JPH10183971A - Oa and heating floor panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily provide high efficient floor heating in any of all buildings including an office residence and a new building without using a thick heat insulating material. SOLUTION: An A-type panel 4 and a B-type panel 6 are laid over a required floor surface of a room, irrespective of either concrete or woody floor, and a heat radiating panel 8 is superposed or such to the panels, hot water pieces 9 being arranged in grooves 2, 7 formed in the heat radiating panel 8. In this arrangement, the heat radiating panel 8 is not required if panels made of a material such as ceramics are used, and the hot water pipes 9 are arranged in grooves directly formed in the end face of the panel. Finally, floorings, tile carpets, straw mats for exclusively used as finishing members are laid being closed with one another.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a panel which can be used for so-called OA floors and floor heating, and which can be used for office offices and general houses, for example, for wiring under the floor of OA equipment and drawing out power outlets, and its accessories. About goods.

[0002]

2. Description of the Related Art Generally, OA floors are used only for wiring office equipment such as offices.
In floor heating, mainly in houses, etc., heat insulating material is laid under the floor, and a heat storage material and a heater, or a heater with a radiator plate, or a heat pipe and a radiator plate are laid above. I was going.

[0003]

The object of the present invention is to achieve more efficient floor heating without using a thick insulating material, and to further provide floor heating to all buildings regardless of offices and houses, regardless of new construction or remodeling. To facilitate floor heating work.

[0004]

Means for Solving the Problems An A-type panel according to claim 1 and a B-type panel according to claim 2 are provided on a required indoor floor surface, irrespective of concrete or wood, as shown in FIG. And a radiator plate is laminated or pasted on the panel group, and a hot water pipe is laid in a groove formed in the radiator plate. At this time, when a panel made of the material described in claim 5 or 6 is used, a hot water pipe is directly piped into a groove formed on an end face of the panel without using a heat sink. Finally, the flooring, tile carpet, floor warming tatami, etc. as the finishing material are laid and completed. With this method, floor heating can be performed efficiently in all buildings, regardless of whether they are office buildings or new constructions.

[0005]

[Function] The conduction of heat includes conduction, convection, and radiation (radiation).
However, if this is described based on this, first, hot water is supplied by piping 9 hot water pipes into the 7 pipe grooves shown in FIG. 1 or the 2 pipe grooves formed on the end face of the panel. At this time, the contact area between the hot water pipe and the radiator plate is made as large as possible to increase the efficiency of the heat conduction. Next, the amount of heat supplied by the hot water pipe 9 is replaced with a thick air-insulating material, and instead of a conventional method of preventing heat dissipation under the floor, an air layer having a high heat insulating effect is formed as shown in FIG. The problem is solved by providing a space between the floor and the floor, and the space is connected to the adjacent panel so that it can be used also as a space for OA equipment wiring. The legs of this panel should have a minimum necessary installation area that can withstand heavy loads such as pianos. Prevent dissipation. In the case of the semi-thermal storage panel according to claims 5 and 6, an aluminum vapor-deposited film or the like is laid under the panel to reflect radiant heat from the panel and prevent heat from dissipating under the floor. Further, since the space under the panel is completely closed, the heat can be completely prevented from dissipating under the floor due to convection. Next, in order to more efficiently radiate heat to the finishing material above the heat source, the radiator plates of claims 3 and 4 are laminated or attached on this panel. In this case, the upper surface of the panel itself emits far-infrared rays, thereby making the role of the heat sink more efficient. Secondly, the space between the panel and the floor surface is used for wiring of OA equipment and the like and power wiring.
Since wiring and the like can be taken out from the cutouts for holes, it can also function as an OA floor, and floor heating can be easily performed even in a room such as an office.

[0006]

In the embodiment shown in FIG. 1, the panels according to claims 1 and 2 are laid in a room, the radiator plate according to claim 4 is laminated thereon, and a hot water pipe 9 is piped into the pipe groove 7. Here is an example. At this time, if necessary, a thin heat insulating material also serving as a cushion may be laid between the panel and the heat sink. Claim 5
When the panel itself of the sixth aspect is used as a semi-heat storage type, it is conceivable to lay a thin heat insulating material / reflecting material also serving as a cushion under the panel.

[0007]

As is apparent from the above description, floor heating in all buildings can be performed more efficiently, regardless of whether it is an office house or a new construction or remodeling, without using a thick insulating material. Since the construction can be easily performed, there is an effect of contributing to the spread of floor heating facilities such as general housing, company offices, nursing homes for the elderly, and the like.

[Brief description of the drawings]

FIG. 1 shows a configuration and a basic shape of the present invention.

[Explanation of symbols]

1 space (between floor and panel to perform heat insulation function) 2 pipe groove (groove for hot water pipe formed by the end of both adjacent panels) 2 'groove notch (hot water pipe on both end faces) Notch for forming groove for use) 3 Notch for hole (notch for forming hole communicating with lower space for taking out wiring etc.) 4 A-type panel (panel shown in claims 1, 5 and 6) 5 Communication groove (a groove on the upper surface of the B-type panel, which connects the notches for the 2 'grooves on both sides) 6 B-type panel (the panel described in claim 2 and claims 5 and 6) 7 Piping groove (claim 4) 8 Heat-dissipating plate (heat-dissipating plate shown in claim 4) 9 Heat-dissipating plate (tube for circulating hot water as a heat source for floor heating)

Claims (6)

[Claims] 1. A notch having a space communicating with a lower surface of a panel laid adjacently, a notch forming a groove for hot water piping at both end surfaces, and a notch forming a hole communicating with a lower space at the other end surface. A panel referred to as an A type having at least one notch. 2. A notch which has a space communicating with a lower surface of an adjacently laid panel, and a groove for hot water piping is formed on both end surfaces, and a groove formed on both end surfaces is connected to the upper surface. A panel referred to as a B-type panel having at least one notch in which a groove is formed and a hole which communicates with the lower space is formed in the other end surface. 3. A heat radiating plate which is laminated or attached to each panel by using an aluminum thin plate or a copper thin plate or the like from both end surfaces of the panel, from both end surfaces forming a groove, to an upper surface. 4. A heat radiating plate for laminating or attaching an aluminum thin plate or a copper thin plate having grooves formed so as to match grooves formed when the panels are laid adjacent to each other on a group of laid panels. 5. A semi-heat storage panel which does not require a radiator plate, wherein the panel is formed of a material such as ceramic having high far-infrared radiation efficiency. 6. A semi-heat storage panel which does not require a heat sink and is formed by laminating or affixing a material such as ceramic having a high far-infrared radiation efficiency from both end surfaces forming a groove to an upper surface of the panel.