JPH10206678A - Light semiconductor element module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bidirectional wave length multiplex communication light semiconductor element module having three wave lengths without enlarging the module by using a plate-like optical part where characteristically different two kinds of band-pass filters are formed on both surfaces. SOLUTION: A first wave length light signal emitted from a first semiconductor laser 11 passes through a first and a second band-pass filters 33 and 34 formed on plate glass 32, and couples with an optical fiber 7. A second wave length light signal emitted from a second semiconductor laser 21 passes through a third band-pass filter 36, and is reflected by the second band-pass filter 34, and couples with the optical fiber 7. A third wave length light signal is made incident from the optical fiber 7, and passes through the second band-pass filter 34, and is reflected by the first band-pass filter 33, and again passes through the second band-pass filter 34, and passes through a third band-pass filter 36, and is made incident on a receiving photodiode 25.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device module for performing bidirectional communication by wavelength multiplexing using an optical fiber as a transmission line in optical communication.

[0002]

FIG. 6 shows, for example, Japanese Patent Application No. 6-29970.
No. 2 (Title of Invention: Optical Semiconductor Element Module) is a conventional optical semiconductor element module for performing bidirectional wavelength multiplexing communication of two wavelengths. In the figure, 1 is a light emitting element, 2
Is a light receiving element, 3 is a lens for condensing light incident on the light receiving element, 4 is a light separation filter, 5 is a band pass filter, 6
Denotes a case, 7 denotes an optical fiber, 8 denotes a ferrule for holding the optical fiber 7, 9 denotes an optical fiber holder, and 10 denotes a light receiving element holder.

The light emitting element 1 includes a semiconductor laser, a monitor photodiode for monitoring an optical output of the semiconductor laser, a block for fixing the semiconductor laser and the monitor photodiode by solder, and a light emitting element for emitting light from the semiconductor laser. The condenser lens, the cap for holding the lens, and the stem are made more airtight, and the lead terminals are connected to the stem so that they are packaged so that they can be electrically connected to the outside. Similarly, the light receiving element 2 has a receiving photodiode, a block for fixing the receiving photodiode with solder, a cap, a window glass fixed to the cap with low-melting glass, and a stem so that airtightness can be obtained. The lead terminals are connected to the stem, and are packaged so that they can be electrically connected to the outside. The light separating filter 4 is provided on the surface of the flat glass on the light emitting element 1 side so that an optical signal of a first wavelength, which is light emitted from a semiconductor laser contained in the light emitting element 1, is not reflected by the light separating filter 4. The anti-reflection film designed for is formed by evaporation,
On the other surface of the light separating filter 4, an optical signal of the first wavelength, which is light emitted from the semiconductor laser contained in the light emitting element 1, is transmitted and contained in the light receiving element 2. A dielectric multilayer filter designed to reflect an optical signal of a second wavelength which is incident light to a receiving photodiode is formed by vapor deposition.

The light separating filter 4 is configured such that an optical signal of a first wavelength emitted from a semiconductor laser contained in the light emitting element 1 is formed by an antireflection film and a dielectric multilayer film filter formed on the light separating filter 4. After being transmitted from the optical fiber 7 and being coupled to the optical fiber 7 and being incident on the receiving photodiode contained in the light receiving element 2 and having an optical signal of the second wavelength, the optical separation filter 4 The light is reflected in a direction perpendicular to the central axis of the optical fiber 7 by the dielectric multilayer film formed on the optical fiber 7, is condensed by the lens 3, passes through the band-pass filter 5, and has an inclination so as to be incident on the receiving photodiode. Let it be fixed. The bandpass filter 5 reflects an optical signal of the first wavelength, which is light emitted from the semiconductor laser contained in the light emitting element 1, and is light incident on the receiving photodiode contained in the light receiving element 2. A dielectric multilayer filter designed to transmit an optical signal of a second wavelength is formed on both sides of a flat glass by vapor deposition. The band-pass filter 5 irregularly reflects the optical signal of the first wavelength emitted from the semiconductor laser housed in the light emitting element 1 by the light separating filter 4 and repeats the reflection inside the module. It is installed between the light receiving element 2 and the lens 3 for the purpose of preventing near-end crosstalk caused by being incident on the contained receiving photodiode. The lens 3 enters from the optical fiber 7, is reflected by the light separation filter 4,
The position is adjusted and fixed so that the optical signal incident on the receiving photodiode accommodated in the light receiving element 2 and transmitted through the light receiving element 2 is optimally incident on the receiving photodiode. The light receiving element 2, the lens 3, and the band pass filter 5 are in the light receiving element holder 10, the optical fiber 7 is in the ferrule 8, the ferrule 8 is in the fiber holder 9, and the light emitting element 1, the light separation filter 4, the fiber holder 9 The light receiving element holder 10 is fixed to the case 6 by bonding or the like.

Next, the operation will be described. The optical signal of the first wavelength condensed and emitted from the light emitting element 1 passes through the antireflection film and the dielectric multilayer filter formed on the light separating filter 4 and is coupled to the optical fiber 7 to be connected to the outside. Is transmitted to On the other hand, an optical signal of the second wavelength transmitted from the outside by the optical fiber 7 and incident on the receiving photodiode contained in the light receiving element 2 is formed on the optical separation filter 4 after being incident on the optical fiber 7. The light is reflected by the dielectric multilayer filter, condensed by the lens 3, passes through the bandpass filter 5, and is incident on the receiving photodiode contained in the light receiving element 2.

[0006]

The conventional optical semiconductor device module is constructed so that bi-directional wavelength multiplex communication of two wavelengths can be performed as described above. In order to provide a configuration capable of performing wavelength-division multiplexing communication, an attempt is made to add a semiconductor laser for transmitting an optical signal of the third wavelength or a receiving photodiode for receiving an optical signal of the third wavelength. In this case, a package including a semiconductor laser or a photodiode for reception, a lens for condensing an optical signal, and a flat glass plate on which a band-pass filter is formed is placed between the optical separation filter of the conventional optical semiconductor element module and the optical fiber. Will be added to At this time, when components such as a semiconductor laser used in a conventional optical semiconductor element module or a package including a receiving photodiode, a lens, and an optical separation filter are added, the optical semiconductor element module becomes large. There is. In addition, since the optical length between each semiconductor element and the optical fiber becomes longer, it is necessary to increase the magnification of each lens. In this case, when the position of each optical component deviates from the design position or the adjustment position due to a temperature change or the like at the time of assembling, the condensing position of the light emitted from the semiconductor laser condensed by the lens depends on the lens magnification. The position deviates greatly from the coupling position with the optical fiber, and the desired optical power cannot be obtained. Similarly, the focus position of the incident light on the photodiode is greatly shifted, and a desired photodiode sensitivity cannot be obtained. For this reason, there is a problem that it is necessary to make the design position accuracy and the adjustment accuracy for each component strict, and to select a component having a small displacement amount of the component due to a temperature change. On the other hand, when each optical component is reduced in size and added, the required accuracy for the component dimensions and the positional accuracy of the component fixing position become severe due to the miniaturization of the component, which increases the cost of the component and the man-hour for assembling. There was a problem that led to up.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and is different from a device in which two elements in which a semiconductor laser and a receiving photodiode are arbitrarily combined are housed in a package and which have different characteristics. By using a flat optical component having two types of bandpass filters formed on both sides, it is possible to obtain the same size component and the same component position accuracy as the conventional two-wavelength bidirectional wavelength division multiplexing optical semiconductor device module. It is another object of the present invention to configure an optical semiconductor device module for bidirectional wavelength multiplex communication of three wavelengths in which the size of the module is the same as that of the conventional one and the multiplex wavelength is increased by one wavelength.

[0008]

An optical semiconductor device module according to the present invention comprises a light emitting device having a first semiconductor laser and a first monitor photodiode in a package, a second semiconductor laser and a second monitor photodiode. A light-emitting and light-receiving element containing a receiving photodiode in a package, a first and a second lens, a ferrule, an optical fiber fixed to the ferrule, and a first wavelength emitted from the first semiconductor laser. A first bandpass filter that transmits an optical signal and reflects an optical signal of a third wavelength incident on the receiving photodiode is deposited on one side, and a light of the first and third wavelengths is deposited. A first band-pass filter which transmits a signal and reflects an optical signal of a second wavelength emitted from the second semiconductor laser on the other surface; -Shaped optical component and a second flat plate formed by vapor-depositing on both surfaces thereof a third band-pass filter that reflects the first wavelength optical signal and transmits the second and third wavelength optical signals. Wherein the light emitting element and the optical fiber are arranged so as to face each other, the light emitting and receiving element is arranged at a position perpendicular to a center line of the light emitting element, and the first plate-shaped optical part is provided. Outgoing light from the second semiconductor laser is reflected by the first flat optical component and coupled to the optical fiber, and incident light from the optical fiber is transmitted to the first flat optical component. The light emitting element is disposed obliquely with respect to the center line of the light emitting element so that the light is reflected by the component and enters the receiving photodiode. Coupling with the above optical fiber through optical components Light emitted from the second semiconductor laser having passed through the second plate-shaped optical component is reflected by the first plate-shaped optical component, and the optical fiber And the incident light from the optical fiber reflected by the first flat optical component is transmitted through the second flat optical component and is coupled to the receiving photodiode. And the second flat optical component is disposed between the light emitting and receiving element and the second lens.

Further, the optical semiconductor element module of the present invention comprises a light emitting element having a first semiconductor laser and a first monitor photodiode in a package, a second semiconductor laser, a second monitor photodiode, and a receiving photodiode. A light emitting and receiving element contained in a package, first and second lenses, a ferrule, an optical fiber fixed to the ferrule, and an optical signal of a first wavelength emitted from the first semiconductor laser. And a first signal for reflecting an optical signal of a third wavelength incident on the receiving photodiode.
A band pass filter is deposited on one side, transmits the optical signals of the first and third wavelengths, and reflects an optical signal of a second wavelength emitted from the second semiconductor laser. A wedge-shaped optical component having a second bandpass filter deposited on the other surface thereof; and a third wedge-shaped optical component reflecting the first wavelength optical signal and transmitting the second and third wavelength optical signals. A band-pass filter on both sides of which is disposed a flat optical component, the light-emitting element and the optical fiber are arranged so as to face each other, and the light-emitting and light-receiving element is arranged at a position perpendicular to the center line of the light-emitting element. The light emitted from the second semiconductor laser is reflected by the wedge-shaped optical component to be coupled to the optical fiber, and the incident light from the optical fiber is transmitted through the wedge-shaped optical component. Reflected by the optical components Credit placed obliquely to the center line of the light emitting device to be incident on the photodiode, the first
Is disposed such that light emitted from the first semiconductor laser passes through the wedge-shaped optical component and couples with the optical fiber, and the second lens passes through the flat optical component. Outgoing light from the second semiconductor laser is reflected by the wedge-shaped optical component, coupled to the optical fiber, and incident light from the optical fiber reflected by the wedge-shaped optical component is reflected by the flat plate. The optical element is disposed so as to be optimally coupled to the receiving photodiode through the optical element, and the flat optical element is disposed between the light emitting and receiving element and the second lens.

Further, the optical semiconductor device module of the present invention has a first light emitting device in which a first semiconductor laser and a first monitor photodiode are housed in a package, a second and a third semiconductor lasers, and a second and a third semiconductor lasers. A second light-emitting element containing the third monitor photodiode in a package, a first and a second lens, a ferrule, an optical fiber fixed to the ferrule, and a first light emitted from the first semiconductor laser.
A first band-pass filter that transmits an optical signal having a wavelength of? And that reflects an optical signal having a third wavelength emitted from the third semiconductor laser is deposited on one side;
A wedge-shaped second band-pass filter that transmits an optical signal of a third wavelength and reflects an optical signal of a second wavelength emitted from the second semiconductor laser is deposited on the other surface. An optical component, wherein the first light emitting element and the optical fiber are arranged so as to face each other, the second light emitting element is arranged at a position perpendicular to a center line of the first light emitting element, and the wedge is provided. Shaped optical components are arranged obliquely with respect to the center line of the first light emitting element so that light emitted from the second and third semiconductor lasers is reflected by the wedge shaped optical components and coupled to the optical fiber. Then, the first lens is disposed so that light emitted from the first semiconductor laser passes through the wedge-shaped optical component and is coupled to the optical fiber, and the second lens is disposed in the second lens. The light emitted from the third semiconductor laser is Is reflected by the serial wedge-shaped optical component is obtained by arranged to couple with said optical fiber.

Further, the optical semiconductor device module of the present invention has a light emitting device in which a first semiconductor laser and a first monitor photodiode are contained in a package, and a light receiving device in which first and second receiving photodiodes are contained in a package. A first and a second lens, a ferrule, an optical fiber fixed to the ferrule, an optical signal of a first wavelength emitted from the first semiconductor laser, and A first band-pass filter for reflecting an optical signal of a third wavelength incident on a receiving photodiode of the present invention is vapor-deposited on one side, and transmits an optical signal of the first and third wavelengths; The second incident on the first receiving photodiode
A wedge-shaped optical component in which a second bandpass filter that reflects an optical signal having a wavelength of 蒸 着 is vapor-deposited on the other surface; and a second and third optical component that reflects the optical signal having the first wavelength. A flat optical component having a third band-pass filter that transmits a light signal of a wavelength deposited on both sides thereof, wherein the light-emitting element and the optical fiber are arranged to face each other, and the light-receiving element is located at the center of the light-emitting element. Place it perpendicular to the line,
The wedge-shaped optical component is arranged obliquely with respect to a center line of the light emitting element such that incident light from the optical fiber is reflected by the wedge-shaped optical component and enters the first and second receiving photodiodes. Then, the first lens is moved to the first lens.
The light emitted from the semiconductor laser is transmitted through the wedge-shaped optical component and is coupled with the optical fiber, and the second lens is reflected from the optical fiber reflected by the wedge-shaped optical component. Light incident on the first and second receiving photodiodes is transmitted through the flat optical component, and is arranged so as to be coupled to the first and second receiving photodiodes, respectively. The light receiving element and the second
Are arranged between the lenses.

Further, the optical semiconductor element module of the present invention comprises a first light receiving element having first and second receiving photodiodes contained in a package, a second light receiving element having a third receiving photodiode, A first lens, a second lens, a ferrule, an optical fiber fixed to the ferrule, and a third light incident on the third receiving photodiode.
A first band-pass filter that transmits an optical signal having a wavelength of? And that reflects an optical signal having a second wavelength incident on the second receiving photodiode is deposited on one side; A wedge shape in which a second band-pass filter that reflects an optical signal of a first wavelength incident on a receiving photodiode and transmits the optical signals of the second and third wavelengths is deposited on the other surface. And a flat optical component having a third band-pass filter that reflects the third wavelength optical signal and transmits the first and second wavelength optical signals deposited on both sides thereof. Wherein the second light receiving element and the optical fiber are arranged to face each other, the first light receiving element is arranged at a position perpendicular to the center line of the second light receiving element, and the wedge-shaped optical The incident light from the optical fiber is Are arranged obliquely with respect to the center line of the light emitting element so that the light is reflected by the optical component of the first and second receiving photodiodes and is incident on the first lens. And the second lens is arranged to penetrate the third receiving photodiode through the optical element, and the first lens and the second lens from the optical fiber reflected by the wedge-shaped optical element. The light incident on the receiving photodiode is transmitted through the plate-shaped optical component and is coupled to each of the first and second receiving photodiodes, and the plate-shaped optical component is connected to the light-receiving element and the second light-receiving element. Are arranged between the lenses.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. 1 is a diagram showing only a part related to an optical system in an optical semiconductor element module according to Embodiment 1 of the present invention. In the figure, 7 and 8 are the same as those of the conventional optical semiconductor device module, 11 is a first semiconductor laser, 12 is a first LD submount, 13 is a first block, and 14 is a first semiconductor laser 11. A first monitor photodiode for monitoring the light output of the first PD submount, 15 a first PD submount, 16 a first cap, 17 a first window glass,
18 is a first stem, 19 is a first lead terminal, 20 is a first lens for condensing light emitted from the first semiconductor laser 11, 21 is a second semiconductor laser, and 22 is a second LD.
23, a second block; 24, a second monitor photodiode for monitoring the optical output of the second semiconductor laser 21; 25, a receiving photodiode;
Is a second PD submount of the second monitor photodiode 24 and the receiving photodiode 25, 27 is a second cap, 28 is a second window glass, 29 is a second stem, 3
0 is the second lead terminal, 31 is the second semiconductor laser 21
A second lens 32 for condensing the light emitted from the device and the light incident on the receiving photodiode 25;
Reference numeral 3 denotes a first bandpass filter formed on the surface of the first flat glass 32 on the side of the first semiconductor laser 11 by vapor deposition, and reference numeral 34 denotes a first bandpass filter 33 formed on the first flat glass 32. A second band-pass filter formed by vapor deposition on a surface opposite to the above, 35 is a second flat glass, 36 is a third band-pass filter formed on both surfaces of the second flat glass 35, and A is The light emitting element B constituted by 19 is a light emitting and receiving element constituted by 21 to 30 described above.

The first and second semiconductor lasers 11 and 21 are attached to first and second LD submounts 12 and 22, respectively, and the first and second LD submounts 12 and 22 are attached to first and second LD submounts 12, 22, respectively. In blocks 13 and 23, first and second monitor photodiodes 14 and 24 are provided with first and second PD submounts 15,
26, and the receiving photodiode 25 is a second PD.
The first and second blocks 13 and 23 and the first and second blocks 13 and 23 are fixed to the submount 26 by solder, respectively.
The first and second PD submounts 15 and 26 are made of solder, respectively.
Are fixed to the stems 18 and 29 of FIG. The first and second stems 18 and 29 are respectively provided with first and second lead terminals 19,
30 for electrical connection to the outside. The first and second window glasses 17 and 28 are fixed to the first and second caps 16 and 27 with low melting point glass so as to be airtight.
And the first monitor photodiode 14 are connected to the first cap 1
6, the first semiconductor glass 21, the second monitor photodiode 24, and the receiving photodiode 25 are formed by the first window glass 17 and the first stem 18, and the second cap 27, the second window glass 28 It is hermetically sealed by the second stem 29. The light-emitting element A and the light-emitting and light-receiving element B are composed of 11 to 19 and 21 to 30, respectively.

The first band-pass filter 33 transmits an optical signal of a first wavelength, which is light emitted from the first semiconductor laser 11, and is third light, which is light incident on the photodiode 25 for reception. This is a dielectric multilayer film designed to reflect a signal, and is formed on the surface of the first flat glass 32 on the side of the first semiconductor laser 11 by vapor deposition. The second bandpass filter 34 transmits an optical signal of a first wavelength that is light emitted from the first semiconductor laser 11 and an optical signal of a third wavelength that is light incident on the photodiode 25 for reception. Further, it is a dielectric multilayer film designed to reflect an optical signal of the second wavelength which is the light emitted from the second semiconductor laser 21, and is provided on the surface of the first flat glass 32 on the optical fiber 7 side. It is formed by vapor deposition. The third band-pass filter 36 reflects an optical signal of the first wavelength, which is the light emitted from the first semiconductor laser 11, and has a second wavelength, which is the light emitted from the second semiconductor laser 21. A dielectric multilayer film designed to transmit an optical signal and a third optical signal that is incident light on the receiving photodiode 25;
Are formed on both sides of the flat glass 35 by vapor deposition.

The second flat glass 35 is provided between the second lens 31 and the second window glass 28, and an optical signal having a first wavelength, which is the light emitted from the first semiconductor laser 11, is output. Near-end crosstalk caused by irregular reflection at the first and second band-pass filters 33 and 34 formed on the first flat glass 32, repeated reflection inside the module, and finally incident on the receiving photodiode 25. It is installed for the purpose of preventing The first lens 20 condenses an optical signal emitted from the first semiconductor laser 11 and transmits the first and second band-pass filters 33 and 34 formed on the first flat glass 32. The position is adjusted and fixed so as to be optimally coupled to the optical fiber 7. The second lens 31 condenses an optical signal emitted from the second semiconductor laser 21 and transmitted through a third band-pass filter 36 formed on both surfaces of the second flat glass 35 to form a first lens. The optical signal of the third wavelength reflected by the second band-pass filter 34 formed on the flat glass 32 and optimally coupled to the optical fiber 7 and incident on the receiving photodiode 25 is
The third band formed on both surfaces of the second flat glass 35 after being incident from the optical fiber 7 and condensed after being reflected by the first band pass filter 34 formed on the first flat glass 32. The position is adjusted and fixed so that the light passes through the pass filter 36 and enters the receiving photodiode 25 optimally. The optical fiber 7 is fixed to the ferrule 8 with an adhesive, and the tip of the optical fiber 7 is polished obliquely.

Next, the operation will be described. The optical signal of the first wavelength emitted from the first semiconductor laser 11 is condensed by the first lens 20 and then the first flat glass 32
First and second band-pass filters 33, 3
4 is coupled to the optical fiber 7 and emitted from the second semiconductor laser 21 at a second wavelength. The optical signal having the second wavelength is applied to a third bandpass filter 36 formed on both surfaces of the second flat glass 35. And is condensed by the second lens 31, is reflected by the second bandpass filter 34 formed on the first flat glass 32, is coupled to the optical fiber 7, and enters the photodiode 25 for reception. The optical signal having the third wavelength is input from the optical fiber 7, and then passes through the second bandpass filter 34 formed on the first flat glass 32. The light is reflected by the first band-pass filter 33 formed on the surface, passes through the second band-pass filter 34 again, is condensed by the second lens 31, and is formed on both surfaces of the second flat glass 35. Third band pass And it enters the receiving photodiode 25 is transmitted through the filter 36.

As described above, the light emitting and receiving element B in which the second semiconductor laser 21, the second monitor photodiode 24, and the receiving photodiode 25 are contained in one package.
And first and second bandpass filters 3 having different characteristics
By using the first flat glass 32 in which the first and second glass plates 3 and 34 are formed on one side, components having the same size and the same size as the conventional two-wavelength bidirectional wavelength division multiplexing optical semiconductor element module are used. And the same design position accuracy, and
An optical semiconductor device module for three-way bidirectional wavelength division multiplexing communication in which the transmission multiplex wavelength is increased by one wavelength can be configured.

Further, as another embodiment of the present invention,
The first wavelength that is the light emitted from the first semiconductor laser 11 in FIG. 1 and the third wavelength that is the light incident on the photodiode 25 for reception are both set to the first wavelength, and the first bandpass filter 33 is used. Is changed to a translucent film for the optical signal of the first wavelength, and the second flat glass 35 on which the third bandpass filter 36 is formed is removed.
An optical semiconductor element module for bidirectional wavelength multiplexing communication of two wavelengths that transmits and receives an optical signal of a first wavelength and transmits an optical signal of a second wavelength can be configured.

Embodiment 2 FIG. 2 is a diagram showing an optical semiconductor device module according to Embodiment 2 of the present invention. In the figure, 7, 8, 11 to 31, and 33 to 36 are the same as those of the first embodiment,
37 is a wedge-shaped glass. This wedge-shaped glass 37
Is replaced with the first flat glass 32 used in the first embodiment, and the first and second band-pass filters 33 and 34 are formed on both surfaces by vapor deposition similarly to the first flat glass 32. It was done.

Next, the operation will be described. After the optical signal of the first wavelength emitted from the first semiconductor laser 11 is condensed by the first lens 20, the first and second band pass filters 33 and 34 formed on the wedge glass 37.
The optical signal of the second wavelength emitted from the second semiconductor laser 21 and transmitted to the optical fiber 7 passes through the third band-pass filter 36 formed on both surfaces of the flat glass 35.
And is condensed by the second lens 31, then reflected by the second band-pass filter 34 formed on the wedge glass 37, coupled to the optical fiber 7, and incident on the receiving photodiode 25. After the optical signal of the third wavelength enters from the optical fiber 7, it passes through the second band-pass filter 34 formed on the wedge-shaped glass 37, and passes through the second band-pass filter 34 formed on the other surface of the wedge-shaped glass 37. The light is reflected by the first bandpass filter 33, passes through the second bandpass filter 34 again, is condensed by the second lens 31, and passes through the third bandpass filters 36 formed on both surfaces of the flat glass 35. Then, the light is incident on the receiving photodiode 25.

Here, the difference from the first embodiment is as follows. That is, since the wedge-shaped glass 37 has an angle with respect to the surface on which the second bandpass filter 34 is formed by the amount of the wedge, the light of the third wavelength incident on the receiving photodiode 25 is emitted. The signal is first
The reflection angle with respect to the normal when reflected by the band-pass filter 33 is smaller than the angle reflected by the first band-pass filter 33 in FIG. 1 described in the first embodiment. For this reason, the output angle and the output position with respect to the normal when the optical signal of the third wavelength passes through the second band-pass filter 34 again are smaller than those in the first embodiment. The emission position is near the center axis of the optical fiber 7. As a result, the outgoing light transmitted through the second band-pass filter 34 does not vignet due to the limitation of the numerical aperture of the second lens 31, and the degree of freedom in designing the second lens 31 can be increased. .

As described above, the light emitting / receiving element B in which the second semiconductor laser 21, the second monitor photodiode 24, and the receiving photodiode 25 are contained in one package,
First and second bandpass filters 33, 3 having different characteristics
By using the wedge-shaped glass 37 formed on one side of each, the same size and the same size as the conventional two-wavelength bidirectional wavelength division multiplexing optical semiconductor element module for two-wavelength communication are used. A three-wavelength optical semiconductor element module for bidirectional wavelength division multiplex communication in which the design position accuracy is achieved, the degree of freedom of design of the second lens 31 can be increased, and the transmission multiplex wavelength is increased by one wavelength. Can be.

Further, as another embodiment of the present invention,
The first wavelength that is the light emitted from the first semiconductor laser 11 in FIG. 2 and the third wavelength that is the light incident on the photodiode 25 for reception are both set to the first wavelength, and the first bandpass filter 33 is used. Is changed to a translucent film for the optical signal of the first wavelength, and by removing the flat glass 35 on which the third band-pass filter 36 is formed, transmission and reception of the optical signal of the first wavelength, and An optical semiconductor element module for two-wavelength bidirectional wavelength division multiplexing communication for transmitting optical signals of two wavelengths can be configured.

Third Embodiment FIG. 3 is a view showing an optical semiconductor device module according to a third embodiment of the present invention. In the figure, 7, 8, 11 to 24, 26 to 31, and 33 to 37 are the same as those in the second embodiment, 38 is a semiconductor laser, 39 is a third LD submount, and 40 is a third semiconductor. A third monitor photodiode for monitoring the light output of the laser 38,
41 is a third PD submount, C is 2 from the above 21
The second consisting of 4, 26 to 30, 38 to 41
Is a light emitting element. The characteristics of the first and second band-pass filters 33 and 34 are the same as those used in the second embodiment, and the light incident on the receiving photodiode 25 used in the second embodiment is A third wavelength,
What is necessary is just to replace it with the third wavelength which is the light emitted from the third semiconductor laser 38. In this embodiment, since near-end crosstalk is not difficult, the flat glass 35 used in the second embodiment and the third band-pass filters 36 formed on both sides of the flat glass 35 are unnecessary. It has been removed.

Next, the operation will be described. After the optical signal of the first wavelength emitted from the first semiconductor laser 11 is condensed by the first lens 20, the first and second band pass filters 33 and 34 formed on the wedge glass 37.
The optical signal of the second wavelength emitted from the second semiconductor laser 21 is transmitted to the optical fiber 7 and condensed by the second lens 31 and then formed on the wedge-shaped glass 37. The optical signal of the third wavelength, which is reflected by the second band-pass filter 34 and coupled to the optical fiber 7 and emitted from the third semiconductor laser 38, is collected by the second lens 31 and then wedges. The light passes through the second band-pass filter 34 formed in the shape 37, is reflected by the first band-pass filter 33 formed on the other surface of the wedge 37, and passes through the second band-pass filter 34 again. To the optical fiber 7.

As described above, the second and third semiconductor lasers 21 and 38 and the second and third monitor photodiodes 24,
A second light emitting element C containing 40 in one package;
First and second bandpass filters 33, 3 having different characteristics
By using the wedge-shaped glass 37 formed on one side of each, the same size and the same size as the conventional two-wavelength bidirectional wavelength division multiplexing optical semiconductor element module for two-wavelength communication are used. It is possible to increase the design position accuracy, increase the degree of freedom in designing the second lens 31, and configure an optical semiconductor element module for three-wavelength multiplex transmission.

Embodiment 4 FIG. 4 is a view showing an optical semiconductor device module according to Embodiment 4 of the present invention. In the figure, 7, 8, 11 to 20, 25 to 31, and 33 to 37 are the same as those in the second embodiment, and 42 is a second receiving photodiode (the receiving photodiode 25 is a first receiving photodiode). ), 43 are PD blocks, D is 25 to 30, 4
2 and 43. Also, the first, second, and third band-pass filters 33, 34, 36
Are the same as those used in the second embodiment.
Second semiconductor laser 21 used in the second embodiment
And a third wavelength, which is light incident on the receiving photodiode 25, respectively.
May be replaced with the light incident on the receiving photodiodes 25 and 42.

Next, the operation will be described. After the optical signal of the first wavelength emitted from the first semiconductor laser 11 is condensed by the first lens 20, the first and second band pass filters 33 and 34 formed on the wedge glass 37.
The optical signal of the second wavelength which is transmitted through the optical fiber 7 and is incident on the first receiving photodiode 25 is incident on the optical fiber 7 and then formed on the second wedge-shaped glass 37. Reflected by the band-pass filter 34 of the second
The light is condensed by the lens 31, passes through the third band-pass filters 36 formed on both surfaces of the flat glass 35, is incident on the first receiving photodiode 25, and is incident on the second receiving photodiode 42. The optical signal of the third wavelength enters the wedge-shaped glass 3 after entering from the optical fiber 7.
7, through the second band-pass filter 34 formed in
The light is reflected by the first band-pass filter 33 formed on the other surface of the wedge-shaped glass 37, passes through the second band-pass filter 34 again, is condensed by the second lens 31, and is formed on both surfaces of the flat glass 35. Then, the light passes through the third band-pass filter 36 formed on the second photodiode 42 and enters the second receiving photodiode 42.

As described above, the light receiving element D in which the first and second receiving photodiodes 25 and 42 are housed in one package and the first and second band pass filters 33 and 34 having different characteristics are each provided on one side. By using the wedge-shaped glass 37 formed as described above, the same size and the same size components as those of the conventional two-wavelength bidirectional wavelength division multiplexing optical semiconductor element module are used, and the same design position accuracy is obtained. Further, the degree of freedom in designing the second lens 31 can be increased,
In addition, an optical semiconductor element module for bidirectional wavelength multiplex communication of three wavelengths in which the reception multiplex wavelength is increased by one wavelength can be configured.

Further, as another embodiment of the present invention,
The first wavelength, which is the light emitted from the first semiconductor laser 11 in FIG. 4, and the third wavelength, which is the light incident on the second photodiode 42, are the same first wavelength.
Is changed to a translucent film for the optical signal of the first wavelength, and the flat glass 35 on which the third band-pass filter 36 is formed is removed, whereby the optical signal of the first wavelength is removed. An optical semiconductor element module for two-way bidirectional wavelength division multiplexing communication that transmits and receives and receives an optical signal of the second wavelength can be configured.

Embodiment 5 FIG. 5 is a view showing an optical semiconductor device module according to Embodiment 5 of the present invention. In the drawing, 7, 8, 16 to 43 are the same as those of the fourth embodiment, 44 is a third receiving photodiode, 45 is a second PD block, and E is composed of the above 15 to 19, 44 and 45. A second light receiving element. The wavelengths of the optical signals incident on the first, second, and third receiving photodiodes 24, 42, and 44 are first, second, and third wavelength optical signals, respectively. Reference numeral 33 denotes a dielectric multi-layer film designed to reflect the optical signal of the second wavelength and transmit the optical signal of the third wavelength.
Reference numeral 4 may be replaced with a dielectric multilayer film designed to reflect the optical signal of the first wavelength and transmit the optical signals of the second and third wavelengths. Embodiment 1
Although the problem of the near-end crosstalk from the first semiconductor laser 11 as shown in FIG.
The optical signal of the third wavelength, which is the light received by the first and second band-pass filters 33 and 34, is irregularly reflected by the first and second band-pass filters 33 and 34, and the cross-talk caused by entering the first and second receiving photodiodes 25 and 42 is reduced. For the purpose of prevention, it is necessary to install the flat glass 35 used in the fourth embodiment and the third bandpass filters 36 formed on both sides of the flat glass 35.

Next, the operation will be described. The optical signal of the first wavelength that is incident on the first receiving photodiode 25 is incident on the optical fiber 7 and then the wedge-shaped glass 3.
7, the light is reflected by the second band-pass filter 34 formed by the second lens 31 and condensed by the second lens 31.
The optical signal of the second wavelength, which is transmitted through the third band-pass filter 36 formed on both surfaces of the first photodiode and incident on the first receiving photodiode 25 and incident on the second receiving photodiode 42, 7, a second band-pass filter 34 formed on a wedge-shaped glass 37.
Through the first surface of the wedge-shaped glass 37
Is reflected by the band-pass filter 33, passes through the second band-pass filter 34 again, is collected by the second lens 31, and passes through the third band-pass filter 36 formed on both surfaces of the flat glass 35. Incident on the second receiving photodiode 42 and the third receiving photodiode 4
The optical signal having the third wavelength incident on the optical fiber 4 is transmitted through the first and second band-pass filters 33 and 34 formed on the wedge-shaped glass 37 after being incident on the optical fiber 7, and then the first optical signal is transmitted through the first and second band-pass filters 33 and 34. The light is condensed by the lens 20 and is incident on the third receiving photodiode 44.

As described above, the first light receiving element D in which the first and second receiving photodiodes 25 and 42 are contained in one package and the first and second band pass filters 33 and 34 having different characteristics. Are formed on one side, and the same size, the same size, and the same design as the conventional two-wavelength bidirectional wavelength division multiplexing optical semiconductor element module are used. Position accuracy,
Further, an optical semiconductor element module for three-wavelength multiplex reception that can increase the degree of freedom in designing the second lens 31 can be configured.

[0035]

According to the present invention, a light emitting and receiving device in which a second semiconductor laser, a second monitor photodiode and a receiving photodiode are housed in a package, and first and second bandpass filters having different characteristics are provided. By using the first flat optical component formed on one side, a component having the same size and the same size as the conventional two-wavelength bidirectional wavelength division multiplexing optical semiconductor element module can be used. It is possible to configure an optical semiconductor element module for bidirectional wavelength division multiplexing communication of three wavelengths in which the design position accuracy is set to 1 and the transmission multiplex wavelength is increased by one wavelength.

According to the present invention, a light emitting and receiving element in which a second semiconductor laser, a second monitor photodiode and a receiving photodiode are housed in a package, and first and second bandpass filters having different characteristics are provided on one side. By using the formed wedge-shaped optical parts, the same size and the same size as the conventional two-wavelength bidirectional wavelength division multiplexing optical semiconductor element module are used, and the same design position accuracy is obtained. Further, the degree of freedom in designing the second lens 31 can be increased, and a three-wavelength bidirectional wavelength multiplexing communication optical semiconductor element module can be configured by increasing the transmission multiplexing wavelength by one wavelength.

According to the present invention, the light emitting element in which the second and third semiconductor lasers and the second and third monitor photodiodes are packaged, and the first and second bandpass filters having different characteristics are provided on one side. By using the wedge-shaped optical components formed in the above, the same size and the same size components as those of the conventional two-wavelength bidirectional wavelength division multiplexing optical semiconductor element module are used, and the same design position accuracy is used. Further, the degree of freedom in designing the second lens 31 can be increased,
Further, an optical semiconductor element module for three-wavelength multiplex transmission can be configured.

According to the present invention, a wedge-shaped optical component in which first and second receiving photodiodes are housed in a package and first and second band-pass filters having different characteristics are formed on one side, respectively. By using the same size and the same size components as the conventional two-wavelength bidirectional wavelength division multiplexing optical semiconductor device module for bidirectional wavelength multiplexing communication, the same design position accuracy is achieved, and the second lens 31 can increase the degree of freedom of design, and can configure an optical semiconductor element module for bidirectional wavelength multiplex communication of three wavelengths in which the number of multiplexed wavelengths for reception is increased by one.

According to the present invention, a wedge-shaped optical component in which first and second receiving photodiodes are housed in a package and first and second bandpass filters having different characteristics are formed on one side, respectively. By using the same size and the same size components as the conventional two-wavelength bidirectional wavelength division multiplexing optical semiconductor device module for bidirectional wavelength multiplexing communication, the same design position accuracy is achieved, and the second lens Thus, an optical semiconductor device module for three-wavelength multiplex reception, which can increase the degree of freedom of design of the optical semiconductor device, can be configured.

[Brief description of the drawings]

FIG. 1 is a diagram showing Embodiment 1 of an optical semiconductor element module according to the present invention.

FIG. 2 is a diagram showing Embodiment 2 of the optical semiconductor element module according to the present invention.

FIG. 3 is a diagram showing Embodiment 3 of the optical semiconductor element module according to the present invention.

FIG. 4 is a diagram showing a fourth embodiment of the optical semiconductor element module according to the present invention.

FIG. 5 is a diagram showing Embodiment 5 of an optical semiconductor element module according to the present invention.

FIG. 6 is a view showing a conventional optical semiconductor element module.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 light emitting element 2 light receiving element 3 lens 4 light separation filter 5 bandpass filter 6 case 7 optical fiber 8 ferrule 9 optical fiber holder 10 light receiving element holder 11 first semiconductor laser 12 first LD submount 13 first block Reference Signs List 14 first monitor photodiode 15 first PD submount 16 first cap 17 first window glass 18 first stem 19 first lead terminal 20 first lens 21 second semiconductor laser 22 second LD submount 23 second block 24 second monitor photodiode 25 receiving photodiode 26 second PD submount 27 second cap 28 second window glass 29 second stem 30 second lead terminal 31 second Lens 32 first flat glass 33 first bandpass filter (C) 34 second bandpass filter 35 second flat glass 36 third bandpass filter 37 wedge glass 38 third semiconductor laser 39 third LD submount 40 third monitor photodiode 41 third PD sub Mount 42 Second receiving photodiode 43 PD block 44 Third receiving photodiode 45 Second PD block A Light emitting element B Light emitting and receiving element C Second light emitting element D Light receiving element E Second light receiving element

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01S 3/18 H01L 31/02 C

Claims (5)

[Claims] A light-emitting element containing a first semiconductor laser and a first monitor photodiode in a package; a light-emitting and light-receiving element containing a second semiconductor laser, a second monitor photodiode, and a receiving photodiode in a package; A first lens, a second lens, a ferrule, an optical fiber fixed to the ferrule, an optical signal of a first wavelength emitted from the first semiconductor laser, and transmitted to the receiving photodiode. A first band-pass filter for reflecting an incident third-wavelength optical signal is deposited on one side, the first and third-wavelength optical signals are transmitted, and the second semiconductor laser is transmitted. A first plate-shaped optical component having a second bandpass filter for reflecting an optical signal of a second wavelength emitted from the other surface deposited on the other surface, and reflecting the optical signal of the first wavelength; Or A second plate-shaped optical component having a third bandpass filter that transmits optical signals of the second and third wavelengths deposited on both sides thereof, such that the light-emitting element faces the optical fiber. The light-emitting and light-receiving element is disposed at a position perpendicular to the center line of the light-emitting element, and the first plate-like optical component is used for emitting light from the second semiconductor laser to the first plate-like light. Reflected by the optical component and coupled to the optical fiber, and incident light from the optical fiber is reflected by the first plate-shaped optical component to enter the receiving photodiode. The first lens is disposed obliquely with respect to a line, and the first lens is disposed such that light emitted from the first semiconductor laser passes through the first flat optical component and couples with the optical fiber; The second lens is the second flat plate The outgoing light from the second semiconductor laser that has passed through the optical component is reflected by the first flat optical component, coupled with the optical fiber, and reflected by the first flat optical component. Arranged so that incident light from the optical fiber passes through the second flat optical component and couples with the receiving photodiode, and connects the second flat optical component to the light emitting and receiving element and the second flat optical component. An optical semiconductor element module, which is disposed between lenses. 2. A light emitting device in which a first semiconductor laser and a first monitor photodiode are contained in a package, a light emitting and receiving device in which a second semiconductor laser, a second monitor photodiode and a receiving photodiode are contained in a package, A first lens, a second lens, a ferrule, an optical fiber fixed to the ferrule, an optical signal of a first wavelength emitted from the first semiconductor laser, and transmitted to the receiving photodiode. A first band-pass filter for reflecting an incident third-wavelength optical signal is deposited on one side, the first and third-wavelength optical signals are transmitted, and the second semiconductor laser is transmitted. A wedge-shaped optical component in which a second bandpass filter for reflecting an optical signal of a second wavelength emitted from the other surface is vapor-deposited on the other surface, and reflects the optical signal of the first wavelength, and A plate-shaped optical component having a third band-pass filter transmitting both the second and third wavelength optical signals deposited on both surfaces thereof, wherein the light-emitting element and the optical fiber are arranged to face each other, The light receiving element is arranged at a position perpendicular to the center line of the light emitting element, and the light emitted from the second semiconductor laser reflects the wedge-shaped optical component by the wedge-shaped optical component to the optical fiber. Coupled, and arranged obliquely with respect to the center line of the light emitting element so that incident light from the optical fiber is reflected by the wedge-shaped optical component and enters the receiving photodiode, and the first lens is The light emitted from the first semiconductor laser is disposed so as to pass through the wedge-shaped optical component and is coupled to the optical fiber, and the second lens is transmitted through the flat optical component. Half of The outgoing light from the body laser is reflected by the wedge-shaped optical component, is coupled to the optical fiber, and the incident light from the optical fiber reflected by the wedge-shaped optical component is the flat optical component. An optical semiconductor element module, wherein the optical element is disposed so as to be coupled to the receiving photodiode while transmitting the light, and the flat optical component is disposed between the light emitting and receiving element and the second lens. 3. A first light emitting element containing a first semiconductor laser and a first monitor photodiode in a package, and second and third semiconductor lasers and a second and a third monitor photodiode in a package. A second light emitting element;
A second lens, a ferrule, an optical fiber fixed to the ferrule, and an optical signal of a first wavelength emitted from the first semiconductor laser, and emitted from the third semiconductor laser. A first band-pass filter for reflecting an optical signal of a third wavelength to be deposited on one side;
A second bandpass filter that transmits the optical signals of the first and third wavelengths and reflects the optical signal of the second wavelength emitted from the second semiconductor laser is deposited on the other surface. A wedge-shaped optical component, wherein the first light emitting element and the optical fiber are arranged to face each other, and the second light emitting element is arranged at a position perpendicular to a center line of the first light emitting element. And the wedge-shaped optical component is replaced with the second,
The first light is emitted from the third semiconductor laser so as to be reflected by the wedge-shaped optical component and coupled to the optical fiber.
And the first lens is arranged so that light emitted from the first semiconductor laser passes through the wedge-shaped optical component and couples with the optical fiber. An optical semiconductor element module, wherein the second lens is arranged such that light emitted from the second and third semiconductor lasers is reflected by the wedge-shaped optical components and coupled to the optical fiber. 4. A light-emitting element containing a first semiconductor laser and a first monitor photodiode in a package, a light-receiving element containing first and second receiving photodiodes in a package, and first and second lenses. A ferrule, an optical fiber fixed to the ferrule, and a second optical fiber that transmits an optical signal of a first wavelength emitted from the first semiconductor laser and is incident on the second receiving photodiode. 3
A first band-pass filter that reflects an optical signal having a wavelength of is deposited on one surface, and transmits an optical signal having the first and third wavelengths and is incident on the first receiving photodiode. A wedge-shaped optical component having a second bandpass filter for reflecting an optical signal of a second wavelength deposited on the other surface; an optical component for reflecting the optical signal of the first wavelength; A plate-shaped optical component having a third band-pass filter that transmits an optical signal having a wavelength of 3 on both surfaces thereof, wherein the light-emitting element and the optical fiber are arranged to face each other, and the light-receiving element is the light-emitting element Are arranged at a position perpendicular to the center line of the wedge-shaped optical component, and the incident light from the optical fiber is reflected by the wedge-shaped optical component and is incident on the first and second receiving photodiodes. To the center line of the light emitting element And the first lens is disposed so that light emitted from the first semiconductor laser passes through the wedge-shaped optical component and couples with the optical fiber. Light incident on the first and second receiving photodiodes from the optical fiber reflected by the wedge-shaped optical component passes through the plate-shaped optical component, and the first and second receiving photodiodes respectively. An optical semiconductor element module, wherein the optical element is arranged to be coupled to a photodiode, and the flat optical component is arranged between the light receiving element and the second lens. 5. A first light receiving element containing first and second receiving photodiodes in a package, a second light receiving element having a third receiving photodiode, first and second lenses, A ferrule, an optical fiber fixed to the ferrule, and a second optical signal that transmits an optical signal of a third wavelength incident on the third receiving photodiode and is incident on the second receiving photodiode. A first band-pass filter for reflecting an optical signal having a wavelength of is vapor-deposited on one side, and a first band-pass filter incident on the first receiving photodiode is formed.
A wedge-shaped optical component in which a second band-pass filter that reflects an optical signal having a wavelength of? And transmits the optical signals having the second and third wavelengths is deposited on the other surface; A flat optical component having a third band-pass filter that reflects an optical signal of a wavelength and transmits the optical signals of the first and second wavelengths on both surfaces, and the second light receiving element And the optical fiber are disposed so as to face each other, the first light receiving element is disposed at a position perpendicular to the center line of the second light receiving element, and the wedge-shaped optical component is incident light from the optical fiber. Are obliquely arranged with respect to the center line of the light emitting element so as to be reflected by the wedge-shaped optical component and enter the first and second receiving photodiodes, and the first lens is incident from the optical fiber. Light is transmitted through the wedge-shaped optical components and Third and arranged to bind to the receiving photodiode, said first and said second lens from the optical fiber is reflected by the optical components of the wedge,
Arranged so that light incident on the second receiving photodiode passes through the flat optical component and couples to the first and second receiving photodiodes, respectively, and connects the flat optical component to the light receiving element. An optical semiconductor element module, which is disposed between second lenses.