JPH10197378A - Pressure sensor module and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pressure sensor module in which an integrated circuit device can be adjusted easily. SOLUTION: A connector body 7a is provided with a passage 7h for leading out a part of a plurality of adjustment wiring patterns of a flexible board 13 from the joint 7f of a connector body 7. An extension 13C of the flexible board 13 is led out through the lead-out passage 7h and an integrated circuit device 23 is adjusted using a plurality of adjustment wiring patterns formed thereat. The extension 13C of the flexible board 13 is then cut off in a resin sump 7i. Subsequently, the resin sump 7i is filled with an insulating resin R and the remaining part of the extension 13C of flexible board 13 is covered with resin along with the opening of the lead-out passage.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure sensor module for detecting pressure based on a change in capacitance and a method of manufacturing the same.

[0002]

2. Description of the Related Art As a pressure sensor module used for a gas pressure detecting device or the like, a pressure sensor module having a structure in which a pressure sensing element, a circuit board, a part of a connector, and the like are housed in a housing is known. The pressure sensing element is a sensor element including a capacitance type sensor element. In this pressure sensing element, at least one of them is provided with opposing electrodes on opposing surfaces of a pair of insulating substrates such as a pair of ceramic plates which are movable or flexible with respect to an applied pressure. It has a structure for detecting a change in pressure. The connector has a structure in which a metal terminal member is fixed to a connector body formed of an insulating material made of synthetic resin. In the pressure sensor module disclosed in JP-A-63-19527, a flange is integrally formed at the lower end of the connector body, and the flange is laminated on the pressure sensing element via a support ring. It is housed in a housing, and is subjected to curling (caulking) so that the flange of the connector body is wrapped around the end of the housing. Also, Japanese Patent Laid-Open No. 2-19
In the pressure sensor module disclosed in JP-A-0731, a metal support member (support base) is disposed between the pressure sensing element and the connector in order to prevent a force from being applied to the synthetic resin connector body through the pressure sensing element. To insulate them.

[0003] Although not described in these publications, in an actual product, a dedicated integrated circuit component and a protection circuit are arranged in a space between the connector and the pressure sensing element. These integrated circuit components and the protection circuit are connected to the terminal members of the connector using a flexible substrate.

[0004] However, the characteristics and performance of the pressure sensor module depend on the characteristics of the components used and the state of assembly (the state of the pressure applied to the pressure sensing element, the variation in the characteristics of the pressure sensing element, the variation in the characteristics of the components used in the electric circuit). Depending on the situation. Therefore, in order to improve the detection accuracy, it is desirable to adjust the characteristics after the assembly of the pressure sensor module is completed. Conventionally, in a commercially available pressure sensor module, a plurality of through holes extending to the inside of the connector are formed in the outer wall portion of the connector, and the inside of the connector is provided at a position corresponding to the plurality of through holes for adjusting integrated circuit components. A plurality of adjustment electrodes are arranged. After the assembly is completed, needle-shaped electrodes are inserted into the plurality of through holes, respectively, and adjustment of the integrated circuit component is performed through the needle-shaped electrodes.

[0005]

However, in the conventional structure and method, if the assembly is completed in a state where the through hole provided in the connector and the adjustment electrode in the connector are displaced, there is a problem that adjustment cannot be performed after the assembly. In addition, if the contact between the electrode and the needle-shaped electrode is not held securely during the adjustment, a poor contact will occur, and the poor contact will cause a poor adjustment. Therefore, the adjustment work is very troublesome. In addition, when the number of electrodes is increased, the number of through holes is increased accordingly, which not only complicates the processing of the connector but also lowers the mechanical strength of the connector.

An object of the present invention is to provide a pressure sensor module in which the adjustment of integrated circuit components is easy and a method of manufacturing the same.

Another object of the present invention is to provide a pressure sensor module and a method of manufacturing the same, which can surely adjust an integrated circuit component.

It is still another object of the present invention to provide a pressure sensor module that can easily perform processing after adjustment of an integrated circuit component.

Still another object of the present invention is to provide a pressure sensor module in which water or static electricity does not enter the inside of the connector after adjusting the integrated circuit components.

[0010]

A pressure sensor module according to the present invention basically has a pressure sensing element for detecting a change in pressure from a change in capacitance, a connector, a housing, A flexible board for connection and an electric circuit for processing the output of the pressure sensing element are used.

[0011] The pressure sensing element comprises an opposing electrode disposed on opposing surfaces of a pressure-sensing insulating substrate and a non-pressure-sensing insulating substrate which are arranged so as to oppose each other at an interval. The change in pressure is detected from the change in capacity. A ceramic substrate is generally used for the pressure sensing side insulating substrate and the non-pressure sensing side insulating substrate.

The connector includes a plurality of terminal members to which terminals of a mating connector are connected, and a connector main body formed of an insulating resin material to which the plurality of terminal members are fixed. The connector body has a base with a storage recess that opens toward one end side and stores therein a component that constitutes an electric circuit for processing the output of the pressure sensing element. An end surface on one end side is arranged in contact with a non-pressure sensing surface of the pressure sensing element (the surface of the non-pressure sensing side insulating substrate). Note that the connector body has a connection portion provided with a terminal fixing portion to which a plurality of terminal members are fixed.

The housing is made of metal and has a storage chamber for storing the pressure sensing element and the base of the connector main body, and a measured object that communicates with the storage chamber to apply pressure to the pressure sensing element (the pressure sensing side insulating substrate). It has a high-pressure fluid supply passage for supplying fluid, and a coupling portion coupled to the base of the connector body.

In a still more specific invention, an annular support is used which is fitted to the outside of the base of the connector body and has one end face outside the base of the connector body and in contact with the non-pressure sensing side insulating base. I have. The annular support may have any mechanical strength higher than that of the connector body, but is preferably made of metal. This annular support is also accommodated in the storage chamber of the housing, and the connecting portion of the housing is curled with respect to the base of the connector main body and the annular support, so that the housing and these components are caulked.

In the present invention, the first circuit pattern is formed on the non-pressure sensing surface (the surface located on the storage recess side of the insulating substrate on the non-pressure sensing side). In addition, a flexible substrate having a second circuit pattern including a plurality of pattern connection terminal electrodes arranged in the storage recess and connected to the first circuit pattern is used. The first circuit pattern described above is used to connect a plurality of electronic component mounting electrodes used to mount one or more electronic components constituting a part of the electric circuit, and to connect the electric circuit and the pressure sensing element. And a plurality of terminal connection electrodes to which a plurality of pattern connection terminal electrodes provided on the flexible substrate are connected by soldering. The plurality of pattern connection terminal electrodes of the flexible substrate are connected by soldering to the plurality of terminal electrode connection electrodes of the first circuit pattern.

In the present invention, a lead-out passage for drawing out a part of the plurality of adjustment wiring patterns of the flexible board to the outside of the connector body (outside of the connection portion) is formed in the connector body. Then, the portion of the flexible substrate drawn out from the drawing passage and the outside opening of the drawing passage are covered with an insulating resin. Here, the portion that is pulled out from the lead-out passage of the flexible substrate is a portion necessary for adjusting the integrated circuit component. Therefore, depending on the adjustment method, the length of the portion from which the flexible substrate is drawn may be increased. If the length of the portion to be pulled out is long, this portion is cut after the adjustment is completed. If the connection portion or cut portion of the adjustment wiring pattern of the flexible substrate is exposed after the adjustment, static electricity and noise enter through the exposed portion. Therefore, in the present invention, the portion of the flexible substrate that is drawn out from the drawing passage along with the outer opening of the drawing passage is covered with the insulating resin.

According to the present invention, the adjustment of the integrated circuit components can be easily and reliably performed after the completion of the assembly by using the flexible substrate used for the internal circuit. This is because, as in the present invention, if a portion including a part of the plurality of wiring patterns for adjustment of the flexible substrate is drawn out of the connector body from the lead-out passage, after the assembly is completed, the plurality of adjustments drawn out to the outside can be obtained. This is because adjustment of the integrated circuit component can be performed using the wiring pattern.

After the adjustment is completed, the portion of the flexible board (a part of the adjustment wiring pattern) protruding from the drawer passage is covered with an insulating resin, and the outer opening of the drawer passage provided in the connector body is also insulated. If covered with resin, water can be prevented from entering the inside, and static electricity can be prevented from entering the inside of the connector body from the exposed portion or cut portion of the adjustment wiring pattern, and adjustment after completion of adjustment No deviation occurs.

In addition, a resin storage recess for storing the insulating resin is formed in the outer wall of the connector body. Then, the outer opening of the drawer passage is opened in the resin storage recess. By forming such a resin reservoir concave portion, the insulating resin does not flow during the filling operation of the insulating resin, and the drawer passage can be reliably closed. Further, the part drawn out from the lead-out passage of the flexible substrate can be completely filled in the formed insulating resin seal part. In addition, processing is performed so that the end of the flexible board pulled out from the draw-out passage is terminated in the resin reservoir concave portion (the cutting of the end of the flexible board or the length of the end of the flexible board is preset). By doing so, the end portion of the adjustment wiring pattern or the cut portion thereof can be completely covered with the insulating resin stored in the resin storage recess.

When a part of the flexible substrate is drawn out of the connector to adjust the integrated circuit component, connector connection electrodes are provided at the ends of the plurality of adjustment wiring patterns drawn out from the drawing passage. And at the time of adjustment,
If the adjustment is performed by fitting the dedicated connector on the adjuster side to the connector connection electrode, the adjustment operation is simplified, and a connection failure does not occur during the adjustment, and the integrated circuit component can be surely adjusted.

Further, a plurality of through holes into which a plurality of terminal members are inserted are formed in the flexible substrate, a plurality of terminal member connection electrodes are formed around the plurality of through holes, and a plurality of through holes inserted into the plurality of through holes are formed. When one end of the terminal member is connected by soldering to a corresponding plurality of terminal member connection electrodes, even when a tensile force is applied to a portion of the flexible board drawn out of the connector during adjustment of the integrated circuit component, a plurality of terminals are connected. The fitting between the terminal member and the plurality of through holes provided in the flexible substrate is
It serves as an anchor (engaging portion) and can prevent a pulling force from being applied to the anchor. As a result, it is possible to prevent an excessive force from being applied to the soldered connection portion of the flexible substrate.

[0022]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1A is a partial cross-sectional view showing a state in which the assembling step of the pressure sensor module according to the embodiment of the present invention has been completed and the adjusting step has been completed, and FIG. It is a partially expanded sectional view. FIG. 2 is a cross-sectional view of the pressure sensor module 1 of FIG. 1 taken along a direction different from the state shown in FIG. 1 by 90 degrees. The pressure sensor module 1 has a structure in which a connector assembly 3 and a housing assembly 5 are assembled. The connector assembly 3 includes a connector 7, an annular support 9, a pressure sensing element 11, a flexible substrate 13, a feedthrough capacitor unit 15, and the like. The housing assembly 5 includes a housing 17, an O-ring 19, and a backup ring 21.

The connector 7 has a structure in which three terminal members 8a, 8b, 8c are insert-molded or press-fitted into a connector body 7a. FIG. 3A is a perspective view of the connector 7, and FIG. 3B is a half-sectional view of the connector 7. The connector body 7a has a base 7b provided with a storage recess 7c that opens toward one end and stores therein a component that constitutes an electric circuit for processing the output of the pressure sensing element 11, and a base 7b at the other end. It has a terminal storage chamber 7d which is open toward the other side and stores the other ends of the three terminal members 8a to 8c, and a connection portion 7f having a terminal fixing portion 7e to which the three terminal members 8a to 8c are fixed. ing. The end face 7b1 on one end side of the base 7b of the connector main body 7a is connected to the non-pressure sensing face 11 of the pressure sensing element 11 described in detail later.
a (the surface of the non-pressure sensing side insulating substrate 11A). As clearly shown in FIG. 3, five openings 7b21 to 7b are provided at the base 7b of the connector body 7a.
25 are formed.

The connector main body 7a is integrally formed of a synthetic resin (insulating resin material) such as PBT (polybutylene terephthalate) which is more easily deformed by a high pressure than a material of a later-described housing 17 (aluminum alloy, iron, etc.).
The base 7b is provided integrally with an annular projection or flange 7g projecting radially outward on the outer periphery of the end opposite to the end face 7b1. The flange portion 7g is formed so that its thickness becomes thinner toward the outside (as it moves away from the base portion 7b), and on the side not facing the annular support 9 (on the side opposite to the end face 7b1), the annular outer end face 7g1 is formed. And a frusto-conical tapered surface 7g2 and an annular end surface 7g3 on the side facing the annular support 9. A gap is formed between the tapered surface 7g2 and a later-described tapered surface 9b of the annular support 9.

The connector body 7a is provided with a lead-out passage 7h for drawing a part of the flexible board 13 to the outside. And on the outer wall of the connector body 7a,
A resin storage recess 7i for storing a sealing insulating resin, which will be described later, so as to surround the outer opening of the drawer passage 7h.
Are formed. As a result, the outside opening of the drawer passage 7h opens toward the inside of the resin reservoir recess 7i.

Further, the end face 7 of the base 7b of the connector body 7a
b1 is provided with two fitting projections 7j, 7j. These fitting projections 7j are provided in two fitting holes 11b, 11b provided on the non-pressure sensing surface of the pressure sensing element 11.
[See FIG. 5 (A)]. Fitting projections 7j, 7
j has a rectangular cross-sectional shape and a tapered end. The fitting projections 7j, 7j are fitted with fitting holes 11b, 11b of the pressure sensing element 11 [FIG.
(A)], the pressure sensing element 11 is fixed to the end face 7b1 of the base 7b of the connector body 7a. The fixed or fitted state is not released (the fitting projections 7j, 7j fall out of the fitting hole 11b) by the restoring force or the repulsive force of the bent flexible substrate 13 to return to the original state. In addition, the shapes and dimensions of the fitting projections 7j, 7j and the fitting hole 11b are determined. The fitting portions between the fitting projections 7j, 7j and the fitting holes 11b, 11b are arranged at positions away from the connection portion to which the flexible substrate 13 is connected by soldering as described later.

As shown in FIGS. 3A and 3B, two fitting projections 7k for preventing rotation are integrally provided on the outer peripheral portion of the base 7b of the connector main body 7a. FIG. 3 shows only one fitting projection 7k.
The fitting projection 7k has a wedge shape in which the height dimension (the dimension in the radial direction of the base 7b) decreases from the flange 7g toward the end face 7b1 of the base 7b. The two fitting protrusions 7k are respectively fitted into fitting recesses 9c, 9c having a semicircular cross-sectional shape provided on the annular support 9 described later, and the connector 7 and the annular support 9 are connected to each other. Prevents rotation between them.

As shown in FIGS. 1A and 2, the annular support 9 has one end face 9a formed on the base 7 of the connector body 7a.
It is arranged so as to surround the outer peripheral portion of the base of the connector main body 7a so as to be in contact with the pressure sensing element 11 outside the position b. The annular support 9 is made of a material (PB) of the connector body 7a.
It is formed of a metal material such as an aluminum alloy or iron which is hardly deformed at a higher pressure than T). As shown in FIGS. 4A to 4C, an annular fitting tapered portion, that is, an annular tapered portion 9b into which the flange portion 7g of the connector 7 is fitted is formed in the opening on the other end surface 9e side of the annular supporting member 9. Are formed. Further, an annular tapered portion 9 b is provided on the inner peripheral portion of the annular support 9.
Fitting recesses 9 extending from the side toward the end face 9a side
c, 9c are formed. The fitting recesses 9c, 9c
Has a shape in which the fitting projection 7k provided on the connector body 9a is fitted. The end surface 9a has a fitting projection 9 formed thereon.
d is provided integrally. As shown in FIG. 1, the fitting projection 9 d is fitted into a fitting recess 17 a described later provided in the housing 17 to prevent rotation between the annular support 9 and the housing 17. doing.

The annular tapered portion 9b is
It is configured to form a gap between b and the flange portion 7g of the connector 7. This gap allows deformation of the flange portion 7g when the housing 17 described later is curled. In this example, in order to form this gap, the outer peripheral surface of the connector main body 7a and the tapered surface 7 are formed.
The angle with g2 is set at 150 degrees, and the angle between the inner peripheral surface of the annular support 9 and the tapered surface 9b is set at 205 degrees.

FIGS. 5A and 5B show the pressure sensing element 1.
FIG. 1 is a plan view and a side view of No. 1 viewed from a non-pressure sensing surface 11a side. The pressure sensing element 11 includes a non-pressure sensing side insulating base 11A made of a ceramic substrate and a pressure sensing side insulating base 11B made of a ceramics substrate constituting a flexible diaphragm via an annular glass layer (not shown). It has a joined structure. Opposing electrodes are formed on opposing surfaces of the non-pressure sensing-side insulating base 11A and the pressure sensing-side insulating base 11B, respectively. The counter electrode of the non-pressure sensing side insulating base 11A is composed of a main capacitance electrode and a reference capacitance electrode, and the counter electrode of the pressure sensing side insulating base 11B has a shape facing both the main capacitance electrode and the reference capacitance electrode. Of movable electrodes. On the side wall of the non-pressure sensing insulating substrate 11A, three concave portions 11A1 to 11A3 are formed side by side in the thickness direction and the radial direction of the substrate. Three side electrodes E11 to E13, which are electrically connected to the main capacitance electrode, the reference capacitance electrode, and the movable electrode, respectively, are formed on the walls in the three concave portions.

The first surface of the non-pressure sensing side insulating base 11, that is, the non-pressure sensing surface 11a of the pressure sensor 11,
Circuit pattern is formed. The first circuit pattern CP1 is used to mount a plurality of electronic component mounting electrodes E21 to E36 and a pressure sensing element 11 used to mount one or more electronic components constituting a part of an electric circuit. Of a plurality of sensing element connection electrodes E21, E23, E25 used to connect to an electric circuit for processing (in this example, a part of the electronic component mounting electrode is also used as the sensing element connection electrode) And a plurality of pattern connection terminal electrodes E61 to E71 provided on the flexible substrate 13 [FIG.
(A)] includes a plurality of terminal electrode connection electrodes E41 to E51 connected by soldering.

The three side electrodes E11 to E13 are connected to the three sensing element connection electrodes E21, E23 and E25 by using three connection patterns P1 to P3, and the three connection patterns P1 are used.
Shield patterns P4 and P5 to which a shielding voltage is applied are formed between two adjacent connection patterns of P3 to P3. These shield patterns P4 and P5
Are connected to electrodes E22 and E25, in this example 2.
A DC voltage of 5 V is applied. These electrodes E21 to E
51 is formed of silver-palladium metal. In particular, solder layers are respectively formed on the surfaces of the terminal electrode connection electrodes E41 to E51. And the electronic component mounting electrode E
Terminals 21 to E36 of the integrated circuit component 23 designed exclusively are connected by soldering. This integrated circuit component 23
It has a function of converting a change in capacitance output from the pressure sensor 11 into a voltage signal proportional to pressure. Further, the integrated circuit component 23 has a function of applying a predetermined shield voltage to the above-mentioned shield patterns P4 and P5, a function necessary for performing necessary adjustments according to an assembling situation and an application, and the like. According to the present invention, the adjustment of the integrated circuit component 23 can be easily and reliably performed after the assembly is completed by using the flexible substrate 13 used for the internal circuit.

As shown in FIGS. 6A and 6B in an enlarged manner, the flexible substrate 13 has a terminal electrode arrangement portion 13A on which a plurality of pattern connection terminal electrodes E61 to E71 are arranged.
And three terminal member connecting electrodes E71 to E73 to which the three terminal members 8a to 8c are connected, and an electronic component on which a plurality of electronic components constituting a part (particularly, a protection circuit) of the above-described electric circuit are mounted. The mounting portion 13B and a plurality of adjustment wiring patterns DP1 to DP used to input and output signals and power necessary for adjusting the integrated circuit component 23 from outside the connector main body 7a.
And an extension 13C on which the DP 10 is formed.
The flexible substrate 13 is a known laminate in which a circuit pattern and electrodes for soldering are formed of copper foil on both surfaces of one polyimide resin substrate, and another polyimide resin substrate is joined to a portion excluding the electrodes for soldering. It has a structure. In this example, another polyimide resin substrate has one surface 13
b.

The pattern connection terminal electrodes E61 to E71 of the flexible substrate 13 have a structure in which a wiring pattern made of copper foil is covered with solder plating. The terminal electrode arrangement portion 13A has an end face 7 on one end side of the base 7b of the connector main body 7a at a position sandwiching the pattern connection terminal electrodes E61 to E71.
A pair of clamped portions 13a, 13a sandwiched between b1 and the surface (11a) of the non-pressure sensing side insulating base 11A are provided. In this example, the end face of the portion of the base 7b of the connector body 7a provided with the fitting projections 7j, 7j and the non-pressure sensing surface 11a of the pressure sensing element 11 shown in FIG.
Between the holding portions 13a, 13a. In this way, the pattern connection terminal electrodes E61 to E71 of the flexible substrate 13 are soldered and connected to the terminal electrode connection electrodes E41 to E51 (FIG. 5A) provided on the pressure sensing element 11 by thermocompression bonding. It is possible to prevent a force for peeling the solder from being applied to the soldering portion to be soldered. Therefore, it is possible to prevent the occurrence of connection failure when the flexible substrate 13 is used for internal connection.

The second circuit pattern CP2 formed on the flexible substrate 13 is formed on one surface 1 of the flexible substrate.
3b side terminal electrodes E61 to E71 for pattern connection
Wiring pattern DP including flexible board 13
And an electronic component mounting pattern MP formed at a portion corresponding to the electronic component mounting portion 13B on the other surface 13b. The electronic component mounting pattern MP is formed with three terminal member connection electrodes E71 to E73 and a plurality of electrodes on which chip-shaped electronic components constituting a protection circuit are mounted. In FIG. 6B, these chip-shaped electronic components are not mounted. Three terminal member connection electrodes E71 to E73
Are formed in a ring shape so as to surround three through holes TH1 to TH3 formed in the electronic component mounting portion 13B of the flexible substrate 13. These through holes TH1 to TH1
One end of each of the three terminal members 8a to 8c passes through TH3. One end of each of the three terminal members 8a to 8c penetrating the three through holes TH1 to TH3 is soldered and connected to the corresponding terminal member connection electrodes E71 to E73, respectively.

The wiring set pattern DP provided on the extension 13C of the flexible substrate 13 includes a plurality of adjustment wiring patterns DP1 to DP4 used to input and output signals and power required for adjusting integrated circuit components from outside the connector body 7a.
It is constituted by DP10. At the ends of the plurality of adjustment wiring patterns DP1 to DP10, connector connection electrodes E81 to E90 are formed, respectively. A dedicated connector provided on the adjuster side when the integrated circuit component 31 is adjusted is fitted to the connector connection electrodes E81 to E90. When the adjustment operation is performed using the dedicated connector, the electrical connection between the adjustment wiring patterns DP1 to DP10 and the adjuster can be easily and reliably performed. In addition, there is almost no possibility that poor contact with the adjuster occurs.

When assembling, first, the pressure sensing element 1
1. The solder plating layer of the pattern connection terminal electrodes E61 to E71 of the flexible substrate 13 is superimposed on the solder layer formed on the terminal electrode connection electrodes E41 to E51 provided on the surface of the flexible substrate 13 on the surface 13c side. Then, by applying heat and pressure using an appropriate heating tool, the plurality of pattern connection terminal electrodes and the plurality of terminal electrode connection electrodes are soldered and connected to each other by thermocompression bonding. Thereafter, the portion between the terminal electrode disposing portion 13A and the electronic component mounting portion 13B is moved so that the electronic component mounting pattern MP of the electronic component mounting portion 13B faces the non-pressure sensing side insulating base 11A. In a bent state, it is arranged in the storage recess 7c (FIG. 1A). When accommodating the flexible board 13 in the accommodating recess 7c of the connector body 7a, first,
Of the extension 13C is drawn out of the connector main body 7a by passing the extension 13C through the drawer passage 7h formed in the connector main body 7a. Next, the through holes TH1 to TH1 provided in the terminal electrode arrangement portion 13B of the flexible substrate 13
H3, one end of each of the terminal members 8a to 8c is inserted into the through hole TH.
The distal ends of the terminal members 8a to 8c protruding from 1 to TH3 are connected by soldering to the corresponding terminal member connection electrodes E71 to E73, respectively. With this connection, the flexible substrate 13
The electronic component mounting portion 13B of the second embodiment securely engages with the terminal members 8a to 8c. As a result, when adjusting the integrated circuit component 23, even if a tensile force is applied to the extension 13C of the flexible board 13 drawn out of the connector 7, the plurality of terminal members 8a to 8c and the plurality of The engagement with the through-holes TH1 to TH3 serves as an anchor (engaging portion), which can prevent a pulling force from being applied to the tip.

FIG. 7 is an exaggerated drawing of the relationship between one terminal member 8a of the three terminal members 8a to 8c and the through hole TH1 formed in the flexible substrate 13. Since the three terminal members 8a to 8c have basically the same shape, only one terminal member 8a will be described. On the outer periphery of one end of the terminal member 8a, an annular constriction 8a1 is formed continuously in the circumferential direction. Constriction 8a1 of this example
Has a shape in which a central portion has a minimum diameter, and tapered portions whose diameters gradually increase are formed on both sides thereof. The minimum diameter of the constricted portion 8a1 is smaller than the inner diameter of the through hole TH1. The shape of the portion 8a2 located above (outside) the constricted portion 8a1 of the terminal member 8a cannot pass through the through hole TH1.
When one end of the terminal member 8a is inserted into the through hole TH1 of the flexible substrate 13, if the portion 8a2 above the constricted portion 8a1 is larger, the flexible substrate 13 will be further deeper or higher than the constricted portion 8a1. There is no intrusion. Therefore, the flexible board 13 is
Positioning can be reliably performed at the position a1. Also constricted part 8a
1, the inner peripheral portion of the through hole TH1 of the flexible substrate 13 is caught, and the tip of the terminal member 8a is connected to the terminal member connecting electrode E.
When soldering to the 71, the flexible substrate 13 does not float (move toward the tip end of the terminal member 8a). As a result, the tip of the terminal member 8a protruding from the through hole TH1 and the terminal electrode connecting electrode E71
Can be easily soldered.

The end of one end of the terminal member 8a has a shape that is press-fitted into the through hole TH1. The distal end portion of the terminal member 8a does not fall out of the hole TH1. Moreover, the terminal member 8a is connected to the through hole TH1.
Is not applied to the flexible substrate 13 to push the through hole TH1. Therefore, large distortion does not occur in the electronic component mounting portion 13B of the flexible substrate 13, and between the electrode of the electronic component mounted on the electrode of the electronic component mounting portion 13B by soldering and the electrode of the electronic component mounting portion 13B. It is possible to prevent the occurrence of soldering failure during soldering. The connection relationship between the other terminal members 8b and 8c and the through holes TH2 and TH3 is the same as above.

Returning to FIG. 1A and FIG. 2, the housing 17 includes the housing body 17b and the cylinder 1 for supplying high-pressure fluid.
7c is integrally formed. The housing 17 is formed of a metal such as an aluminum alloy, iron, brass, or the like. The housing body 17b has a shape having a bottom wall portion 17b1 and a peripheral wall portion 17b2, and has a storage chamber 17d formed therein. Storage room 1
Reference numeral 7d denotes a pressure sensing element housing portion 17e in which the pressure sensing element 11 is housed, and a support body housing portion 17f provided continuously with the pressure sensing element housing portion 17e and housing the base of the annular support 9 and the connector body 7a. And Since the support receiving portion 17f is formed to be larger in diameter than the pressure sensing element receiving portion 17e, one end face 9a of the annular support 9 is provided between the pressure sensing element receiving portion 17e and the support receiving portion 17f.
A support step 17g for supporting the outer edge of the support is formed.
In this embodiment, an O-ring 19 is arranged between the pressure sensing side insulating base 11B of the pressure sensing element 11 and the inner bottom surface (bottom wall 17b1) of the pressure sensing element housing 17e.
A backup ring 21 is arranged concentrically outside the ring 19. This backup ring 21 is formed from Teflon (trademark). An annular groove for accommodating the O-ring 19 and the backup ring 21 is formed on the bottom wall 17b1 of the housing body 17b. These O-ring 19 and backup ring 2
The presence of 1 forms a chamber for applying pressure to the pressure sensing side insulating base 11B.

The wall constituting a part of the peripheral wall 17b2 of the housing body 17b surrounding the support accommodating portion 17f is extended to a position extending beyond the end face 9d of the annular support 9 accommodated in the support accommodating portion 17f. The extended portion forms a connecting portion 17h. As shown in FIGS. 1A and 2, the connecting portion 17h wraps the outer edge of the outer end surface 7g1 located in a direction away from the end surface 9e of the annular support 9 and the base of the flange portion 7g of the connector body 7a. Curled. The connector assembly 3 is attached to the pressure sensor assembly 5 by the engagement of the curled connection portion 17h and the flange portion 7g of the connector body 7a, that is, the caulking connection. Although not shown, in this example, the connecting portion 17
From h, a seal layer made of epoxy resin or urethane resin is formed so as to straddle the connector body 7a.

The high pressure fluid supply cylinder 17c has a cylindrical shape with a smaller diameter than the housing body 17a.
A screw portion 17i is formed on the outer peripheral portion. A high-pressure fluid supply passage 17j is formed inside the high-pressure fluid supply cylinder 17c. The high pressure fluid supply passage 17j is
d so as to communicate with the pressure sensing element 11.
A fluid to be measured consisting of a high-pressure fluid for applying pressure to the pressure-sensing-side insulating substrate 11B is supplied.

As shown in FIGS. 1A and 2, a feedthrough capacitor unit 15 is housed in the housing recess 7c. This feedthrough capacitor unit 15
Is a terminal 3 in which one ends of the terminal members 8a to 8c are fitted.
It is composed of a plurality of feedthrough capacitors 27a to 27c and a conductive support member 29 on which these three feedthrough capacitors 27a to 27c are supported. Three feedthrough capacitors 27
One of electrodes a to 27c (+ electrode) is electrically connected to the corresponding terminal members 8a to 8c, and the other electrode (-electrode or ground electrode) is electrically connected to the conductive support member 29. I have. The conductive support member 29 has a pair of contact members 31 having spring properties.

FIG. 8A shows one feedthrough capacitor 27.
8B shows a front view of the feedthrough capacitor unit 15 in which only the component c is mounted, and FIG. 8B shows a plan view of the conductive support member 29. The pair of contact members 31, 31 are arranged at positions facing each other, one end is connected to the conductive support member 29, the intermediate portion is inclined in a direction away from each other, and the tip portions are curved so as to approach each other. It has a shape. In this example, the conductive support member 29 and the pair of contact members 31, 31 are formed by pressing and bending a single phosphor bronze plate.

The conductive support member 29 has three through holes 2 for fitting three through capacitors 27a to 27c.
9a to 29c are formed. As shown in FIG. 8A, the feedthrough capacitor 27c used in this example has a through hole 27c1 at the center and a flange 27c2 at one end.
The other end has a main body 27c3. And the through hole 27
A positive terminal electrode is provided inside c1 and the flange 27c2, and a negative electrode or earth electrode is provided on the outer periphery of the main body 27c3. And the feedthrough capacitors 27a to 27
c denotes through holes 29 a to 29 provided in the conductive support member 29.
The main body is fitted to c, and the negative electrode on the outer peripheral portion of the main body is soldered to the conductive support member 29. A terminal member 8a that is inserted into a through hole of each of the feedthrough capacitors 27a to 27c and extends beyond a flange portion of each of the feedthrough capacitors 27a to 27c.
8c are soldered to the + electrode of each feedthrough capacitor.

The pair of contact members 31, 31 are shown in FIG.
Are fitted in two openings (contact openings) 7b21 and 7b22 formed in the base 7b of the connector 7 shown in FIG. These two openings 7b21 and 7b22 allow the contacts of the contact members 31, 31 to come into contact with the annular support 9. When the annular support 9 is fitted to the base 7b of the connector body 7a, the contact members 31, 31 are annularly supported by a spring force generated by being pressed radially inward by the inner peripheral surface of the annular support 9 to generate annular support. The contact is pressed against the inner wall surface of the body 9. In order to generate such a spring force, before the annular support 9 is fitted to the base 7b of the connector main body 7a, the contacts of the pair of contact members 31, 31 are connected to the pair of opening portions 7a.
The shapes of the pair of contact members 31, 31 are determined so as to protrude from b21, 7b22.

As can be seen by comparing FIGS. 1A and 2, the feedthrough capacitor unit 15 is arranged in a positional relationship where the contact members 31, 31 and the flexible substrate 13 do not interfere with each other (do not collide with each other). ing.

According to the structure of this example, the contact members 31, 3
The feedthrough capacitors 27a to 27c can be connected to the ground potential with a simple structure of contact between the first contact and the inner wall surface of the annular support 9. Therefore, there is no need to use soldering or connection wires for ground connection, and the structure is simplified. Further, in this structure, since the annular support member 9 is fitted to the outer peripheral portion of the connector main body 7a, the connector main body 7a
Even if a plurality of openings including the contact opening are formed in the base 7b, the mechanical strength of the base 7b of the connector main body 7a does not decrease.

Although the number of the contact members 31 may be one,
When a pair of contact members 31, 31 are used as in this example,
As the number of contacts increases, the possibility of connection failure decreases. Also, as in this example, the pair of contact members 3
When the first and first members 31 are arranged so as to face each other in the radial direction, the spring forces generated in the pair of contact members 31 and 31 are balanced, so that an unreasonable force applied to the conductive support member 29 is not applied. As a result, the conductive support member 29 and the feedthrough capacitor 2
An unreasonable force is not applied to the soldered portions with 7a to 27c, so that occurrence of a connection failure can be prevented.

In the above example, the conductive support member 29 is located on the flexible substrate 13. The conductive support member 2 of the electronic component mounting portion 13B of the flexible substrate 13
No electronic component is mounted on the surface facing the side 9. Therefore, a short circuit does not occur between components between the feedthrough capacitors 27a to 27c and the electronic components mounted on the electronic component mounting portion 13B.

The characteristics and performance of the pressure sensor module are as follows.
Depending on the characteristics of the components used and the state of assembly (the state of the pressure applied to the pressure sensing element, variations in the characteristics of the pressure sensing element, variations in the characteristics of the components used in the electric circuit), considerable variations occur. Therefore, it is necessary to adjust the characteristics after the assembly of the pressure sensor module is completed. Therefore, in the present invention, as shown in FIG. 1A, a part of the plurality of adjustment wiring patterns of the flexible substrate 13 is drawn out of the connector main body, and after the assembly is completed (after the curling process is completed), The power and the adjustment signal are supplied to the integrated circuit component 23 from the outside through the adjustment wiring patterns DP1 to DP10 of the flexible substrate 13 drawn out to perform the adjustment. In this example, since the connector connection electrodes E81 to E90 are provided at the ends of the wiring patterns DP1 to DP10 provided on the extension portion 13C of the flexible substrate 13, the connector connection electrodes E81 to E90 are provided with an adjuster. Adjustment work can be easily performed by fitting the connectors.

When the adjustment is completed, the flexible substrate 13
Recess 7i provided outside resin connector body 7a.
The extension 13C of the flexible substrate 13 is cut so that the flexible substrate 13 terminates in [FIG. 1 (A) and FIG. 3 (A)]. Then, as shown in FIG.
With the resin reservoir concave portion 7i facing upward, epoxy resin or urethane resin is poured into the resin reservoir concave portion 7i to cut and expose the wiring pattern provided on the extension 13c of the flexible substrate 13 and the connector body. Drawer passage 7h provided in 7a [FIG. 1 (A) and FIG. 3 (A)]
Cover the outside opening with resin and seal. This ultimately completes the manufacture of the product.

A method of assembling the pressure sensor module according to the present embodiment will be described. First, as shown in the exploded sectional view of FIG. 9, the terminal members 8a to 8c are press-fitted into the connector 7 (the terminal members 8a to 8c may be insert-molded into the connector 7). Next, the tips of the terminal members 8a to 8c are inserted into the through holes of the through capacitors 27a to 27c of the through capacitor unit 15 manufactured in advance, and the tips are soldered to the + terminal electrodes of the through capacitors 27a to 27c.
Next, as shown in FIG. 10A, the electronic component mounting portion 13B
Flexible board 1 on which electronic parts (not shown) are mounted
The pattern connection terminal electrodes E61 to E71 provided in the terminal electrode arrangement portion 13A of No. 3 are connected by soldering to the terminal electrode connection electrodes E41 to E51 of the pressure sensing element 11 on which the integrated circuit component 23 is mounted by thermocompression bonding.

Next, as shown in FIG. 9, the annular support 9 is fitted to the base 7b of the connector 7. At this time, the two fitting projections 7k provided on the base 7b of the connector 7 are fitted to the fitting recesses 9c formed on the inner peripheral portion of the annular support 9 to prevent rotation. Thereafter, the extension portion 13c of the flexible board 13 is pulled out to the outside through a lead-out passage provided in the connector 7, and the electronic component mounting section 1 of the flexible board 13 is drawn out.
Terminal members 8a to 8 are inserted into through holes TH1 to TH3 provided in 3B.
c into the through holes TH1 to TH
3 is connected by soldering to the terminal member connecting electrodes E71 to E73 provided around the terminal 3. Then, while bending the flexible substrate 13, the fitting hole portion 11 b provided in the pressure sensing element 11 is provided.
The connector assembly 3 is assembled by fitting the fitting projections 7j provided on the base of the connector 7 to [FIG. 5 (A)]. Next, the housing 17 is combined with the housing assembly 5 in which the O-ring 19 and the backup ring 21 are fitted. At this time, the fitting projection 9d provided on the end face of the annular support 9 is fitted into the fitting recess 17a provided in the support step 17g inside the housing 17. Then, a curling process, that is, a caulking process is performed on the connecting portion 17h of the housing 17. Next, an epoxy resin is applied from the connecting portion 17h to the connector body 7a to form a seal layer (not shown). Thereafter, the integrated circuit component 23 is adjusted using the wiring pattern provided on the extension 13C of the flexible board 13 drawn out of the connector. After the adjustment is completed, the extension 13C is cut, and the resin reservoir recess 7 is cut.
i is filled with resin to complete the sealing.

In the above embodiment, the flexible substrate 1
The length of the extension 13C is set to a size such that the extension 13C protrudes greatly from the resin reservoir recess 7i. However, the length of the extension 13C may be set as shown in FIG. 1B from the beginning. In this case, when adjusting the integrated circuit component, an input / output unit having a pin-shaped terminal electrode is provided in the adjuster, and the pin-shaped terminal electrode is brought into contact with the wiring pattern in the resin reservoir recess 7i. Good.

[0056]

According to the present invention, if the portion including the plurality of adjustment wiring patterns of the flexible substrate is drawn out of the connector body from the lead-out passage, after the assembly is completed, the plurality of adjustments drawn out to the outside can be obtained. There is an advantage that the adjustment of the integrated circuit component can be easily and reliably performed by using the wiring pattern.

After the adjustment is completed, the portion of the flexible substrate (a part of the adjustment wiring pattern) protruding from the drawer passage is covered with an insulating resin, and the outer opening of the drawer passage provided in the connector body is also insulated. Covering with resin prevents water from entering the inside and prevents static electricity from entering the inside of the connector body from the exposed or cut portion of the adjustment wiring pattern. There is an advantage that no occurrence occurs.

[Brief description of the drawings]

FIG. 1A is a partial cross-sectional view showing a state in which an assembling step of an example of an embodiment of the present invention is completed and an adjusting step is completed, and FIG. 1B is a part of a completed product; It is an expanded sectional view.

FIG. 2 is a cross-sectional view of the pressure sensor module taken along a direction different from the state shown in FIG. 1 by 90 degrees.

FIG. 3A is a perspective view of a connector.
(B) shows a half section view of the connector.

FIGS. 4A to 4C are a perspective view, a plan view, and a cross-sectional view of an annular support.

FIGS. 5A and 5B are a plan view and a side view of the pressure sensing element as viewed from a non-pressure sensing surface side.

FIGS. 6A and 6B are diagrams showing patterns on the front and back surfaces of a flexi-based substrate.

FIG. 7 is an exaggerated drawing of a relationship between a terminal member and a through hole formed in a flexible substrate.

FIG. 8A shows a front view of a feedthrough capacitor unit having only one feedthrough capacitor mounted thereon,
(B) is a plan view of the conductive support member.

FIG. 9 is an exploded perspective view of the pressure sensor module of FIG.

10A is a view showing a state in which a flexible substrate is connected to a pressure sensing element, and FIG. 10B is a view showing an assembling process of a connector assembly.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 pressure sensor module 3 connector assembly 5 housing assembly 7 connector 7 h extraction passage 7 i resin reservoir recess 9 annular support 11 pressure sensing element 13 flexible substrate 13 C extension 15 penetration capacitor unit 17 housing 19 O-ring 21 backup ring 23 integrated circuit Parts DP Wiring Pattern DP1 to DP10 Wiring Pattern for Adjustment

Claims (7)

[Claims] An opposing electrode is disposed on each of opposing surfaces of a pressure-sensing insulating substrate and a non-pressure-sensing insulating substrate which are arranged so as to oppose each other at an interval. A pressure sensing element for detecting a change in pressure from a change, a plurality of terminal members to which terminals of a mating connector are connected, and a connector main body formed of an insulating resin material to which the plurality of terminal members are fixed; The connector body has an opening toward one end and a base part having therein a component constituting an electric circuit for processing the output of the pressure sensing element and a storage recess for storing one end of the plurality of terminal members. A connector; a metal housing for housing the pressure sensing element and the base of the connector main body; and a part of the electric circuit arranged in the housing recess of the connector main body. An integrated circuit component, and a flexible substrate that electrically connects the integrated circuit component and the one end of the plurality of terminal members. The circuit pattern formed on the flexible substrate includes adjustment of the integrated circuit component. A plurality of adjustment wiring patterns used to input and output necessary signals and power from the outside of the connector main body, and the connector main body includes a part of the plurality of adjustment wiring patterns of the flexible substrate. A pressure sensor module, wherein a drawing passage for drawing out to the outside of the connector body is formed. 2. A method according to claim 1, wherein opposing electrodes are disposed on opposing surfaces of the pressure-sensing-side insulating base and the non-pressure-sensing-side insulating base, respectively, so as to oppose each other at intervals. A pressure sensing element for detecting a change in pressure from a change, a plurality of terminal members to which terminals of a mating connector are connected, and a connector main body formed of an insulating resin material to which the plurality of terminal members are fixed; A connector body that opens toward one end and forms a part of an electric circuit for processing the output of the pressure sensing element therein, and a base having a storage recess for storing one end of the plurality of terminal members;
A terminal storage chamber that opens toward the other end side and stores the other ends of the plurality of terminal members, and a connection portion including a terminal fixing portion to which the plurality of terminal members are fixed; A connector arranged such that an end surface of the one end side of the base is in contact with the non-pressure sensing side insulating base; a storage chamber for storing the pressure sensing element and the base of the connector body; and a communication with the storage chamber A metal housing having a high-pressure fluid supply passage for supplying a fluid to be measured for applying a pressure to the pressure-sensing-side insulating substrate; and a surface of the non-pressure-sensing-side insulating substrate located on the storage recess side. A plurality of electrodes for mounting electronic components formed thereon and used for mounting integrated circuit components constituting a part of the electric circuit, and used for connecting the electric circuit and the pressure sensing element. A first circuit pattern including a number of sensing element connection electrodes and a plurality of terminal electrode connection electrodes; and a first circuit pattern disposed in the housing recess and connected to the plurality of terminal electrode connection electrodes of the first circuit pattern. A plurality of pattern connection terminal electrodes, a plurality of terminal member connection electrodes connected to the plurality of terminal members, and signals and power required for adjusting the integrated circuit component from outside the connector body. And a flexible substrate having a second circuit pattern including a plurality of adjustment wiring patterns used for a plurality of through-holes into which the plurality of terminal members are inserted. The plurality of terminal member connection electrodes are formed around a hole, and the plurality of terminal member connections correspond to the one ends of the plurality of terminal members inserted into the plurality of through holes. A lead-out passage for leading a portion of the flexible substrate including the plurality of adjustment wiring patterns to the outside of the connection portion of the connector body, the lead-out passage being formed in the connector body; A pressure sensor module, wherein a portion of the substrate that is drawn out from the drawing passage and an outside opening of the drawing passage are covered with an insulating resin. 3. The pressure sensor module according to claim 1, wherein the integrated circuit element is adjusted by using a part of the plurality of adjustment wiring patterns led out from the lead-out passage. 4. A resin reservoir recess for storing the insulating resin is formed in an outer wall portion of the connector body, and the outer opening of the drawer passage opens into the resin reservoir recess. 3. The pressure sensor module according to 2. 5. The pressure sensor module according to claim 1, wherein a connector connection electrode is formed at an end of each of the plurality of adjustment wiring patterns drawn from the drawing passage. 6. A counter electrode is disposed on each of opposing surfaces of a pressure-sensing-side insulating base and a non-pressure-sensing-side insulating base, which are disposed so as to face each other at an interval, and a capacitance between the opposing electrodes is reduced. A pressure sensing element for detecting a change in pressure from a change, a plurality of terminal members to which terminals of a mating connector are connected, and a connector main body formed of an insulating resin material to which the plurality of terminal members are fixed; The connector body has an opening toward one end and a base part having therein a component constituting an electric circuit for processing the output of the pressure sensing element and a storage recess for storing one end of the plurality of terminal members. A connector; a metal housing for housing the pressure sensing element and the base of the connector main body; and a part of the electric circuit arranged in the housing recess of the connector main body. An integrated circuit component, and a flexible substrate that electrically connects the integrated circuit component and the one end of the plurality of terminal members. The circuit pattern formed on the flexible substrate includes adjustment of the integrated circuit component. A plurality of adjustment wiring patterns used to input and output necessary signals and power from the outside of the connector main body, and the connector main body includes a part of the plurality of adjustment wiring patterns of the flexible substrate. A method for manufacturing a pressure sensor module in which a lead-out passage for drawing out to the outside of the connector main body is formed, wherein a part including the plurality of adjustment wiring patterns is drawn out of the connector main body from the draw-out passage. After completing the assembly in, adjust the integrated circuit component through the plurality of adjustment wiring patterns, Manufacturing method of the pressure sensor module, characterized in that covering the outer opening of the portion of the flexible substrate drawn out from the drawer passage and the drawer path after settling completion with an insulating resin. 7. A counter electrode is disposed on each of opposing surfaces of a pressure sensing side insulating base and a non-pressure sensing side insulating base which are arranged so as to face each other at an interval, and a capacitance between the counter electrodes is reduced. A pressure sensing element for detecting a change in pressure from a change, a plurality of terminal members to which terminals of a mating connector are connected, and a connector main body formed of an insulating resin material to which the plurality of terminal members are fixed; A connector body that opens toward one end and forms a part of an electric circuit for processing the output of the pressure sensing element therein, and a base having a storage recess for storing one end of the plurality of terminal members;
A terminal storage chamber that opens toward the other end side and stores the other ends of the plurality of terminal members, and a connection portion including a terminal fixing portion to which the plurality of terminal members are fixed; A connector arranged such that an end face of the one end side of the base is in contact with the non-pressure sensing side insulating base; and one end face fitted to the outside of the base of the connector main body and one end face of the base of the connector main body. An annular support that is in contact with the non-pressure sensing-side insulating substrate at an outer side, a storage chamber that stores the pressure sensing element, the base of the connector body, and the annular support, and the storage chamber that communicates with the storage chamber. A metal housing having a high-pressure fluid supply path for supplying a fluid to be measured for applying pressure to the pressure-sensing-side insulating substrate and a coupling portion coupled to the base of the connector body by curling. A first circuit pattern formed on a surface of the non-pressure sensing side insulating substrate that is located on the storage recess side; and a first circuit pattern disposed in the storage recess and connected to the first circuit pattern. And a flexible substrate having a second circuit pattern including a plurality of pattern connection terminal electrodes and a plurality of terminal member connection electrodes connected to the plurality of terminal members, wherein the first circuit pattern, A plurality of electrodes for mounting electronic components used for mounting an integrated circuit component constituting a part of the electric circuit, and a plurality of electrodes for connecting sensing elements used for connecting the electric circuit and the pressure sensing element And a method of manufacturing a pressure sensor module including a plurality of terminal electrode connection electrodes to which the plurality of pattern connection terminal electrodes provided on the flexible substrate are connected by soldering. Wherein the flexible substrate is provided with a plurality of adjustment wiring patterns for inputting and outputting signals and power required for adjusting the integrated circuit components from outside the connector main body; Forming a lead-out passage for pulling out the plurality of adjustment wiring patterns to the outside of the connection portion of the connector main body, and forming a portion of the flexible substrate including the plurality of adjustment patterns on the connection portion of the connector main body. In the state of being pulled out, the pressure sensing element, the base of the connector main body, and the annular support are housed in the storage chamber of the housing, and the coupling portion of the housing is connected to the annular support and the connector main body. Curling the base, and then using the plurality of adjustment wiring patterns to form the integrated circuit component; After performing the adjustment, the portion of the flexible substrate drawn out of the connection portion after the adjustment is cut, and the exposed portions of the cut plurality of adjustment wiring patterns and the outer openings of the lead-out passages are covered with an insulating resin. A method for manufacturing a pressure sensor module, comprising: