JPH1021507A - Production of induction type thin-film magnetic head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a process for producing an induction type thin-film magnetic head which consists of a magnetic multilayered film of magnetic film and interlayer insulating film and is adequate for a high-recording density magnetic disk device with an exact track width. SOLUTION: The first upper magnetic film 14, the interlayer insulating film 15 and a plating substrate film 16 are deposited to form a frame 17 for regulating the shape of an upper magnetic core. A mask 19 is formed by plating the second upper magnetic film 18 and the second upper magnetic film 18 outside the mask 19 is removed to form a second upper magnetic core 18a. Next, the mask 19 and the frame 17 are removed and the plating substrate film 16, interlayer insulating film 15 and first upper magnetic film 14 not coated with the second upper magnetic core 18a are removed to form the upper magnetic core 14a. As a result, the exact regulation of the track width by the spacing of the frame 17 is made possible. The upper magnetic core is the multilayered magnetic films laminated with the first upper magnetic core 14a, the interlayer insulating film 15 and the second upper magnetic core 18a and, therefore, a magnetic domain structure is formed of a single magnetic domain and high-frequency characteristics are improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inductive thin film magnetic head for recording and reproducing or an inductive thin film magnetic head for recording such as a magnetic disk drive, and more particularly to a magnetic film and an interlayer insulating film at least on an upper magnetic core. The present invention relates to a method of manufacturing an inductive thin film magnetic head using a magnetic multilayer film in which are alternately stacked.

[0002]

2. Description of the Related Art As a method of forming a magnetic core of an inductive type thin film magnetic head, a magnetic film is deposited on a substrate by sputtering or the like, and then the magnetic film is formed by ion milling or the like using a suitable mask. Method of Forming into Core Shape There is a method of forming a frame patterned on a substrate into a desired magnetic core shape and then plating a magnetic film.

[0003] In the sputtering method, the composition of the magnetic film is easily controlled, the composition variation in the substrate surface is small, and the control of the magnetic domain structure of the magnetic core is easy. On the other hand, the plating method is currently mainstream because the shape of the magnetic core can be accurately defined by the shape of the frame, and the manufacturing cost is lower than that of the sputtering method.

As a means for increasing the recording density of a magnetic disk drive, there is a method of increasing the track density of a recording signal.
One method for increasing the track density is to reduce the track width of the recording head.

The track width of an inductive thin film magnetic head is currently about 5 μm. As the inductive thin film magnetic head becomes narrower in track width, magnetic flux concentrates in the magnetic gap, so that magnetic saturation tends to occur. In order to avoid this magnetic saturation, the thickness of the magnetic core has been increased to 3 μm or more.

As described above, since the track width and the film thickness are almost the same, the magnetic film is deposited on the substrate and then the magnetic film is formed into the shape of the magnetic core, as in the above method. With the processing method, it is difficult to specify an accurate track width.

On the other hand, according to the method, the composition varies in the magnetic core due to current concentration near the frame during plating, and the domain structure at the magnetic core peripheral edge cannot be sufficiently controlled due to the demagnetizing field and stress at the magnetic core peripheral edge.

As described in JP-A-7-0444817,
The track width of the inductive thin film magnetic head is determined by the shape of the upper magnetic core near the magnetic gap. A method of manufacturing a thin-film magnetic head having the shape of the magnetic core is described in, for example, Japanese Patent Application Laid-Open No. 5-342527. This manufacturing method is based on the premise that the magnetic film is deposited by sputtering, and thus has a problem that the manufacturing cost is relatively high as described above.

As another means for increasing the recording density of a magnetic disk drive, there is a method of increasing the linear recording density of a recording signal, that is, increasing the recording frequency. To increase the recording frequency, the inductive thin film magnetic head must be operated at a higher frequency. However, when the magnetic core has a multi-domain structure, the motion of the domain wall cannot follow the excitation signal in the high frequency range.

Therefore, a magnetic core is formed of a magnetic multilayer film in which magnetic films and interlayer insulating films are alternately laminated to form a single magnetic domain structure, and the magnetic flux in the magnetic core is propagated only by the rotation of the magnetization. It has been proposed to improve. When the magnetic core is formed into a magnetic multilayer film, an insulating film such as alumina is used as an interlayer insulating film in order to reduce eddy current loss in the magnetic core, but the insulating film such as alumina cannot be plated. Therefore, it has been difficult to form a magnetic core of a magnetic multilayer film by frame formation and plating.

[0011]

In the above prior art, the magnetic core of the inductive type thin film magnetic head has become thicker in response to the track width becoming narrower, so that the magnetic film is deposited on the substrate. In the method of processing the magnetic core into a shape after the formation, there is a problem that it is difficult to define an accurate track width.

In the frame plating method, the magnetic domain structure at the peripheral portion of the magnetic core cannot be sufficiently controlled, and it is difficult to use a magnetic multilayer film for the magnetic core in order to improve high-frequency characteristics.

An object of the present invention is to provide a method of manufacturing an inductive thin film magnetic head in which a magnetic multilayer film can be used as a magnetic core in order to improve high-frequency characteristics, and track width processing accuracy is sufficiently high.

[0014]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a step of forming a lower magnetic core having a predetermined shape on a substrate, and a step of forming a non-magnetic gap film on the lower magnetic core. Forming a winding of a conductive film and an insulating film covering the winding and having a back gap hole; and forming a back magnetic hole on the insulating film and the non-magnetic gap film that is magnetically connected to the lower magnetic core. (1) forming an upper magnetic film; forming an interlayer insulating film on the first upper magnetic film;
Forming a plating base metal film on the interlayer insulating film, forming a frame patterned in the shape of the upper magnetic core on the plating base metal film, and forming a second upper magnetic film by plating; Forming a first mask on the second upper magnetic film, etching the first mask and the second upper magnetic film into a predetermined pattern to form a second upper magnetic core having a predetermined shape, And a step of removing the frame, and a step of forming the interlayer insulating film and the first upper magnetic film into predetermined shapes using the second upper magnetic core as a mask.

In order to achieve the above object, the present invention also provides a step of forming a lower magnetic core having a predetermined shape on a substrate, a step of forming a non-magnetic gap film on the lower magnetic core, Forming a winding and an insulating film covering the winding and having a back gap hole; and a first upper magnetic film magnetically connected to the lower magnetic core through the back gap hole on the insulating film and the non-magnetic gap film. Forming a first and a first
Forming an interlayer insulating film on the upper magnetic film, forming a plating base metal film on the interlayer insulating film, and forming a frame patterned in the shape of the upper magnetic core on the plating base metal film; Forming a second upper magnetic film by plating, forming a first mask on the second upper magnetic film, etching the first mask and the second upper magnetic film into a predetermined pattern, Forming a second upper magnetic core, removing the first mask and the frame, forming a second mask having a predetermined shape on the second upper magnetic core, and forming an interlayer insulating film in the second mask shape And a method of forming the first upper magnetic film.

In order to achieve the above object, the present invention further provides a step of forming a lower magnetic core having a predetermined shape on a substrate, a step of forming a non-magnetic gap film on the lower magnetic core, Forming a winding and an insulating film covering the winding and having a back gap hole; and a first upper magnetic film magnetically connected to the lower magnetic core through the back gap hole on the insulating film and the non-magnetic gap film. Forming a first and a first
Forming an interlayer insulating film on the upper magnetic film, forming a plating base metal film on the interlayer insulating film, and forming a frame patterned in the shape of the upper magnetic core on the plating base metal film; Forming a second upper magnetic film by plating, forming a third mask having a lower etching rate than the first upper magnetic film on the second upper magnetic film, and forming the first mask on the third mask. Forming and third
Etching the mask and the second upper magnetic film into a predetermined pattern to form a second upper magnetic core having a predetermined shape; removing the first mask and the frame;
Forming an interlayer insulating film and a first upper magnetic film in a mask shape.

The base metal film for plating is composed of Cr and a magnetic film.
A layer film can be used, and a magnetic multilayer film in which a magnetic metal film and an interlayer insulating film are alternately laminated can be used as the first upper magnetic film, and W, Mo, Cr can be used as the third mask. It is preferable to use any of the above.

In the present invention, after forming a lower magnetic core on a substrate, a non-magnetic gap film for a magnetic gap is deposited, and thereafter, a winding and a hole for a back gap covering the winding are provided. An insulating film is formed.

Next, a first upper magnetic film thinner by several μm than a predetermined thickness is formed. For example, if the thickness of the upper magnetic film is 3 μm
If necessary, the thickness of the first upper magnetic film is about 1 to 2 μm. If the thickness of the upper magnetic film is 5 μm, the thickness of the first upper magnetic film is about 1 to 4 μm. The first upper magnetic film can be formed by a plating method or a sputtering method. When a dry process is used like sputtering, it is easy to make the first upper magnetic film a magnetic multilayer film in which a magnetic film and an interlayer insulating film are alternately deposited.

Subsequently, a plating base film for plating the interlayer insulating film and the second upper magnetic film is deposited on the first upper magnetic film, and a frame patterned in the shape of the upper magnetic core is formed. After forming the frame, a second upper magnetic film is deposited. The thickness of the second upper magnetic film varies depending on the manufacturing method. When the second upper magnetic film is used as a mask, the first
When the upper magnetic film is etched to form the upper magnetic core, the second upper magnetic film is also shaved. Therefore, the thickness of the second upper magnetic film must be increased in consideration of the amount. When a protective mask is formed on the second upper magnetic film so that the thickness of the second upper magnetic film does not decrease when the first upper magnetic film is etched, the first upper magnetic film and the second upper magnetic film are formed. The total thickness of the film and the film is set to a predetermined film thickness of the upper magnetic film.

After depositing the second upper magnetic film, a mask is formed on the second upper magnetic film, and the mask is etched into the shape of the upper magnetic core. Then, the second upper magnetic film outside the frame is removed. Thereafter, the mask and the frame are removed.

When the second upper magnetic film is used as a mask, the interlayer insulating film and the first upper magnetic film in a region not covered with the second upper magnetic film are removed by ion milling or the like to obtain a desired upper shape. A magnetic core can be formed. When a mask is formed on the second upper magnetic film, after forming the mask, the interlayer insulating film and the first upper magnetic film in a region not covered by the mask are removed by ion milling or the like to obtain an upper magnetic film having a desired shape. A core can be formed.

The output at the track end in the track width direction causes noise. In order to reduce the output in the track width direction, for example, US Pat.
Referring to the method described in No. 7, a mask may be formed such that the tip of the magnetic core is exposed, and a part of the upper surface of the tip of the lower magnetic core may be removed according to the shape of the tip of the upper magnetic core. .

When a magnetic core is manufactured in such a process,
Since the second upper magnetic film can be formed by the frame plating method, the processing accuracy of the track width is improved. In addition, since the upper magnetic core can be easily formed as a multilayer film, an inductive thin film magnetic head having good recording characteristics in a high frequency region can be obtained.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a method of manufacturing an inductive thin film magnetic head according to the present invention will be described with reference to FIGS.

Embodiment 1 FIG. 1 is a sectional view of the tip of a magnetic core showing a first half of a manufacturing process in Embodiment 1 of a method of manufacturing an inductive thin film magnetic head according to the present invention, and FIG.
FIG. 6 is a diagram illustrating the latter half of the manufacturing process according to the first embodiment.

In the first embodiment, first, a lower magnetic core 12 and a magnetic gap 13 are formed on a substrate 11. Subsequently, although not appearing in FIG. 1, a conductor film winding and an insulating film covering the winding and having a back gap hole are formed.
Next, a first upper magnetic film 14, an interlayer insulating film 15, and a plating base film 16 are sequentially deposited.

When the first upper magnetic film 14 is deposited by a dry process such as sputtering, it is easy to form a magnetic multilayer film in which the magnetic metal films 14 and the interlayer insulating films 15 are alternately laminated. The plating base film 16 is made of two of Cr and a magnetic film.
It is desirable to form a layer film. In the first embodiment, the Ni—Fe thin film is used as the material of the second upper magnetic film 18.
In an ammonium persulfate-based etchant used for wet etching of an i-Fe-based thin film, Cr is hardly etched. Therefore, if Cr is used as the lower layer of the plating base film 16, the second upper magnetic film 18 outside the region surrounded by the frame 17 to be described later is removed by etching and processed into the upper magnetic core shape. It is possible to prevent over-etching to a portion below the ground film 16. Further, when a magnetic film is used as the upper layer of the plating base film 16, the control of the magnetic anisotropy of the second upper magnetic film 18 becomes easy.

As shown in FIG. 1A, a frame 17 having an upper magnetic core shape is formed by using a material such as a photoresist. As shown in FIG. 1b, a second upper magnetic film 18 is deposited by plating. As shown in FIG. 1c, a thin film of a material such as a photoresist is deposited and patterned into an upper magnetic core shape to form a first mask 19.

Subsequently, as shown in FIG. 2D, the second upper magnetic film in a region not covered by the first mask 19 and the frame 17 is removed by etching or the like to form a second upper magnetic core 18a. I do. As shown in FIG. 2e, the frame 17 and the first mask 19 are removed. Finally, the second
When the plating base film 16, the interlayer insulating film 15, and the first upper magnetic film 14 in the region not covered by the upper magnetic core 18a are removed by ion milling or the like, as shown in FIG. An inductive thin film magnetic head having a desired upper magnetic core shape, which is composed of a magnetic multilayer film in which interlayer insulating films are alternately stacked, is obtained.

It is to be noted that the plating base film is composed of two layers of Cr and a magnetic film.
When the second upper magnetic film is patterned into an upper magnetic core shape by wet etching as a layer film, the etchant dissolves the magnetic film of the plating base film under the frame 17 and soaks into the frame, thereby forming the second upper magnetic film. In some cases, the magnetic core cannot be formed into a predetermined magnetic core shape.

As a method for avoiding this phenomenon, after plating the second upper magnetic film 18, the frame 17 is removed, and after removing the magnetic film of the plating base film by a method such as ion milling, a material such as a photoresist is removed. Is deposited and patterned in the shape of an upper magnetic core to form a first mask 19, and the second upper magnetic film 18 in a region not covered by the first mask 19 is removed by wet etching to form a second upper magnetic film. The core 18a may be formed.

FIG. 3 is a view showing a modification of the first embodiment in which the upper portions of the non-magnetic gap film and the lower magnetic core are removed by ion milling or the like. As described in U.S. Pat. No. 5,438,747, in order to reduce noise at the track end, a non-magnetic gap film and a lower magnetic core in a desired area at the tip of the magnetic head are exposed using a mask in which the area is exposed. 12 may be removed by ion milling or the like.

FIG. 4 is a view showing an example of the observation result of the magnetic domain structure in the upper magnetic core of the induction type thin film magnetic head. FIG. 4A shows a magnetic domain structure when the upper magnetic core is a single-layer magnetic film, and FIG. 4B shows a magnetic domain structure when the upper magnetic core is a two-layer magnetic film of a magnetic film / interlayer insulating film / magnetic film. 44Ni-Fe for the magnetic film and Al2O3 (1
0 nm), Cr (20 nm) + Ni-F
Using e, the track width Tw is 1, 2, 3, 5 μm, and the first upper magnetic film 14 and the second upper magnetic film 18 are a magnetic two-layer film having a thickness of 1.0 and 2.0 μm, respectively. , The first upper magnetic film 14 and the second upper magnetic film 18 are both 1.5.
μm.

As shown in FIG. 4A, when the upper magnetic core is a single-layer magnetic film, it is understood that the return magnetic domain structure has a hexagonal main magnetic domain and a triangular return magnetic domain. On the other hand, as shown in FIG. 4B, when the upper magnetic core is a two-layer magnetic film, although it has 180-degree domain walls at both ends of the back gap, it can be seen that it has a substantially single domain structure.

FIG. 5 is a graph showing μ-f characteristics of the magnetic film measured by the figure eight coil method. More specifically, FIG. 5a shows the μ-f of the magnetic film measured by the figure eight coil method.
FIG. 5B is a μ-f characteristic diagram normalized by the value of μ at 1 MHz. The single layer film is 3 μm Co-Ni
-The Fe film and the two-layer film are made of 1.5 μm Co-Ni-Fe /
This is a 10 nm Al2O3 / 1.5 [mu] m Co-Ni-Fe film. According to FIG. 5, it is clear that the two-layer film has better magnetic permeability frequency characteristics than the single-layer film.

Embodiment 2 FIG. 6 is a diagram showing the first half of the manufacturing process in Embodiment 2 of the method of manufacturing an inductive thin film magnetic head according to the present invention, and FIG. FIG. However, the structure of the finished product is the same as the structure of FIG.

In the second embodiment, first, a lower magnetic core 12 and a magnetic gap 13 are formed on a substrate 11. next,
A winding made of a conductive film and an insulating film covering the winding and having a hole for a back gap are formed. A first upper magnetic film 14, an interlayer insulating film 15, and a plating base film 16 are sequentially deposited. When the first upper magnetic film 14 is deposited by a dry process such as sputtering, it is easy to form a magnetic multilayer film in which magnetic metal films and interlayer insulating films are alternately stacked. Further, as the plating base film 16, two layers of Cr and a magnetic film are used.
When a layer film is used, the second layer outside the region surrounded by the frame is used.
When removing the upper magnetic film by etching and processing it into the shape of the upper magnetic core, the etching rate of Cr is slow, so
It is possible to prevent over-etching of a portion below the plating base film 16 and to easily control the magnetic anisotropy of the second upper magnetic film.

Subsequently, as shown in FIG. 6A, a frame having an upper magnetic core shape is formed using a material such as a photoresist. As shown in FIG. 6B, a second upper magnetic film 18 is deposited by plating. Next, as shown in FIG. 6C, a thin film of a material such as a photoresist is deposited and patterned into an upper magnetic core shape to form a first mask 19.

As shown in FIG. 7D, the second upper magnetic film in an area not covered by the first mask 19 and the frame 17 is removed by a method such as etching.
8a is formed. As shown in FIG. 7E, the frame 17 and the first mask 19 are removed. Thereafter, as shown in FIG. 7F, a thin film of a material such as a photoresist is deposited and patterned into an upper magnetic core shape, thereby forming a second mask 20. Finally, the plating base film 16, the interlayer insulating film 15, and the first upper magnetic film 1 in a region not covered with the second mask 20
4 is removed by ion milling or the like, and then the second mask 20 is removed. As shown in FIG. 2F of the first embodiment, the upper metal core has a desired upper magnetic core shape, and the magnetic metal film and the interlayer insulating film are alternately formed. An inductive thin-film magnetic head in which the upper magnetic core is constituted by the laminated magnetic multilayer films is obtained.

As in the case of FIG. 3, a desired area at the tip of the magnetic head is exposed using a mask, and the nonmagnetic gap film in that area and the upper portion of the lower magnetic core 12 are removed by ion milling or the like. Is also good.

Third Embodiment FIG. 8 is a diagram showing the first half of the manufacturing process in a third embodiment of the method of manufacturing an inductive thin film magnetic head according to the present invention, and FIG. 9 is the second half of the manufacturing process in the third embodiment. FIG.

In the third embodiment, first, a lower magnetic core 12 and a magnetic gap 13 are formed on a substrate 11. continue,
A winding made of a conductive film and an insulating film covering the winding and having a hole for a back gap are formed. Next, a first upper magnetic film 14, an interlayer insulating film 15, and a plating base film 16 are sequentially deposited. When the first upper magnetic film 14 is deposited by a dry process such as sputtering, it is easy to form a magnetic multilayer film in which magnetic metal films and interlayer insulating films are alternately stacked. When a two-layer film of Cr and a magnetic film is used as the plating base film 16, when the second upper magnetic film outside the region surrounded by the frame is removed by etching and processed into the shape of the upper magnetic core, Cr is removed. However, since the etching rate is low, it is possible to prevent over-etching to a portion below the plating base film 16 and to easily control the magnetic anisotropy of the second upper magnetic film.

Subsequently, as shown in FIG. 8A, a frame having an upper magnetic core shape is formed using a material such as a photoresist. As shown in FIG. 8B, a third mask film 21 made of a material having a lower etching rate than the second upper magnetic film 18 and the first upper magnetic film is sequentially deposited by plating.
As a material of the third mask film, Cr, W, Mo, or the like is desirable. As shown in FIG. 8c, a thin film of a suitable material such as a photoresist is deposited and patterned into an upper magnetic core shape to form a first mask 19.

As shown in FIG. 9D, the third mask film and the upper magnetic film in a region not covered by the first mask 19 are removed by a method such as etching to form a second upper magnetic core 18a.

In the third embodiment, as a method of etching, after removing the third mask film in a region not covered with the first mask 19 by ion milling, a region not covered with the first mask 19 by wet etching is used. Second
Although the method of removing the upper magnetic film was used, for example, when Cr was used as the material of the third mask film, the third region of the region not covered with the first mask 19 with the second cerium nitrate-based etchant was used. After removing the mask film, wet etching may be used twice as in the method of removing the second upper magnetic film in a region not covered with the first mask 19 by wet etching.

Next, as shown in FIG.
And the first mask 19 is removed. Finally, after removing the plating base film 16, the interlayer insulating film 15, and the first upper magnetic film 14 in the region not covered by the third mask 21 by ion milling or the like, the third mask 21 is removed, as shown in FIG. 9F.
As shown in (1), an inductive thin-film magnetic head having a desired upper magnetic core shape and comprising an upper magnetic core by a magnetic multilayer film in which magnetic metal films and interlayer insulating films are alternately stacked is obtained.

As in the case of FIG. 3, using a mask in which a desired region at the tip of the magnetic head is exposed, the upper portion of the nonmagnetic gap film and the lower magnetic core 12 in that region is removed by ion milling or the like. Is also good.

[0049]

According to the present invention, after forming the lower magnetic core and the magnetic gap on the substrate, the first upper magnetic film,
An interlayer insulating film and a plating base film are sequentially deposited, for example, a frame that defines the shape of the upper magnetic core is formed, a second upper magnetic film is plated, and a mask is formed.
The upper magnetic film is removed to form a second upper magnetic core. Then, the mask and the frame are removed, and a plating base film, an interlayer insulating film, and a first insulating film that are not covered with the second upper magnetic core by ion milling or the like. Since the method of manufacturing the inductive thin film magnetic head having the upper magnetic core and the upper magnetic core removed is obtained, the track width can be accurately defined by the interval between the frames.
The upper magnetic core is a first upper magnetic core, an interlayer insulating film,
Since it becomes a magnetic multilayer film in which the second upper magnetic core is laminated,
The magnetic domain structure is a single magnetic domain, and high frequency characteristics can be greatly improved.

[Brief description of the drawings]

FIG. 1 is a diagram showing a first half of a manufacturing process in Embodiment 1 of a method of manufacturing an inductive thin film magnetic head according to the present invention.

FIG. 2 is a diagram showing the latter half of the manufacturing process in Embodiment 1 of the method of manufacturing the inductive thin film magnetic head according to the present invention.

FIG. 3 is a diagram showing a modification in which the upper portions of the nonmagnetic gap film and the lower magnetic core are removed by ion milling or the like in the first embodiment.

FIG. 4 is a diagram showing an example of an observation result of a magnetic domain structure in an upper magnetic core of the inductive type thin film magnetic head.

FIG. 5 shows μ-f of a magnetic film measured by a figure eight coil method.
It is a figure showing a characteristic.

FIG. 6 is a diagram showing the first half of the manufacturing process in Embodiment 2 of the method of manufacturing the induction type thin film magnetic head according to the present invention.

FIG. 7 is a diagram showing the latter half of the manufacturing process in Embodiment 2 of the method of manufacturing the inductive thin film magnetic head according to the present invention.

FIG. 8 is a diagram showing the first half of the manufacturing process in Embodiment 3 of the method of manufacturing the induction type thin film magnetic head according to the present invention.

FIG. 9 is a diagram illustrating the latter half of the manufacturing process in Embodiment 3 of the method of manufacturing the inductive type thin film magnetic head according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Substrate 12 Lower magnetic core 13 Magnetic gap 14 First upper magnetic film 14a First upper magnetic core 15 Interlayer insulating film 15a Interlayer insulating film 16 Plating base film 16a Plating base film 17 Frame 18 Second upper magnetic film 18a Second upper magnetic Core 19 First mask 20 Second mask 21 Third mask 21a Third mask

 ──────────────────────────────────────────────────の Continuing on the front page (72) Katsumi Hoshino 1-280 Higashi Koikekubo, Kokubunji-shi, Tokyo Inside the Central Research Laboratory, Hitachi, Ltd. (72) Tomohiro Okada 1-1-280 Higashi Koikekubo, Kokubunji-shi, Tokyo Hitachi, Ltd. Central Research Laboratory (72) Inventor Takashi Kawabe 2880 Kofu, Odawara City, Kanagawa Prefecture Hitachi, Ltd.Storage Systems Division (72) Inventor Yoshiaki Kita 1-280 Higashi-Koikekubo, Kokubunji-shi, Tokyo Hitachi Central Research Laboratory ( 72) Inventor Moriaki Fuyama 1-280 Higashi Koigakubo, Kokubunji-shi, Tokyo Inside the Central Research Laboratory, Hitachi, Ltd.

Claims (6)

[Claims] 1. A step of forming a lower magnetic core having a predetermined shape on a substrate, a step of forming a non-magnetic gap film on the lower magnetic core, a winding of a conductor film and a back gap hole covering the winding. Forming an insulating film having: a first upper magnetic film magnetically connected to the lower magnetic core through the back gap hole on the insulating film and the nonmagnetic gap film; Forming an interlayer insulating film on the first upper magnetic film, forming a plating base metal film on the interlayer insulating film, and forming a frame patterned on the plating base metal film in the shape of an upper magnetic core. Forming, forming a second upper magnetic film by plating, forming a first mask on the second upper magnetic film, forming the first mask and the second upper magnetic film in a predetermined pattern. Forming a second upper magnetic core having a predetermined shape by etching; removing the first mask and a frame; using the second upper magnetic core as a mask, the interlayer insulating film and the first upper magnetic film Forming an inductive thin film magnetic head into a predetermined shape. 2. A step of forming a lower magnetic core having a predetermined shape on a substrate; a step of forming a nonmagnetic gap film on the lower magnetic core; a winding of a conductor film and a back gap hole covering the winding. Forming an insulating film having: a first upper magnetic film magnetically connected to the lower magnetic core through the back gap hole on the insulating film and the nonmagnetic gap film; Forming an interlayer insulating film on the first upper magnetic film, forming a plating base metal film on the interlayer insulating film, and forming a frame patterned on the plating base metal film in the shape of an upper magnetic core. Forming, forming a second upper magnetic film by plating, forming a first mask on the second upper magnetic film, forming the first mask and the second upper magnetic film in a predetermined pattern. Forming a second upper magnetic core having a predetermined shape by etching; removing the first mask and the frame; forming a second mask having a predetermined shape on the second upper magnetic core; Forming the interlayer insulating film and the first upper magnetic film in the shape of the second mask. 3. A step of forming a lower magnetic core having a predetermined shape on a substrate; a step of forming a non-magnetic gap film on the lower magnetic core; a winding of a conductor film and a back gap hole covering the winding. Forming an insulating film having: a first upper magnetic film magnetically connected to the lower magnetic core through the back gap hole on the insulating film and the nonmagnetic gap film; Forming an interlayer insulating film on the first upper magnetic film, forming a plating base metal film on the interlayer insulating film, and forming a frame patterned on the plating base metal film in the shape of an upper magnetic core. Forming; forming a second upper magnetic film by plating; forming a third mask having a lower etching rate than the first upper magnetic film on the second upper magnetic film; Ma Forming a first mask on a mask, etching the third mask and the second upper magnetic film into a predetermined pattern to form a second upper magnetic core having a predetermined shape, A method of manufacturing an inductive thin film magnetic head, comprising: a step of removing a frame; and a step of forming the interlayer insulating film and the first upper magnetic film in the third mask shape. 4. The method of manufacturing an inductive thin film magnetic head according to claim 3, wherein any one of W, Mo, and Cr is used as the third mask. 5. The method of manufacturing an inductive thin-film magnetic head according to claim 1, wherein a two-layered film of Cr and a magnetic film is used as the plating base metal film. A method for manufacturing an inductive thin film magnetic head. 6. The method of manufacturing an inductive thin film magnetic head according to claim 1, wherein a magnetic metal film and an interlayer insulating film are alternately laminated. A method for manufacturing an inductive thin film magnetic head, comprising using a film as the first upper magnetic film.