid into the gaps.

When a fluid different from pure water is used as the heat source, the material of the second pipe member 3b is selected according to the type of fluid flowing through the second pipe member 3b.
The first pipe member 3a and the face plate 1 may be combined. In this case, the first pipe member 3a and the face plate 1 may be made of the same material. Further, a heating source such as a sheathed heater can be provided by filling a heating wire into the second pipe member 3b via an inorganic electric insulator.

Further, the hot plate can be used by mounting a heating element on a metallic face plate 1 having a main surface 1a on which the object to be heated is placed and heated. That is, the face plate 1 may be provided so that a thickness of an aluminum material is about 10 mm and a sheathed heater as a heating element is attached to one surface 1b.

Note that the first pipe member 3a and the second pipe member 3b can be prevented from being deformed by bending by making the plate thicknesses different from each other. The second pipe member 3b may be made of a resin material having excellent corrosion resistance, which is limited to a metal material.

[0026]

As described above, according to the hot plate of the present invention, the double tubular heat source pipe is joined to the hot plate with the first and second pipe materials, and the second plate having excellent corrosion resistance is formed. Since the pipe material is used, the corrosion resistance due to the fluid is improved, so that not only can it withstand long-time use, but also the thermal resistance with the fluid can be reduced.

Further, since the second pipe member is made higher in hardness than the first pipe member, the temperature distortion of the main surface can be improved, and the external inlet pipe or outlet pipe can be connected to the second pipe member.
The connection with the pipe member can be completed with a simple structure.

Further, a second pipe member is provided on the inner peripheral surface of the first pipe member.
And the first pipe member is joined to the groove to form one surface, so that the second pipe member is located on the inner peripheral surface of the first pipe member even if the one surface is cut. Therefore, an effect of increasing parallel flatness can be obtained, and one surface can be flattened, and a surface that can be directly machined can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of a hot plate of the present invention.

FIG. 2 is a plan view showing a state in which the hot platen shown in FIG. 1 is viewed from the back surface side.

FIG. 3 is a sectional view showing a part of the hot platen shown in FIG. 1 in an enlarged manner.

FIG. 4 is a schematic view illustrating a conventional prevader process.

FIG. 5 is a cross-sectional view showing a conventional hot plate in a disassembled state.

[Explanation of symbols]

 1,200 Heat plate (face plate) 1a Main surface 3 Heat source pipe 3a First pipe member 3b Second pipe member 5,201 Groove 203 Sealing plate 204 Screw

Claims (8)

[Claims] 1. A heating plate including a heating plate having a main surface on which an object to be heated is placed and heated, and a heat source pipe provided on the heating plate 1 so as to face the main surface, wherein the heat source pipe is 1
And a second pipe member having an outer peripheral surface in close contact with an inner peripheral surface of the first pipe member. 2. The hot plate according to claim 1, wherein the hot plate has a groove for mounting the heat source pipe on one surface opposite to the main surface, and the first pipe member is provided with the first pipe member. A hot plate characterized by being joined to the inner surface of the groove. 3. The hot platen according to claim 1, wherein
A hot plate, wherein the second pipe member has higher hardness than the pipe member of (1). 4. The hot plate according to claim 1, wherein the second
Wherein the pipe member is made of a material having corrosion resistance to a fluid flowing through the second pipe member. 5. The hot plate according to claim 1, wherein said hot plate and said first pipe member are made of the same material. 6. The hot plate according to claim 1, wherein said hot plate and said first pipe member are made of the same material, and said second pipe member is made of said hot plate and said first pipe member. A hot plate made of a material different from that of the first pipe member. 7. The hot platen according to claim 1, wherein
Wherein the pipe member is made of aluminum and the second pipe member is made of stainless steel. 8. The hot platen according to claim 1, wherein
The tip of the pipe member protrudes from the tip of the first pipe member.