JPH10198777A - Pc card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the reliability at the connection part between an electrostatic clip and a built-in substrate by forming a press contact part between the said clip and the built-in substrate on the surface of the built-in substrate that is set opposite to a 2nd panel. SOLUTION: An electrostatic clip 5 is laterally inserted to a PC card and attached to a casing 2 through the open side of the clip 5 by means of a gap secured by a positioning groove 10 after a 1st panel 3 and a built-in substrate 4 are attached to the casing 2. Thus, an angular contact piece 5B is built into the card while the piece 5B is touching the lower side surface of the substrate 4. A ground part is also formed at the position of the substrate 4 that is touched by the piece 5B. The piece 5B is soldered to the substrate 4. This soldering attains the sure connection to the ground and then improves the reliability at the connection part between the clip 5 and the substrate 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a PC (program co
unter) It relates to the structure of the card.

[0002]

14 to 17 show an example of a conventional PC card. FIG. 14 is an overall perspective view, FIG. 15 is an exploded perspective view of a main part thereof, and FIG. 16 is a DD line of FIG. 17 is a cross-sectional view showing a state where some of the element members are not attached. 14 to 17, the PC card 101 is roughly composed of a housing 102,
It comprises a metal tray-shaped first panel 103, a built-in substrate 104, an electrostatic clip 105, a metal tray-shaped second panel 106, and the like.

More specifically, the housing 102 has an opening 107 penetrating vertically (front and back) at a substantially central portion, and the upper side (front side) of the opening 107 is closed.
The first panel 103 is fixedly attached in advance. Further, a groove 110 for mounting the electrostatic clip 105 is formed in the left and right side edge portions of the housing 102, and the groove 110 and a recess 111 formed on the upper surface side of the housing 102 are formed. Thus, the locking portion 112 for attaching the electrostatic clip is formed on the side edge portion.

The electrostatic clip 105 is provided with an engaging portion 105A having a substantially C-shaped cross section for sandwiching the locking portion 112 between upper and lower surfaces, and extending substantially horizontally from one end (front surface) of the engaging portion 105A. A contact piece 105B is formed integrally with the distal end portion 105b, which is bent in the shape of a letter "H" on the other end (back surface) side. The electrostatic clip 105 is also attached to the housing 102 in advance, like the first panel 103. In this attachment, the engaging portion 105A is engaged with the locking portion 112, the tip 105b of the touch piece 105B is in a state of protruding greatly into the opening 107, and the electrostatic clip 105 and the first panel 103 are in contact with each other.

On the other hand, on the lower side (back side) of the housing 102,
The built-in substrate 104 and the second panel 106 are disposed so as to cover the lower side of the opening 107.
At 8, it is fixedly attached to the housing 102. Also,
When the built-in board 104 is attached,
Is pressed against the contact piece 105B of the electrostatic clip 105, and the contact piece 105B comes into contact with the contact piece 105B with elastic bending. A grounding portion 113 is provided on the upper surface of the built-in substrate 104 at a position where it comes into contact with the contact piece 105B, and the grounding portion 113-the electrostatic clip 105-the first panel 1
The structure can be grounded through the third panel and the second panel. FIG. 17 shows a state before the second panel 106 is assembled. Further, in FIGS. 16 and 17, the touch piece 105B drawn in a state of being inserted into the built-in substrate 104 is
Indicates the position where the embedded board 104 is not attached, and the contact piece 105B drawn in contact with the upper surface of the built-in board 104 is when the built-in board 104 is arranged at a predetermined position of the housing 102. The state is shown.

[0006]

However, in the structure of the PC card 101 having the conventional structure described above, the built-in substrate 1
The ground portion 113 of 04 is on the surface facing the first panel 103 already attached to the housing 102, that is, on the front side. Therefore, the first panel 103 hinders the connection between the built-in substrate 104 and the electrostatic clip 105,
Since soldering cannot be performed, only the repulsive force due to the bending of the contact piece 105B results. For this reason, if the repulsive force is weak, the contact force is reduced, and there is a problem that the contact is unstable and lacks reliability.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a PC card having a structure capable of improving the reliability of a connection portion between an electrostatic clip and a built-in substrate. It is in. Further, other objects will be clarified sequentially in the contents described below.

[0008]

Means for Solving the Problems The present invention is characterized by taking the following technical means in order to achieve the above object.
That is, it is formed of a housing, a first panel attached to one surface of the housing, a built-in substrate incorporated in the housing from the other surface of the housing, and an elastic metal plate piece. And an electrostatic clip partially pressed against the built-in substrate and attached to the side surface of the housing, and attached to the housing by covering the other surface of the housing after the built-in substrate is assembled. And a press-contact portion between said part of said electrostatic clip and said built-in substrate is provided on a surface side of said built-in substrate facing said second panel. This is a configuration made up of:

According to this, since a part of the electrostatic clip is pressed against the surface of the built-in substrate facing the side attached to the housing after the built-in substrate is assembled, the second
Before the panel is mounted, the portion where the panel abuts can be fixed between the built-in substrate and the electrostatic clip with solder or the like.

[0010]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Although the embodiments described below are preferred specific examples of the present invention, various technically preferable limitations are added thereto. However, the scope of the present invention is not limited to the particulars described in the following description. It is not limited to these forms unless otherwise stated.

FIGS. 1 to 4 show a first preferred embodiment of a PC card according to the present invention. FIG. 2 is an overall perspective view, FIG. 3 is an exploded perspective view of a main part thereof, and FIG. A of 2
FIG. 4 is an enlarged cross-sectional view along the line A, and FIG. 4 is a cross-sectional view showing a state where some of the element members are not attached. 1 to 4, the PC card 1 includes a housing 2, a metal tray-shaped first panel 3, a built-in board 4,
It is composed of an electrostatic clip 5, a metal tray-shaped second panel 6, and the like.

More specifically, the housing 2 has an opening 7 penetrating vertically (front and back) at a substantially central portion, and the upper side (front side) of the opening 7 is closed so that the first The panel 3 is fixed and attached in advance. In addition, positioning grooves 10 (see FIG. 3) for mounting the electrostatic clips 5 are formed in left and right side edge portions of the housing 2. When the first panel 3 is mounted on the housing 2, the positioning groove 10 is provided between the housing 2 and the first panel 3.
To form a gap into which a can be inserted. On the other hand, on the lower side (back side) of the housing 2, the built-in substrate 4 and the second panel 6 are arranged so as to cover the lower side of the opening 7, and are fixed to the housing 2 with screws 8. Installed. The electrostatic clip 5 is formed of a metal plate having elasticity and has a substantially U-shaped cross section. The end on the side corresponding to the lower surface of the built-in substrate 4 is extended more than the main body portion 5A. The contact piece 5B is formed by folding the back surface of the built-in substrate 4 in a portion.
Is formed.

After the first panel 3 and the built-in substrate 4 are attached to the housing 2, the electrostatic clip 5 utilizes the gap formed by the positioning groove 10 as shown in FIG. Is inserted from the open side of the electrostatic clip 5 into the inside thereof and attached from the lateral direction. Then, as shown in FIG. 1, the contact piece 5 </ b> B formed in the shape of a mountain fold is assembled in a state of being in contact with the lower surface of the built-in substrate 4. A ground portion is formed at the position of the built-in substrate 4 where the touch piece 5B is in contact. Next, the contact piece 5B is soldered to the built-in substrate 4 (a portion indicated by reference numeral 14 in FIGS. 1 and 4), and then the second panel 6 is fixed to the housing 2 with screws 8 to complete the assembly.

Therefore, in the structure of the first embodiment,
Since the contact piece 5B of the electrostatic clip 5 can be soldered to the ground portion of the built-in substrate 4 before attaching the second panel 6, the ground connection can be reliably performed. Thereby, the reliability at the connection portion between the electrostatic clip 5 and the built-in substrate 4 can be improved.

5 to 8 show a second preferred embodiment of the PC card according to the present invention. FIG. 5 is an overall perspective view, FIG. 6 is an exploded perspective view of a main part thereof, and FIG. 5 B
FIG. 8 is an enlarged sectional view taken along the line B, and FIG. 8 is a sectional view showing a state in which some of the element members are not attached. 5 to 8, the PC card 21 is roughly composed of a housing 22 and
It is composed of a metal tray-shaped first panel 23, a built-in substrate 24, an electrostatic clip 25, a metal tray-shaped second panel 26, and the like.

More specifically, the housing 22 has an opening 27 penetrating vertically (front and back) at a substantially central portion.
The first panel 23 is fixedly attached in advance with the upper side (front side) of the opening 27 closed. Also,
Positioning grooves 30 for mounting the electrostatic clips 25 are formed in the left and right side edge portions of the housing 22.
With the recess 31 and the groove 30 formed on the upper surface side, a locking portion 32 for attaching an electrostatic clip is formed on a side edge portion thereof. The electrostatic clip 25 is formed by press-molding an elastic metal plate, and has an engaging portion 25A having a substantially C-shaped cross section for sandwiching the locking portion 32 between upper and lower surfaces, and one end (surface) of the engaging portion 25A. ) Side is extended substantially horizontally, then bent downward at a substantially right angle, and integrally has a contact piece 25B having its tip folded back in a substantially U-shape.

On the other hand, on the lower side (back side) of the housing 22, a built-in substrate 24 and a second panel 26 are disposed so as to cover the lower side of the opening 27, and this is fixed to the housing 22 by screws 28. Fixed and mounted. Notches 34 are formed in the built-in substrate 24 at positions corresponding to the contact pieces 25B. Then, when the built-in board 24 is attached to the housing 22, the touch piece 25B is temporarily elastically deformed outward (in the direction indicated by an arrow 35 in FIG. 8) and released, and the built-in board 2 is released.
4 is arranged at a predetermined position, the tip of the contact piece 25B is self-recovered and is engaged with the back surface of the built-in substrate 24.

That is, in the structure of the second embodiment, after the first panel 23 and the electrostatic clip 25 are mounted on the housing 22 and then the built-in substrate 24 is mounted on the housing 22, When the substrate 24 is disposed to a predetermined position, the contact piece 25B is engaged with the back surface of the built-in substrate 4. A ground portion (not shown) is formed at the position of the built-in substrate 24 where the touch piece 25B is in contact. Next, the contact piece 25
B is soldered to the built-in substrate 24 (a portion indicated by reference numeral 36 in FIGS. 7 and 8), and then the second panel 26 is fixed to the housing 22 with screws 28 to complete the assembly.

Therefore, in the structure of the second embodiment,
Before attaching the second panel 26, the contact piece 25B of the electrostatic clip 25 can be soldered to the ground portion of the built-in substrate 24, so that the ground connection can be reliably performed. Thereby, the reliability at the connection portion between the electrostatic clip 25 and the built-in substrate 24 can be improved.

9 to 12 show a third preferred embodiment of the PC card according to the present invention. FIG. 9 is an overall perspective view, FIG. 10 is an exploded perspective view of a main part thereof, and FIG. 10 is an enlarged cross-sectional view taken along line CC of FIG. 10, and FIG. 12 is a cross-sectional view showing a state where some of the element members are not attached. FIG.
12 to 12, the PC card 41 includes a housing 42 and a first panel 43 in the form of a metal tray.
, A built-in substrate 44, an electrostatic clip 45, and a second panel 46 in the form of a metal tray.

More specifically, the housing 42 has an opening 47 penetrating vertically (front and back) at a substantially central portion.
The first panel 43 is fixed and attached in advance with the upper side (front side) of the opening 47 closed. Also,
Positioning grooves 50 for mounting the electrostatic clips 45 are formed in the left and right side edge portions of the housing 42.
The concave portion 51 and the groove 50 formed on the lower surface side of 2 form a state in which a locking portion 52 for attaching an electrostatic clip is formed on a side edge portion thereof.

As shown in FIG. 13, the electrostatic clip 45 includes an engaging portion 45A having a substantially C-shaped cross section for sandwiching the locking portion 52 between upper and lower surfaces, and one end of the engaging portion 45A. An extension piece 45B extending substantially horizontally from the (back side) side and a contact piece 45C extending from one end of the engaging portion 45 substantially perpendicular to the extension piece 45B are integrally provided. . And
The electrostatic clip 45 is attached to the housing 42 before the built-in board 44 is attached. Further, in a state of being attached to the housing 44, the extension piece 45B protrudes greatly into the opening 47, and the contact piece 45C is in a state of protruding downward. On the other hand, on the lower side (back side) of the housing 42, the lower side of the opening 47 is closed so that the built-in substrate 44 and the second panel 46 are closed.
Is fixed to the housing 42 with screws 58.

In the structure of the third embodiment configured as described above, after attaching the first panel 43 and the electrostatic clip 45 to the housing 42, the built-in substrate 44 is moved to the housing 42.
, The built-in board 44 abuts on the extension piece 45B on the way. When the built-in board 42 is further pushed into a predetermined position, the extension piece 45B and the contact piece 45C are indicated by an arrow 66 in FIG. The contact piece 45 </ b> C rotates with elastic deformation in the direction, and the contact piece 45 </ b> C is pressed against the back surface of the built-in substrate 44. In addition, a ground portion (not shown) is formed at the position of the built-in substrate 44 where the contact piece 45C is in contact. Next, the contact piece 45C is soldered to the built-in substrate 44 (portion indicated by reference numeral 64 in FIGS. 11 and 12), and then the second panel 46 is fixed to the housing 42 with screws 58, whereby the assembly is completed.

Therefore, even in the structure of the third embodiment,
Before attaching the second panel 46, the contact piece 45C of the electrostatic clip 45 can be soldered to the ground portion of the built-in substrate 44, so that the ground connection can be reliably performed. Thereby, the reliability at the connection portion between the electrostatic clip 45 and the built-in substrate 44 can be improved. Further, in the structure of the third embodiment, since the contact piece 45C that is deformed and rotated using the hinge 67 is provided, a portion to be soldered can be made large.

[0025]

As described above, according to the present invention,
Since a part of the electrostatic clip is elastically abutted on the surface of the built-in board facing the side to be attached to the housing after the built-in board is assembled, before attaching the second panel, The built-in substrate and the electrostatic clip can be easily and reliably fixed by soldering or the like at the portion where the elastic contact is made. As a result, improvement in reliability and workability can be expected.

[Brief description of the drawings]

FIG. 1 is an enlarged sectional view taken along the line AA of FIG.

FIG. 2 is an overall perspective view of a PC card shown as a first embodiment of the present invention.

FIG. 3 is an exploded perspective view of a main part of the PC card shown as the first embodiment of the present invention.

FIG. 4 is an enlarged cross-sectional view taken along the line AA of FIG. 2 in a state where some element members are not attached.

FIG. 5 is an overall perspective view of a PC card shown as a second embodiment of the present invention.

FIG. 6 is an exploded perspective view of a main part of a PC card shown as a second embodiment of the present invention.

FIG. 7 is an enlarged sectional view taken along line BB of FIG. 5;

FIG. 8 is an enlarged cross-sectional view taken along the line BB of FIG. 5 showing a state where some element members are not attached.

FIG. 9 is an overall perspective view of a PC card shown as a third embodiment of the present invention.

FIG. 10 is an exploded perspective view of a main part of a PC card shown as a third embodiment of the present invention.

FIG. 11 is an enlarged sectional view taken along line CC of FIG. 9;

FIG. 12 is an enlarged cross-sectional view taken along line CC of FIG. 9 in a state where some element members are not attached.

FIG. 13 is a perspective view of a single electrostatic clip used in the third embodiment of the present invention.

FIG. 14 is an overall perspective view of a conventional card.

FIG. 15 is an exploded perspective view of a main part of a conventional card.

FIG. 16 is a schematic sectional view taken along line DD of FIG. 14;

FIG. 17 is an enlarged cross-sectional view taken along line DD of FIG. 16 showing a state where some element members are not attached.

[Explanation of symbols]

1,21,41 PC card 2,22,42
Case 3,23,43 First panel 4,24,44
Built-in board 5, 25, 45 Electrostatic clip 5B, 25B,
45C contact piece 6, 26, 46 second panel 45B extension piece

Claims (5)

[Claims] 1. A housing, a first panel attached to one surface of the housing, a built-in substrate incorporated into the housing from the other surface of the housing, and an elastic metal plate piece. An electrostatic clip attached to a side surface of the housing while being partially pressed against the built-in substrate; and covering the other surface side of the housing after the built-in substrate is assembled. A PC card comprising: a second panel attached to a body, wherein a press-contact portion between the part of the electrostatic clip and the built-in board is provided on the built-in board facing the second panel. A PC card, provided on a surface side. 2. The PC card according to claim 1, wherein a pressure contact portion between the part of the electrostatic clip and the built-in substrate is soldered. 3. The electrostatic clip is formed to have a substantially U-shaped cross section, and is attached so as to sandwich the upper and lower surfaces of the housing from the outside of the side surface of the housing. Item 2. The PC card according to Item 1. 4. A part of the electrostatic clip penetrates through the built-in substrate from a side where the first panel is mounted and protrudes to a side where the second panel is mounted. The PC card according to claim 1, wherein: 5. An extension piece protruding into a passage on which the built-in substrate is mounted on a side of the housing to which the built-in substrate is mounted;
A contact piece that is pressed against the built-in substrate on the side where the second panel is attached, wherein the extension piece and the contact piece are rotated in conjunction with an operation of mounting the built-in substrate, The PC card according to claim 1, wherein the contact piece is pressed against the built-in substrate by the rotation.