JPH10207014A - Circuit board and its production as well as film unit with lens - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify the production work of a circuit board and to prevent the shorting by excessive solder. SOLUTION: A stroboscope substrate 32 built into the film unit with a lens is integrated by case-in of a conductor pattern sheet with an insulator 53. The conductor pattern sheet 52 is made of the form obtd. by connecting plural circuit patterns in series by plural connecting parts to prevent the sepn. thereof at a plane. The region inclusive of the through-holes of the conductor pattern sheet 52 is formed to recess one step along the insertion direction of packaging parts. The conductor pattern sheet 52 is inserted into a metal mold and is cast in by the insulator 53. The region 58a including the connecting parts is blanked to electrically separate the respective circuit pattern after the forming.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board in which a plurality of conductive patterns constituting an electronic circuit are mounted on an electronic component by mounting the electronic parts so as not to be separated on a plane, a method of manufacturing the same, and a method of using the same. The present invention relates to a film unit with a lens.

[0002]

2. Description of the Related Art An inexpensive single-sided printed wiring board is manufactured by a screen printing method using an etching resist ink using a paper phenol copper-clad laminate. In this method, a copper clad laminate is produced through steps such as leveling, screen printing, etching, resist removal, leveling, and solder resist printing.

[0003]

However, although the above-described steps are automated, the number of steps is large and the production cost is still high. Moreover, defects that cannot be found by electrical inspection, such as residual copper, chipping, pinching, protrusions, pinholes, and the like, are likely to occur, and appearance inspection becomes indispensable, which is a factor that increases manufacturing costs.

An object of the present invention is to solve the above-mentioned problems and to provide a circuit board having a low manufacturing cost, a manufacturing method thereof, and a film unit with a lens using the same.

[0005]

In order to solve the above-mentioned problems, in the present invention, a plurality of circuit patterns formed by punching a conductive sheet and a region including a through hole of the circuit pattern are exposed to a proper portion. In the state, a circuit board is formed from an integrated insulator by casting the circuit pattern,
The region including the through hole of the circuit pattern is recessed one step along the insertion direction of the mounted component. As a manufacturing method of integrating a plurality of circuit patterns by casting with an insulator, insert molding is preferable.

At the time of insert molding, an opening for exposing a through hole for inserting a mounted component to the outside is also formed. The region including the through hole is formed in advance so as to be recessed one step along the mounting component insertion direction. By doing so, on the contrary, since the solder surface side of the through hole protrudes, uniform soldering can be performed even by, for example, flow soldering, and excessive soldering can be reliably prevented.

[0007] Insert parts set in the mold are:
Although there are a plurality of circuit patterns, if the insertion is automated, the time required for the insertion operation can be improved. Furthermore, if a plurality of insert dies are prepared, and the insert dies are circulated infinitely with respect to the counterpart die and molded, the molding work can be performed in parallel with the insert work, The molding cycle time can be reduced.

According to the second aspect of the present invention, a conductor pattern sheet punched out of a single conductor sheet in a state where a plurality of circuit patterns are connected in series through a connection portion, and the conductor pattern sheet is formed by casting. The plurality of circuit patterns are electrically separated from each other by an opening punched through a region including a connection portion of the conductor pattern sheet after being cast with the insulator. In the circuit board, the region including the connecting portion is formed so as to be recessed one step toward the side opposite to the solder surface of the through hole near the connecting portion.

The conductor pattern sheet is formed by punching a plurality of circuit patterns into a pattern shape connected in series at a plurality of connecting portions so as not to be separated on a plane. After that, the semiconductor device is separated into a plurality of circuit patterns by punching through a region including the connection portion. The region including the connecting portion of the conductor pattern sheet is formed so as to be recessed one step toward the side opposite to the solder surface of the through hole in the vicinity thereof. As a method of casting the conductor pattern sheet with an insulator, insert molding is desirable.

After insert molding, it is necessary to electrically separate the conductor pattern sheet into a plurality of circuit patterns. Therefore, in the last operation, the connecting portion of the conductor pattern sheet is punched. In the punching, an opening for exposing a region including the connecting portion to the outside is formed in the insulator at the time of insert molding, and only the connecting portion is punched in accordance with the opening. Also, an opening for exposing the through hole to the outside is formed at the same time. When a part of the through hole opening and a part of the connection part opening overlap, the opening is formed by one opening. Thereafter, the mounted components are inserted into the through holes of the electrically isolated circuit pattern and soldering is performed. At this time, the solder adheres not only to the through holes on the solder surface side but also to the connecting portions. There is fear. For this reason, in the present invention, the region including the connecting portion is recessed one step toward the surface of the nearby through hole opposite to the solder surface.

The film unit with a lens with a flash has a built-in flash unit. The strobe unit is roughly composed of a strobe circuit board, a mounting component (electronic component) attached thereto, a synchro contact, a battery contact piece, a strobe light emitting section, and the like. The strobe circuit board can be formed by the method described above.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG. 2, a film unit with a lens (hereinafter referred to as "film unit") 9 is a unit main body 10 containing a photographic film cartridge, various photographing mechanisms, and a strobe unit. When,
And an exterior body 11 that covers part or all of this.

The unit body 10 is, as shown in FIG.
It comprises a front cover 13, a main body base 14, an exposure unit 15, a strobe unit 16, a photographic film cartridge 17, and a rear cover 18. The cartridge base 2 is provided on one side of the main body base 14 with the aperture 19 interposed therebetween.
A cartridge storage chamber 21 for storing a film roll 22a for drawing out the photo film 22 from the cartridge 20 in a roll form is provided integrally with the other side.

The rear cover 18 has a cartridge storage chamber 2
Pull-top type bottom lids 24 and 25 for closing the bottoms of the film roll chamber 1 and the film roll chamber 23 are provided respectively. After the rear cover 18 is attached, the bottom of each of the chambers 21 and 23 is closed by the bottom lids 24 and 25, so that the photographic film cartridge 17 is light-tightly stored between the main body base 14 and the rear cover 18. Bottom lid 2 for closing the bottom of the cartridge storage chamber 21
Reference numeral 4 denotes a lid which is opened when the cartridge 20 containing the photographic film 22 which has been photographed in the developing station is taken out.

A winding knob 26 is rotatably provided above the cartridge storage chamber 21. A part of the winding knob 26 is exposed from an opening 27 of the rear cover 18. When the film winding operation is performed, the unexposed photographic film 22 is pulled out from the film roll chamber 23 and set in the aperture 19, and at the same time, the exposed photographic film 22 is stored in the cartridge 20.

The shutter button 28 is provided on the upper surface of the front cover 13 so as to be resiliently provided with a part thereof cut out, and the shutter mechanism of the exposure unit 15 is operated by a pressing operation. The shutter mechanism is of a type in which a shutter blade swings in front of a shutter opening. When the shutter blade swings, the subject light passes through the photographing window 29 of the front cover 13 and the photographing lens 30 of the exposure unit 15 and enters the photographic film 22 set on the aperture 19 through the shutter opening. . A space between the shutter opening and the aperture 19 is defined as a dark room by a dark box 31 provided in the exposure unit 15.

The strobe unit 16 includes a main capacitor 3 on a circuit board 32 including a power supply circuit and a trigger circuit.
3 is a unit component in which a mounting component such as 3, a power supply battery 34, a synchro contact 35, and a strobe light emitting section 36 are integrally attached. The strobe unit 16 is attached to a correct position of the main body base 14 by a positioning means, and is held by a pawl connection. The positioning means includes the main body base 14.
And positioning holes provided in the circuit board 32. The claw connection includes an elastic locking claw 37 provided on the main body base portion 14 and an engaged portion provided on the circuit board 32.

On the front surface of the front cover 13, there is provided a flash charging switch 38 which is cut out and formed elastically. Behind the flash charging switch 38, a short-circuit plate 39 formed by bending a conductive material elastically is provided. The short-circuit plate 39 contacts a pair of contacts provided on the circuit board 32 by pressing the strobe charging switch 38 to close the power supply circuit.

As shown in FIG. 4, a switch 40 comprising a short-circuit plate 39 and a pair of contacts is connected in series to a power supply circuit 41. The high voltage output from the power supply circuit 41 charges the trigger capacitor 42 and the main capacitor 33. The trigger transformer 42 includes a trigger transformer 4.
The primary winding 43a is connected to the contact piece 35a on one side of the sync contact 35, and the secondary winding 43b is started to discharge the discharge tube 44 provided inside the strobe light emitting unit 36. Trigger electrodes 45 are connected to each other.

When the shutter is released, the exposure unit 1
The shutter blade provided in 5 swings once. When the shutter blades are fully opened during this time, one contact piece 35a of the sync contact 35 comes into contact with the other contact piece 35b. At this moment,
The trigger circuit is short-circuited, and the electric charge stored in the trigger capacitor 42 is discharged via the primary winding 43a.
When the trigger circuit is short-circuited in this way, a trigger signal for light emission is given to the discharge tube 44 via the secondary winding 43b and the trigger electrode 45, and the discharge tube 44 is discharged by the electric charge stored in the main capacitor 33. , To provide auxiliary lighting to the subject.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A power supply battery 34 is held in a strobe unit 16. As shown in FIG. 1, the power supply battery 34 has a form in which a coating is removed from a commercially available AA battery. In this embodiment, the electrode from the button side surface 34a of the cylinder to the outer periphery is also a positive electrode, and the outer periphery has a recess 34c which is recessed one step closer to the minus electrode 34b.
Is provided. The circuit board 32 is integrally provided with a C-shaped battery contact piece 47 that holds the power supply battery 34 by being inserted into the recess 34c from above. Further, when the power supply battery 34 is held by the battery contact piece 47, a battery contact piece 48 connected to the negative electrode 34 b of the power supply battery 34 is also provided integrally with the circuit board 32. Note that reference numeral 4
Reference numerals 9 and 50 denote a pair of contacts forming the switch 40 together with the short-circuit plate 39.

The circuit board 32 is integrated by casting a conductor pattern sheet with an insulator by insert molding. As shown in FIG. 5, the conductor pattern sheet 52 includes a plurality of circuit patterns, through holes 60 formed in each circuit pattern, and the synchro contacts 3 connected to the circuit patterns.
5, battery contacts 47, 48, a pair of contacts 49, 50, discharge tube contacts 56, 57, and a connecting portion 58.

The conductor pattern sheet 52 is formed by punching one conductor sheet into a predetermined pattern at a time in a punching step. The connecting portion 58 connects a plurality of circuit patterns in series. The sync contacts 35, the battery contacts 47, 48, the pair of contacts 49, 50, and the discharge tube contacts 56, 57 are connected to the circuit pattern in a developed shape. By doing so, the sheet can be handled as one sheet, so that subsequent operations are simplified. In this example, the conductor sheet is a thin metal material having a thickness of, for example, 0.3 mm.

At the time of punching, predetermined through holes on each circuit pattern are also punched. In the punching of the through hole, an area 60 including the through hole 60 as shown in FIG.
“a” is recessed one step along the insertion direction of the mounted component so as to protrude toward the solder surface 61. This shape is formed in a funnel cross section so that the lead terminals of the mounted components are naturally drawn into the through holes 60. By doing so, the insertion of the lead terminal into the through hole 60 is facilitated, and the probability of insertion into the through hole 60 is improved.

Further, as shown in FIG. 7, the region 58a including the connecting portion 58 of the conductor pattern sheet has a shape recessed by one step toward the surface opposite to the solder surface 61 to prevent solder adhesion. Is formed.

The punched conductor pattern sheet 52 is integrated with an insulator 53 which is an insulating plastic material. As this manufacturing method, insert molding is desirable. As shown in FIG. 8, the insulator 53 is inserted into the sync contact 35 and the battery contact piece 4 by insert molding.
7, 48 are formed in a contour shape exposing to the outside. At the time of this molding, the discharge tube contact piece 56 and the pair of contacts 4
Openings for exposing 9 and 50, through holes 60
The opening for exposing the region 60a including the connecting portion 58, the opening for exposing the region 58a including the connecting portion 58, and the like are also formed. Further, a positioning hole for engaging with a positioning pin provided on the main body base portion 14 and an engaged portion with which a locking claw 37 provided on the main body base portion 14 engages are formed together.

Further, in this example, in order to reduce the number of components to be attached to the circuit board 32, the support portion 55 constituting the strobe light-emitting portion is molded together with the insulator 53 at the time of insert molding. The support portion 55 is provided with the discharge tube contact piece 5.
7 is formed. Therefore, the discharge tube contact piece 57 is bent after punching the conductor sheet. In this example, the bent portions 47a, 47b, 48a, 48b and the like provided on the battery contact pieces 47, 48 are simultaneously bent in this punching step. Note that these bent portions 47a, 47b, 48a, 48b may be formed in a later bending step. Also, if an opening or a depression is provided in the conductor pattern sheet 52 to be inserted, and a plastic material penetrates these during insert molding, the conductor pattern sheet 52 is firmly fixed to the insulator 53. You.

After the insert molding, the connecting portion 58 is punched out of the region 58a exposed from the opening of the insulator 53, and the individual circuit patterns are electrically separated. Connection part 5
The punching of 8 is performed in the direction of the arrow line shown in FIG. 9, that is, in the direction in which burrs and burrs do not occur on the solder surface 61 side. The opening 53a that exposes the region 58a formed in the insulator 53 has a size that allows even the bent portion 58b to be cast in order to minimize the exposure range of the conductor pattern sheet 52 and prevent solder adhesion. It is desirable to do.

After punching out the connecting portion 58, as shown in FIG. 10, the synchro contact 35, the battery contact pieces 47 and 48, the discharge tube contact piece 56 and the like are bent and formed in a predetermined posture. Thus, the circuit board 52 is completed. As shown in FIG. 11, electronic components are provided on the circuit board 52, in this example,
The mounting components such as the main capacitor 33, the trigger capacitor 42, and the trigger transformer 43 are connected to the through holes 60.
And mounted by soldering. The circuit board 52 of this example is a single-sided mounting board in which mounting components are inserted only from one side. Thereafter, after performing a soldering inspection, the discharge tube 44 is attached to the support portion 55 of the circuit board 52, and the discharge tube connecting pieces 56 and 57 are soldered to both ends of the discharge tube 44. 63 is the supporting part 5
By attaching the flash unit 5, the strobe unit 16 is completed. The strobe unit 16 is supplied to a film unit assembling process, where it is incorporated into the unit body 10.

Next, the operation of the above configuration will be briefly described. As shown in FIG. 12, the strobe unit 16 passes through a conductor punching step, an insert molding step, a connecting part punching step, a bending step, a mounting component insertion step, a soldering inspection step, another component mounting step, and a strobe inspection step. It is supplied to the film unit assembly process.

In the conductor punching step, a conductor pattern sheet 52 is formed by punching a single conductor sheet into a predetermined pattern shape. In this step, together with the punching of the contour shape and the punching of the through hole 60, the region 60a including the through hole 60 is recessed by one step along the insertion direction of the mounted component, and the region 58a including the connecting portion 58 is drawn. Is drawn in one step toward the surface opposite to the solder surface 61 side. The contour shape is a shape in which a plurality of circuit patterns are connected by the connecting portion 58, and the sync contact 35, the power battery contacts 47 and 48, and the discharge tube contact 5
6, 57 are formed by connecting the developed shapes. It is preferable that the contraction depth of the region 60a including the through hole 60 and the region 58a including the connecting portion 58 be such that the outer surface of the one-step recessed surface does not protrude from the thickness of the insulator 53.

In the insert molding step, the conductor pattern sheet 52 is integrated with the insulator 53 by casting. At this time, an opening for exposing the region 60a including the through hole 60, an opening for exposing the region including the connecting portion 58, an opening for exposing the pair of contacts 49 and 50, a positioning opening for attachment to the main body base 14, The engaged portion, the support portion 55, and the like are formed at the same time. As the mold, a divided mold is used, and the conductor pattern sheet 52 is inserted into one of the molds. Thereafter, after the molds are combined, an insulating plastic material is injected to form the insulator 53.

In the form after molding, only the contact pieces 35a, 35b, 47, 48, 56, etc., which are bent in the next step, are exposed from the outer contour of the insulator 53, and the remaining portion is a region including the through hole 60. 60a, a region 58 including the connecting portion 58
a and the portion excluding the pair of contacts 49 and 50 is the insulator 5
Covered with 3.

In the bending step, the developed portions such as the contacts 35a, 35b and the contact pieces 47, 48, 56 are bent and formed, and as shown in FIG.
48 and the discharge tube contact piece 56 are formed in a predetermined posture.

In the connecting portion punching step, punching is performed through the region 58a including the connecting portion 58. Thereby, the plurality of circuit patterns are electrically separated from each other. At this time, as shown in FIG. 13, the punching is performed by placing the punch 65 on the solder surface 61 and the die 66 on the opposite surface.
It is punched out from the solder surface 61 side. As the punching range,
The punch 65 is used to punch a part of the one-step recessed surface. As described above, since the region 58a including the connecting portion 58 is recessed in a direction away from the solder surface 61, even if the punching range of the connecting portion 58 is reduced, a defect such as a short circuit due to excessive solder does not occur. Absent. In addition, it is possible to reduce the shearing force by providing a cut in advance along the punching contour of the region 58a including the connecting portion 58 to reduce the shearing force. Thus, the insulator 53 can be prevented from being damaged or damaged.

The completed circuit board 32 is sent to a mounting component insertion step, where the main capacitor 33, the trigger transformer 43, the trigger capacitor 42, and the mounting components of the power supply circuit 41 are inserted as shown in FIG. Is done.
At the time of this insertion, since the cross-sectional shape of the region 60a including the through hole 60 is a funnel-like shape on the insertion side of the mounted component, insertion becomes easy. After the insertion, as shown in FIG. 14, the end of the lead terminal 67 inserted into the through hole 60 is bent and temporarily fixed. At this time,
If the chamfer 68a is formed on the opening edge on the solder surface 61 side of the opening 68 exposing the region 60a including the through hole 60 to the outside, it is possible to prevent the solder from adhering to the edge of the opening 68.

In the soldering step, the mounted components are soldered. As a soldering method, a flow method of immersing in a molten solder bath and performing batch soldering is adopted.
In this method, when the pitch of the through-holes 60 is reduced to increase the mounting density, defects such as short-circuits are likely to occur.
Are protruded toward the solder surface 61, so that a defect such as a short circuit hardly occurs even when the mounting density is increased. Thereby, the solder 69
As shown in FIG. 15, is formed in a mountain shape that gradually decreases from the side of the solder surface 61 toward the bent portion at the tip end side of the lead terminal 67 inserted through the through hole 60.

A portion where the opening 53a for exposing the region 58a including the connecting portion 58 to the outside and the opening 68 for exposing the region including the through hole 60 to the outside is also used as one opening. . In such a place, the solder easily adheres also to the region 58a including the connecting portion 58, but in the present embodiment, the region 58a including the connecting portion 58 is opposite to the solder surface 61 of the through hole 60 adjacent thereto. Since it is recessed toward the side, it is possible to reliably prevent solder from adhering to the soldering prohibited area.

In the soldering inspection step, an automatic solder inspection machine is used. As shown in FIG. 16, the inspection device includes an illumination unit 70, an imaging unit 71, an image processing unit 72, and a determination unit 73.
It is composed of The illumination unit 70 has a configuration in which three ring lights 70a to 70b having different diameters are arranged so as to be shifted along the imaging optical axis 71a. The imaging unit 71 captures the light reflected from the solder 69 in the illumination light emitted from the illumination unit 70. The captured image is captured by the image processing unit 72, and is sent to the determination unit 73 after performing image processing such as clipping of the inspection target range and density correction. The determination unit 73 compares the captured image with a reference image stored in advance, and determines whether the soldering form is a mountain shape.

In this inspection machine, the area 60a including the through hole 60 is used to image the reflected light from the illumination unit 70.
Is surrounded by the insulator 53, the lighting unit 70
However, even if the light is illuminated, a shadow is generated and the entire image of the solder 69 cannot be imaged. However, in this embodiment, since the region 60a including the through hole 60 protrudes toward the solder surface 61, the region 60a including the through hole 60 is not shielded from light, so that the reliability of the inspection is improved. The opening 6 exposing the region 60a including the through hole 60 to the outside.
Since the chamfer 68a is formed on the surface 8, the illumination light easily enters, and the reliability of the inspection is further improved.

After the soldering inspection, the process is sent to another component mounting step, in which the discharge tube 44 is mounted on the support portion 55 together with the reflector 62, and both terminals of the discharge tube 44 are connected to the contact pieces 56, 57.
After that, the diffusion plate 63 is attached. Thus, the flash light emitting section 36 is completed. Although not shown, a trigger electrode 45 is provided on the back surface of the reflector.

The strobe unit 16 assembled in this way is subjected to a strobe inspection, and only those which pass are supplied to the assembling process of the film unit 9, where the strobe unit 16 is built in the unit body 10 together with the power battery 34. Is done.

In the above embodiment, the circuit board 32 is used for the strobe unit 16 of the film unit 9. However, the present invention is not limited to this, and it goes without saying that the circuit board 32 can be used for any board or wiring board. Absent.
In addition, the sync contact 35,
Although the power supply batteries 47 and 48 and the discharge tube connecting pieces 56 and 57 are provided integrally, they may be formed as separate parts and handled as insert parts during insert molding.

In the above embodiment, one conductor pattern sheet 52 in which a plurality of circuit patterns are connected by the connecting portion 58 is inserted. However, the present invention is not limited to this, and a plurality of circuit patterns may be inserted in a separated form. You may make it. Further, in the above-described embodiment, the processing for narrowing the area including the connecting portion 58 or the area including the through hole 60 is performed together in the conductor punching step. However, after this, before the casting with the insulator, Alternatively, it may be performed as secondary processing.

Further, although the circuit board 32 of the above embodiment is a single-sided mounting board, it may be a double-sided mounting board. In this case, the through holes 6 may be inserted in accordance with the insertion direction of the mounting component.
What is necessary is just to change the recess direction of the area 60a including 0. In addition,
In the case of a double-sided mounting substrate, soldering of not only the flow method but also a reflow method can be performed.

[0046]

As described above, in the present invention, the circuit board has a structure in which a plurality of circuit patterns formed by punching a conductive sheet are integrated with an insulator to be cast.
The work is simpler than in the prior art, and the cost can be reduced. In addition, since the area including the through hole is recessed one step along the insertion direction of the mounted component, even if excess solder occurs, it becomes difficult for solder to adhere around it, and defects such as short circuits can be reliably prevented. it can.

In another invention using a conductor pattern sheet connected in series at a connecting portion so that a plurality of circuit patterns are not separated on a plane, handling can be facilitated at the time of insert molding, and the insert time can be reduced. In order to separate the conductor pattern sheet into a plurality of circuit patterns, it is only necessary to punch out the connecting portion after molding, which can be performed at low cost. In addition, since the circuit pattern is formed by punching the conductive sheet, defects such as residual copper, chipping, pinching, projections, and pinholes, which are disadvantages of the screen printing method, do not occur. Furthermore, since the region including the connection portion is recessed one step toward the surface of the through hole near the surface opposite to the solder surface, the solder adheres to the region after punching, making it difficult to short-circuit.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a strobe unit using a circuit board of the present invention.

FIG. 2 is a perspective view showing an appearance of a film unit with a lens.

FIG. 3 is an exploded perspective view of a unit main body.

FIG. 4 is a circuit diagram schematically showing an electrical configuration of a strobe unit.

FIG. 5 is a perspective view showing a conductor pattern sheet formed by punching a conductor sheet.

FIG. 6 is a cross-sectional view of a main part of a region including a through hole.

FIG. 7 is a cross-sectional view of a main part of a region including a connecting portion.

FIG. 8 is a perspective view showing a circuit board after insert molding.

FIG. 9 is a fragmentary cross-sectional view showing a region including a through hole after insert molding.

FIG. 10 is a perspective view showing a state where a contact piece or the like is bent and formed.

FIG. 11 is a perspective view schematically showing an electronic component mounted on a circuit board.

FIG. 12 is a follow chart illustrating a manufacturing procedure of the strobe unit.

FIG. 13 is a cross-sectional view of a main part showing a state where a connecting portion is punched out.

FIG. 14 is a fragmentary cross-sectional view showing a state where lead terminals are inserted into through holes.

FIG. 15 is a cross-sectional view of a main part showing a state where lead terminals are soldered.

FIG. 16 is an explanatory view schematically showing a soldering inspection step.

[Explanation of symbols]

 9 Film unit with lens 10 Unit main body 16 Strobe unit 32 Circuit board 35 Synchro contact 49, 50 A pair of contacts for starting charging 52 Conductor pattern sheet 53 Insulator 58 Connecting part 58a Area including connecting part 60 Through hole 60a Through hole Area containing

Claims (6)

[Claims] A plurality of circuit patterns formed by punching a conductive sheet, and an insulator formed by casting and integrating the circuit pattern in a state where a region including a through hole of the circuit pattern is exposed to the outside. A circuit board, comprising: a region including a through hole of the circuit pattern, which is recessed by one step along a mounting component insertion direction. 2. A conductive sheet punching step of punching a conductive sheet to form a plurality of circuit patterns, and, in a state in which a region including a through hole of the circuit pattern is exposed to the outside, an insulating plastic material. A method for manufacturing a circuit board from an insert molding step of casting and integrating with a material, wherein in the conductor sheet punching step or after this step, a region including a through hole of the circuit pattern is mounted on a component. A method of manufacturing a circuit board, characterized in that a drawing process is performed in a one-step concave shape along the insertion direction. 3. A conductor pattern sheet punched from one conductor sheet in a state where a plurality of circuit patterns are connected in series through a connection portion, and an insulator formed by casting and integrating the conductor pattern sheet. The plurality of circuit patterns are circuit boards which are electrically separated from each other by openings punched through a region including the connection portion of the conductor pattern sheet after being cast with the insulator. A circuit board, wherein a region including the connecting portion is recessed by one step toward a surface opposite to a solder surface of a through hole near the connecting portion. 4. A conductor sheet punching step of punching a conductor sheet and forming a conductor pattern sheet connected by a connecting portion so that a plurality of circuit patterns are not separated on a plane, and said conductor pattern sheet is made of an insulating plastic material. An insert molding step of casting and integrating, and a connecting portion for punching out a region including the connecting portion of the conductive pattern sheet after the casting with the plastic material and electrically punching out the plurality of circuit patterns from each other. A method for manufacturing a circuit board from a punching step, wherein in the conductor sheet punching step or after this step, the area including the connection portion is on the side opposite to the solder surface of the through hole in the vicinity thereof. A method of manufacturing a circuit board, characterized in that a one-step concave drawing process is performed toward the substrate. 5. A plurality of circuit patterns formed by punching a conductive sheet, and an insulator integrated by casting the circuit pattern in a state where a region including a through hole of the circuit pattern is exposed to the outside. A lens-equipped film unit having a built-in strobe circuit board, wherein a region including a through hole of the circuit pattern is recessed by one step along a mounting component insertion direction. 6. A conductor pattern sheet punched from one conductor sheet in a state where a plurality of circuit patterns are connected in series through a connection portion, and an insulator formed by casting the conductor pattern sheet into one piece. And a strobe circuit in which the plurality of circuit patterns are electrically separated from each other by punching out through a region including the connecting portion after the insulator is cast and formed. A lens-equipped film unit including a substrate, wherein the region including the connection portion is recessed by one step toward a surface opposite to a solder surface of a through hole near the connection portion. .