JPH10218276A - Tray for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a tray for a semiconductor device which can support a ball-grid type semiconductor device without contact with ball type electrodes. SOLUTION: This tray is provided with a plurality of containing pockets 9 formed by the wall 10 and the bottom face 11 surrounded by the wall 10. Semiconductor devices 30 having a plurality of ball type electrodes 3 arranged in rows to form a lattice at the lower face 2a are contained respectively while they are positioned along the wall 10, in the tray for semiconductor devices. Support members 12 are protruded higher than the height of the ball type electrodes 3 at the position avoiding the electrodes on the bottom face 11 to support the semiconductor device 30 at the tops.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ball grid array (hereinafter referred to as BGA) having a ball-shaped electrode for wiring on the bottom surface.
The present invention relates to a tray for accommodating semiconductor devices of the abbreviated form, and more particularly to a structure of a portion of a storage pocket for supporting a semiconductor device.

[0002]

2. Description of the Related Art FIG. 8 is a partially sectional perspective view showing the structure of a BGA type semiconductor device of this type, FIG. 9 is a perspective view showing the structure of a conventional semiconductor device tray for accommodating a BGA type semiconductor device, and FIG. FIG. 11 is an enlarged sectional perspective view showing the configuration of the storage pocket in FIG. 9, and FIG.
It is a fragmentary sectional view showing the state where the GA type semiconductor device was stored. In the figure, reference numeral 1 denotes a sealing body 2 and a lower surface 2 of the sealing body 2.
A BGA type semiconductor device (hereinafter abbreviated as a semiconductor device) composed of a plurality of ball-shaped electrodes 3 arranged in a lattice and having gaps of x and y respectively in a is formed on the upper surface of a semiconductor device tray. A plurality of storage pockets, a wall portion 5, a bottom surface 6 surrounded by the wall portion 5, and a step portion 7 having a step W higher than the height Z of the ball-shaped electrode 3 around the bottom surface 6. .

Next, the operation will be described. Semiconductor device 1
Are inserted along the wall 5 of the storage pocket 4, respectively.
The semiconductor device 1 is stored in the storage pocket 4 by supporting the periphery of the lower surface 2 a of the sealing body 2 with the step 7 of the storage pocket 4. Then, in this state, the tip of the ball electrode 3 is held without contacting the bottom surface 6, and problems such as adhesion of foreign substances are prevented. Further, the wall portion 5 functions as a guide when the semiconductor device 1 is inserted, and also serves to restrict the movement of the semiconductor device 1 during the transfer of the tray and prevent problems such as damage.

[0004]

The conventional semiconductor device tray is constructed as described above, and the sealing body 2 of the semiconductor device 1 is formed.
CSP (Chip Size Pac) pursuing miniaturization in recent years because the periphery of the lower surface 2a of the
12, the gaps x and y between the ball-shaped electrodes 3 are reduced with the miniaturization of the sealing body 2 due to the formation of the sealing body 2, and the periphery of the lower surface 2a of the supported sealing body 2 is also narrowed, as shown in FIG.
In the SP-formed semiconductor device 30, since the ball-shaped electrode near the periphery of the lower surface 2a comes into contact with the stepped portion 7, the semiconductor device 30 cannot stably support the sealing body 2.
However, there is a problem that a problem occurs in the storage of the document.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a semiconductor device tray capable of stably storing a CSP-formed semiconductor device in a storage pocket without contacting a ball-shaped electrode. The purpose is to obtain.

[0006]

According to a first aspect of the present invention, there is provided a semiconductor device tray including a plurality of storage pockets formed by a wall and a bottom surface surrounded by the wall. In a semiconductor device tray in which a semiconductor device having a plurality of ball-shaped electrodes arranged in a lattice pattern on the lower surface is regulated at a wall portion and accommodated therein, the height of the ball-shaped electrodes is set at a position avoiding the ball-shaped electrodes on the bottom surface. A supporting member that protrudes higher than the upper end and supports the semiconductor device at the top is provided.

According to a second aspect of the present invention, there is provided a semiconductor device tray according to the first aspect, wherein the supporting member is constituted by a projection formed at least in a triangular shape and formed in a cone or pyramid shape.

According to a third aspect of the present invention, there is provided a semiconductor device tray according to the first aspect, wherein the supporting member is formed at least in a triangular shape, and the projection is formed in a column shape having a recess at the top to avoid a ball-shaped electrode. It consists of.

According to a fourth aspect of the present invention, there is provided a semiconductor device tray according to the first aspect, wherein the supporting member is formed of ribs which are formed in a knife-edge shape at the top and cross each other.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration of a semiconductor device tray according to a first embodiment of the present invention, and FIG. 2 is an enlarged sectional perspective view showing a configuration of a storage pocket of the semiconductor device tray in FIG. In the drawing, reference numeral 9 denotes a plurality of storage pockets formed on the upper surface of the semiconductor device tray, and four storage pockets at positions avoiding the wall portion 10, the bottom surface 11 surrounded by the wall portion 10, and the ball-shaped electrode 3 on the bottom surface 11. The projection 12 is formed as a support member which is disposed and has a height S larger than the height Z of the ball-shaped electrode 3 and is formed to protrude conically at a height S.

Next, the operation will be described. Each of the CSP-formed semiconductor devices 30 is attached to the wall 10 of the storage pocket 9.
When the ball-shaped electrode 3 is inserted along the top of the ball-shaped electrode 3, the tops of the four protrusions 12 arranged at positions avoiding the ball-shaped electrode 3
The lower surface 2a of the sealing body 2 with a gap between
And the BGA type semiconductor device 30 is supported at the top, so that the semiconductor device 30 converted into a CSP can be stably supported and stored in the storage pocket 9 of the tray. In FIG. 2, four protruding portions 12 are arranged. However, if at least three protruding portions 12 are arranged in a triangular shape and supported at three points, it goes without saying that stable support can be obtained. In addition, the projection 12 has a conical shape, but is not limited thereto, and may have a pyramid shape, for example.

Embodiment 2 FIG. FIG. 3 is a sectional perspective view showing a configuration of a storage pocket of a semiconductor device tray according to a second embodiment of the present invention, and FIG. 4 is a sectional view taken along line IV-IV in FIG. In the figure, reference numeral 13 denotes a plurality of storage pockets formed on the upper surface of the tray,
Bottom surface 15 surrounded by a ball-shaped electrode 3 on the bottom surface 15
And four projections 16 as support members that have a recess 16a at the center of the top to avoid the ball-shaped electrode 3 and protrude in a column shape higher than the height of the ball-shaped electrode 3.

Next, the operation will be described. The CSP-formed semiconductor device 30 is mounted on the wall 1 of the storage pocket 13.
4, the four protrusions 16 arranged at positions avoiding the ball-shaped electrode 3 in the recess 16a at the center of the top.
Abuts on the lower surface 2a of the sealing body 2 with the gap G between the ball-shaped electrode 3 and the bottom surface of the concave portion 16a and supports the semiconductor device 30 at the top. The semiconductor device 30 can be stably supported and housed. Although four protrusions 16 are arranged in FIG. 3, it is needless to say that stable support can be obtained if at least three protrusions are arranged in a triangular shape and supported at three points.

Embodiment 3 FIG. 5 is a cross-sectional perspective view showing a configuration of a storage pocket of a semiconductor device tray according to Embodiment 3 of the present invention, and FIG. 6 is a cross-sectional view taken along line VI-VI of FIG. As is apparent from the figure, in the second embodiment, the protrusion 16 has a recess 16a at the center of the top to avoid the ball-shaped electrode 3. However, in the third embodiment, the recess 17a to avoid the ball-shaped electrode 3 is provided. The projections 17 formed at four locations around the top are formed so as to avoid the ball electrode 3 by four recesses 17a, so that the same effect as in the second embodiment can be obtained. Although four protrusions 17 are arranged in FIG. 5, it is needless to say that stable support can be obtained by arranging at least three in a triangular shape and supporting them at three points.

Embodiment 4 FIG. 7 is a sectional perspective view showing a configuration of a storage pocket of a semiconductor device tray according to Embodiment 4 of the present invention. In the drawing, reference numeral 18 denotes a plurality of storage pockets formed on the upper surface of the tray, and a wall portion 19, a bottom surface 20 surrounded by the wall portion 19, and a height of the ball-shaped electrode 3 at a position avoiding the ball-shaped electrode 3 on the bottom surface 20. The height is greater than the height Z and the top is formed in a knife-edge shape, and is formed of a rib 21 as a supporting member that protrudes and crosses each other.

Next, the operation will be described. The CSP-formed semiconductor device 30 is mounted on the wall 1 of the storage pocket 18.
9, the top of the rib 21 disposed at a position avoiding the ball-shaped electrode 3 becomes the ball-shaped electrode 3 and the bottom surface 2.
Since the semiconductor device 30 is supported at the top while being in contact with the lower surface 2a of the sealing body 2 with a gap between 0, the CSP-formed semiconductor device 30 can be stably supported and stored in the storage pocket 18 of the tray. .

[0017]

As described above, according to the first aspect of the present invention, there are provided a plurality of storage pockets formed by a wall portion and a bottom surface surrounded by the wall portion. In a semiconductor device tray that stores a semiconductor device having a plurality of ball-shaped electrodes arranged in a row and regulates the position thereof by a wall portion, the semiconductor device is protruded to a position avoiding the ball-shaped electrode on the bottom surface and higher than the height of the ball-shaped electrode. Since a support member for supporting the semiconductor device is provided at the top, a semiconductor device tray capable of stably supporting the CSP-formed semiconductor device without contacting the ball-shaped electrode can be obtained.

According to a second aspect of the present invention, in the first aspect, the supporting member is constituted by at least a triangularly arranged conical or pyramid-shaped projection.
A semiconductor device tray capable of stably supporting a CSP-formed semiconductor device without contacting a ball-shaped electrode can be obtained.

According to a third aspect of the present invention, in the first aspect, the supporting member is formed of a columnar projection having at least a triangular shape and a concave portion at the top to avoid a ball-shaped electrode. And a semiconductor device tray capable of stably supporting the CSP-formed semiconductor device without contacting the ball-shaped electrode.

According to a fourth aspect of the present invention, in the first aspect, the support member is formed by ribs having a top formed in a knife-edge shape and intersecting with each other. A tray for a semiconductor device that can be stably supported without contact can be obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of a semiconductor device tray according to Embodiment 1 of the present invention;

FIG. 2 is an enlarged sectional perspective view showing a configuration of a storage pocket of a semiconductor device tray in FIG. 1;

FIG. 3 is a sectional perspective view showing a configuration of a storage pocket of a tray for a semiconductor device according to a second embodiment of the present invention.

FIG. 4 is a sectional view taken along line IV-IV in FIG. 3;

FIG. 5 is a sectional perspective view showing a configuration of a storage pocket of a semiconductor device tray according to a third embodiment of the present invention.

FIG. 6 is a sectional view taken along line VI-VI in FIG. 5;

FIG. 7 is a sectional perspective view showing a configuration of a storage pocket of a semiconductor device tray according to a fourth embodiment of the present invention.

FIG. 8 is a partial cross-sectional perspective view showing a configuration of a general BGA type semiconductor device.

FIG. 9 is a perspective view showing a configuration of a conventional semiconductor device tray.

FIG. 10 is an enlarged sectional perspective view showing a configuration of a storage pocket in FIG. 9;

11 is a partial cross-sectional view showing a state where the semiconductor device is stored in the storage pocket of FIG.

FIG. 12 is a partial cross-sectional view for describing a problem in a conventional configuration.

[Explanation of symbols]

2 sealing body, 2a bottom surface, 3 ball-shaped electrode, 9.1
3,18 storage pockets, 10,14,19 wall, 1
1, 15, 20 Bottom surface, 12, 16, 17 Projection portion (support member), 16a, 17a recess portion, 21 rib (support member), 30 semiconductor device.

Claims (4)

[Claims] 1. A semiconductor device comprising a plurality of storage pockets formed by a wall and a bottom surface surrounded by the wall, and a plurality of ball-shaped electrodes arranged in a lattice pattern on a lower surface in the storage pocket. In the semiconductor device tray, the position of the ball-shaped electrode is regulated and stored by the wall portion, and the height of the ball-shaped electrode is protruded at a position on the bottom surface avoiding the ball-shaped electrode, and the top supports the semiconductor device. A tray for a semiconductor device, comprising a support member. 2. The semiconductor device tray according to claim 1, wherein the support member is at least arranged in a triangular shape and is formed of a projection formed in a conical or pyramid shape. 3. The supporting member according to claim 1, wherein the supporting member is formed of a column-shaped protrusion having a concave portion at least at a top thereof and avoiding a ball-shaped electrode.
4. The semiconductor device tray according to item 1. 4. The semiconductor device tray according to claim 1, wherein the support member is formed by ribs having a top formed in a knife-edge shape and intersecting with each other.